MF1S7031XDUD/V1V - NXP Semiconductors

1. General description

NXP Semiconductors has developed the MIF ARE Classic MF1S70yyX/V1 to be used in a

contactless smart card according to ISO/IEC 14443 Type A.

The MIFARE Classic EV1 4K MF1S70yyX/V1 IC is used in applications like public

transport ticketing and can also be used for various other applications.

1.1 Anticollision

An intelligent anticollision function allows to operate more than one card in the field

simultaneously. The anticollision algorithm selects each card individually and ensures that

the execution of a transaction with a selected card is performed correctly without

interference from another card in the field.

1.2 Simple integration and user convenience

The MF1S70yyX/V1 is designed for simple integration and user convenience which allows

complete ticketing transactions to be handled in less than 100 ms.

1.3 Security and privacy

•Manufacturer programmed 7-byte UID or 4-byte NUID identifier for each device

•Random ID support

•Mutual three pass authentication (ISO/IEC DIS 9798-2)

•Individual set of two keys per sector to support multi-application with key hierarchy

MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card

IC for fast and easy solution development

Rev. 3.1 — 8 September 2014

279331 Product data sheet

COMPANY PUBLIC

Fig 1. Contactless MIFARE system

001aam199

MIFARE

CARD PCD

energy

data

Product data sheet

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

1.4 Delivery options

•7-byte UID, 4-byte NUID

•Bumped die on sawn wafer

•MOA4 and MOA8 contactless module

2. Features and benefits

2.1 EEPROM

3. Applications

4. Quick reference data

[1] Tamb=22°C, f=13,56Mhz, VLaLb = 1,5 V RMS

Contactless transmission of data and

energy supply

Operating distance up to 100 mm

depending on antenna geometry and

reader configuration

Operating frequency of 13.56 MHz Data transfer of 106 kbit/s

Data integrity of 16-bit CRC, parity, bit

coding, bit coun tin g

Anticollision

Typical ticketing transaction time of

< 100 ms (including backup

management)

7 Byte UID or 4 Byte NUID

Random ID support (7 Byte UID version)

4 kB, organized in 32 sectors of 4 blocks

and 8 sectors of 16 blocks (one block

consists of 16 byte)

User definable access conditions for

each memory block

Data retention time of 10 years Write endurance 200000 cycles

Public transportation Access management

Electronic toll collection Car parking

School and campus cards Employee cards

Internet cafés Loyalty

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Ciinput capacitance [1] 14.9 16.9 19.0 pF

fiinput frequency - 13.56 - MHz

EEPROM characteristics

tret retention time Tamb = 22 C10--year

Nendu(W) write endurance Tamb = 22 C 100000 200000 - cycle

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

5. Ordering information

6. Block diagram

Table 2. Ordering information

Type number Package

Name Description Version

MF1S7001XDUD/V1 FFC Bump 8 inch wafer, 120 m thickness, on film frame carrier, electronic fail die

marking according to SECS-II format), Au bumps, 7-byte UID -

MF1S7001XDUF/V1 FFC Bump 8 inch wafer, 75 m thickness, on film frame carrier, electronic fail die

marking according to SECS-II format), Au bumps, 7-byte UID -

MF1S7000XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-2

MF1S7000XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape, 7-byte UID SOT500-4

MF1S7031XDUD/V1 FFC Bump 8 inch wafer, 120 m thickness, on film frame carrier, electronic fail die

marking according to SECS-II format), Au bumps, 4-byte non-unique ID -

MF1S7031XDUF/V1 FFC Bump 8 inch wafer, 75 m thickness, on film frame carrier, electronic fail die

marking according to SECS-II format), Au bumps, 4-byte non-unique ID -

MF1S7030XDA4/V1 MOA4 plastic leadless module carrier package; 35 mm wide tape,

4-byte non-unique ID SOT500-2

MF1S7030XDA8/V1 MOA8 plastic leadless module carrier package; 35 mm wide tape,

4-byte non-unique ID SOT500-4

Fig 2. Block diagram of MF1S70yyX/V1

001aan006

INTERFACE

UART

ISO/IEC 14443

TYPE A

LOGIC UNIT

RNG

CRC

EEPROM

CRYPTO1

POWER ON

RESET

VOLTAGE

REGULATOR

CLOCK

INPUT FILTER

RESET

GENERATOR

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

7. Pinning information

7.1 Pinning

The pinning for the MF1 S70yyX/V1DAx is shown as an example in Figure 3 for the MOA4

contactless module. For the contactless module MOA8, the pinning is analogous and not

explicitly shown.

Fig 3. Pin configuration for SOT500-2 (MOA4)

Table 3. Pin allocation table

Pin Symbol

LA LA Antenna coil connection LA

LB LB Antenna coil connection LB

001aan002

LA LBtop view

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8. Functional description

8.1 Block description

The MF1S70yyX/V1 chip consists of a 4 kB EEPROM, RF interface and Digital Control

Unit. Energy and data are transferred via an antenna consisting of a coil with a small

number of turns which is directly connected to the MF1S70yyX/V1. No further external

components are necessary. Refer to the document Ref. 1 for details on antenna design.

•RF interface:

–Modulator/demodulator

–Rectifier

–Clock regenerator

–Power-On Reset (POR)

–Voltage regulator

•Anticollision: Multiple cards in the field may be selected and managed in sequence

•Authentication: Preceding any memory operation the authentication procedure

ensures that acce ss to a block is only possible via the two keys specified for each

block

•Control and Arithmetic Lo gic Unit: V alue s are stored in a special redundant forma t and

can be incremented and decremented

•EEPROM interface

•Crypto unit: The CRYPTO1 stream cipher of the MF1S70yyX/V1 is used for

authentication and encryption of data exchange.

•EEPROM: 4 kB is organized in 32 sectors of 4 blocks and 8 sectors of 16 blocks. One

block contains 16 bytes. The last block of each sector is called “trailer”, which

contains two secret keys and programmable access conditions for each block in this

sector.

8.2 Communication principle

The commands are in itiate d by the rea der and co ntrolled by the Digital Control Unit of the

MF1S70yyX/V1. The command response is depending on the state of the IC and for

memory operations also on the access conditions valid for the corresponding sector.

8.2.1 Request standard / all

After Power-On Reset (POR) the card answers to a request REQA or wakeup WUPA

command with the answer to request code (see Section 9.4, ATQA according to ISO/IEC

14443A).

8.2.2 Anticollision loop

In the anticollision loop the identifier of a card is read. If there are several cards in the

operating field of the reader, they can be distinguished by their identifier and one can be

selected (select card) for further transactions. The unse lected cards return to the idle state

and wait for a new request command. If the 7-byte UID is used for anticollision and

selection, two cascade levels need to be processes as defined in ISO/IEC 14443-3.

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

Remark: For the 4-byte non-uni que ID product versions, the identifier retrieved from the

card is not defined to be un ique . F or fu rther information regarding handling of no n- uniq ue

identifiers see Ref. 6.

