Intel® Server Board S2600CO Family
Technical Product Specification
Intel order number G42278-004
Revision 1.4
September, 2013
Enterprise Platforms and Services Division – Marketing
Revision History Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
ii
Revision History
Date Revision
Number
Modifications
February, 2012 1.0 Initial release.
June, 2012 1.1 Updated Thermal Management and Environmental Limits Specification.
September, 2012 1.2 Updated PCIe slots definition and added NTB support section.
August, 2013 1.3 Added E5-2600 v2 processor support
September, 2013 1.4 Updated chapter 3.2.2.1
Disclaimers
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absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel® reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The products described in this document may contain design defects or errors known as errata which may cause the
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Copyright © 2013 Intel Corporation
Intel® Server Board S2600CO Family TPS Table of Contents
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Table of Contents
1.Introduction ..................... ................ ............. .............. ................ ............. ............. ........ .......... 1
1.1Chapter Outline ......................................................................................................... 1
1.2Server Board Use Disclaimer .................................................................................... 2
2.Product Overview ............ ... .. ...... .. ...... .. ... ..... ... ..... ... ... ..... ... .. ...... .. ...... .. ... ..... ... ..... ... ... ..... ....... 3
2.1Server Board Connector and Component Layout .................................................... 5
2.2Server Board Dimensional Mechanical Drawings .................................................. 10
3.Functional Architecture Overview ........................ ..................... .............. .......... ........... ..... 15
3.1Processor Support ................................................................................................... 16
3.1.1Processor Socket Assembly ................................................................................... 16
3.1.2Processor Population Rules .................................................................................... 16
3.1.3Processor Initializion Error Summary ..................................................................... 17
3.2Processor Function Overview ................................................................................. 19
3.2.1Intel® QuickPath Interconnect ................................................................................. 20
3.2.2Integrated Memory Controller (IMC) and Memory Subsystem .............................. 21
3.2.3Processor Integrated I/O Module (IIO) .................................................................... 30
3.3Intel® C600-A Chipset Functional Overview ........................................................... 34
3.3.1Non-Transparent Bridge .......................................................................................... 35
3.3.2Low Pin Count (LPC) Interface ............................................................................... 35
3.3.3Universal Serial Bus (USB) Controller .................................................................... 35
3.3.4On-board Serial Attached SCSI (SAS)/Serial ATA (SATA)/RAID Support and
Options 36
3.3.5Manageability .......................................................................................................... 38
3.4Integrated Baseboard Management Controller Overview ...................................... 39
3.4.1Super I/O Controller ................................................................................................ 40
3.4.2Graphics Controller and Video Support .................................................................. 40
3.4.3Baseboard Management Controller ........................................................................ 41
4.Technology Support .................. .. ... ..... ... ... ..... ... .. ...... .. ... ..... ... ... .. ...... .. ... ..... ... ... ..... ... .. ...... .. 43
4.1Intel® Trusted Execution Technology ...................................................................... 43
4.2Intel® Virtualization Technology – Intel® VT-x/VT-d/VT-c ....................................... 43
4.3Intel® Intelligent Power Node Manager ................................................................... 44
4.3.1Hardware Requirements ......................................................................................... 45
5.System Security ........... ...... .. ... ..... ... ..... ... ... ..... ... ..... ... .. ...... .. ...... .. ... ..... ... ..... ... ... ..... ... ..... ..... 46
5.1BIOS Password Protection ..................................................................................... 46
5.2Trusted Platform Module (TPM) Support ................................................................ 47
5.2.1TPM security BIOS .................................................................................................. 47
5.2.2Physical Presence ................................................................................................... 48
5.2.3TPM Security Setup Options ................................................................................... 48
5.3Intel® Trusted Execution Technology ...................................................................... 50
6.Platfor m Ma nagement Functional Overview ..................................................................... 52
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6.1Baseboard Management Controller (BMC) Firmware Feature Support ................ 52
6.1.1IPMI 2.0 Features .................................................................................................... 52
6.1.2Non IPMI Features .................................................................................................. 53
6.1.3New Manageability Features .................................................................................. 54
6.2Advanced Configuration and Power Interface (ACPI) ............................................ 55
6.3Power Control Sources ........................................................................................... 55
6.4BMC Watchdog ....................................................................................................... 56
6.5Fault Resilient Booting (FRB) ................................................................................. 56
6.6Sensor Monitoring ................................................................................................... 57
6.7Field Replaceable Unit (FRU) Inventory Device ..................................................... 57
6.8System Event Log (SEL) ......................................................................................... 58
6.9System Fan Management ....................................................................................... 58
6.9.1Thermal and Acoustic Management ....................................................................... 58
6.9.2Memory Thermal Throttling ..................................................................................... 61
6.10Messaging Interfaces .............................................................................................. 61
6.10.1User Model .............................................................................................................. 62
6.10.2IPMB Communication Interface .............................................................................. 62
6.10.3LAN interface ........................................................................................................... 62
6.10.4Address Resoluton Protocol (ARP) ........................................................................ 68
6.10.5Internet Control Message Protocol (ICMP) ............................................................. 69
6.10.6Virtual Local Area Network (VLAN) ........................................................................ 69
6.10.7Secure Shell (SSH) ................................................................................................. 70
6.10.8Serial-over-LAN (SOL 2.0) ...................................................................................... 70
6.10.9Platform Event Filter ................................................................................................ 70
6.10.10LAN Alterting ........................................................................................................... 71
6.10.11Altert Policy Table ................................................................................................... 71
6.10.12SM-CLP (SM-CLP Lite) ........................................................................................... 71
6.10.13Embeded Web Server ............................................................................................. 72
6.10.14Virtual Front Panel ................................................................................................... 73
6.10.15Embedded Platform Debug ..................................................................................... 74
6.10.16Data Center Management Interface (DCMI) ........................................................... 76
6.10.17Lightweight Directory Authentication Protocol (LDAP) ........................................... 77
7.Advanced Management Features Support (RMM4) ....... .......... .............. .......... ........... ..... 78
7.1Keyboard, Video, and Mouse (KVM) Redirection ................................................... 78
7.1.1Remote Console ...................................................................................................... 79
