Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION * Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. * No switch ON/OFF clicks * Excellent power supply ripple rejection * Low power consumption * Short-circuit resistant * High performance - high signal-to-noise ratio - high slew rate - low distortion * Large output voltage swing. QUICK REFERENCE DATA VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL VDD PARAMETER CONDITIONS MIN. TYP. MAX. UNIT supply voltage single dual 3.0 5.0 7.0 V 1.5 2.5 3.5 V -1.5 -2.5 -3.5 V no load - 3 5 mA total power dissipation no load - 15 25 mW Po maximum output power THD < 0.1%; note 1 - 60 - mW (THD + N)/S total harmonic distortion plus note 1 noise-to-signal ratio - 0.03 0.06 % - -70 -65 dB dB VSS negative supply voltage IDD supply current Ptot - -101 - S/N signal-to-noise ratio 100 110 - dB cs channel separation - 70 - dB - 105 - dB PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV - 90 - dB Tamb operating ambient temperature -40 - +85 C RL = 5 k RL = 5 k Note 1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 August 1994 2 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 BLOCK DIAGRAM Fig.1 Block diagram. PINNING SYMBOL OUTA PIN 1 DESCRIPTION output A INA(neg) 2 inverting input A INA(pos) 3 non-inverting input A VSS 4 negative supply INB(pos) 5 non-inverting input B INB(neg) 6 inverting input B OUTB 7 output B VDD 8 positive supply Fig.2 Pin configuration. August 1994 3 Philips Semiconductors Product specification TDA1308 Fig.3 Equivalent schematic diagram. Class AB stereo headphone driver August 1994 4 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL PARAMETER VDD supply voltage tSC(O) output short-circuit duration Tstg storage temperature Tamb operating ambient temperature Vesd electrostatic discharge CONDITIONS Tamb = 25 C; Ptot = 1 W MIN. MAX. UNIT 0 8.0 V 20 - s -65 +150 C -40 +85 C note 1 -2000 +2000 V note 2 -200 +200 V Notes 1. Human body model: C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative. 2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 ; 3 pulses positive plus 3 pulses negative. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER VALUE UNIT DIP8 109 K/W SO8 210 K/W thermal resistance from junction to ambient in free air QUALITY SPECIFICATION In accordance with "UZW-BO/FQ-0601". The numbers of the quality specification can be found in the "Quality Reference Handbook". The handbook can be ordered using the code 9398 510 63011. August 1994 5 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 CHARACTERISTICS VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V -1.5 -2.5 -3.5 V VSS negative supply voltage IDD supply current no load - 3 5 mA Ptot total power dissipation no load - 15 25 mW DC characteristics VI(os) input offset voltage - 10 - mV Ibias input bias current - 10 - pA VCM common mode voltage 0 - 3.5 V Gv open-loop voltage gain RL = 5 k - 70 - dB IO maximum output current (THD + N)/S < 0.1% - 60 - mA RO output resistance VO output voltage swing PSRR power supply rejection ratio cs channel separation - 0.25 - note 1 0.75 - 4.25 V V RL = 16 ; note 1 1.5 - 3.5 RL = 5 k; note 1 0.1 - 4.9 V fi = 100 Hz; Vripple(p-p) = 100 mV - 90 - dB - 70 - dB - 105 - dB - - 200 pF RL = 5 k CL load capacitance AC characteristics (THD + N)/S total harmonic distortion plus note 2 noise-to-signal ratio note 2; RL = 5 k - -70 -65 dB - 0.03 0.06 % - -101 - dB - 0.0009 - % 100 110 - dB S/N signal-to-noise ratio fG unity gain frequency open-loop; RL = 5 k - 5.5 - MHz Po maximum output power (THD + N)/S < 0.1% - 60 - mW Ci input capacitance - 3 - pF SR slew rate unity gain inverting - 5 - V/s B power bandwidth unity gain inverting - 20 - kHz Notes 1. Values are proportional to VDD; (THD + N)/S < 0.1%. 