TDA1308T/N1,115 - NXP

August 1994 2

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

FEATURES

•Wide temperature range

•No switch ON/OFF clicks

•Excellent power supply ripple rejection

•Low power consumption

•Short-circuit resistant

•High performance

– high signal-to-noise ratio

– high slew rate

– low distortion

•Large output voltage swing.

GENERAL DESCRIPTION

The TDA1308 is an integrated class AB stereo headphone

driver contained in an SO8 or a DIP8 plastic package. The

device is fabricated in a 1 mm CMOS process and has

been primarily developed for portable digital audio

applications.

QUICK REFERENCE DATA

VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi= 1 kHz; RL= 32 Ω; unless otherwise speciﬁed.

Note

1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDD supply voltage

single 3.0 5.0 7.0 V

dual 1.5 2.5 3.5 V

VSS negative supply voltage −1.5 −2.5 −3.5 V

IDD supply current no load −3 5 mA

Ptot total power dissipation no load −15 25 mW

Pomaximum output power THD < 0.1%; note 1 −60 −mW

(THD + N)/S total harmonic distortion plus

noise-to-signal ratio note 1 −0.03 0.06 %

− −70 −65 dB

RL= 5 kΩ − −101 −dB

S/N signal-to-noise ratio 100 110 −dB

αcs channel separation −70 −dB

RL = 5 kΩ − 105 −dB

PSRR power supply ripple rejection fi= 100 Hz; Vripple(p-p) = 100 mV −90 −dB

Tamb operating ambient

temperature −40 −+85 °C

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

August 1994 3

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

BLOCK DIAGRAM

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

OUTA 1 output A

INA(neg) 2 inverting input A

INA(pos) 3 non-inverting input A

VSS 4 negative supply

INB(pos) 5 non-inverting input B

INB(neg) 6 inverting input B

OUTB 7 output B

VDD 8 positive supply

Fig.2 Pin configuration.

August 1994 4

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

Fig.3 Equivalent schematic diagram.

August 1994 5

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC134).

Notes

1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.

2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“UZW-BO/FQ-0601”

. The numbers of the quality specification can be found in the

“Quality Reference

Handbook”

. The handbook can be ordered using the code 9398 510 63011.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VDD supply voltage 0 8.0 V

tSC(O) output short-circuit duration Tamb = 25 °C; Ptot = 1 W 20 −s

Tstg storage temperature −65 +150 °C

Tamb operating ambient temperature −40 +85 °C

Vesd electrostatic discharge note 1 −2000 +2000 V

note 2 −200 +200 V

SYMBOL PARAMETER VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

DIP8 109 K/W

SO8 210 K/W

August 1994 6

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

CHARACTERISTICS

VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi= 1 kHz; RL= 32 Ω; unless otherwise speciﬁed.

Notes

1. Values are proportional to VDD; (THD + N)/S < 0.1%.

2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

VDD supply voltage

single 3.0 5.0 7.0 V

dual 1.5 2.5 3.5 V

VSS negative supply voltage −1.5 −2.5 −3.5 V

IDD supply current no load −3 5 mA

Ptot total power dissipation no load −15 25 mW

DC characteristics

VI(os) input offset voltage −10 −mV

Ibias input bias current −10 −pA

VCM common mode voltage 0 −3.5 V

Gvopen-loop voltage gain RL= 5 kΩ − 70 −dB

IOmaximum output current (THD + N)/S < 0.1% −60 −mA

ROoutput resistance −0.25 − Ω

VOoutput voltage swing note 1 0.75 −4.25 V

RL= 16 Ω; note 1 1.5 −3.5 V

RL= 5 kΩ; note 1 0.1 −4.9 V

PSRR power supply rejection ratio fi= 100 Hz;

Vripple(p-p) = 100 mV −90 −dB

αcs channel separation −70 −dB

RL= 5 kΩ − 105 −dB

CLload capacitance − − 200 pF

AC characteristics

(THD + N)/S total harmonic distortion plus

noise-to-signal ratio note 2 − −70 −65 dB

−0.03 0.06 %

note 2; RL= 5 kΩ − −101 −dB

−0.0009 −%

S/N signal-to-noise ratio 100 110 −dB

fGunity gain frequency open-loop; RL= 5 kΩ − 5.5 −MHz

Pomaximum output power (THD + N)/S < 0.1% −60 −mW

Ciinput capacitance −3−pF

SR slew rate unity gain inverting −5−V/µs

B power bandwidth unity gain inverting −20 −kHz

August 1994 7

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

TEST AND APPLICATION INFORMATION

Fig.4 Measurement circuit for inverting application.

Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).

August 1994 8

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

Fig.6 Open-loop gain as a function of input

frequency.

Fig.7 Crosstalk as a function of input

frequency.

Fig.8 Output power as a function of supply

voltage.

August 1994 9

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.

Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.

August 1994 10

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

PACKAGE OUTLINES

Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.

Dimensions in mm.

handbook, full pagewidth

8.25

7.80

0.38 max

10.0

8.3

7.62

MSA252 - 1

6.48

6.20

1.73 max

1.15

max 0.53

max

0.254 M

3.2

max 4.2

max

3.60

3.05

9.8

9.2

2.54

(3x)

0.51

min

seating plane

August 1994 11

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

handbook, full pagewidth

pin 1

index

0.7

0.3

0.49

0.36

1.27 0.25 M

(8x)

0.1 SS

5.0

4.8

4.0

3.8

6.2

5.8

MBC180 - 1

0.25

0.19

0.7

0.6 1.75

1.35

1.45

1.25

detail A

1.0

0.5

0.25

0.10 0 to 8o

Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1).

Dimensions in mm.

August 1994 12

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

SOLDERING

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

REPAIRING SOLDERED JOINTS

Apply the soldering iron below the seating plane (or not

more than 2 mm above it). If its temperature is below

300 °C, it must not be in contact for more than 10 s; if

between 300 and 400 °C, for not more than 5 s.

Plastic small outline packages

BY WAVE

During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the

adhesive, the component can be soldered. The adhesive

can be applied by screen printing, pin transfer or syringe

dispensing.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder bath is

10 s, if allowed to cool to less than 150 °C within 6 s.

Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended

using two solder waves (dual-wave), in which a turbulent

wave with high upward pressure is followed by a smooth

laminar wave. Using a mildly-activated flux eliminates the

need for removal of corrosive residues in most

applications.

BY SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or

pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt, infrared, and

vapour-phase reflow. Dwell times vary between 50 and

300 s according to method. Typical reflow temperatures

range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 min at 45 °C.

REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally

opposite, end pins. Apply the heating tool to the flat part of

the pin only. Contact time must be limited to 10 s at up to

300 °C. When using proper tools, all other pins can be

soldered in one operation within 2 to 5 s at between 270

and 320 °C. (Pulse-heated soldering is not recommended

for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO

packages, solder is applied to the substrate by dipping or

by an extra thick tin/lead plating before package

placement.

August 1994 13

Philips Semiconductors Product speciﬁcation

Class AB stereo headphone driver TDA1308

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

04/00 v

V. PRODUCT LISTING EXPLANATION

Table 1 FAMI L Y PREFIX AND DEVICE TEMPE RATURE Table 2 PACKAGE DESCRIPTIONS

Prefix A/WP = Leaded Chip Carrier (PLCC)

ADC

AM =

=Alternat e to National part number

Alternat e to AMD part number B/BB/BC/BE/BG = Plast ic Quad Flat Package(PQFP)

- Dry Pack handl i ng required

AU = Automotive -40° to +125°C BD = Low Profile quad Flat Pac kage(LQFP)

DAC = Alternate to P.M.I. part number BF/BH/BK = Shri nk quad Fl at Package(S QFP )

FB = Futurebus+, 0°C to +70°C D=

Plast i c Smal l Outline (SO/SOL)

ICM = Alternat e to lntersil part number DB/DK/DL = Shri nk Smal l Outline Package (SSOP)

LF = Alternat e to National part number F=

Ceramic Dual In-Line

LM = A l t ernate to National part number FE = Hermet i c CERDIP - 8 lead

MB = MULTIBYTE™, -40' C to +85'C GW = Pcio Gate

MC = Alternate t o Motorol a part number M=

Module

N, NE = O°C to +70°C (O° to +75° C for 9300) MSC = Miscellaneous

Philips N/P = Plastic Dual In-Line (DIL)

PL = Programmable Logic PW/DH/DG/DGG = Thi n Shrink Small Outl i ne P ackage (TSSOP)

PZ = Programm able Logic/Philips Zero Power NB = 42 Pin Shrink Dual In-Line (DI L)

S/SC = MCO Microcontroller SC/SD = Microprocessor Support

SA = -40°C to +85° C U=

Plast i c Single In-Li ne (SIL)

SE = -55°C to +125°C ** The DH on PW and G on some DGG Part

SG = Alternate to Silicon General part number Package Codes have been removed due to

µA = Alternate to National part number Space constraints i n this pric e book.

