© 2007 Microchip Technology Inc. DS80060D-page 1
PIC16C505
The PIC16C505 parts you have received conform func-
tionally to the Device Data Sheet (DS40192C), except
for the anomalies described below.
All of the issues listed here will be addressed in future
revisions of the PIC16C505 silicon.
1. Module: Voltage Frequency Graphs
Use the following graphs for the respective graphs
in the Electrical Specification Section.
FIGURE 1: PIC16LC505 VOLTAGE-FREQUENCY GRAPH, -40°C TA 0°C
6.0
2.5
4.0
3.0
0
3.5
4.5
5.0
5.5
410
Frequency (MHz)
VDD
20
(Volts)
25
2.0
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
2.7
PIC16C505 Rev. A Silicon/Data Sheet Errata
PIC16C505
DS80060D-page 2 © 2007 Microchip Technology Inc.
FIGURE 2: PIC16LC505 VOLTAGE-FREQUENCY GRAPH, 0°C TA +70°C
6.0
2.5
4.0
3.0
0
3.5
4.5
5.0
5.5
410
Frequency (MHz)
VDD
20
(Volts)
25
2.0
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
© 2007 Microchip Technology Inc. DS80060D-page 3
PIC16C505
FIGURE 3: PIC16LC505 VOLTAGE-FREQUENCY GRAPH, +70°C TA +125°C
6.0
2.5
4.0
3.0
0
3.5
4.5
5.0
5.5
410
Frequency (MHz)
VDD
20
(Volts)
25
2.0
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency.
Please reference the Product Identification System section for the maximum rated speed of the parts.
PIC16C505
DS80060D-page 4 © 2007 Microchip Technology Inc.
Clarifications/Corrections to the Data
Sheet:
In the Device Data Sheet (DS40192C), the following
clarifications and corrections should be noted.
1. Module: Special Function Register
Corrections to the Special Function Register
(SFR) Summary are shown in Table 4-1.
TABLE 4-1: SPECIAL FUNCTION REGISTER (SFR) SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Value on
Power-On
Reset
Value on
All Other
Resets(2)
04h FSR Indirect Data Memory Address Pointer 100x xxxx 10uu uuuu
Legend: Shaded cells not used by PORT Registers, read as0’, – = unimplemented, read as ‘0’, x = unknown, u = unchanged,
q = depends on condition.
Note 1: If Reset was due to wake-up on pin change, then bit 7 = 1. All other Resets will cause bit 7 = 0.
2: Other (non-power-up) Resets include external Reset through MCLR, Watchdog Timer and wake-up on pin change
Reset.
© 2007 Microchip Technology Inc. DS80060D-page 5
PIC16C505
2. Module: DC Characteristics
Corrections for the DC Characteristics, Sections
10.1, 10.2 and 10.3 are shown.
10.1 DC CHARACTERISTICS: PIC16C505-04 (Commercial, Industrial, Extended)
PIC16C505-20(Commercial, Industrial, Extended)
DC CHARACTERISTICS
POWER SUPPLY PINS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0°C TA +70°C (commercial)
–40°C TA +85°C (industrial)
–40°C TA +125°C (extended)
Parm.
No. Characteristic Sym Min Typ(1) Max Units Conditions
D010 Supply Current(3) IDD
0.8
0.6
3
4
4.5
19
1.4
1.0
7
12
16
27
mA
mA
mA
mA
mA
μA
FOSC = 4MHz, VDD = 5.5V, WDT
disabled, XT mode (Note 4)
FOSC = 4MHz, VDD = 3.0V, WDT
disabled, XT mode (Note 4)
FOSC = 10MHz, VDD = 3.0V, WDT
disabled,
HS mode (Note 6)
FOSC = 20MHz, VDD = 4.5V, WDT
disabled,
HS mode
FOSC = 20MHz, VDD = 5.5V, WDT
disabled,
HS mode
FOSC = 32kHz, VDD = 3.0V, WDT
disabled,
LP mode (Note 6)
D020 Power-Down Current (5) IPD
0.25
0.4
3
5
4
5.5
8
14
μA
μA
μA
μA
VDD = 3.0V (Note 6)
VDD = 4.5V (Note 6)
VDD = 5.5V, Industrial
VDD = 5.5V, Extended Temp.