2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB). August 1994 6 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 TEST AND APPLICATION INFORMATION Fig.4 Measurement circuit for inverting application. Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC). August 1994 7 Philips Semiconductors Product specification Class AB stereo headphone driver Fig.6 Open-loop gain as a function of input frequency. Fig.8 Output power as a function of supply voltage. August 1994 TDA1308 Fig.7 8 Crosstalk as a function of input frequency. Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency. Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level. August 1994 9 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 PACKAGE OUTLINES 8.25 7.80 9.8 9.2 seating plane handbook, full pagewidth 3.2 max 4.2 max 0.51 min 3.60 3.05 2.54 (3x) 1.15 max 0.53 max 0.254 M 7.62 1.73 max 8 0.38 max 10.0 8.3 5 6.48 6.20 1 4 Dimensions in mm. Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1. August 1994 10 MSA252 - 1 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 4.0 3.8 5.0 4.8 handbook, full pagewidth S A 6.2 5.8 0.1 S 0.7 0.3 5 8 0.7 0.6 1.45 1.25 1 4 1.0 0.5 0.25 0.10 pin 1 index detail A 1.27 0.49 0.36 1.75 1.35 0.25 0.19 0 to 8 o MBC180 - 1 0.25 M (8x) Dimensions in mm. Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1). August 1994 11 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 SOLDERING BY SOLDER PASTE REFLOW Plastic dual in-line packages Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) REPAIRING SOLDERED JOINTS Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small outline packages BY WAVE For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. August 1994 12 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1994 13 V. Table 1 Prefix ADC AM AU DAC FB ICM LF LM MB MC N, NE P PL PZ S/SC SA SE SG A PRODUCT LISTING EXPLANATION FAMILY PREFIX AND DEVICE TEMPERATURE = = = = = = = = = = = = = = = = = = = Alternate to National part number Alternate to AMD part number Automotive -40 to +125C Alternate to P.M.I. part number Futurebus+, 0C to +70C Alternate to lntersil part number Alternate to National part number Alternate to National part number MULTIBYTETM, -40'C to +85'C Alternate to Motorola part number OC to +70C (O to +75 C for 9300) Philips Programmable Logic Programmable Logic/Philips Zero Power MCO Microcontroller -40C to +85 C -55C to +125C Alternate to Silicon General part number Alternate to National part number Table 2 A/WP B/BB/BC/BE/BG BD BF/BH/BK D DB/DK/DL F FE GW M MSC N/P PW/DH/DG/DGG NB SC/SD U PACKAGE DESCRIPTIONS = Leaded Chip Carrier (PLCC) = Plastic Quad Flat Package(PQFP) - Dry Pack handling required = Low Profile quad Flat Package(LQFP) = Shrink quad Flat Package(SQFP) = Plastic Small Outline (SO/SOL) = Shrink Small Outline Package (SSOP) = Ceramic Dual In-Line = Hermetic CERDIP - 8 lead = Pcio Gate = Module = Miscellaneous = Plastic Dual In-Line (DIL) = Thin Shrink Small Outline Package (TSSOP) = 42 Pin Shrink Dual In-Line (DIL) = Microprocessor Support = Plastic Single In-Line (SIL) ** The DH on PW and G on some DGG Part Package Codes have been removed due to Space constraints in this price book. Table 3 - PRODUCT FAMILY ABBR BIC CLI CON DC DSG IND LIC LOG LV MCO MM MOS MST PDI PLD PRM RF TEL PRODUCT FAMILY BiCMOS Logic CMOS Logic (CLIC) Consumer Multimedia Digital/Linear Data Comm/FB+ Discrete Identification