8.2.3 Select card

With the select card command the reader selects one individual card for authentication

and memory related operations. The card returns the Select AcKnowledge (SAK) code

which determines the type of the sele cted card, see Section 9.4. For further details refer to

the document Ref. 2.

8.2.4 Three pass authentication

After selection of a car d the reader specifie s the memory location of the following memory

access and uses the corresponding key for the three pa ss authentication proced ure. Af ter

a successful authentication all commands and responses are encrypted.

Remark: The HLTA command needs to be sent encr ypted to the PICC after a successful

authentication in order to be accepted.

(1) the command flow diagram does not include the Personalize UID Usage and the

SET_MOD_TYPE command, for details on those commands please see Section 10.1.1 and

Section 11

Fig 4. MIFARE Classic command flow diagram

Request Standard Request All

Anticollision Loop

Get Identifier

Select Card

3 Pass Authenticationon

specific sector

Read

Block Write

Block Decre-

ment Incre-

ment Re-

store Halt

Transfer

Identification and Selection

Procedure

~2.5 ms without collision

+ ~1 ms for 7-byte UID

Typical Transaction T ime

Authentication Procedure

~2 ms

Transaction Sequence

POR

Memory Operations

~2.5 ms read block

~5.5 ms write block

~2.5 ms de-/increment

~4.5 ms transfer

+ ~1 ms for each collision

001aan921

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.2.5 Memory operations

After authentication any of the following operations may be performed:

•Read block

•Write block

•Decrement: Decrements the contents of a block and stores the result in the internal

Transfer Buffer

•Increment: Increments the contents of a block and stores the result in the internal

Transfer Buffer

•Restore: Moves the contents of a block into the internal Transfer Buffer

•Transfer: Writes the contents of the internal Transfer Buffer to a value block

8.3 Data integrity

Following mechanisms are implemented in the contactless communication link between

reader and card to ensure very reliable data transmission:

•16 bits CRC per block

•Parity bits for each byte

•Bit count checking

•Bit coding to distinguish between “1”, “0” and “no information”

•Channel monitoring (protocol sequence and bit stream analysis)

8.4 Three pass authentication sequence

1. The reader specifies the sector to be accessed and chooses key A or B.

2. The card reads the secret key and the access conditions fr om the secto r traile r. Then

the card sends a number as the challenge to the reader (pass one).

3. The reader calculates the response using the secret key an d additional input. The

response, together with a random challe nge from the reader , is then transmitted to the

card (pass two).

4. The card verifies the response of the reader by comparing it with its own challenge

and then it calculates the response to the challenge and transmits it (pass three).

5. The reader verifies the response of the card by comparing it to its own challenge.

After transmission of the first random challenge the communication between card and

reader is encrypted.

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.5 RF interface

The RF-interface is according to the standard for contactless smart cards

ISO/IEC 14443A.

For operation, the carrier field from the reader always needs to be present (with short

pauses when transmitting), as it is used for the power supply of the card.

For both directions of data communication there is only one start bit at the beginning of

each frame. Each byte is transmitted with a parity bit (odd parity) at the end. The LSB of

the byte with the lowest address of the selected block is transmitted first. The maximum

frame length is 163 bits (16 data bytes + 2 CRC bytes = 16  9 + 2  9 + 1 start bit).

8.6 Memory organization

The 4096  8 bit EEPROM memory is or ganized in 32 sectors of 4 blocks and 8 sectors of

16 blocks. One block contains 16 bytes.

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

Fig 5. Memory organization

001aan021

Byte Number within a Block

15141312111098765

Key A Access Bits Key B

43210Block

Sector

Description

Sector Trailer 39

Data

: :

Data

1 Data

2 Data

: :

Key A Access Bits Key B

1532

Sector Trailer 32

Data

: :

Data

1 Data

2 Data

Key A Access Bits Key B

Sector Trailer 31

Data

0 Data

331

Key A Access Bits

Manufacturer Data

Key B

Sector Trailer 0

Data

0 Manufacturer Block

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.6.1 Manufacturer block

This is the first data block (block 0) of the first sector (sector 0). It contains the IC

manufacturer data. This block is programmed and write protected in the production test.

The manufacturer block is shown in Figure 6 and Figure 7 for the 4-byte NUID a nd 7-byte

UID version respectively.

8.6.2 Data blocks

One block consists of 16 bytes. The first 32 sectors contain 3 bl ocks and the last 8 sectors

contain 15 blocks for storing data (Sector 0 contains only two data blocks and the

read-only manufacturer block).

The data blocks can be configured by the access bits as

•read/write blocks

•value blocks

Value blocks can be used for e.g. electronic purse applications, where additional

commands like increment and decrement for direct control of the stored value are

provided

A successful authentication has to be performed to allow any memory operation.

Remark: The default content of the data blocks at delivery is not defined.

8.6.2.1 Value blocks

Value blocks allow performing electronic purse functions (valid commands are: read,

write, increment, decrement, restore, transfer). Value blocks have a fixed data format

which permits error detection and correction and a backup management.

A value block can only be generated through a write operation in value block format:

•Value: Signifies a signed 4-byte value. The lowest significant byte of a value is stor ed

in the lowest address byte. Negative values are stored in standard 2´s complement

format. For reasons of data integrity and security, a value is stored three times, twice

non-inverted and once inverted.

Fig 6. Manufacturer block for MF1S503yX with 4-byte NUID

Fig 7. Manufacturer block for MF1S500yX with 7-byte UID

001aan010

1514131211109876543

NUID Manufacturer Data

Block 0/Sector 0

21Byte 0

001aam204

1514131211109876543

UID Manufacturer Data

Block 0/Sector 0

21Byte 0

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

•Adr: Signifies a 1-byte add ress, which can be used to save the storage address of a

block, when implementing a powerful backup management. The address byte is

stored four times, twice inverted and non-inverted. During increment, decrement,

restore and transfer operations the address remains unchanged. It can only be

altered via a write com m a nd .

An example of a valid value block format for the decimal value 1234567d and the block

address 17d is shown in Table 4. First, the decimal value has to be converted to the

hexadecimal representation of 0012D687h. The LSByte of the hexadecimal value is

stored in Byte 0, the MSByte in Byte 3. The bit inverted hexadecimal representation of th e

value is FFED2978h where the LSByte is stored in Byte 4 and the MSByte in Byte 7.

The hexadecimal value of the a ddress in the example is 11h, the bit inverted hexadecimal

value is EEh.

8.6.3 Sector trailer

The sector trailer is always th e last block in one sector. For the first 32 sectors this is block

3 and for the remaining 8 sectors it is block 15. Each sector has a sector trailer cont aining

the

•secret keys A (mandatory) and B (optional), which return logical “0”s when read and

•the access conditions for the blocks of that sector , which are stored in bytes 6...9. The

access bits also specify the type (data or value) of the data blocks.

If key B is not ne eded, the last 6 bytes of the sector trailer can be used a s dat a bytes. The

access bits for the sector trailer have to be configured accordingly, see Section 8.7.2.