Table 3 - PRODUCT FAMILY

ABBR PRODUCT FAMILY

BIC

CLI BiCMOS Logic

CMOS Logic (CLI C)

CON

DSG

IND

Consum er Mult i media

Digital/Linear Data Com m/FB+

Discrete

Identif i cation Contac t

LIC

LOG

Linear Indust ri al

Bipolar Logic

Low Voltage

MCO Microproc es sor, Microcontrollers,

CRT (Sunnyvale)

MOS Multimedia

MOS Microcont rol l ers /Hamburg

MST

PDI

PLD

PRM

TEL

Mass St orage/ Mot or Cont rol

Philips Digital Interface

Program mable Logic Devi ces

Proms

Wireless/RF Product s

Telecom

Table 4 - COLUMN HEADING EXPLANATIONS

PART

NUMBER CROSS REF. PRD

FAM PRODUCT

DESCRIPTION SPQ P/C

N74F244D LOG Octal Buff er 3 S tate 1520 20

N74F244D-T LOG Octal Buff er 3 S tate 1000

N74F244N Product Family-

See Table 3 Pin Count

Descript i on of Product Quantity per

tube/reel/ box

Indust ry Standard Part Number

-Complexity of LOG Parts

-Product Di scontinuation Notic e (DN-##)

-Dry Pack Indicator

Special P ackaging Alternatives - s ee following page

Package Code - See Table 2

Device Number

Famil y P ref i x and Device Temperature - See Tabl e 1

04/00vi

VII. COMMERCIAL PRODUCT SPECIAL PROCESSING

SPECIAL PACKAGING ALTERNATIVES

SPECIFICATIONS

Tape and Reel specifications conform to Electronic Industries Association (EIA) standard EIA-481-1, EIA-481-2,

EIA-481-3, and EIA-468-B.

DEVICE AVAILABILITY

Plastic Leaded Chip Carrier (PLCC) and Plastic Small Outline (SO/SOL/SSOP/TSSOP) parts are available in tape

and reel pack aging. Produc ts available in tape and reel ar e identified in the Pr ice Book with a "-T " (13”) or "-G" (7”)

added to the end of basic part num ber (e.g. N74F379AD- T or T DA1543T D-G). Return of product M UST be in full

reels with unbroken quality seals.

Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are

identified in the Price Book with a "-S" added to the end of basic part number (e.g. SAB9075HB-S). Return of

product MUST be in original container with unbroken quality seals.

VII. DRY PACK HANDLING

Philips Semiconductors is providing moisture barrier protection for plastic Surface Mount Technology (SMT) lCs

prior to shipping/storage. This protection is designed to minim ize the absorption of water into the body of the pack -

age in high humidity environments and later causing damage to itself when exposed to the rapid thermal heating

associated with surface m ount printed circuit board assem bly. As the package is heated, m oisture inside the pac k-

age rapidly heats and vaporizes, generating pressure within the package, which can result in package cracking.

Philips Semiconductors has conducted susceptibility testing on its entire line of SMT packages and has found that

certain combinations of package outlines and lead frames are sensitive to this accelerated test. These packages

include specif ic, but not all varieties of Sm all Outline SO/SSOP-16/24/28 lead, Plas tic Leaded Chip Carrier (PLCC)-

32/52/68/84 lead, and all Plastic Quad Flat Pack (PQFP).

Philips Sem iconductors pr oducts that are dry packed ar e indicated in the price book with "DRY PACK" entered next

to the device in the "Cross Ref column.

The dry packing process begins with a 24-hour bake at 125°C after electrical test to rem ove any moisture build-up

within the package. Product is then packed under a partial vacuum in a moisture barrier bag containing desiccant

and a humidity indicator card. The bag interior is maintained at a relative humidity (RH) level of less than 30%.