7.1.2Performance ............................................................................................................ 79
7.1.3Securi ty .................................................................................................................... 80
7.1.4Availability ................................................................................................................ 80
7.1.5Usage ...................................................................................................................... 80
7.1.6Force-enter BIOS Setup .......................................................................................... 80
7.2Media Redirection ................................................................................................... 80
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7.2.1Availability ................................................................................................................ 81
7.2.2Network Port Usage ................................................................................................ 81
8.On-board Connector/Header Overview ............. .............. ........................ ............. ............. 82
8.1Power Connectors ................................................................................................... 82
8.1.1Main Power .............................................................................................................. 82
8.1.2CPU Power Connectors .......................................................................................... 82
8.1.3PCIe Card Power Connectors ................................................................................. 83
8.2Front Panel Headers and Connectors .................................................................... 83
8.2.1SSI Front Panel Header .......................................................................................... 83
8.2.2Front Panel USB Connector ................................................................................... 87
8.2.3Intel® Local Control Panel Connector ..................................................................... 87
8.3On-Board Storage Connectors ............................................................................... 87
8.3.1SATA Only Connectors: 6 Gbps ............................................................................. 88
8.3.2SATA/SAS Connectors ........................................................................................... 88
8.3.3SAS SGPIO Connectors ......................................................................................... 88
8.3.4Intel® RAID C600 Upgrade Key Connector ............................................................ 88
8.3.5HSBP_I2C Header ................................................................................................... 89
8.3.6HDD LED Header .................................................................................................... 89
8.3.7Internal Type-A USB Connector ............................................................................. 89
8.3.8Internal 2mm Low Profile eUSB SSD Connector ................................................... 89
8.4Management and Security Connectors .................................................................. 90
8.4.1RMM4_Lite Connector ............................................................................................ 90
8.4.2RMM4_NIC connector ............................................................................................. 90
8.4.3TPM Connector ....................................................................................................... 90
8.4.4PMBus* Connector .................................................................................................. 91
8.4.5Chassis Intrustion Header ....................................................................................... 91
8.4.6IPMB Connector ...................................................................................................... 91
8.5Fan Connectors ....................................................................................................... 91
8.5.1System FAN Connectors ......................................................................................... 92
8.5.2CPU FAN Connector ............................................................................................... 92
8.6Serial Port Connectors ............................................................................................ 92
8.6.1Serial Port A connector (DB9) ................................................................................. 92
8.6.2Serial Port B Connector .......................................................................................... 93
8.6.3Video Connector ...................................................................................................... 93
8.7Other Connectors and Headers .............................................................................. 94
8.7.1FAN BOARD_I2C Connector ................................................................................... 94
8.7.2IEEE 1394b Connector ........................................................................................... 94
9.Reset and Recovery Jumpers .......... ............. ........................ ............. .............. .................. 95
9.1BIOS Default (that is, CMOS Clear) and Password Reset Usage Procedure ....... 96
9.1.1Set BIOS to default (that is, Clearing the CMOS) .................................................. 96
9.1.2Clearing the Password ............................................................................................ 96
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9.2Integrated BMC Force Update Procedure .............................................................. 97
9.3ME Force Update Jumper ....................................................................................... 97
9.4BIOS Recovery Jumper .......................................................................................... 98
10.Light Guided Diagnostics . ........................ ............. ........................ ............. ........................ 99
10.15 Volt Stand-by LED ................................................................................................ 99
10.2Fan Fault LEDs ....................................................................................................... 99
10.3DIMM Fault LEDs .................................................................................................. 101
10.4System ID LED, System Status LED and POST Code Diagnostic LEDs ............ 101
10.4.1System ID LED ...................................................................................................... 102
10.4.2System Status LED ............................................................................................... 103
10.4.3POST Code Diagnostic LEDs ............................................................................... 103
11.Environmental Limits Specification ........... ... ... ..... ... .. ...... .. ... ..... ... ... ..... ... .. ... ..... ... ... ..... ... 105
11.1Processor Thermal Design Power (TDP) Support ............................................... 105
11.2MTBF ..................................................................................................................... 106
12.Power Supply Specification Guidelines .......................................................................... 107
12.1Power Supply DC Output Specification ................................................................ 107
12.1.1Output Power/Currents ......................................................................................... 107
12.1.2Cross Loading ....................................................................................................... 107
12.1.3Standby Output ..................................................................................................... 108
Appendix A: Integration and Usage Tips ....................................... ........................ ................ 113
Appendix B: Compatible Intel® Server Chassis ................. ............. ...................................... 114
Appendix C: Integrated BMC Sensor Tables ................................................... ...................... 120
Appendix D: Intel® Server Board S2600CO Family Specific Sensors ................................ 133
Product ID ............................................................................................................................ 133
ACPI S3 Sleep State Support .............................................................................................. 133
Processor Support for Intel® Server Board S2600CO ......................................................... 133
Supported Chassis ............................................................................................................... 133
Hot-plug fan support ............................................................................................................. 134
Fan redundancy support ...................................................................................................... 134
HSC Availability .................................................................................................................... 136
Power unit support ............................................................................................................... 136
Redundant Fans only for Intel® Server Chassis .................................................................. 137
Fan Fault LED support ......................................................................................................... 137