Contact Linear Industrial Bipolar Logic Low Voltage Microprocessor, Microcontrollers, CRT (Sunnyvale) Multimedia MOS Microcontrollers/Hamburg Mass Storage/Motor Control Philips Digital Interface Programmable Logic Devices Proms Wireless/RF Products Telecom Table 4 - COLUMN HEADING EXPLANATIONS PART NUMBER N74F244D N74F244D-T N74F244N CROSS REF. PRD FAM PRODUCT DESCRIPTION SPQ P/C LOG LOG Octal Buffer 3 State Octal Buffer 3 State 1520 1000 20 Product FamilySee Table 3 Pin Count Description of Product Quantity per tube/reel/box Industry Standard Part Number -Complexity of LOG Parts -Product Discontinuation Notice (DN-##) -Dry Pack Indicator Special Packaging Alternatives - see following page Package Code - See Table 2 Device Number Family Prefix and Device Temperature - See Table 1 04/00 v VII. COMMERCIAL PRODUCT SPECIAL PROCESSING SPECIAL PACKAGING ALTERNATIVES SPECIFICATIONS Tape and Reel specifications conform to Electronic Industries Association (EIA) standard EIA-481-1, EIA-481-2, EIA-481-3, and EIA-468-B. DEVICE AVAILABILITY Plastic Leaded Chip Carrier (PLCC) and Plastic Small Outline (SO/SOL/SSOP/TSSOP) parts are available in tape and reel packaging. Products available in tape and reel are identified in the Price Book with a "-T" (13") or "-G" (7") added to the end of basic part number (e.g. N74F379AD-T or TDA1543TD-G). Return of product MUST be in full reels with unbroken quality seals. Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are identified in the Price Book with a "-S" added to the end of basic part number (e.g. SAB9075HB-S). Return of product MUST be in original container with unbroken quality seals. VII. DRY PACK HANDLING Philips Semiconductors is providing moisture barrier protection for plastic Surface Mount Technology (SMT) lCs prior to shipping/storage. This protection is designed to minimize the absorption of water into the body of the package in high humidity environments and later causing damage to itself when exposed to the rapid thermal heating associated with surface mount printed circuit board assembly. As the package is heated, moisture inside the package rapidly heats and vaporizes, generating pressure within the package, which can result in package cracking. Philips Semiconductors has conducted susceptibility testing on its entire line of SMT packages and has found that certain combinations of package outlines and lead frames are sensitive to this accelerated test. These packages include specific, but not all varieties of Small Outline SO/SSOP-16/24/28 lead, Plastic Leaded Chip Carrier (PLCC)32/52/68/84 lead, and all Plastic Quad Flat Pack (PQFP). Philips Semiconductors products that are dry packed are indicated in the price book with "DRY PACK" entered next to the device in the "Cross Ref column. The dry packing process begins with a 24-hour bake at 125C after electrical test to remove any moisture build-up within the package. Product is then packed under a partial vacuum in a moisture barrier bag containing desiccant and a humidity indicator card. The bag interior is maintained at a relative humidity (RH) level of less than 30%. Once outside the bag (in a typical factory environment of 20C to 30C and 50% to 70% RH), product should be used within 48 hours. If this time is exceeded, or upon opening the bag, the humidity indicator card registers pink on the 20% level, the product should be baked at 125C for 24 hours. Product must be baked in metal tubes, not the plastic tubes or reels in which it was shipped. PQFP products packed in trays can be baked at 125C. Philips Semiconductors