Once outside the bag (in a typical factory environment of 20°C to 30°C and 50% to 70% RH), product should be

used within 48 hours. If this time is exceeded, or upon opening the bag, the humidity indicator card register s pink on

the 20% level, the product should be baked at 125°C for 24 hours. Product m ust be baked in metal tubes, not the

plastic tubes or reels in which it was shipped. PQFP products packed in trays can be baked at 125°C.

Philips Semiconductors complies with the recommendations of the NEDA Semiconductor Packing and Handling

Committee for Moisture Sensitive Plastic Surface Mount Components that is incorporated in NIGP 103.00. Our in-

ternal specif ications are available upon r equest from Ron Deetz, 408-991-3892: 1) 874-0086, General Operator Dry

Packing Requirements; and 2) 874-0083, General Operator Dry Packing.

Dry packed products m ust be order ed in full tube or full tray increm ents and m ust also m eet the order m inim um s as

determined by each device's Price Book inventory code (I/C).

Only factory Q.A. sealed containers, undamaged, with all labels intact are eligible for stock rotation. Philips Semi-

conductors recommends that the minimum quantity be imposed as a minimum buy to distributor's end customer.

04/00 vii

VIII. PACKING QUANTITY INFORMATION

CERAMIC DUAL IN-LINE (CERDIP) QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER TUBE DEVICES

PER BOX

FE 8-pin (300 mil) 48 1920

F 14-pin (300 mil) 25 1000

F 16-pin (300 mil) 25 1000

F 18-pin (300 mil) 21 840

F/FA 20-pin (300 mil) 20 800

F 22-pin (400 mil) 17 544

F/FA/F24 24-pin (300 mil) 15 600

F 24-pin (400 mil) 15 480

F 24-pin (600 mil) 15 360

F/FA/F28 28-pin (600 mil) 13 312

F/FA/F40 40-pin (600 mil) 9 216

CERQUAD QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER TRAY DEVICES

PER BOX

K/KA/K44 44-pin 66

K/KA/K68 68-pin 44

KA 84-pin 42 210

QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF

THAT QUANTITY.

04/00viii

VIII. PACKING QUANTITY INFORMATION

PLASTIC DUAL IN-LINE QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER TUBE DEVICES

PER BOX

N/N8 8-pin (300 mil) 50 * 2000

N/N14 14-/16-pin (300 mil) 25 * 1000

N 14-/16-pin (300 mil long tube) 28 * 1120

N 18-pin (300 mil) 20 800

N 18-pin (standard tube) 22 880

N 18-pin (long tube) 25 1000

N 20-pin (300 mil) 18 * 720

N 20-pin (long tube) 20 * 800

N 22-pin (400 mil) 17 544

N/N3/N24 24-pin (300 mil) 15 600

N/N24 24-pin (400 mil) 15 480

N 24-pin (600 mil) 15 360

N 24-pin (600 mil long tube) 17 510

N 24-pin (600 mil long tube) 25 1000

N/N3 28-pin (300 mil) 13 520

N/N28 28-pin (600 mil) 13 312

N 28-pin (600 mil long tube) 15 450

N 32-pin (600 mil) 11 264

N 28-pin (600 mil shrink) 19 760

N/N40 40-pin (600 mil) 9 216

N 40-pin (600 mil long tube) 10 300

NB (Shrink) 42-pin (600 mil) 12 288

N/NB 42-pin (600 mil long tube) 14 420

N/N48 48-pin (600 mil) 7 168

N 50-pin (900 mil) 7 112

N 52-pin (600 mil) 10 240

N/N64 64-pin (900 mil) 580

* Selected part t ypes in these pac kages may be subject t o full box multi pl es. Refer to specific part “PQ” for minimum purc has e amount.