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
a) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD,
MCLR = VDD; WDT enabled/disabled as specified.
b) For standby current measurements, the conditions are the same, except that the device is in Sleep
mode.
4: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in kOhm.
5: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS.
6: Commercial temperature range only.
PIC16C505
DS80060D-page 6 © 2007 Microchip Technology Inc.
10.2 DC CHARACTERISTICS: PIC16LC505-04 (Commercial, Industrial)
DC CHARACTERISTICS
POWER SUPPLY PINS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature 0°C TA +70°C (commercial)
–40°C TA +85°C (industrial)
Parm.
No. Characteristic Sym Min Typ(1) Max Units Conditions
D010 Supply Current(3) IDD
0.8
0.4
15
1.4
0.8
23
mA
mA
μA
FOSC = 4MHz, VDD = 5.5V, WDT
disabled, XT mode (Note 4)
FOSC = 4MHz, VDD = 2.5V, WDT
disabled, XT mode (Note 4)
FOSC = 32kHz, VDD = 2.5V, WDT
disabled, LP mode (Note 6)
D020 Power-Down Current (5) IPD
0.25
0.25
3
3
4
8
μA
μA
μA
VDD = 2.5V (Note 6)
VDD = 3.0V (Note 6)
VDD = 5.5V Industrial
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
c) The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD,
MCLR = VDD; WDT enabled/disabled as specified.
d) For standby current measurements, the conditions are the same, except that the device is in Sleep
mode.
4: Does not include current through REXT. The current through the resistor can be estimated by the formula:
IR = VDD/2REXT (mA) with REXT in kOhm.
5: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS.
6: Commercial temperature range only.
© 2007 Microchip Technology Inc. DS80060D-page 7
PIC16C505
10.3 DC CHARACTERISTICS: PIC16C505-04 (Commercial, Industrial, Extended)
PIC16C505-20(Commercial, Industrial, Extended)
PIC16LC505-04 (Commercial, Industrial))
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating temperature 0°C T
A +70°C (commercial)
–40°C TA +85°C (industrial)
–40°C TA +125°C (extended)
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
Input High Voltage VIH
I/O ports
D040 with TTL buffer 2.0 VDD V4.5 VDD 5.5V
D040A 0.25VDD+
0.8V
—VDD VOtherwise
Input Leakage Current (Notes 2, 3) IIL
D061 RB3/MCLR (Note 5) 8 130 250 μAVss VPIN VDD
D061A RB3/MCLR (Note 6) +5μAVss VPIN VDD
D070 RB weak pull-up current (Note 4) IPUR 179 250 333 μAVDD = 5V, VPIN = VSS
Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended
that the PIC16C505 be driven with external clock in RC mode.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
3: Negative current is defined as coming out of the pin.
4: Does not include RB3. For RB3 see parameters D0061 and D0061A.
5: This specification applies to RB3/MCLR configured as external MCLR and RB3/MCLR configured as input
with internal pull-up enabled.
6: This specification applies to RB3/MCLR configured as external MCLR and RB3/MCLR configured as input
with pull-up disabled. The leakage current of the MCLR circuit is higher than the standard I/O logic.
PIC16C505
DS80060D-page 8 © 2007 Microchip Technology Inc.
3. Module: PORTB Pull-up Register Ranges
Corrections for the PORTB pull-up resistor ranges are
shown in Table 10-1.