Memory Throttling support ................................................................................................... 137
Appendix E: Management Engine Generated SEL Event Messages .................. ................ 138
Appendix F: POST Code Diagnostic LED Decoder ... ... ..... ... .. ... ..... ... ... .. ... ..... ... ... .. ...... .. ... ... 140
Appendix G: POST Code Errors...................... ............. ............. ...................................... ........ 145
Glossary ....................................................................................................................... .............. 152
Reference Documents ...................... ..... ... .. ...... .. ...... .. ... ..... ... ... ..... ... ..... ... .. ...... .. ... ..... ... ..... ...... 155
Intel® Server Board S2600CO Family TPS List of Figures
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List of Figures
Figure 1. Major Board Components ............................................................................................... 6
Figure 2. Intel® Light Guided Diagnostic LED Identification ........................................................... 7
Figure 3. Jumper Block Identification ............................................................................................. 8
Figure 4. Rear I/O Layout ............................................................................................................... 9
Figure 5. Mounting Hole Locations (1 of 2) .................................................................................. 10
Figure 6. Mounting Hole Locations (2 of 2) .................................................................................. 11
Figure 7. Major Connector Pin-1 Locations .................................................................................. 12
Figure 8. Primary Side Keep-out .................................................................................................. 13
Figure 9. Secondary Side Keep-out ............................................................................................. 14
Figure 10. Intel® Server Board S2600CO Functional Block Diagram .......................................... 15
Figure 11. Processor Socket Assembly ....................................................................................... 16
Figure 12. Integrated Memory Controller Functional Block Diagram .......................................... 21
Figure 13. Intel® Server Board S2600CO DIMM Slot Layout ...................................................... 25
Figure 14. Functional Block Diagram of Processor IIO Sub-system ........................................... 31
Figure 15. Functional Block Diagram - Chipset Supported Features and Functions .................. 34
Figure 16. Intel® RAID C600 Upgrade Key Connector ................................................................ 36
Figure 17. Integrated BMC Functional Block Diagram................................................................. 39
Figure 18. Integrated BMC Hardware .......................................................................................... 39
Figure 19. Setup Utility – TPM Configuration Screen .................................................................. 49
Figure 20. High-level Fan Speed Control Process ....................................................................... 60
Figure 21. Other Connectors and Headers .................................................................................. 93
Figure 22. Server Board Jumper Block Locations (J1E2, J1E3, J1E4, J1E6, J2J2) ................... 95
Figure 23. 5 Volt Stand-by Status LED Location ......................................................................... 99
Figure 24. Fan Fault LED’s Location .......................................................................................... 100
Figure 25. DIMM Fault LED’s Location ...................................................................................... 101
Figure 26. Location of System Status, System ID and POST Code Diagnostic LEDs ............. 102
Figure 27. Differential Noise test setup ...................................................................................... 110
Figure 28. Output Voltage Timing............................................................................................... 111
Figure 29. Turn On/Off Timing (Power Supply Signals) ............................................................ 112
Figure 30. Intel® Server Chassis P4000M with Fixed Power Supply, Fixed Hard Drives and
Fixed System Fans .............................................................................................................. 114
Figure 31. Intel® Server Chassis P4000M with Hot-swap Power Supply, Hot-swap Hard Drives
and Hot-swap System Fans ................................................................................................. 115
Figure 32. Chassis/System Product Code Naming Conventions .............................................. 116
List of Tables Intel® Server Board S2600CO Family TPS
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List of Tables
Table 1. Intel® Server Board S2600CO Family Feature Set .......................................................... 3
Table 2. Mixed Processor Configurations Error Summary .......................................................... 18
Table 3. UDIMM Support Guidelines ............................................................................................ 22
Table 4. RDIMM Support Guidelines ............................................................................................ 22
Table 5. LRDIMM Support Guidelines .......................................................................................... 23
Table 6. Intel® Server Board S2600CO DIMM Nomenclature ..................................................... 24
Table 7. Supported Intel® Integrated RAID Modules ................................................................... 32
Table 8. Supported Intel® Riser Card ........................................................................................... 33
Table 9. External RJ45 NIC Port LED Definition .......................................................................... 33
Table 10. Intel® RAID C600 Upgrade Key Options ...................................................................... 36
Table 11. Video Modes ................................................................................................................. 40
Table 12. Video mode ................................................................................................................... 41
Table 13. Data Center Problems .................................................................................................. 44
Table 14. Setup Utility – Security Configuration Screen Fields ................................................... 50
Table 15. ACPI Power States ....................................................................................................... 55
Table 16. Power Control Initiators ................................................................................................ 55
Table 17. Standard ID Channel Assignments .............................................................................. 62
Table 18. Factory Configured PEF Table Entries ........................................................................ 70
Table 19. Diagnostic Data. ........................................................................................................... 76
Table 20. Additional Diagnostics on Error. ................................................................................... 76
Table 21. Intel® RMM4 options kits .............................................................................................. 78
Table 22. Enabling Advanced Management Features ................................................................. 78
Table 23. Main Power Connector Pin-out (“MAIN PWR”) ............................................................ 82
Table 24. CPU Power Connector Pin-out (“CPU_1 PWR” and “CPU_2 PWR”) ......................... 82
Table 25. PCIe Card Power Connector Pin-out (“OPT_12V_PWR”) .......................................... 83
Table 26. SSI Front Panel Header Pin-out (“SSI Front Panel”) ................................................... 83
Table 27. Power/Sleep LED Functional States ............................................................................ 84
Table 28. NMI Signal Generation and Event Logging.................................................................. 85
Table 29. System Status LED State Definitions ........................................................................... 85
Table 30. Front Panel USB Connector Pin-out (USB5-6) ............................................................ 87
Table 31. Intel® Local Control Pane Connector Pin-out (LCP) .................................................... 87
Table 32. SATA Only Connector Pin-out (SATA_0 and SATA_1) ............................................... 88
Table 33. SATA/SAS Connector Pin-out (SATA/SAS_0 to SATA/SAS_7) ................................. 88
Table 34. SAS SGPIO Connector Pin-out (SAS_SPGIO_0 and SAS_SPGIO_1) ...................... 88
Table 35. Intel® RAID C600 Upgrade Key Connector Pin-out (STRO UPG KEY) ...................... 89
Table 36. HSBP_I2C Header Pin-out (HSBP_I2C) ....................................................................... 89
Table 37. Hard Drive Acitivity Header Pin-out (HDD_LED) ......................................................... 89
Table 38. Internal Type-A USB 2.0 Connector Pin-out (USB_4) ................................................. 89
Table 39. Internal eUSB Connector Pin-out (eUSB_SSD) .......................................................... 90