Byte 9 of the sector trailer is available for user data. For this byte the same access rights

as for byte 6, 7 and 8 apply.

When the sector trailer is read, the key bytes are blanked out by return ing logical zeros. If

key B is configured to be readable, the data stored in bytes 10 to 15 is returned, see

Section 8.7.2.

All keys are set to FFFF FFFF FFFFh at chip delivery and the bytes 6, 7 and 8 are set to

FF0780h.

Fig 8. Value blocks

Table 4. Value block format example

Byte Number 012345678910 11 12 13 14 15

Description value value value adr adr adr adr

Values [hex] 87D612007829EDFF87D6120011EE11EE

001aan018

151413121110987654321Byte Number 0

adradradradrvalue valuevalueDescription

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.7 Memory access

Before any memory oper ation can be done, the card has to be selected and authenticated

as described in Section 8.2. The possible me mory operations for an addressed block

depend on the key used during authentication and the access conditions stored in the

associated sector trailer.

Fig 9. Sector trailer

001aan013

151413121110987654321Byte Number 0

Key A Key B (optional)Access BitsDescription

Table 5. Memory operations

Operation Description Valid for Block Type

Read reads one memory block read/write, value and sector trailer

Write writes one memory block read/write, value and sector trailer

Increment increments the contents of a block and

stores the result in the internal

Transfer Buffer

value

Decrement decrements the contents of a block and

stores the result in the internal

Transfer Buffer

value

Transfer writes the contents of the internal

Transfer Buffer to a block value and read/write

Restore reads the contents of a block into the

internal Transfer Buffer value

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.7.1 Access conditions

The access conditions for every data block and sector trailer are defined by 3 bits, which

are stored non-inverted and inverted in the sector trailer of the specified sector.

The access bits control the rights of memory access using the secret keys A and B. The

access conditions may be altered, provided one knows the relevant key and the current

access condition allows this operation.

Remark: With each memory access the internal logic verifies the format of the access

conditions. If it detects a format violation the whole sector is irreversibly blocked.

Remark: In the following desc rip tio n the access bits are mentione d in the no n-i nv er te d

mode only.

The internal logic of the MF1S70yyX/V1 ensures that the commands are executed only

after a successful authentication.

Table 6. Access conditions

Access Bits Valid Commands Block

(sectors 0 - 31) Block(s)

(sectors 32-39) Description

C13 C23 C33 read, write 3 15 sector trailer

C12 C22 C32 read, write, increment,

decrement, transfer, restore 2 10-14 data block(s)

C11 C21 C31 read, write, increment,

decrement, transfer, restore 1 5-9 data block(s)

C10 C20 C30 read, write, increment,

decrement, transfer, restore 0 0-4 data block(s)

Fig 10. Access conditions

001aan003

151413121110987654321Byte Number

Description

Key A Key B (optional)Access Bits

user data

Byte 6 C23C22C21C20C13C12C11C10

7Bit 6543210

Byte 7 C13C12C11C10C33C32C31C30

Byte 8 C33C32C31C30C23C22C21C20

Byte 9

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MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.7.2 Access conditions for the sector trailer

Depending on the access bits for the sector trailer (block 3, respectively block 15) the

read/write access to the keys and the access bits is specified as ‘never’, ‘key A’, ‘key B’ or

key A|B’ (key A or key B).

On chip delivery the access conditions for the sector trailers and key A are predefined as

transport configuration. Since key B may be read in th e transport configuration, new cards

must be authenticated with key A. Since the access bits them selve s can al so be bl ocke d,

special care has to be taken during the personalization of cards.

[1] For this access condition key B is readable and may be used for data

Table 7. Access conditions for the sector trailer

Access bits Access condition for Remark

KEYA Access bits KEYB

C1 C2 C3 read write read write read write

000never key A key A never key A key A Key B may be read[1]

010never never key A never key A never Key B may be read[1]

1 0 0 never key B key A|B never never key B

1 1 0 never never key A|B never never never

001never key A key A key A key A key A Key B may be read,

transport configuration[1]

0 1 1 never key B key A|B key B never key B

1 0 1 never never key A|B key B never never

1 1 1 never never key A|B never never never

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

8.7.3 Access conditions for data blocks

Depending on the access bits for data blocks (blocks 0...2) the read/write access is

specified as ‘never’, ‘key A’, ‘key B’ or ‘key A|B’ (key A or key B). The setting of the

relevant access bits defines the application and the corresponding applicable commands.

•Read/write block: the operations read and write are allowed.

•Value block: Allows the additional value operations incre ment, decrement, transfer

and restore. With access condition ‘001’ only read and decrement are possible which

reflects a non-rechargeab le card. For access conditio n ‘110’ recharging is possible b y

using key B.

•Manufacturer block: the read-only condition is not affected by the access bits setting!

•Key management: in transport configuration key A must be used for authentication

[1] If key B may be read in the corresponding Sector Trailer it cannot serve for authentication (see grey marked

lines in Table 7). As a consequences, if the reader authenticates any block of a sector which uses such

access conditions for the Sector Trailer and using key B, the card will refuse any subsequent memory

access after authentication.

Table 8. Access conditions for data blocks

Access bits Access condition for Application

C1 C2 C3 read write increment decrement,

transfer,

restore

0 0 0 key A|B key A|B key A|B key A|B transport

configuration[1]

0 1 0 key A|B never never never read/write block[1]

1 0 0 key A|B key B never never read/write blo c k[1]

1 1 0 key A|B key B key B key A|B value block[1]

0 0 1 key A|B never never key A|B value block[1]

0 1 1 key B key B never never read/write block[1]

1 0 1 key B never never never read/write block[1]

1 1 1 never never never never read/write block

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MIFARE Classic EV1 4K - Mainstream contactless smart card IC

9. Command overview

The MIFARE Classic card activation follows the ISO/IEC 14443 Type A. After the

MIFARE Classic card has been selected, it can either be deactivated using the

ISO/IEC 14443 Halt command, or the MIFARE Classic commands can be performed . For

more details about the card activation refer to Ref. 4.

9.1 MIFARE Classic command overview

All MIFARE Classic commands typically use the MIFARE CRYPTO1 and require an

authentication.

All available commands for the MIFARE Classic EV1 4K are shown in Table 9.

All commands use the coding and framing as described in Ref. 3 and Ref. 4 if not

otherwise specified.

Table 9. Command overview

Command ISO/IEC 14443 Command code

(hexadecimal)

Request REQA 26h (7 bit)

Wake-up WUPA 52h (7 bit)

Anticollision CL1 Anticollision CL1 93h 20h

Select CL1 Select CL1 93h 70h

Anticollision CL2 Anticollision CL2 95h 20h

Select CL2 Select CL2 95h 70h

Halt Halt 50h 00h

Authentication with Key A - 60h

Authentication with Key B - 61h

Personalize UID Usage - 40h

SET_MOD_TYPE - 43h

MIFARE Read - 30h

MIFARE Write - A0h

MIFARE Decrement - C0h

MIFARE Increment - C1h

MIFARE Restore - C2h

MIFARE Transfer - B0h

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

9.2 Timings

The timing shown in this document are not to scale and values are rounded to 1 s.