PLASTIC LEADED CHIP CARRIER (PLCC) QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER TUBE DEVICES

PER BOX DEVICES

PER REEL

A 20-pin 46 3680 1000

A/A28 28-pin 37 2368 750

A 28-pin 34 2176 750

A 32-pin 31 2232 750

A/A44 44-pin 26 1248 500

A/A44 44-pin 26 1300 500

A/A52 52-pin 23 1012 500

A/A68 68-pin 18 648 250

A/A84 84-pin 15 420 250

QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF

THAT QUANTITY. VIII. PACKING QUANTITY INFORMATION

04/00 ix

PLASTIC QUAD FLAT PACK (PQFP) QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER 5 TRAY DEVICES PER

SINGLE TRAY DEVICES

PER REEL

B/BD 32-pin LQFP ( 7x7) 1250 250 2000

B 32-Pin LQFP (5x5) 1800 360 2000

B 44-pin QFP (14x14) 420 84 500

B/B44 44-pin QFP (10x10) 480 96 1500

BC/BD 44-pin LFQP (10x10) 800 160 1500

B/BE 48-pin LQFP (7x7) 1250 250 2000

BB 52-pin QFP (10x10) 480 96 500

B/BD 64-pin LQFP (10x10) 800 160 -

BG 64-pin QPF (14x14) 420 84 600

B/BA/BB1 64/80-pin QFP (14x20) 330 66 500

BE 80-pin LQFP (12x12) 595 119 1000

BE/BP 100-pin TQFP (14x14) 450 90 1000

B/BB1 100-pin QFP (14x20) 330 66 -

B 120-pin QFP (28x28) 120 24 -

BE 128-pin LQFP (14x20) 360 72 -

BH 128-pin SQFP (14x20) 330 66 -

B/BB 128/160-pin QFP (28x28) 120 24 -

BF 208-pin SQFP (28x28) 120 24 -

QUANTIT IES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULT IPLES OF

THAT QUANTITY.

04/00

VIII. PACKING QUANTITY INFORMATION

PLA S TIC SMALL OUTLINE (SO/SOL/SSOP/TSSOP) QUANTITIES

PACKAGE CODE PIN COUNT DEVICES

PER TUBE DEVICES

PER BOX DEVICES

PER REEL

D/D8 8-pin (Small) 100 * 2000 2500

D 8-pin (Large) 64 * 2560 1000

D/D14 14-pin (Small) 57 * 1140 2500

DB (SSOP) 14-pin (Medium) 78 1092 2000

PW/DH (TSSOP) 14-pin 96 2400 2500

D 16-pin (Small) 50 * 1000 2500

DB (SSOP) 16-pin (Medium) 78 1092 2000

D 16-pin (Large) 48 * 1920 1000

PW/DH (TSSOP) 16-pin 96 2400 2500

DK (SSOP) 16-pin 93 1674 2500

DK (SSOP) 20-pin (Small) 75 1350 2500

DB (SSOP) 20-pin (Medium) 66 924 1000

PW/DH (TSSOP) 20-pin 75 1875 2500

D 20-pin (Large) 38 * 1520 2000

DB (SSOP) 24-pin (Medium) 59 826 1000

PW/DH (TSSOP) 24-pin 63 1575 2500

D 24-pin (Large) 30 1200 1000

DB (SSOP) 28-pin (Medium) 47 658 1000

D 28-pin (Large) 27 1080 1000

D 32-pin (Large) 24 960 1000

D 40-pin (VSO-40) 31 1240 500

DG/DGG (TSSOP) 48-pin 39 975 2000

DL (SSOP) 48-pin (Large) 31 1581 1000

DG/DGG (TSSOP) 56-pin 35 875 2000

DL (SSOP) 56-pin (Large) 26 1326 1000

D 56-pin (VSO-56) 22 616 500

* Selected part t ypes in these pac kages may be subject t o full box multi pl es. Refer to specific part “PQ” for minimum purc has e amount.

QUANTIT IES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULT IPLES OF

THAT QUANTITY.

04/00 x

IX. PRODUCT IDENTIFICATION

4000 CMOS PRODUCTS

Example: H E F 4 X X X X X X Philips North America Package Code:

D = Plastic SO

N = Plast i c Dual In-Line

DB = Shrink Small Outline (SSOP)

Philips Pac kage Code on part:

P = Plas tic Dual In-Li ne

T = Plastic SO

S = Shrink Small Outline (SSOP)

B = JEDEC “B” series CMOS specification

4XXX = Devic e number up to 5 digi ts

F = Limited

Family I dentificat i on

BiCMOS PRODUCTS - ABT

Example 74 ABT XXX X

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

D = Plastic SO

DB = Shrink Small Outline (SSOP)