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Table 40. RMM4_Lite Connector Pin-out (RMM4_Lite) ............................................................... 90
Table 41. RMM4_NIC Connector Pin-out (RMM4_NIC) .............................................................. 90
Table 42. TPM Connector Pin-out (TPM) ..................................................................................... 90
Table 43. PMBus* Connector Pin-out (SMB_PMBUS*) .............................................................. 91
Table 44. Chassis Intrusion Header Pin-out (CHAS INTR) ......................................................... 91
Table 45. Chassis Instrusion Header State Description .............................................................. 91
Table 46. IPMB Connector Pin-out (IPMB) .................................................................................. 91
Table 47. 6-pin System FAN Connector Pin-out (SYS_FAN_1 to SYS_FAN_6) ........................ 92
Table 48. 4-pin System FAN Connector Pin-out (SYS_FAN_7) .................................................. 92
Table 49. CPU Fan Connector Pin-out (CPU_1 FAN and CPU_2 FAN) ..................................... 92
Table 50. Serial Port A Connector Pin-out (SERIAL_A) .............................................................. 92
Table 51. Serial-B Connector Pin-out (SERIAL_B) ...................................................................... 93
Table 52. Rear VGA Video Connector Pinout (VGA) ................................................................... 93
Table 53. HSBP 4-PIN I2C BUS Connector pin out (FAN BOARD_I2C) ..................................... 94
Table 54. IEEE 1394b Connector pin out ..................................................................................... 94
Table 55. Server Board Jumpers (J1E2, J1E3, J1E4, J1E6, J1J2) ............................................. 95
Table 56. System Status LED .................................................................................................... 103
Table 57. POST Code Diagnostic LEDs .................................................................................... 104
Table 58. Server Board Design Specifications........................................................................... 105
Table 59. MTBF Estimate ........................................................................................................... 106
Table 60. Over Voltage Protection Limits ................................................................................... 107
Table 61. Loading Conditions ..................................................................................................... 107
Table 62. Voltage Regulation Limits ........................................................................................... 108
Table 63. Transient Load Requirements .................................................................................... 108
Table 64. Capacitive Loading Conditions ................................................................................... 109
Table 65. Ripples and Noise ...................................................................................................... 109
Table 66. Output Voltage Timing ................................................................................................ 110
Table 67. Turn On/Off Timing ..................................................................................................... 111
Table 68. Intel® Server Chassis P4000M family Features ......................................................... 117
Table 69. BMC Core Sensors ..................................................................................................... 122
Table 70. Chassis-specific Sensors ........................................................................................... 133
Table 71. Fan Domain Definition ................................................................................................ 134
Table 72. Power Supply Support ................................................................................................ 136
Table 73. Server Platform Services Firmware Health Event ..................................................... 138
Table 74. Node Manager Health Event ...................................................................................... 139
Table 75. POST Progress Code LED Example ......................................................................... 140
Table 76. Diagnostic LED POST Code Decoder ....................................................................... 141
Table 77. MRC Progress Codes ................................................................................................. 143
Table 78. MRC Fatal Error Codes .............................................................................................. 143
Table 79. POST Error Codes and Messages ............................................................................. 145
Table 80. POST Error Beep Codes ............................................................................................ 150
List of Tables Intel® Server Board S2600CO Family TPS
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Table 81. Integrated BMC Beep Codes ..................................................................................... 151
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Intel® Server Board S2600CO Family TPS Introduction
Revision 1.4 1
Intel order number G42278-004
1. Introduction
This Technical Product Specification (TPS) provides board-specific information detailing the
features, functionality, and high-level architecture of the Intel® Server Board S2600CO.
Design-level information related to specific server board components and subsystems can be
obtained by ordering External Product Specifications (EPS) or Ex ternal Design Specifications
(EDS) related to this server generation. EPS and EDS documents are made available under
NDA with Intel® and must be ordered through your local Intel® representative. See the
Reference Documents section for a list of available documents.
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Functional Architecture Overview
Chapter 4 – Technology Support
Chapter 5 – System Security
Chapter 6 – Platform Management Functional Overview
Chapter 7 – Advanced Management Features Support (RMM4)
Chapter 8 – On-board Connector/Header Overview
Chapter 9 – Reset and Recovery Jumpers
Chapter 10 – Light Guided Diagnostics
Chapter 11 – Environmental Limits Specification
Chapter 12 – Power Supply Specification Guidelines
Appendix A: Integration and Usage Tips
Appendix B: Compatible Intel® Server Chassis
Appendix C: Integrated BMC Sensor Tables
Appendix D: Intel® Server Board S2600CO Family Specific Sensors
Appendix E: Management Engine Generated SEL Event Messages
Appendix F: POST Code Diagnostic LED Decoder
Appendix G: POST Code Errors
Glossary
Reference Documents
Introduction Intel® Server Board S2600CO Family TPS
2 Revision 1.4
Intel order number G42278-004
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI (Very Large Scale Integration) and power delivery components that need adequate airflow
to cool. Intel® ensures through its own chassis development and testing that when Intel® server
building blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses
not to use Intel® developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible if components fail or the
server board does not operate correctly when used outside any of the published operating or
non-operating limits.
Intel® Server Board S2600CO Family TPS Product Overview
Revision 1.4 3
Intel order number G42278-004
2. Product Overview
The Intel® Server Board S2600CO is a monolithic printed circuit board (PCB) assembly with
features designed to support the pedestal server markets. It has two board SKUs, namely
S2600CO4 and S2600COE. These server boards are designed to support the Intel® Xeon®
Processor E5-2600 or E5-2600 v2 product family. Previous generation Intel® Xeon® processors
are not supported. Many of the features and functions of these two SKUs are common. A board
will be identified by the name when a described feature or a function is unique to it.
Table 1. Intel® Server Board S2600CO Family Feature Set
Feature Description
Processor Support Two LGA 2011 (Socket R) processor sockets
S2600CO4 - Support for one or two Intel® Xeon® Processor(s) E5-2600 or E5-2600
v2 product with a Thermal Design Power (TDP) of up to 135W.
S2600COE - Support for one or two Intel® Xeon® Processor(s) E5-2600 or E5-2600
v2 product family with a Thermal Design Power (TDP) of up to 150W with possible
configuration limits.
Memory 16 DIMM slots – 2 DIMM slots/channel – 4 memory channels per processor
Channels A, B, C, D, E, F, G and H
Support for Registered DDR3 Memory (RDIMM), LV-RDIMM, Unbuffered DDR3
memory ((UDIMM) with ECC and Load Reduced DDR3 memory (LR-DIMM)
Memory DDR3 data transfer rate of 800, 1066, 1333,1600 and1866 MT/s
DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V
Chipset Intel
®
C600-A chipset with support for optional Storage Option Select keys
Rear I/O connections One DB15 Video VGA connector
One DB9 Serial connector
Four USB 2.0 connectors
Four RJ-45 Network Interface Connectors supporting 10/100/1000Mb
Internal I/O
connectors/headers
One 2x5 pin connector providing front panel support for two USB ports
One internal type A USB 2.0 connector
One internal low-profile 2mm USB port for USB Solid State Drive
One 2x15 pin SSI-EEB compliant front panel connector
One DH-10 Serial Port B connector
Two internal IEEE 1394b connectors (Intel® Server Board S2600COE only.)
Cooling Fan Support Two 4-pin managed CPU fan headers
Six 6-pin managed system fan headers
One 4-pin managed rear system fan header
One 4-pin I2C header that is intended to be used for third party fan control circuits
using a Maxim 72408 controller (Intel® Server Board S2600CO4 only.)