All given times refer to the data frames including star t of communication and end of

communication. A PCD data frame contains the start of communication (1 “start bit”) and

the end of communication (one logic 0 + 1 bit length of unmod ulated carrier). A PICC dat a

frame contains the start of communication (1 “start bit”) and the end of communication (1

bit length of no subcarrier).

The minimum command response time is specified according to Ref. 4 as an integer n

which specifies the PCD to PICC frame delay time. The frame delay time from PICC to

PCD is at least 87 s. Th e ma xim u m co mm a nd res po ns e ti me is specified as a time-out

value. Depending on the command, the TACK value specified for comma nd responses

defines the PCD to PICC frame delay time. It does it for either the 4-bit ACK value

specified in Section 9.3 or for a data frame.

All command timings are according to ISO/IEC 14443-3 frame specification as shown for

the Frame Delay Time in Figure 11. For mor e details refer to Ref. 3 and Ref. 4.

Remark: Due to the coding of commands, the measured timings usually excludes (a par t

of) the end of communication. Consider this factor when comparing the specified with the

measured times.

Fig 11. Frame Delay Time (from PCD to PICC) and TACK and TNAK

aaa-006279

last data bit transmitted by the PCD

FDT = (n* 128 + 84)/fc

first modulation of the PICC

FDT = (n* 128 + 20)/fc

128/fc

logic „1“

128/fc

logic „0“

256/fc

end of communication (E)

256/fc

end of communication (E)

128/fc

start of

communication (S)

128/fc

start of

communication (S)

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MIFARE Classic EV1 4K - Mainstream contactless smart card IC

9.3 MIFARE Classic ACK and NAK

The MIFARE Classic uses a 4 bit ACK / NAK as shown in Table 10.

9.4 ATQA and SAK responses

For details on the type identification procedure please refer to Ref. 2.

The MF1S70yyX/V1 answers to a REQA or WUPA command with the ATQA value shown

in Table 11 and to a Select CL1 command (CL2 for the 7-byte UID variant) with the SAK

value shown in Table 12.

Remark: The ATQA coding in bits 7 and 8 indicate the UID size according to

ISO/IEC 14443 independent from the settings of the UID usage.

Remark: The bit numbering in the ISO/IEC 1444 3 start s with LSBit = bit 1, but not LSBit =

bit 0. So one byte counts bit 1 to 8 instead of bit 0 to 7.

Table 10. MIFARE ACK and NAK

Code (4-bit) Transfer Buffer Validity Description

Ah Acknowledge (ACK)

0h valid invalid operation

1h valid parity or CRC error

4h invalid invalid operation

5h invalid parity or CRC error

Table 11. ATQA response of the MF1S70yyX/V1

Bit Number

Sales Type Hex V alue 16 15 14 13 12 11 10 987654321

MF1S700yX 00 42h0000000001000010

MF1S703yX 00 02h0000000000000010

Table 12. SAK response of the MF1S70yyX/V1

Bit Number

Sales Type Hex Value 8 7 6 5 4 3 2 1

MF1S70yyX/V1 18 00011000

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

10. UID Options and Handling

The MF1S70yyX/V1 product family offers two delivery options for the UID which is stored

in block 0 of sector 0.

•7-byte UID

•4-byte NUID (Non-Unique ID)

This section describes the MIFARE Classic MF1S70yyX/V1 operation when using one of

the 2 UID options with re sp ec t to car d selection, authentic ati on and personalization. See

also Ref. 6 for details on how to handle UIDs and NUIDs with MIFARE Classic products.

10.1 7-byte UID Operation

All MF1S70yXDyy products are featuring a 7-byte UID. This 7-byte UID is stored in

block 0 of sector 0 as shown in Figure 7. The behaviour during anti-collision, selection and

authentication can be configured during personalization for this UID variant.

10.1.1 Personalization Options

The 7-byte UID variants of the MF1S70yyX/V1 can be oper ated with four diffe rent

functionalities, denoted as UIDFn (UID Functionality n).

1. UIDF0: anti-collision and selection with the double size UID according to ISO/IEC

14443-3

2. UIDF1: anti-collision and selection with the double size UID according to ISO/IEC

14443-3 and optional usage of a selection process shortcut

3. UIDF2: anti-collision and selection with a single size random ID according to ISO/IEC

14443-3

4. UIDF3: anti-collision and selection with a single size NUID according to ISO/IEC

14443-3 where the NUID is calculated out of the 7-byte UID

The anti-collision and selection procedure and the implications on the authentication

process are detailed in Section 10.1.2 and Section 10.1.3.

The default configuration at delivery is option 1 which enables the ISO/IEC 14443-3

compliant anti-collision and selection. This configuration can be changed using the

‘Personalize UID Usage’ command. The execution of this command requires an

authentication to sector 0. Once this command has been issued and accepted by the

PICC, the configuration is automatically locked. A subsequently issued ‘Personalize UID

Usage’ command is not executed and a NAK is replied by the PICC.

Remark: As the configuration is changeable at delivery, it is strongly recommended to

send this command at personalization of the card to prevent unwanted changes in the

field. This should also be done if the default configuration is used.

Remark: The configuration becomes effective only after PICC unselect or PICC field

reset.

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

10.1.2 Anti-collision and Selection

Depending on the chosen personalization option there are certain possibilities to perform

anti-collision and selection. To bring the MIFARE Classic into the ACTIVE state according

to ISO/IEC 14443-3, the following sequences are available.

Sequence 1: ISO/IEC 14443-3 compliant anti-collision and selection using the cascade

level 1 followed by the cascade level 2 SEL command

Sequence 2: using cascade level 1 anti-collision and selection procedure followed by a

Read command from block 0

Sequence 3: ISO/IEC 14443-3 compliant anti-collision and selection using the cascade

level 1 SEL command

Remark: The Read from Block 0 in Sequence 2 does not require a pri or auth entication to

Sector 0 and is transmit te d in pla in da ta. For all other sequences, the readout from Block

0 in Sector 0 is encrypted and requires an authentication to that sector.

Remark: The settin gs done with Perso nalize UID Usage do n ot change the ATQA coding.