complies with the recommendations of the NEDA Semiconductor Packing and Handling Committee for Moisture Sensitive Plastic Surface Mount Components that is incorporated in NIGP 103.00. Our internal specifications are available upon request from Ron Deetz, 408-991-3892: 1) 874-0086, General Operator Dry Packing Requirements; and 2) 874-0083, General Operator Dry Packing. Dry packed products must be ordered in full tube or full tray increments and must also meet the order minimums as determined by each device's Price Book inventory code (I/C). Only factory Q.A. sealed containers, undamaged, with all labels intact are eligible for stock rotation. Philips Semiconductors recommends that the minimum quantity be imposed as a minimum buy to distributor's end customer. vi 04/00 VIII. PACKING QUANTITY INFORMATION CERAMIC DUAL IN-LINE (CERDIP) PACKAGE CODE FE F F F F/FA F F/FA/F24 F F F/FA/F28 F/FA/F40 PIN COUNT 8-pin (300 mil) 14-pin (300 mil) 16-pin (300 mil) 18-pin (300 mil) 20-pin (300 mil) 22-pin (400 mil) 24-pin (300 mil) 24-pin (400 mil) 24-pin (600 mil) 28-pin (600 mil) 40-pin (600 mil) QUANTITIES DEVICES DEVICES PER TUBE PER BOX 48 1920 25 1000 25 1000 21 840 20 800 17 544 15 600 15 480 15 360 13 312 9 216 CERQUAD PACKAGE CODE K/KA/K44 K/KA/K68 KA PIN COUNT 44-pin 68-pin 84-pin QUANTITIES DEVICES DEVICES PER TRAY PER BOX 6 6 4 4 42 210 QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF THAT QUANTITY. 04/00 vii VIII. PACKING QUANTITY INFORMATION PLASTIC DUAL IN-LINE PACKAGE CODE N/N8 N/N14 N N N N N N N N/N3/N24 N/N24 N N N N/N3 N/N28 N N N N/N40 N NB (Shrink) N/NB N/N48 N N N/N64 QUANTITIES DEVICES DEVICES PER TUBE PER BOX 50 * 2000 25 * 1000 28 * 1120 20 800 22 880 25 1000 18 * 720 20 * 800 17 544 15 600 15 480 15 360 17 510 25 1000 13 520 13 312 15 450 11 264 19 760 9 216 10 300 12 288 14 420 7 168 7 112 10 240 5 80 PIN COUNT 8-pin (300 mil) 14-/16-pin (300 mil) 14-/16-pin (300 mil long tube) 18-pin (300 mil) 18-pin (standard tube) 18-pin (long tube) 20-pin (300 mil) 20-pin (long tube) 22-pin (400 mil) 24-pin (300 mil) 24-pin (400 mil) 24-pin (600 mil) 24-pin (600 mil long tube) 24-pin (600 mil long tube) 28-pin (300 mil) 28-pin (600 mil) 28-pin (600 mil long tube) 32-pin (600 mil) 28-pin (600 mil shrink) 40-pin (600 mil) 40-pin (600 mil long tube) 42-pin (600 mil) 42-pin (600 mil long tube) 48-pin (600 mil) 50-pin (900 mil) 52-pin (600 mil) 64-pin (900 mil) * Selected part types in these packages may be subject to full box multiples. Refer to specific part "PQ" for minimum purchase amount. PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGE CODE A A/A28 A A A/A44 A/A44 A/A52 A/A68 A/A84 PIN COUNT 20-pin 28-pin 28-pin 32-pin 44-pin 44-pin 52-pin 68-pin 84-pin DEVICES PER TUBE 46 37 34 31 26 26 23 18 15 QUANTITIES DEVICES PER BOX 3680 2368 2176 2232 1248 1300 1012 648 420 DEVICES PER REEL 1000 750 750 750 500 500 500 250 250 QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF THAT QUANTITY. VIII. PACKING QUANTITY INFORMATION viii 04/00 PLASTIC QUAD FLAT PACK (PQFP) PACKAGE CODE B/BD B B B/B44 BC/BD B/BE BB B/BD BG B/BA/BB1 BE BE/BP B/BB1 B BE BH B/BB BF PIN COUNT 32-pin LQFP ( 7x7) 32-Pin LQFP (5x5) 44-pin QFP (14x14) 44-pin QFP (10x10) 44-pin LFQP (10x10) 48-pin LQFP (7x7) 52-pin QFP (10x10) 64-pin LQFP (10x10) 64-pin QPF (14x14) 64/80-pin QFP (14x20) 80-pin LQFP (12x12) 100-pin TQFP (14x14) 100-pin QFP (14x20) 120-pin QFP (28x28) 128-pin LQFP (14x20) 128-pin SQFP (14x20) 128/160-pin QFP (28x28) 208-pin SQFP (28x28) DEVICES PER 5 TRAY 1250 1800 420 480 800 1250 480 800 420 330 595 450 330 120 360 330 120 120 QUANTITIES DEVICES PER SINGLE TRAY 250 360 84 96 160 250 96 160 84 66 119 90 66 24 72 66 24 24 DEVICES PER REEL 2000 2000 500 1500 1500 2000 500 600 500 1000 1000 - QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF THAT QUANTITY. 