STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87628
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87628 01 R A
Drawing number Device type
see 1.2.1
Case outline
see 1.2.2
Lead finish
see 1.2.3
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 54FCT374 Octal non-inverting D-type flip-flop with three-state
outputs, TTL compatible inputs
02 54FCT374A Octal non-inverting D-type flip-flop with three-state
outputs, TTL compatible inputs
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
R GDIP1-T20 or CDIP2-T20 20 Dual-in-line
S GDFP2-F20 or CDFP3-F20 20 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC) ........................................................................... -0.5 V dc to +6.0 V dc
DC input voltage range (VIN) ......................................................................... -0.5 V dc to VCC + 0.5 V dc
DC output voltage range (VOUT) .................................................................... -0.5 V dc to VCC + 0.5 V dc
DC input diode current (IIK) ........................................................................... -20 mA
DC output diode current (IOK) ........................................................................ -50 mA
DC output current (IOUT) ................................................................................ 100 mA
Maximum power dissipation (PD) 2/ .............................................................. 500 mW
Thermal resistance, junction-to-case (JC) .................................................... See MIL-STD-1835
Storage temperature range (TSTG) ................................................................ -65C to +150C
Junction temperature (TJ) ............................................................................. +175C
Lead temperature (soldering, 10 seconds) ................................................... +300C
1.4 Recommended operating conditions. 1/
Supply voltage range (VCC) ........................................................................... +4.5 V dc to +5.5 V dc
Maximum low level input voltage (VIL)........................................................... 0.8 V
Minimum high level input voltage (VIH) .......................................................... 2.0 V
Case operating temperature range (TC) ........................................................ -55C to +125C
Minimum setup time, Dn to CP (ts) ................................................................ 2.5 ns
Minimum hold time, Dn to CP (th) .................................................................. 2.5 ns
Minimum clock pulse width (tw) ..................................................................... 7.0 ns
1/ Unless other wise specified, all voltages are referenced to ground.
2/ Must withstand the added PD due to short circuit test; e.g., IOS.