Fig 12. Personalize UID Usage

Table 13. Personalize UID Usage command

Name Code Description Length

Cmd 40h Set anti-collision, selection and

authentication behaviour 1 byte

Type - Encoded type of UID usage:

UIDF0: 00h

UIDF1: 40h

UIDF2: 20h

UIDF3: 60h

1 byte

CRC - CRC according to Ref. 4 2 bytes

ACK, NAK see Table 10 see Section 9.3 4-bit

Table 14. Personalize UID Usage timing

TACK min TACK max TNAK min TNAK max TTimeOut

Personalize UID Usage n=9 TTimeOut n=9 TTimeOut 10 ms

368 µs 59 µs

ACK

NAK

NAK 59 µs

TimeOut

Cmd Type CRC

ACK

PCD

PICC `ACK`

TimeOut

PICC `NAK`

001aan919

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MIFARE Classic EV1 4K - Mainstream contactless smart card IC

10.1.3 Authentication

During the authentication process, 4-byte of the UID are pa ssed on to the MIF ARE Classic

Authenticate command of the contactless reader IC. Depending on the activation

sequence, those 4-byte are chosen differently. In general, the input parameter to the

MIFARE Classic Authenticate command is the set of 4 bytes retrieved during the last

cascade level from the ISO/IEC 14443-3 Type A anticollision.

10.2 4-byte UID Operation

All MF1S703yXDyy products are featuring a 4-byte NUID. This 4-byte NUID is stored in

block 0 of sector 0 as shown in Figure 6.

10.2.1 Anti-collision and Selection

The anti-collision and selection process for the product variants featuring 4-byte NUIDs is

done according to ISO/IEC 14443-3 Type A using cascade level 1 only.

10.2.2 Authentication

The input parameter to the MIFARE Classic Authenticate command is the full 4-byte UID

retrieved during the anti-collision procedure. This is the same as for the activation

Sequence 3 in the 7-byte UID variant.

11. Load Modulation Strength Option

The MIF ARE Classic EV1 4K features the possibility to set the load modulation strength to

high or normal. The default level is set to a high modulation strength and it is

recommended for optimal performance to maintain this level and only switch to the low

load modulation strength if the contactless system requires it.

Remark: The configuration becomes effective only after a PICC unselect or a PICC field

reset. The configuration can be changed multiple times by asserting the command.

Remark: The MIFARE Classic EV1 4K needs to be authenticated to secto r 0 with Key A

to perform the SET_MOD_TYPE command. The Access Bits for sector 0 are irrelevant.

Table 15. Available activation sequences fo r 7-byte UID options

UID Functionality Available Activation Sequences

UIDF0 Sequence 1

UIDF1 Sequence 1, Sequence 2

UIDF2 Sequence 3

UIDF3 Sequence 3

Table 16. Input parameter to MIFARE Classic Authenticate

UID Functionality Input to MIFARE Classic Authenticate Command

Sequence 1 CL2 bytes (UID3...UID6)

Sequence 2 CL1 bytes (CT, UID0...UID2)

Sequence 3 4-byte NUID/RID (UID0...UID3)

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The configured load modulation is shown in the manufacturer data of block 0 in sector 0.

The exact location is shown below in Figure 14 and Table 19.

Fig 13. SET_MOD_TYPE

Table 17. SET_MOD_TYPE command

Name Code Description Length

Cmd 43h Set load modulation strength 1 byte

Type - Encoded load modulation stre ngth:

strong modulation: 01h (default)

normal modul a ti on : 00h

1 byte

CRC - CRC according to Ref. 4 2 bytes

ACK, NAK see Table 10 see Section 9.3 4-bit

Table 18. SET_MOD_TYPE timing

TACK min TACK max TNAK min TNAK max TTimeOut

SET_MOD_TYPE n=9 TTimeOut n=9 TTimeOut 5 ms

Fig 14. Byte Location of Load Modulation Status in Block 0 / Sector 0

Table 19. Load Modulation Status Indication

Bit Number

Load Modulation Type Hex V alue 7 6 5 4 3 2 1 0

strong load modulation 20h (default) 0 0 1 0 0 0 0 0

normal load modulatio n 00h 0 0 0 0 0 0 0 0

368 µs 59 µs

ACK

NAK

NAK 59 µs

TimeOut

Cmd Type CRC

ACK

PCD

PICC `ACK`

TimeOut

PICC `NAK`

001aan919

aaa-012192

1514131211109876543

Block 0/Sector 0

21Byte 0

Load Modulation Status Byte

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12. MIFARE Classic commands

12.1 MIFARE Authentication

The MIFARE authentication is a 3-pass mutual authentication which needs two pairs of

command-response. These two p art s, MIF ARE authentication p art 1 and p art 2 are shown

in Figure 15, Figure 16 and Table 20.

Table 21 shows the required timing.

Fig 15. MIFARE Authentication part 1

Fig 16. MIFARE Authentication part 2

Table 20. MIFARE authentication command

Name Code Description Length

Auth (with Key A) 60h Authentication with Key A 1 byte

Auth (with Key B) 61h Authentication with Key B 1 byte

Addr - MIFARE Block address (00h to FFh) 1 byte

CRC - CRC according to Ref. 4 2 bytes

Token RB - Challenge 1 (Random Number) 4 bytes

Token AB - Challenge 2 (encrypted data) 8 bytes

Token BA - Challenge 2 (encrypted data) 4 bytes

NAK see Table 10 see Section 9.3 4-bit

001aan004

CRCAddrPCD Auth

Token RB

PICC ,,ACK''

368 μs359 μs

PICC ,,NAK'' NAK

Time out TTimeOut

TNAK

TACK

59 μs

TimeOut

ACK

Token AB

708 µs

Token BA

PCD

PICC `ACK`

TimeOut

359 µs

001aan917

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

Remark: The minimum requ ired time between MIFARE Authentication p art 1 and p art 2 is

the minimum required FDT according to Ref. 4. There is no maximum time specified.

Remark: The MIFARE authentication an d e ncryption r equ ires a n MIFARE reader IC (e.g.

the CL RC632). For more details about the authentication command refer to the

correspond in g da ta sheet (e.g . Ref. 5). The 4-byte input parameter for the MIFARE

Classic Authentication is detailed in Section 10.1.3 and Section 10.2.2.

12.2 MIFARE Read

The MIFARE Read requires a block address, and retur ns the 16 bytes of one

MIFARE Classic block. The command structure is shown in Figure 17 and Table 22.

Table 23 shows the required timing.

Table 21. MIFARE authentication timing

TACK min TACK max TNAK min TNAK max TTimeOut

Authentication part 1 n=9 TTimeOut n=9 n=9 1 ms

Authentication part 2 n=9 TTimeOut 1 ms

Fig 17. MIFARE Read

Table 22. MIFARE Read command

Name Code Description Length

Cmd 30h Read one block 1 byte

Addr - MIFARE Block address (00h to FFh) 1 byte

CRC - CRC according to Ref. 4 2 bytes

Data - Data content of the addressed block 16 bytes

NAK see Table 10 see Section 9.3 4-bit

Table 23. MIFARE Read timing

TACK min TACK max TNAK min TNAK max TTimeOut

Read n=9 TTimeOut n=9 TTimeOut 5 ms

001aan014

CRC

AddrPCD Cmd

Data

PICC ,,ACK''

368 μs1548 μs

PICC ,,NAK'' NAK

Time out TTimeOut

TNAK

TACK

59 μs

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12.3 MIFARE Write

The MIFARE Write requires a block address, and writes 16 bytes of data into the

addressed MIFARE Classic EV1 4K block. It needs two pairs of command-response.