TABLE 10-1: PULL-UP RESISTOR RANGES – PIC16C505
VDD (Volts) Temperature (°C) Min Typ Max Units
RB0/RB1/RB4
2.5 –40 38K 42K 63K Ω
25 42K 48K 63K Ω
85 42K 49K 63K Ω
125 50K 55K 63K Ω
5.5 –40 15K 17K 20K Ω
25 18K 20K 23K Ω
85 19K 22K 25K Ω
125 22K 24K 28K Ω
RB3(1)
2.5 –40 65K 80K 850K Ω
25 80K 100K 1150K Ω
85 85K 110K 1300K Ω
125 100K 120K 1500K Ω
5.5 –40 50K 60K 600K Ω
25 60K 65K 750K Ω
85 65K 80K 900K Ω
125 75K 90K 990K Ω
* These parameters are characterized but not tested.
Note 1: The weak pull-up resistor and associated current for the RB3/MCLR pin is nonlinear when the respective
pin voltage is less than VDD – 1.0V. See parameter D061 for RB3/MCLR pin current specifications.
© 2007 Microchip Technology Inc. DS80060D-page 9
PIC16C505
4. Module: Reset (CLKIN/CLKOUT)
For the section titled “Reset”, additional information is
provided on OSC1/CLKIN and OSC2/CLKOUT pin
states during a MCLR.
Reset
When MCLR is asserted, the state of the OSC1/CLKIN
and CLKOUT/OSC2 pins are as follows:
CLKIN/CLKOUT PIN STATES WHEN MCLR
ASSERTED
Oscillator Mode OSC1/CLKIN Pin OSC2/
CLKOUT Pin
EXTRC, CLKOUT on
OSC2
OSC1 pin is
tri-stated and
driven by external
circuit
OSC2 pin is
driven low
EXTRC, OSC2 is I/O OSC1 pin is
tri-stated and
driven by external
circuit
OSC2 pin is
tri-state input
INTRC, CLKOUT on
OSC2
OSC1 pin is
tri-state input
OSC2 pin is
driven low
INTRC, OSC2 is I/O OSC1 pin is
tri-state input
OSC2 pin is
tri-state input
PIC16C505
DS80060D-page 10 © 2007 Microchip Technology Inc.
5. Module: Packaging (TSSOP)
Update data sheet to include TSSOP as follows:
Pin Diagram:
PIC16C505 Product Identification System
10.3 Package Marking Information
PDIP, SOIC, TSSOP, Ceramic Side Brazed
PIC16C505
VDD
RB5/OSC1/CLKIN
RB4/OSC2/CLKOUT
RB3/MCLR/VPP
RC5/T0CKI
RC4
RC3
VSS
RB0
RB1
RB2
RC0
RC1
RC2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Pattern: Special Requirements
Package: SL = 150 mil SOIC
P = 300 mil PDIP
JW = 300 mil Windowed Ceramic Side Brazed
ST = Thin Shrink Small Outline (TSSOP)
Temperature
Range:
-=0°C to +70°C
I=-40°C to +85°C
E=-40°C to +125°C
Frequency
Range:
04 = 4 MHz (XT, INTRC, EXTRC OSC)
20 = 20 MHz (HS OSC)
Device PIC16C505
PIC16LC505
PIC16C505T (Tape & reel for SOIC only)
PIC16LC505T (Tape & reel for SOIC only)
PART NO. -XX X /XX XXX Examples
a) PIC16C505-04/P
Commercial Temp.,
PDIP Package, 4 MHz,
normal VDD limits
b) PIC16C505-04I/SL
Industrial Temp., SOIC
package, 4 MHz, normal
VDD limits
c) PIC16C505-04I/P
Industrial Temp.,
PDIP package, 4 MHz,
normal VDD limits
14-Lead TSSOP
XXXXXXXX
YYWW
NNN
Example
C505/ST
0610
017
© 2007 Microchip Technology Inc. DS80060D-page 11
PIC16C505
APPENDIX A: REVISION HISTORY
Revision D (5/2007)
Updates throughout document.
PIC16C505
DS80060D-page 12 © 2007 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS80060D-page 13
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
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Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
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All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS80060D-page 14 © 2007 Microchip Technology Inc.
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