04/00 ix VIII. PACKING QUANTITY INFORMATION PLASTIC SMALL OUTLINE (SO/SOL/SSOP/TSSOP) PACKAGE CODE D/D8 D D/D14 DB (SSOP) PW/DH (TSSOP) D DB (SSOP) D PW/DH (TSSOP) DK (SSOP) DK (SSOP) DB (SSOP) PW/DH (TSSOP) D DB (SSOP) PW/DH (TSSOP) D DB (SSOP) D D D DG/DGG (TSSOP) DL (SSOP) DG/DGG (TSSOP) DL (SSOP) D PIN COUNT 8-pin (Small) 8-pin (Large) 14-pin (Small) 14-pin (Medium) 14-pin 16-pin (Small) 16-pin (Medium) 16-pin (Large) 16-pin 16-pin 20-pin (Small) 20-pin (Medium) 20-pin 20-pin (Large) 24-pin (Medium) 24-pin 24-pin (Large) 28-pin (Medium) 28-pin (Large) 32-pin (Large) 40-pin (VSO-40) 48-pin 48-pin (Large) 56-pin 56-pin (Large) 56-pin (VSO-56) DEVICES PER TUBE 100 * 64 * 57 * 78 96 50 * 78 48 * 96 93 75 66 75 38 * 59 63 30 47 27 24 31 39 31 35 26 22 QUANTITIES DEVICES PER BOX 2000 2560 1140 1092 2400 1000 1092 1920 2400 1674 1350 924 1875 1520 826 1575 1200 658 1080 960 1240 975 1581 875 1326 616 DEVICES PER REEL 2500 1000 2500 2000 2500 2500 2000 1000 2500 2500 2500 1000 2500 2000 1000 2500 1000 1000 1000 1000 500 2000 1000 2000 1000 500 * Selected part types in these packages may be subject to full box multiples. Refer to specific part "PQ" for minimum purchase amount. QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF THAT QUANTITY. x 04/00 IX. PRODUCT IDENTIFICATION 4000 CMOS PRODUCTS Example: H E F 4 X X X X X X Philips North America Package Code: D = Plastic SO N = Plastic Dual In-Line DB = Shrink Small Outline (SSOP) Philips Package Code on part: P = Plastic Dual In-Line T = Plastic SO S = Shrink Small Outline (SSOP) B = JEDEC "B" series CMOS specification 4XXX = Device number up to 5 digits F = Limited Family Identification BiCMOS PRODUCTS - ABT Example 74 ABT XXX X Package Code: A = Plastic Leaded Chip Carrier (PLCC) D = Plastic SO DB = Shrink Small Outline (SSOP) N = Plastic Dual In-Line PW = Thin Shrink Small Outline (TSSOP) Device Number Designates Advanced BiCMOS TTL Process 74 = Commercial Operating Temperature Range: -40C to +85C BiCMOS PRODUCTS - ABT16 Example 74 ABT 16 XXX X Package Code: DL = Shrink Small Outline (SSOP) DG = Thin Shrink Small Outline (TSSOP) Device Number 16 Bit Designates Advanced BiCMOS TTL Process 74 = Commercial Operating Temperature Range: -40C to +85C BiCMOS PRODUCTS - 3.3V LVT Example 74 LVT XXX D Package Code: D = Plastic SO DB = Shrink Small Outline (SSOP) PW = Thin Shrink Small Outline (TSSOP) Device Number 3.3V Device Family 74 = Commercial Operating Temperature Range: -40C to +85C 04/00 xi IX. PRODUCT IDENTIFICATION BiCMOS PRODUCTS - 3.3V LVT16 Example 74 LVT 16 XXX DL Package Code: DL = Shrink Small Outline (SSOP) DG = Thin Shrink Small Outline (TSSOP) Device Number 16 Bit 3.3V BiCMOS 74 = Commercial Operating Temperature Range: -40C to +85C CONSUMER & INDUSTRIAL PRODUCTS PREFIXES PC, SA, TD, TE, TS, UA, UM Example: Device Family: PCx SAx TDx TEx TSx UAx UMx TD = = = = = = = CMOS Circuit Digital Circuit Linear Circuit Linear Circuit Analog Circuit Digital Circuit Digital Circuit A XXXX P N Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) N = Plastic Dual In-Line D = Plastic SO DK = Shrink Small Outline Package (SSOP) F = Ceramic Dual In-Line U = Plastic Single In-Line Package Code on Part: GP = Quad Flat Pack (QFP) P = Plastic Dual In-Line T = Plastic SO D = Ceramic Dual In-Line M = Shrink Small Outline Package (SSOP) WP = Plastic Leaded Chip Carrier (PLCC) Device Number Operating Temperatures: A = Temperature range no specified (see data sheet) B = 0C to 70C C = -55C to +125C D = -25C to +70C E = -25C to +85C F = -40C to +85C xii 04/00 IX. PRODUCT IDENTIFICATION DATA COMMUNICATIONS, LOCAL AREA NETWORK, FUTUREBUS+ Example 1: S C N X X X X X C N 4 Philips Designator 8 Pin Count: 14, 16, 20, 24, 28, 40, 48, etc. Process: N = N - Channel C = C - Channel Package Code: A = Plastic Leaded Chip Carrier (PLCC) N = Plastic Dual In-Line F = Ceramic Dual In-Line Device Number See individual data sheets Temperature: C = 0C to +70C (Commercial) A = -40C to +85C (Industrial) M = -55C to +125C (Military) E = -40C to +85C (Industrial) Example 2: S C X X C X X X C 1 Philips Designator Package Code: A = Plastic Leaded Chip Carrier (PLCC) N = Plastic Dual In-Line Device Number See individual data sheets Timing Variation: 1 = Normal Process/Power Variation: C = CMOS 5V L = CMOS 3V Example 3: A Temperature: C = 0C to +70C (Commercial) A = -40C to +85C (Industrial) N E 8 3 X 9 2 A Philips Designator Package Code: A = Plastic Leaded Chip Carrier (PLCC) N = Plastic Dual In-Line F = Ceramic Dual In-Line D = Plastic Small Outline Device Number See individual data sheets Applications Designator (See Data Sheets) Example 4: F B X X X X B B Package Code: A = Plastic Leaded Chip Carrier (PLCC) BB = Quad Flat Pack (QFP) Device Number Designates Futurebus+ Product Temperature Range: 0C to +70C For Industrial -- Contact Factory 04/00 xiii IX. PRODUCT IDENTIFICATION FIBER OPTIC, LINE DRIVERS/RECEIVERS, MODEMS Example 1: NE XXXX N Package Code: D = Plastic SO N = Plastic Dual In-Line Device Number Device Family and Temperature Range Prefix: NE = 0C to +70C SE = -55C to +125C SA = -40C to +85C Example 2: AM XX LS XX C N Generic Industry Prefix Package Code: D = Plastic SO N = Plastic Dual In-Line Device Number See individual data sheets Device Family and Temperature Range Prefix: C = 0C to +70C M = -55C to +125C I = -40C to +85C Generic Industry ID HIGH-SPEED CMOS PRODUCTS Example: 74 HC XXXXX N Package Code: D = Plastic SO N = Plastic Dual In-Line Device Number HC = CMOS input switching levels, supply voltage range 2V to 6V, fully buffered. HCT = TTL input switching levels, supply voltage range 4.5V to 5.5V, fully buffered 74 = Standard Temperature Range: -40C to +125C LOGIC PRODUCTS - ALS/FAST Example: N 74FXXX N Package Code Device Number Temperature Range TEMPERATURE RANGE N = Commercial Range 0C to 70C xiv DEVICE NUMBER 74ALSXXX 74FXX PACKAGE CODE A = Plastic Leaded Chip Carrier (PLCC) D = Plastic SO F = Ceramic Dual In-Line N = Plastic Dual In-Line 04/00 IX. PRODUCT IDENTIFICATION LINEAR AND RF PRODUCTS Example: NE XXXX N Package Code: A = Plastic Leaded Chip Carriers (PLCC) D = Plastic SO DK = Shrink Small Outline (SSOP) F = Ceramic Dual In-Line FE = Hermetic Cerdip (8 Lead) N = Plastic Dual In-Line Device Number Device Family and Temperature Range Prefix: AU = -40C to +125C NE = 0C to +70C SE = -55C to +125C SA = -40C to +85C LOW VOLTAGE (3.3V CMOS) LOGIC - ALVC16 D Example: 74ALVC16XXX Package Code Device Number TEMPERATURE RANGE Tamb = -40C to +85C DEVICE NUMBER 74ALVC16XXX PACKAGE CODE D = Plastic SO DL = Shrink Small Outline (SSOP) DG = Thin Shrink Small Outline (TSSOP) LOW VOLTAGE (3.3V CMOS) LOGIC - HLL D Example: 74HL33XXX Package Code Device Number TEMPERATURE RANGE Tamb = -40C to +85C DEVICE NUMBER 74HL33XXX PACKAGE CODE D = Plastic SO DB = Shrink Small Outline (SSOP) PW = Thin Shrink Small Outline (TSSOP) LOW VOLTAGE (3.3V CMOS) LOGIC - LV D Example: 