These two parts, MIFARE Write part 1 and p art 2 are shown in Figure 18 and Figure 19

and Table 24.

Table 25 shows the required timing.

Fig 18. MIFARE Write part 1

Fig 19. MIFARE Write part 2

Table 24. MIFARE Write command

Name Code Description Length

Cmd A0h Write on e bl ock 1 byte

Addr - MIFARE Block or Page address (00h

to FFh) 1 byte

CRC - CRC according to Ref. 4 2 bytes

Data - Data 16 bytes

NAK see Table 10 see Section 9.3 4-bit

001aan015

CRCAddrPCD Cmd

PICC ,,ACK''

368 μs

PICC ,,NAK'' NAK

Time out T

TimeOut

NAK

ACK

59 μs

ACK

59 μs

001aan016

CRCPCD Data

PICC ,,ACK''

1558 μs

PICC ,,NAK'' NAK

Time out T

TimeOut

NAK

ACK

59 μs

ACK

59 μs

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Remark: The minimum required time between MIFARE Write part 1 and part 2 is the

minimum required FDT according to Ref. 4. There is no maximum time specified.

12.4 MIFARE Increment, Decrement and Restore

The MIFARE Increment requires a source block address and an operand. It adds the

operand to the value of the addressed block, and stores the result in the Transfer Buffer.

The MIFARE Decrement requires a source block address and an operand. It subtracts th e

operand from the value of the addressed block, and stores the result in the Transfer

Buffer.

The MIFARE Restore requires a source block address. It copies the value of the

addressed block into the Transfer Buffer. The 4 byte Operand in the second part of the

command is not used and may contain arbitrary values.

All three commands are re sponding with a NAK to the first command part if the addressed

block is not formatted to be a valid value block, see Section 8.6.2.1.

The two parts of each command are shown in Figure 20 and Figure 21 and Table 26.

Table 27 shows the required timing.

Table 25. MIFARE Write timing

TACK min TACK max TNAK min TNAK max TTimeOut

Write part 1 n=9 TTimeOut n=9 TTimeOut 5 ms

Write part 2 n=9 TTimeOut n=9 TTimeOut 10 ms

Fig 20. MIFARE Increment, Decrement, Restore part 1

001aan015

CRCAddrPCD Cmd

PICC ,,ACK''

368 μs

PICC ,,NAK'' NAK

Time out T

TimeOut

NAK

ACK

59 μs

ACK

59 μs

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NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

Remark: The minimum required time between MIFARE Increment, Decrement, and

Restore part 1 and part 2 is the minimum required FDT according to Ref. 4. There is no

maximum time specified.

Remark: The MIFARE Increment, Decrement, and Restore command s require a MIFARE

Transfer to store the value into a destination block.

Remark: The MIFARE Increment, Decrement, and Restore command part 2 does not

provide an acknowledgement, so the regular time out has to be used instead.

(1) Increment, Decrement and Restore part 2 does not acknowledge

Fig 21. MIFARE Increment, Decrement, Restore part 2

Table 26. MIFARE Increment, Decrement and Restore command

Name Code Description Length

Cmd C1h Increment 1 byte

Cmd C0h Decrement 1 byte

Cmd C2h Re store 1 byte

Addr - MIFARE source block address (00h to FFh) 1 byte

CRC - CRC according to Ref. 4 2 bytes

Data - Operand (4 byte signed integer) 4 bytes

NAK see Table 10 see Section 9.3 4-bit

Table 27. MIFARE Increment, Decrement and Restore timing

TACK min TACK max TNAK min TNAK max TTimeOut

Increment,

Decrement, and

Restore part 1

n=9 TTimeOut n=9 TTimeOut 5 ms

Increment,

Decrement, and

Restore part 2

n=9 TTimeOut n=9 TTimeOut 5 ms

001aan009

CRCPCD Data

PICC ,,ACK''

538 μs

PICC ,,NAK'' NAK

Time out T

TimeOut

NAK

59 μs

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12.5 MIFARE Transfer

The MIFARE T ransfer req uires a destination blo ck address, and writes the value sto red in

the Transfer Buffer into one MIFARE Class ic block. The command structure is shown in

Figure 22 and Table 28.

Table 29 shows the required timing.

Fig 22. MIFARE Transfer

Table 28. MIFARE Transfer command

Name Code Description Length

Cmd B0h Write the value from the Transfer

Buffer into destination block 1 byte

Addr - MIFARE destination block address

(00h to FFh) 1 byte

CRC - CRC according to Ref. 4 2 bytes

NAK see Table 10 see Section 9.3 4-bit

Table 29. MIFARE Transfer timing

TACK min TACK max TNAK min TNAK max TTimeOut

Transfer n=9 TTimeOut n=9 TTimeOut 10 ms

001aan015

CRCAddrPCD Cmd

PICC ,,ACK''

368 μs

PICC ,,NAK'' NAK

Time out T

TimeOut

NAK

ACK

59 μs

ACK

59 μs

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13. Limiting values

Stresses above one or more of the limiting values may cause permanent damage to the

device. Exposure to limiting values for extended periods may affect device reliability.

[1] ANSI/ESDA/JEDEC JS-001; Human body model: C = 100 pF, R = 1.5 k

14. Characteristics

[1] Tamb=22°C, f=13,56Mhz, VLaLb = 1,5 V RMS

Table 30. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Min Max Unit

IIinput current - 30 mA

Ptot/pack total power dissipation per package - 120 mW

Tstg storage temperature 55 125 C

Tamb ambient temperature 25 70 C

VESD electrostatic discharge voltage on LA/LB [1] 2- kV

Table 31. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Ciinput capacitance [1] 14.9 16.9 19.0 pF

fiinput frequency - 13.56 - MHz

EEPROM characteristics

tret retention time Tamb = 22 C10--year

Nendu(W) write endurance Tamb = 22 C 100000 200000 - cycle

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15. Wafer specification

For more details on the wafer delivery forms see Ref. 9.

[1] The step size and the gap between chips may vary due to changing foil expansion

[2] Pads VSS and TESTIO are disconnected when wafer is sawn.

15.1 Fail die identification

Electronic wafer mapping covers the electrical test results and additionally the results of

mechanical/visual inspection. No ink dots are applied.

Table 32. Wafer specifications MF1S70yyXDUy

Wafer

diameter 200 mm typical (8 inches)

maximum diameter after foil expansion 210 mm

thickness MF1S70yyXDUD 120 m 15 m

MF1S70yyXDUF 75 m 10 m

flatness not applicable

Potential Good Dies per Wafer (PGDW) 64727

Wafer backside

material Si

treatment ground and stress relieve

roughness Ramax = 0.5 m

Rtmax = 5 m

Chip dimensions

step size[1] x = 658 m

y = 713 m

gap between chips[1] typical = 19 m

minimum = 5 m

Passivation

type sandwich structure

material PSG / nitride

thickness 500 nm / 600 nm

Au bump (substrate connected to VSS)

material > 99.9 % pure Au

hardness 35 to 80 HV 0.005

shear strength > 70 MPa

height 18 m

height uniformity within a die = 2 m

within a wafer = 3 m

wafer to wafer = 4 m

flatness minimum = 1.5 m

size LA, LB, VSS, TEST[2] =66 m66 m

size variation 5 m

under bump metallization sputtered TiW

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15.2 Package outline

For more det ails on th e contactless modules MOA4 and MOA8 please refer to Ref. 7 an d

Ref. 8.