Product Overview Intel® Server Board S2600CO Family TPS
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Intel order number G42278-004
Feature Description
Add-in Card Slots Support up to six expansion slots
Slot 1: PCIe Gen II x4 electrical with x8 physical connector, routed from Intel® C600
Chipset, support half-length card
Slot 2: PCIe Gen III x16 electrical with x16 physical connector, routed from CPU1,
support full length card
Slot 3: PCIe Gen III x16 electrical with x16 physical connector(blue slot), routed from
CPU2, support full length, double width card
Slot 4: PCIe Gen III x8 electrical with x8 connector, routed from CPU2, support full
length card
Slot 5: PCIe Gen III x16 electrical with x16 connector(blue slot), routed from CPU1,
support full length, double width card
Slot 6: PCIe Gen III x16 electrical with x16 connector, routed from CPU2, support
half-length card, Intel® designed PCIe riser card
Storage One low-profile eUSB 2x5 pin connector to support 2mm low-profile eUSB solid
state devices
Two AHCI SATA connectors capable of supporting up to 6Gb/sec
AHCI SATA 0 supports high profile, vertical SATA DOM with onboard power.
Eight SCU SAS/SATA connectors capable of supporting up to 3Gb/sec
Intel® SAS ROC module support (Optional, PCIe slot form factor)
Intel® RAID C600 Upgrade Key support providing optional expanded SAS/SATA
RAID capabilities
RAID Support Intel
®
RSTe SW RAID 0/1/10/5
LSI* SW RAID 0/1/10
Video Support Integrated Matrox* G200 2D Video Graphics controller
LAN Four Gigabit through Intel
®
I350-AM Quad 10/100/1000 integrated GbE MAC and PHY
controller
Security Trusted Platform Module (Accessory Option)
Server Management Integrated Baseboard Management Controller, IPMI 2.0 compliant
Support for Intel® Server Management Software
Intel® Remote Management Module 4 support (Accessory Option)
Intel® Remote Management Module 4 Lite support (Accessory Option)
Form Factor SSI EEB (12”x13”)
Compatible Intel
®
Server
Chassis
Intel
®
Server Chassis P4000M family
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2.1 Server Board Connector and Component Layout
The following illustrations provide a general overview of the server board, identifying key feature
and component locations. Each connector and major component is identified by a number or
letter, and the description is given below the figure.
Callout Description Callout Description
A Chassis Intrusion AH System Fan 1 Connector
B Slot1, PCI Express* Gen2 AI LCP
C RMM4 Lite AJ Optional 12V Power Connector
D Slot 2, PCI Express* Gen3 AK BIOS Default
E Slot 3, PCI Express* Gen3 (blue slot), supports AL SMB_PMBUS*
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Callout Description Callout Description
double width card
F Battery AM Main Power
G Slot 4, PCI Express* Gen3 AN USB_4 (Internal Type A USB
Connector)
H Slot 5, PCI Express* Gen3 (blue slot), supports
double width card AO Storage Upgrade key connector
I Slot 6, PCI Express* Gen3 AP* FAN BOARD_I2C (Intel
®
Server
Board S2600CO4 only)
J DIMM E1/E2/F1/F2 AQ SATA_0 connector
K Status LED AR SATA_1 Connector
L ID LED AS SAS/SATA_7 Connector
M Diagnostic LED AT SAS/SATA_6 Connector
N NIC 3/4 AU SAS/SATA_5 Connector
O USB 0/1/2/3, NIC 1,2 AV SAS/SATA_4 Connector
P VGA AW SAS/SATA_3 Connector
Q CPU 2 Power connector AX SAS/SATA_2 Connector
R System Fan 7 AY SAS/SATA_1 Connector
S Serial Port A AZ SAS/SATA_0 Connector
T CPU 2 Fan Connector BA SAS SGPIO 0
U DIMM H1/H2/G1/G2 BB SAS SGPIO 1
V DIMM A1/A2/B1/B2 BC IPMB
W CPU 1 Power connector BD HSBP_I2C
X CPU 1 Fan Connector BE USB 5-6 (front panel USB connector)
Y DIMM C1/C2/D1/D2 BF ME Force Update
Z USB port to support SSD BG BMC Force Update
AA HDD LED Header BH** IEEE_1394B_0 Connector (Intel
®
Server Board S2600COE only)
AB TPM Connector BI Password Clear
AC System Fan 6 Connector BJ BIOS Recovery
AD System Fan 5 Connector BK** IEEE_1394B_1 Connector (Intel
®
Server Board S2600COE only)
AE System Fan 4 Connector BL Serial B connector
AF System Fan 3 Connector BM RMM4 NIC
AG System Fan 2 Connector BN SSI Front Panel
Figure 1. Major Board Components
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Figure 2. Intel® Light Guided Diagnostic LED Identification
See Chapter 10 for additional details.
Product Overview Intel® Server Board S2600CO Family TPS
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Figure 3. Jumper Block Identification
See Chapter 9 for additional details.
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Callout Description Callout Description
A Serial Port A E NIC Port 3 and 4
B Video F Diagnostics LED’s
C NIC Port 1, USB Port 0 (top) and 1
(bottom) G ID LED
D NIC Port 2, USB Port 2 (top) and 3
(bottom) H Status LED
Figure 4. Rear I/O Layout
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2.2 Server Board Dimensional Mechanical Drawings
Figure 5. Mounting Hole Locations (1 of 2)
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Figure 6. Mounting Hole Locations (2 of 2)
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12 Revision 1.4
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Figure 7. Major Connector Pin-1 Locations
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Figure 8. Primary Side Keep-out
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Figure 9. Secondary Side Keep-out
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3. Functional Architecture Overview
The architecture and design of the Intel® Server Board S2600CO is developed around the
integrated features and functions of the Intel® processor E5-2600 or E5-2600 v2 product family,
the Intel® C600-A chipset, the Intel® Ethernet Controller I350 Quad Port 1GbE chip, and the
Server Engines* Pilot-III Server Management Controller.
The following diagram provides an overview of the server board architecture, showing the
features and interconnects of each of the major sub-system components.
Figure 10. Intel® Server Board S2600CO Functional Block Diagram
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3.1 Processor Support
The server board includes two Socket-R (LGA2011) processor sockets and can support one or
two of the following processors:
Intel® Xeon® processor E5-2600 or E5-2600 v2 product family, with a Thermal Design
Power (TDP) of up to 135W.