74LVXXX Package Code Device Number TEMPERATURE RANGE Tamb = -40C to +85C DEVICE NUMBER 74LVXXX PACKAGE CODE D = Plastic SO DB = Shrink Small Outline (SSOP) N = Plastic Dual In-Line LOW VOLTAGE (3.3V CMOS) LOGIC - LVC D Example: 74LVCXXX Package Code Device Number TEMPERATURE RANGE Tamb = -40C to +85C 04/00 DEVICE NUMBER 74LVC16XXX PACKAGE CODE D = Plastic SO DB = Shrink Small Outline (SSOP) PW = Thin Shrink Small Outline (TSSOP) xv IX. PRODUCT IDENTIFICATION MICROCONTROLLER PRODUCTS Example: P8 X C XXX E B P N Memory Options: 0 = ROMLESS 3 = ROM 7 = OTP-EPROM 9 = FEEPROM (FLASH) Philips North America Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) N = Plastic Dual In-Line Philips Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) F = Hermetic Cerdip (window) L = Cerdip (Window)) P = Plastic Dual In-Line Q = Ceramic Quad Flat Pack (Window) T = Small Outline (SO) Device Number Speed: C = 3.5MHz to 12MHz D = 0MHz to 20MHz E = 3.5MHz to 16mhz F = 1.2Mhz to 16MHz G = 3.5MHz to 20MHz H = 32KHz to 12MHz I = 3.5MHz to 24MHz N = 3.5MHz to 33MHz P = 3.5MHz to 40MHz S = 0MHz to 16MHz T = 0MHz to 24MHz U = 0MHz to 33MHz Example: Memory Options: 0 = ROMLESS 3 = ROM 7 = OTP-EPROM 9 = FEEPROM (FLASH) Device Number FXFX+ FX2 xvi Temperature: B = 0C to 70C F = -40C to +85C H = -40C to +125C P 8 X C 51 XXX X X Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) N = Plastic Dual In-Line Temperature / Speed: B = 0C to 70C / 16 MHz F = -40C to 85C / 16 MHz I = 0C to 70C / 33 MHz J = -40C to 85C / 33 MHz 04/00 IX. PRODUCT IDENTIFICATION MICROCONTROLLER PRODUCTS (Continued) Example: S 8 X C XXX -1 N 24 S = Standard P = Static Design Pin Count (optional) Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) N = Plastic Dual In-Line Memory Options: 0 = ROMLESS 3 = ROM 7 = EPROM/OTP 9 = FLASH Speed / Temperature Range: 1 = 12MHz, 0oC to 70oC 2 = 12MHz, -40oC to +85oC 3 = 0.5 to 12 MHz, 0oC to +70oC 4 = 16MHz, 0oC to 70oC 5 = 16MHz, -40oC to +85oC 6 = 12 or 16MHz, -55oC to +125oC 7 = 20MHz, 0oC to 70oC 8 = 20MHz, -40oC to +85oC A = 24MHz, 0oC to 70oC B = 24MHz, -40oC to +85oC I = 33MHz, 0oC to 70oC J = 33MHz, -40oC to +85oC - = Other / + = Rx Family Device Number MICROCONTROLLER PRODUCTS - XA Example: P51XA G3 7 K B A Philips 80C51 eXtended Architecture P51XAG3 or PXAG3 or S3 or SCC Derivative Name Package Code: A = Plastic Leaded Chip Carrier (PLCC) B = Quad Flat Pack (QFP) BD = Thin Quad Flat Pack (TQFP) N = Plastic Dual In-Line Temperature: B = 0C to 70C F = -40C to +85C Speed: E = 16MHz G = 20Mhz K = 30MHz J = 25MHz Memory Options: 0 = ROMLESS 3 = ROM 5 = Bondout 7 = EPROM/OTP 9 = FLASH MICROCONTROLLER PRODUCTS - PXA Example: PXA Philips XA extended Architecture SCC K F XX Package Code: A = Plastic Leaded Chip Carrier (PLCC) BD = Leaded Quad Flat Pack (LQFP) BE = Plastic Quad Flat Pack (PQFP) Derivative Name C = CAN G = Generic S = Generic with ADC Temperature: A = 0C to 70C F = -40C to +85C Speed: K = 30MHz IX. PRODUCT IDENTIFICATION MICROCONTROLLER PRODUCTS - LPC 04/00 xvii Example: P 8 X LPC XXX B N 80C51 Family Derivative Name Package Code: DIP, SO Memory Options 7 = OTP Temperature: B = 0C to 70C F = -40C to +85C Derivative Name Low Pin Count: MICROCONTROLLER PRODUCTS - PERIPHERALS Example: P82B XXX X X Philips North America Package Code: Philips Package Code Device Number MULTIBYTETM PRODUCTS Example: MB 2 XXX BB Package Code: BB = QuadFlat Pack (QFP) Device Number Byte-width (2 or 4) Designates MULTIBYTETM Product. Temperature Range: -40C to +85C MULTIBYTE is a registered trademark of Philips Semiconductors. xviii 04/00