Fig 23. Package outline SOT500-2

UNIT D

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 35.05

34.95

For unspecified dimensions see PLLMC-drawing given in the subpackage code.

DIMENSIONS (mm are the original dimensions)

SOT500-2 03-09-17

06-05-22

- - - - - -- - -

PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-2

A(1)

max.

0.33

0 10 20 mm

scale

detail X

Note

1. Total package thickness, exclusive punching burr.

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Fig 24. Package outline SOT500-4

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT500-4 - - -

- - -

sot500-4_po

11-02-18

Unit

mm max

nom

min

0.26 35.05

35.00

34.95

A(1)

Dimensions

Note

1. Total package thickness, exclusive punching burr.

PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-4

For unspecified dimensions see PLLMC-drawing given in the subpackage code.

0 10 20 mm

scale

detail X

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16. Bare die outline

For more details on the wafer delivery forms, see Ref. 9.

(1) The air gap and thus the step size may vary due to varying foil expansion

(2) All dimensions in m, pad locations measured from metal ring edge (see detail)

Fig 25. Bare die outline MF1S70yyXDUz/V1

VSS

238

TESTIO

x [µm] y [µm]

658(1)

713(1)

Chip Step

Bump size

LA, LB, VSS, TEST

typ. 713(1)

typ. 18(1)

min. 5

typ. 18(1)

min. 5

633

aaa-012193

typ. 658(1)

578

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17. Abbreviations

Table 33. Abbreviatio ns and symbols

Acronym Description

ACK ACKnowledge

ATQA Answer To reQuest, Type A

CRC Cyclic Redundancy Check

CT Cascade Tag (value 88h) as defined in ISO/IEC 14443-3 Type A

EEPROM Electrically Erasable Programmable Read-Only Memory

FDT Frame Delay Time

FFC Film Frame Carrier

IC Integrated Circuit

LCR L = inductance, Capacitance, Resistance (LCR meter)

LSB Least Significant Bit

NAK Not AcKnowledge

NUID Non-Unique IDentifier

NV Non-Volatile memory

PCD Proximity Coupling Device (Contactless Reader)

PICC Proximity Inte grated Circuit Card (Contactless Card)

REQA REQuest command, Type A

RID Random ID

RF Radio Frequency

RMS Root Mean Squa r e

RNG Random Number Generator

SAK Select AcKnowledge, type A

SECS-II SEMI Equipment Communications Standard part 2

TiW Titanium Tungsten

UID Unique IDentifier

WUPA Wake-Up Protocol type A

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18. References

[1] MIFARE (Card) Coil Design Guide — Application note, BU-ID Document

number 0117**1

[2] MIFARE Type Identification Procedure — Application note, BU-ID Document

number 0184**1

[3] ISO/IEC 14443-2 — 2001

[4] ISO/IEC 14443-3 — 2001

[5] MIFARE & I-CODE CL RC632 Multiple protocol contactless read er IC —

Product data sheet

[6] MIFARE and handling of UIDs — Application note, BU-ID Document number

1907**1

[7] Contactless smart card module specification MOA4 — Delivery Type

Description, BU-ID Document number 0823**1

[8] Contactless smart card module specification MOA8 — Delivery Type

Description, BU-ID Document number 1636**1

[9] General specification for 8" wafer on UV-tape with electronic fail die marking;

delivery type s — Delivery Type Description, BU-ID Document number 10 93**1

1. ** ... document version number

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19. Revision history

Table 34. Revision history

Document ID Release date Data sheet status Change notice Supersedes

MF1S70yyX_V1 v.3.1 20140908 Product data sheet - MF1S70yyX_V1 v.3.0

Modifications: •NXP originality check support only for 1 kB memory version

•Wafer delivery specificatio n refe re nce corrected

MF1S70yyX_V1 v.3.0 20140303 Product data sheet - -

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20. Legal information

20.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) d escribed in th is docume nt may have changed since this docume nt was pub lished and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

20.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

20.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative li ability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessa ry

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property right s.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the prod uct specification.

Product data sheet

COMPANY PUBLIC Rev. 3.1 — 8 September 2014

279331 38 of 41

NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omo tive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applicati ons.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product cl aims resulting fr om customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

20.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

MIFARE — is a trademark of NXP Semiconductors N.V.

21. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet

COMPANY PUBLIC Rev. 3.1 — 8 September 2014

279331 39 of 41

NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

22. Tables

Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3

Table 3. Pin allocation table . . . . . . . . . . . . . . . . . . . . . . .4

Table 4. Value block format example . . . . . . . . . . . . . . .11

Table 5. Memory operations. . . . . . . . . . . . . . . . . . . . . .12

Table 6. Access conditions. . . . . . . . . . . . . . . . . . . . . . .13

Table 7. Access conditions for the sector trailer . . . . . .14

Table 8. Access conditions for data blocks. . . . . . . . . . .1 5

Table 9. Command overview . . . . . . . . . . . . . . . . . . . . .16

Table 10. MIFARE ACK and NAK . . . . . . . . . . . . . . . . . .18

Table 11. ATQA response of the MF1S70yyX/V1 . . . . . .18

Table 12. SAK response of the MF1S70yyX/V1. . . . . . . .18

Table 13. Personalize UID Usage command . . . . . . . . . .20

Table 14. Personalize UID Usage timing . . . . . . . . . . . . .20

Table 15. Available activation sequences for 7-byte

UID options. . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 16. Input parameter to MIFARE Classic

Authenticate . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 17. SET_MOD_TYPE command . . . . . . . . . . . . . .22