Intel® Xeon® processor E5-2600 or E5-2600 v2 product family, with a Thermal Design
Power (TDP) of up to 150W with Intel® Server Board S2600COE with possible
configuration limits.
Note: Previous generation Intel® Xeon® processors are not supported on the Intel® server
boards described in this document.
Visit the Intel® website for a complete updated list of supported processors.
3.1.1 Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
The illustration below identifies each sub-assembly component.
Figure 11. Processor Socket Assembly
3.1.2 Processor Population Rules
Note: Although the server board does support dual-processor configurations consisting of
different processors that meet the defined criteria below, Intel® does not perform validation
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testing of this configuration. For optimal system performance in dual-processor configurations,
Intel® recommends that identical processors be installed.
When using a single processor configuration, the processor must be installed into the processor
socket labeled “CPU_1”.
When two processors are installed, the following population rules apply:
Both processors must be of the same processor family.
Both processors must have the same number of cores.
Both processors must have the same cache sizes for all levels of processor cache
memory.
Processors with different core frequencies can be mixed in a system, given the prior
rules are met. If this condition is detected, all processor core frequencies are set to the
lowest common denominator (highest common speed) and an error is reported.
Processors which have different Intel® QuickPath (QPI) Link Frequencies may operate
together if they are otherwise compatible and if a common link frequency can be
selected. The common link frequency would be the highest link frequency that all
installed processor can achieve.
Processor stepping within a common processor family can be mixed as long as it is
listed in the processor specification updates published by Intel Corporation.
3.1.3 Processor Initializion Error Summary
The following table describes mixed processor conditions and recommended actions for all
Intel® server boards and Intel® server systems designed around the Intel® Xeon® processor E5-
2600 or E5-2600 v2 product family and Intel® C600 chipset product family architecture. The
errors fall into one of the following categories:
Fatal: If the system can boot, it pauses at a blank screen with the text “Unrecoverable
fatal error found. System will not boot until the error is resolved” and “Press <F2>
to enter setup”, regardless of whether the “Post Error Pause” setup option is enabled or
disabled.
When the operator presses the <F2> key on the keyboard and enter BIOS setup, the
error message is displayed on the Error Manager screen, and an error is logged to the
System Event Log (SEL) with the POST Error Code.
The system cannot boot unless the error is resolved. The user needs to replace the
faulty part and restart the system.
For Fatal Errors during processor initialization, the System Status LED will be set to a
steady Amber color, indicating an unrecoverable system failure condition
Major: If the “Post Error Pause” setup option is enabled, the system goes directly to the
Error Manager screen to display the error and log the error code to SEL. Operator
intervention is required to continue booting the system.
Otherwise, if “POST Error Pause” is disabled, the system continues to boot and no
prompt is given for the error, although the error code is logged to the Error Manager and
in a SEL message.
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Minor: The message is displayed on the screen or on the Error Manager screen, and
the POST Error Code is logged to the SEL. The system continues booting in a degraded
state. The user may want to replace the erroneous unit. The POST Error Pause option
setting in the BIOS setup does not have any effect on this error.
Table 2. Mixed Processor Configurations Error Summary
Error Severity System Action
Processor family not
identical
Fatal The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the System Event Log (SEL).
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0194: Processor family mismatch detected” message in the
Error Manager.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor model not
identical
Fatal The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the System Event Log (SEL).
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0196: Processor model mismatch detected” message in the
Error Manager.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor
cores/threads not
identical
Fatal The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0191: Processor core/thread count mismatch detected”
message in the Error Manager.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor cache not
identical
Fatal The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0192: Processor cache size mismatch” detected message in
the Error Manager.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor frequency
(speed) not identical
Fatal The BIOS detects the processor frequency difference, and responds as
follows:
Adjusts all processor frequencies to the highest common frequency.
No error is generated – this is not an error condition.
Continues to boot the system successfully.
If the frequencies for all processors cannot be adjusted to be the same,
then this is an error, and the BIOS responds as follows:
Logs the POST Error Code into the SEL.
Alerts the BMC to set the System Status LED to steady Amber.
Does not disable the processor.
Displays “0197: Processor speeds unable to synchronize” message in
the Error Manager.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
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Error Severity System Action
Processor Intel®
QuickPath
Interconnect link
frequencies not
identical
Fatal The BIOS detects the QPI link frequencies and responds as follows:
Adjusts all QPI interconnect link frequencies to highest common
frequency.
No error is generated – this is not an error condition.
Continues to boot the system successfully.
If the link frequencies for all QPI links cannot be adjusted to be the same,
then this is an error, and the BIOS responds as follows:
Logs the POST Error Code into the SEL.
Alerts the BMC to set the System Status LED to steady Amber.
Displays “0195: Processor Intel® QPI link frequencies unable to
synchronize” message in the Error Manager.
Does not disable the processor.
Takes Fatal Error action (see above) and will not boot until the fault
condition is remedied.
Processor microcode
update missing
Minor The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Displays “818x: Processor 0x microcode update not found” message in
the Error Manager or on the screen.
The system continues to boot in a degraded state, regardless of the
setting of POST Error Pause in the Setup.
Processor microcode
update failed
Major The BIOS detects the error condition and responds as follows:
Logs the POST Error Code into the SEL.
Displays “816x: Processor 0x unable to apply microcode update”
message in the Error Manager or on the screen.
Takes Major Error action. The system may continue to boot in a degraded
state, depending on the setting of POST Error Pause in Setup, or may halt
with the POST Error Code in the Error Manager waiting for operator
intervention.
3.2 Processor Function Overview
With the release of the Intel® Xeon® processor E5-2600 or E5-2600 v2 product family, several
key system components, including the CPU, Integrated Memory Controller (IMC), and
Integrated IO Module (IIO), have been combined into a single processor package and feature
per socket; two Intel® QuickPath Interconnect point to point links capable of up to 8.0 GT/s, up
to 40 lanes of Gen 3 PCI Express* links capable of 8.0 GT/s, and 4 lanes of DMI2/PCI Express*
Gen 2 interface with a peak transfer rate of 5.0 GT/s. The processor supports up to 46 bits of
physical address space and 48-bit of virtual address space.