N = Plast i c Dual In-Line

PW = Thin Shrink Small Outline (TSSOP)

Device Number

Designates Advanced Bi CMOS TTL P rocess

74 = Commercial Operat i ng Temperature Range:

-40°C to +85°C

BiCMOS PRODUCTS - ABT16

Example 74 ABT 16 XXX X

Package Code:

DL = Shrink Small Outline (SSOP)

DG = Thin Shrink Small Outline (TSSOP)

Device Number

16 Bit

Designates Advanced Bi CMOS TTL P rocess

74 = Commercial Operat i ng Temperature Range:

-40°C to +85°C

BiCMOS PRODUCTS - 3.3V LVT

Example 74 LVT XXX D

Package Code:

D = Plastic SO

DB = Shrink Small Outline (SSOP)

PW = Thin Shrink Small Outline (TSSOP)

Device Number

3.3V Devic e Family

74 = Commercial Operat i ng Temperature Range:

-40°C to +85°C

04/00xi

IX. PRODUCT IDENTIFICATION

BiCMOS PRODUCTS - 3.3V LVT16

Example 74 LVT 16 XXX DL

Package Code:

DL = Shrink Small Outline (SSOP)

DG = Thin Shrink Small Outline (TSSOP)

Device Number

16 Bit

3.3V Bi CMOS

74 = Commercial Operat i ng Temperature Range:

-40°C to +85°C

CONSUMER & INDUSTRIAL PRODUCTS

PREFIXES PC, SA, TD, TE, TS, UA, UM

Example: TD A XXXX P N

Device Family:

PCx

SAx

TDx

TEx

TSx

UAx

UMx

CMOS Circuit

Digital Ci rcuit

Linear Circui t

Analog Circ ui t

Digital Ci rcuit

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

N = Plast i c Dual In-Line

D = Plastic SO

DK = Shrink Small Outline Package (SSOP)

F = Cerami c Dual In-Line

U = Plast i c Single In-Li ne

Package Code on Part:

GP = Quad Flat Pac k (QFP )

P = Plas tic Dual In-Li ne

T = Plastic SO

D = Ceramic Dual In-Line

M = Shrink Small Outl i ne Package (SS O P )

WP = Plastic Leaded Chip Carri er (PLCC)

Device Number

Operating Temperatures:

A = Temperature range no specified (see

data sheet)

B = 0°C to 70° C

C = -55°C to +125°C

D = -25°C to +70°C

E = -25°C to +85° C

F = -40°C to +85°C

04/00 xii

IX. PRODUCT IDENTIFICATION

DATA COMMUNICATIONS, LOCAL AREA NETWORK, FUTUREBUS+

Example 1: SCNXXXXXCN48

Philips Desi gnat or Pin Count:

14, 16, 20, 24, 28, 40, 48, etc.

Process:

N = N - Channel Package Code:

C = C - Channel A = Plas tic Leaded Chip Carrier (P LCC)

N = Plast i c Dual In-Line

Device Number

See individual dat a sheets F = Cerami c Dual In-Line

Temperature:

C = 0°C to +70°C (Comm ercial)

A = -40°C to +85° C (I ndustrial)

M = -55°C to +125°C (Military)

E = -40°C to +85° C (I ndustrial)

Example 2: S C X X C X X X C 1 A

Philips Desi gnat or Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

Device Number

See individual dat a sheets N = Plast i c Dual In-Line

Timing Variation:

Process/Power Variati on: 1 = Normal

C = CMOS 5V

L = CMOS 3V Temperat ure:

C = 0°C to +70°C (Comm ercial)

A = -40°C to +85° C (I ndustrial)

Example 3: N E 8 3 X 9 2 A

Philips Desi gnat or Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

Device Number

See individual dat a sheets N = Plast i c Dual In-Line

F = Cerami c Dual In-Line

D = Plastic Small Outline

Applic at i ons Designator

(See Data Sheets)

Example 4: FB XXXX BB

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

BB = Quad Flat P ac k (QFP)

Device Number

Designates Futurebus+ Produc t

Temperat ure Range: 0° C to +70°C

For Industri al -- Contact Factory

04/00xi

IX. PRODUCT IDENTIFICATION

FIBER OPTIC, LINE DRIVERS/RECEIVERS, MODEMS

Example 1: NE XXXX N

Package Code:

D = Plastic SO

N = Plast i c Dual In-Line

Device Number

Device Family and Temperature Range Prefix:

NE = 0°C to +70° C

SE = -55°C t o +125° C

SA = -40°C t o +85° C

Example 2: AM XX LS XX C N

Generic Industry Prefix Package Code:

D = Plastic SO

Device Number N = Plast i c Dual In-Line

See individual dat a

sheets Device Family and Temperature Range Prefix:

Generic Industry ID C = 0°C to +70°C

M = -55°C to +125°C

I = -40°C to +85°C

HIGH-SPEED CMOS PRODUCTS

Example: 74 HC XXXXX N

Package Code:

D = Plastic SO

N = Plast i c Dual In-Line

Device Number

HC = CMOS input switching le vel s,

supply volt age range 2V to 6V,

fully buffered.

HCT = TTL input s witching levels,

supply volt age range 4. 5V to 5.5V,

fully buffered

74 = Standard Temperature Range:

-40°C to +125°C

LOGIC PRODUCTS - ALS/FAST

Example: N 74FXXX N

Package Code

Device Number

Temperat ure Range

TEMPERATURE

RANGE DEVICE

NUMBER PACKAGE CODE

N = Commercial Range

0°C to 70°C 74ALSXXX

74FXX A = Plastic Leaded Chip Carrier (PLCC)

D = Plastic SO

F = Ceramic Dual In-Line

N = Plastic Dual In-Line

04/00 x

IX. PRODUCT IDENTIFICATION

LINEAR AND RF PRODUCTS

Example: NE XXXX N

Package Code:

A = Plas tic Leaded Chip Carriers (PLCC)

D = Plastic SO

DK = Shrink Small Outline (SSOP)

F = Cerami c Dual In-Line

FE = Hermetic Cerdip (8 Lead)

N = Plast i c Dual In-Line

Device Number

Device Family and Temperature Range Prefix:

AU = -40°C to +125°C

NE = 0°C to +70° C

SE = -55°C t o +125° C

SA = -40°C t o +85° C

LOW VOLTAGE (3.3V CMOS) LOGIC - ALVC16

Example: 74ALVC16XXX DPackage Code

Device Number

TEMPERATURE

RANGE DEVICE

NUMBER PACKAGE CODE

Tamb = -40°C to +85°C 74ALVC16XXX D = Plastic S O

DL = Shrink Small Outline (SSOP)

DG = Thin Shrink Small Outline (TSSOP)

LOW VOLTAGE (3.3V CMOS) LOGIC - HLL

Example: 74HL33XXX DPackage Code

Device Number

TEMPERATURE

RANGE DEVICE

NUMBER PACKAGE CODE

Tamb = -40°C to +85°C 74HL33XXX D = Plastic SO

DB = Shrink Small Outline (SSOP)

PW = Thin Shrink Small Outline (TSSOP)

LOW VOLTAGE (3.3V CMOS) LOGIC - LV

Example: 74LVXXX DPackage Code

Device Number

TEMPERATURE

RANGE DEVICE

NUMBER PACKAGE CODE

Tamb = -40°C to +85°C 74LVXXX D = Pl as tic SO

DB = Shrink Small Outline (SSOP)

N = Plastic Dual In-Line

LOW VOLTAGE (3.3V CMOS) LOGIC - LVC

Example: 74LVCXXX DPackage Code

Device Number

TEMPERATURE

RANGE DEVICE

NUMBER PACKAGE CODE

Tamb = -40°C to +85°C 74LVC16XXX D = Plastic SO

DB = Shrink Small Outline (SSOP)

PW = Thin Shrink Small Outline (TSSOP)

04/00xv

IX. PRODUCT IDENTIFICATION

MICROCONTROLLER PRODUCTS

Example: P 8 X C XXX E B P N

Memory Options:

0 = ROMLESS

3 = ROM

7 = OTP-EPROM

9 = FEEPROM (FLASH)

Device Number

Speed:

C = 3.5MHz to 12MHz

D = 0MHz to 20MHz

E = 3.5MHz to 16mhz

F = 1.2Mhz to 16MHz

G = 3.5MHz to 20MHz

H = 32KHz to 12MHz

I = 3.5MHz to 24MHz

N = 3.5MHz to 33MHz

P = 3.5MHz to 40MHz

S = 0MHz to 16MHz

T = 0MHz to 24MHz

U = 0MHz to 33MHz

Philips North A merica Pac kage Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

N = Plast i c Dual In-Line

Philips Pac kage Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

F = Hermet i c Cerdi p (window)

L = Cerdip (Window))

P = Plastic Dual In-Line

Q = Ceramic Quad Fl at Pack (Window)

T = Small Out line (S O)

Temperature:

B = 0°C to 70° C

F = -40°C to +85°C

H = -40°C to +125°C

Example: P 8 X C 51 XXX X X

Memory Options:

0 = ROMLESS

3 = ROM

7 = OTP-EPROM

9 = FEEPROM (FLASH)

Device Number

FX-

FX+

FX2

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

N = Plast i c Dual In-Line

Temperat ure / Speed:

B = 0ºC to 70ºC / 16 MHz

F = -40ºC to 85ºC / 16 MHz

I = 0ºC to 70ºC / 33 MHz

J = -40ºC to 85ºC / 33 MHz

04/00 xvi

IX. PRODUCT IDENTIFICATION

MICROCONTROLLER PRODUCTS (Continued)

Example: S 8 X C XXX -1 N 24

S = Standard

P = Static Design

Memory Options:

0 = ROMLESS

3 = ROM

7 = EPROM/OTP

9 = FLASH

Device Number

Pin Count (opt i onal )

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

N = Plast i c Dual In-Line

Speed / Temperature Range:

1 = 12MHz, 0oC to 70oC

2 = 12MHz, -40oC to +85oC

3 = 0.5 to 12 MHz, 0oC to +70oC

4 = 16MHz, 0oC to 70oC

5 = 16MHz, -40oC to +85oC

6 = 12 or 16MHz, -55oC to +125oC

7 = 20MHz, 0oC to 70oC

8 = 20MHz, -40oC to +85oC

A = 24MHz, 0oC to 70oC

B = 24MHz, -40oC to +85oC

I = 33MHz, 0oC to 70oC

J = 33MHz, -40oC to +85oC

- = Other / + = Rx Family

MICROCONTROLLER PRODUCTS - XA

Example: P51XA G3 7 K B A

Philips 80C51 eXtended Architec ture

P51XAG3 or PXAG3 or S3 or SCC

Derivative Name

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

B = Quad Flat Pac k (QFP )

BD = Thin Quad Flat Pack (TQFP)

N = Plast i c Dual In-Line

Temperature:

B = 0°C to 70° C

F = -40°C to +85°C

Speed:

E = 16MHz

G = 20Mhz

K = 30MHz

J = 25MHz

Memory Options:

0 = ROMLESS

3 = ROM

5 = Bondout

7 = EPROM/OTP

9 = FLASH

MICROCONTROLLER PRODUCTS - PXA

Example: PXA SCC K F XX

Philips XA extended Architecture

Derivative Name

C = CAN

G = Generic

S = Generic with ADC

Package Code:

A = Plas tic Leaded Chip Carrier (P LCC)

BD = Leaded Quad Flat Pac k (LQFP)

BE = Plastic Quad Flat Pack (PQFP)

Temperature:

A = 0°C to 70°C

F = -40°C to +85°C

Speed:

K = 30MHz

IX. PRODUCT IDENTIFICATION

MICROCONTROLLER PRODUCTS - LPC

04/00xvii

Example: P 8 X LPC XXX B N

80C51 Famil y

Derivative Name

Memory Options

7 = OTP

Package Code:

DIP, SO

Temperature:

B = 0°C to 70° C

F = -40°C to +85°C

Derivative Name

Low Pin Count:

MICROCONTROLLER PRODUCTS – PERIPHERALS

Example: P82B XXX X X

Philips North A merica Pac k age Code:

Philips Pac k age Code

Device Number

MULTIBYTE™ PRODUCTS

Example: MB 2 XXX BB

Package Code:

BB = QuadFlat Pack (QFP)

Device Number

Byte-width (2 or 4)

Designates MULTIBYTE™ P roduct.

Temperat ure Range: -40° C to +85°C

MULTIBYTE is a registered tradem ark of Philips Semiconduc t ors.