Table 18. SET_MOD_TYPE timing . . . . . . . . . . . . . . . . .22

Table 19. Load Modulation Status Indication . . . . . . . . . .22

Table 20. MIFARE authentication command . . . . . . . . . .23

Table 21. MIFARE authentication timing . . . . . . . . . . . . .24

Table 22. MIFARE Read command . . . . . . . . . . . . . . . . .24

Table 23. MIFARE Read timing . . . . . . . . . . . . . . . . . . . .2 4

Table 24. MIFARE Write command . . . . . . . . . . . . . . . . .25

Table 25. MIFARE Write timing . . . . . . . . . . . . . . . . . . . .26

Table 26. MIFARE Increment, Decrement

and Restore command . . . . . . . . . . . . . . . . . . .27

Table 27. MIFARE Increment, Decrement

and Restore timing . . . . . . . . . . . . . . . . . . . . . .27

Table 28. MIFARE Transfer command. . . . . . . . . . . . . . .28

Table 29. MIFARE Transfer timing . . . . . . . . . . . . . . . . . .28

Table 30. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .29

Table 31. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .29

Table 32. Wafer specifications MF1S70yyXDUy . . . . . . .30

Table 33. Abbreviations and symbols . . . . . . . . . . . . . . .34

Table 34. Revision history . . . . . . . . . . . . . . . . . . . . . . . .36

Product data sheet

COMPANY PUBLIC Rev. 3.1 — 8 September 2014

279331 40 of 41

NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

23. Figures

Fig 1. Contactless MIFARE system . . . . . . . . . . . . . . . . .1

Fig 2. Block diagram of MF1S70yyX/V1 . . . . . . . . . . . . .3

Fig 3. Pin configuration for SOT500-2 (MOA4) . . . . . . . .4

Fig 4. MIFARE Classic command flow diagram. . . . . . . .6

Fig 5. Memory organization . . . . . . . . . . . . . . . . . . . . . . .9

Fig 6. Manufacturer block for MF1S503yX with 4-byte

NUID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Fig 7. Manufacturer block for MF1S500yX with 7-byte

UID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Fig 8. Value blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Fig 9. Sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Fig 10. Access conditions . . . . . . . . . . . . . . . . . . . . . . . .13

Fig 11. Frame Delay Time (from PCD to PICC)

and TACK and TNAK. . . . . . . . . . . . . . . . . . . . . . . .17

Fig 12. Personalize UID Usage . . . . . . . . . . . . . . . . . . . .2 0

Fig 13. SET_MOD_TYPE . . . . . . . . . . . . . . . . . . . . . . . .22

Fig 14. Byte Location of Load Modulation Status in

Block 0 / Sector 0. . . . . . . . . . . . . . . . . . . . . . . . .22

Fig 15. MIFARE Authentication part 1 . . . . . . . . . . . . . . .23

Fig 16. MIFARE Authentication part 2 . . . . . . . . . . . . . . .23

Fig 17. MIFARE Read . . . . . . . . . . . . . . . . . . . . . . . . . . .24

Fig 18. MIFARE Write part 1 . . . . . . . . . . . . . . . . . . . . . .25

Fig 19. MIFARE Write part 2 . . . . . . . . . . . . . . . . . . . . . .25

Fig 20. MIFARE Increment, Decrement, Restore part 1 .26

Fig 21. MIFARE Increment, Decrement, Restore part 2 .27

Fig 22. MIFARE Transfer. . . . . . . . . . . . . . . . . . . . . . . . .28

Fig 23. Package outline SOT500-2 . . . . . . . . . . . . . . . . .31

Fig 24. Package outline SOT500-4 . . . . . . . . . . . . . . . . .32

Fig 25. Bare die outline MF1S70yyXDUz/V1. . . . . . . . . .33

NXP Semiconductors MF1S70yyX/V1

MIFARE Classic EV1 4K - Mainstream contactless smart card IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 September 2014

279331

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

24. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.1 Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 Simple integration and user convenience. . . . . 1

1.3 Security and privacy. . . . . . . . . . . . . . . . . . . . . 1

1.4 Delivery options . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2

2.1 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Block description . . . . . . . . . . . . . . . . . . . . . . . 5

8.2 Communication principle . . . . . . . . . . . . . . . . . 5

8.2.1 Re quest standard / all. . . . . . . . . . . . . . . . . . . . 5

8.2.2 Anticollision loop. . . . . . . . . . . . . . . . . . . . . . . . 5

8.2.3 Select card . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8.2.4 Three pass authentication . . . . . . . . . . . . . . . . 6

8.2.5 Memory operations. . . . . . . . . . . . . . . . . . . . . . 7

8.3 Data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . . 7

8.4 Three pass authentication sequence . . . . . . . . 7

8.5 RF interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

8.6 Memory organization . . . . . . . . . . . . . . . . . . . . 8

8.6.1 Manufacturer block. . . . . . . . . . . . . . . . . . . . . 10

8.6.2 Data blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

8.6.2.1 Value blocks . . . . . . . . . . . . . . . . . . . . . . . . . . 10

8.6.3 Sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . 11

8.7 Memory access . . . . . . . . . . . . . . . . . . . . . . . 12

8.7.1 Access conditions. . . . . . . . . . . . . . . . . . . . . . 13

8.7.2 Access co nditions for the sector trailer. . . . . . 14

8.7.3 Access co nditions for data blocks. . . . . . . . . . 15

9 Command overview. . . . . . . . . . . . . . . . . . . . . 16

9.1 MIFARE Classic command overview . . . . . . . 16

9.2 Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

9.3 MIFARE Classic ACK and NAK . . . . . . . . . . . 18

9.4 ATQA and SAK responses . . . . . . . . . . . . . . . 18

10 UID Options and Handling . . . . . . . . . . . . . . . 19

10.1 7-byte UID Operation . . . . . . . . . . . . . . . . . . . 19

10.1.1 Personalization Op tions . . . . . . . . . . . . . . . . . 19

10.1.2 Anti-collision and Selection. . . . . . . . . . . . . . . 20

10.1.3 Authentication. . . . . . . . . . . . . . . . . . . . . . . . . 21

10.2 4-byte UID Operation . . . . . . . . . . . . . . . . . . . 21

10.2.1 Anti-collision and Selection. . . . . . . . . . . . . . . 21

10.2.2 Authentication. . . . . . . . . . . . . . . . . . . . . . . . . 21

11 Load Modulation Strength Option. . . . . . . . . 21

12 MIFARE Classic commands. . . . . . . . . . . . . . 23

12.1 MIFARE Authentication . . . . . . . . . . . . . . . . . 23

12.2 MIFARE Read . . . . . . . . . . . . . . . . . . . . . . . . 24

12.3 MIFARE Write . . . . . . . . . . . . . . . . . . . . . . . . 25

12.4 MIFARE Increment, Decrement and Restore 26

12.5 MIFARE Transfer . . . . . . . . . . . . . . . . . . . . . . 28

13 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 29

14 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 29

15 Wafer specification . . . . . . . . . . . . . . . . . . . . . 30

15.1 Fail die identification . . . . . . . . . . . . . . . . . . . 30

15.2 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 31

16 Bare die outline. . . . . . . . . . . . . . . . . . . . . . . . 33

17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 34

18 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

19 Revision history . . . . . . . . . . . . . . . . . . . . . . . 36

20 Legal information . . . . . . . . . . . . . . . . . . . . . . 37

20.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 37

20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 37

20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 38

21 Contact information . . . . . . . . . . . . . . . . . . . . 38

22 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

23 Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

24 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

NXP:

MF1S7001XDUD,005 MF1S7031XDUD,005 MF1S7031XDUF/V1V MF1S7031XDUD/V1V MF1S7001XDUF/V1V

MF1S7001XDUD/V1V