The following sections will provide an overview of the key processor features and functions that
help to define the architecture, performance and supported functionality of the server board. For
more comprehensive processor specific information, refer to the Intel® Xeon® processor E5-
2600 or E5-2600 v2 product family documents listed in the Reference Documents list.
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Processor Core Features:
Up to twelve execution cores
Each core supports two threads (Intel® Hyper-Threading Technology), up to 16 threads
per socket
46-bit physical addressing and 48-bit virtual addressing
1 GB large page support for server applications
A 32-KB instruction and 32-KB data first-level cache (L1) for each core
A 256-KB shared instruction/data mid-level (L2) cache for each core
Up to 20 MB last level cache (LLC): up to 2.5 MB per core instruction/data last level
cache (LLC), shared among all cores
Supported Technologies:
Intel® Virtualization Technology (Intel® VT)
Intel® Virtualization Technology for Directed I/O (Intel® VT-d)
Intel® Virtualization Technology Processor Extensions
Intel® Trusted Execution Technology (Intel® TXT)
Intel® 64 Architecture
Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)
Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)
Intel® Advanced Vector Extensions (Intel® AVX)
Intel® Hyper-Threading Technology
Execute Disable Bit
Intel® Turbo Boost Technology
Intel® Intelligent Power Technology
Enhanced Intel® SpeedStep Technology
3.2.1 Intel® QuickPath Interconnect
The Intel® QuickPath Interconnect is a high speed, packetized, point-to-point interconnect used
in the processor. The narrow high-speed links stitch together processors in distributed shared
memory and integrated I/O platform architecture. It offers much higher bandwidth with low
latency. The Intel® QuickPath Interconnect has an
efficient
architecture
allowing more
interconnect performance to be achieved in real systems. It has a snoop protocol optimized for
low latency and high scalability, as well as packet and lane structures enabling quick
completions of transactions. Reliability, availability, and serviceability features (RAS) are built into
the architecture.
The physical connectivity of each interconnect link is made up of twenty differential signal pairs
plus a differential forwarded clock. Each port supports a link pair consisting of two uni-directional
links to complete the connection between two components. This supports traffic in both
directions simultaneously. To facilitate flexibility and longevity, the interconnect is defined as
having five layers: Physical, Link, Routing, Transport, and Protocol.
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The Intel® QuickPath Interconnect includes a cache coherency protocol to keep the distributed
memory and caching structures coherent during system operation. It supports both low-latency
source snooping and a scalable home snoop behavior. The coherency protocol provides for
direct cache-to-cache transfers for optimal latency.
3.2.2 Integrated Memory Controller (IMC) and Memory Subsystem
Intel® Xeon®
E5-2600
CPU 1
DDR3 MEMORY
2 DIMMs/channel
CHANNEL 0
Intel® Xeon®
E5-2600
CPU2
CHANNEL 1
CHANNEL 2
CHANNEL 3
CHANNEL 0
CHANNEL 1
CHANNEL 2
CHANNEL 3
DDR3 MEMORY
2 DIMMs/channel
QPI
QPI
P2 P1P3P0
IOU0 IOU2IOU1
P1P3 P2P0
IOU2IOU1 IOU0
Figure 12. Integrated Memory Controller Functional Block Diagram
Integrated into the processor is a memory controller. Each processor provides four DDR3
channels that support the following:
Unbuffered DDR3 and registered DDR3 DIMMs
LR DIMM (Load Reduced DIMM) for buffered memory solutions demanding higher
capacity memory subsystems
Independent channel mode or lockstep mode
Data burst length of eight cycles for all memory organization modes
Memory DDR3 data transfer rates of 800, 1066, 1333, 1600 and 1866 MT/s
64-bit wide channels plus 8-bits of ECC support for each channel
DDR3 standard I/O Voltage of 1.5 V and DDR3 Low Voltage of 1.35 V
1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported for these devices:
o UDIMM DDR3 – SR x8 and x16 data widths, DR – x8 data width
o RDIMM DDR3 – SR, DR, and QR – x4 and x8 data widths
o LRDIMM DDR3 – QR – x4 and x8 data widths with direct map or with rank
multiplication
Up to 8 ranks supported per memory channel, 1, 2, or 4 ranks per DIMM
Open with adaptive idle page close timer or closed page policy
Per channel memory test and initialization engine can initialize DRAM to all logical zeros
with valid ECC (with or without data scrambler) or a predefined test pattern
Isochronous access support for Quality of Service (QoS)
Minimum memory configuration: independent channel support with 1 DIMM populated
Integrated dual SMBus* master controllers
Command launch modes of 1n/2n
RAS Support:
o Rank Level Sparing and Device Tagging
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o Demand and Patrol Scrubbing
o DRAM Single Device Data Correction (SDDC) for any single x4 or x8 DRAM
device. Independent channel mode supports x4 SDDC. x8 SDDC requires
lockstep mode
o Lockstep mode where channels 0 and 1 and channels 2 and 3 are operated in
lockstep mode
o Data scrambling with address to ease detection of write errors to an incorrect
address.
o Error reporting by the Machine Check Architecture
o Read Retry during CRC error handling checks by IMC
o Channel mirroring within a socket
CPU1 Channel Mirror Pairs (A,B) and (C,D)
CPU2 Channel Mirror Pairs (E,F) and (G,H)
o Error Containment Recovery
Improved Thermal Throttling with dynamic Closed Loop Thermal Throttling (CLTT)
Memory thermal monitoring support for DIMM temperature
3.2.2.1 Supported Memory
Table 3. UDIM M Su ppo r t Gu idelines
Ranks Per
DIMM and Data
Width
Memory Capacity Per
DIMM
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)
Intel® Server Board S2600CO (2 Slots per Channel)
1DPC 2DPC
1.35V
1.5V
1.35V
1.5V
E5-2600 Processor
SRx8 ECC 1GB 2GB 4GB 1066, 1333 1066, 1333 1066 1066, 1333
DRx8 ECC 2GB 4GB 8GB 1066, 1333 1066, 1333 1066 1066, 1333
E5-2600 v2 Processor
SRx8 ECC 1GB 2GB 4GB 1066, 1333 1066, 1333,
1600, 1866 1066, 1333 1066, 1333,
1600
DRx8 ECC 2GB 4GB 8GB 1066, 1333 1066, 1333,
1600, 1866 1066, 1333 1066, 1333,
1600
Table 4. RDIM M Su ppo r t Gu idelines
Ranks Per
DIMM and
Data Width
Memory Capacity Per
DIMM
Speed (MT/s) and Voltage Validated by Slot per Channel (SPC) and DIMM
Per Channel (DPC)
Intel® Server Board S2600CO (2 Slots per Channel)
1DPC 2DPC
1.35V 1.5V 1.35V 1.5V
E5-2600 Processor
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SRx8 1GB 2GB 4GB 1066, 1333 1066, 1333,
1600 1066,1333 1066, 1333,
1600
DRx8 2GB 4GB 8GB 1066, 1333 1066, 1333,
1600 1066,1333 1066, 1333,
1600
SRx4 2GB 4GB 8GB 1066, 1333 1066, 1333,
1600 1066,1333 1066, 1333,
1600
DRx4 4GB 8GB 16GB 1066, 1333 1066, 1333,
1600 1066,1333 1066, 1333,
1600
QRx4 8GB 16GB 32GB 800 1066 800 800
QRx8 4GB 8GB 16GB 800 1066 800 800
E5-2600 v2 Processor
SRx8 1GB 2GB 4GB 1066, 1333 1066, 1333,
1600,1866 1066,1333 1066, 1333,
1600
DRx8 2GB 4GB 8GB 1066, 1333 1066, 1333,
1600,1866 1066,1333 1066, 1333,
1600
SRx4 2GB 4GB 8GB 1066, 1333 1066, 1333,
1600,1866 1066,1333 1066, 1333,
1600
DRx4 4GB 8GB 16GB 1066, 1333 1066, 1333,
1600,1866 1066,1333 1066, 1333,
1600
QRx4 8GB 16GB 32GB 800 1066 800 800
QRx8 4GB 8GB 16GB 800 1066 800 800
Table 5. LRDIMM Support Guidelines
Ranks Per
DIMM and
Data Width
Memory Capacity Per
DIMM
Speed (MT/s) and Voltage Validated by Slot per Channel (SPC) and DIMM
Per Channel (DPC)
Intel® Server Board S2600CO
(2 Slots per Channel)
1DPC 2DPC
1.35V 1.5V 1.35V 1.5V
E5-2600 Processor
QRx4
(DDP) 16GB 32GB 1066 1066, 1333 1066 1066, 1333
QRx8
(P) 8GB 16GB 1066 1066, 1333 1066 1066, 1333
E5-2600 v2 Processor
QRx4
(DDP) 16GB 32GB 1066,1333 1066, 1333 1066,1333 1066, 1333
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8Rx4
(QDP) 32G 64G 1066 1066 1066 1066
3.2.2.2 Memory Slot Identification and Population Rules
Note: Although mixed DIMM configurations may be functional, Intel® only performs platform
validation on systems that are configured with identical DIMMs installed.
Each installed processor provides four channels of memory. On the Intel® Server Board
S2600CO each memory channel support 2 memory slots, for a total possible 16 DIMMs
installed.
System memory is organized into physical slots on DDR3 memory channels that belong
to processor sockets.
The memory channels from processor socket 1 are identified as Channel A, B, C and D.
The memory channels from processor socket 2 are identified as Channel E, F, G, and H.
Each memory slot on the server board is identified by channel and slot number within
that channel. For example, DIMM_A1 is the first slot on Channel A on processor 1;
DIMM_E1 is the first DIMM socket on Channel E on processor 2.
The memory slots associated with a given processor are unavailable if the
corresponding processor socket is not populated.
A processor may be installed without populating the associated memory slots provided a
second processor is installed with associated memory. In this case, the memory is
shared by the processors. However, the platform suffers performance degradation and
latency due to the remote memory.
Processor sockets are self-contained and autonomous. However, all memory subsystem
support (such as Memory RAS, Error Management,) in the BIOS setup is applied
commonly across processor sockets.
The BLUE memory slots on the server board identify the first memory slot for a given
memory channel.
DIMM population rules require that DIMMs within a channel be populated starting with the BLUE
DIMM slot or DIMM farthest from the processor in a “fill-farthest” approach. In addition, when
populating a Quad-rank DIMM with a Single- or Dual-rank DIMM in the same channel, the
Quad-rank DIMM must be populated farthest from the processor. Intel® Memory Reference
Code (MRC) will check for correct DIMM placement.
On the Intel® Server Board S2600CO a total of 16 DIMM slots is provided (2 CPUs – 4
Channels/CPU, 2 DIMMs /Channel). The nomenclature for DIMM sockets is detailed in the
following table:
Table 6. Intel® Server Board S2600CO DIMM Nomenclature
Processor Socket 1 Processor Socket 2
(0)
Channel A
(1)
Channel B
(2)
Channel C
(3)
Channel D
(0)
Channel E
(1)
Channel F
(2)
Channel G
(3)
Channel H
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 G1 G2 H1 H2
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Figure 13. Intel® Server Board S2600CO DIMM Slot Layout
The following are generic DIMM population requirements that generally apply to the Intel®
Server Board S2600CO.
All DIMMs must be DDR3 DIMMs
Unbuffered DIMMs can be ECC or non-ECC. However, Intel® only validates and
supports ECC memory for its server products.
Mixing of Registered and Unbuffered DIMMs is not allowed per platform.
Mixing of LRDIMM with any other DIMM type is not allowed per platform.
Mixing of DDR3 voltages is not validated within a socket or across sockets by Intel®. If
1.35V (DDR3L) and 1.50V (DDR3) DIMMs are mixed, the DIMMs will run at 1.50V.
Mixing of DDR3 operating frequencies is not validated within a socket or across sockets
by Intel®. If DIMMs with different frequencies are mixed, all DIMMs will run at the
common lowest frequency.
Quad rank RDIMMs are supported but not validated by Intel®.
A maximum of 8 logical ranks (ranks seen by the host) per channel is allowed.
Mixing of ECC and non-ECC DIMMs is not allowed per platform.
DIMMs with different timing parameters can be installed on different slots within the
same channel, but only timings that support the slowest DIMM will be applied to all. As a
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consequence, faster DIMMs will be operated at timings supported by the slowest DIMM
populated.
When one DIMM is used, it must be populated in the BLUE DIMM slot (farthest away
from the CPU) of a given channel.
When single, dual and quad rank DIMMs are populated for 2DPC, always populate the
higher number rank DIMM first (starting from the farthest slot), for example, first quad
rank, then dual rank, and last single rank DIMM.
Mixing of quad ranks DIMMs (RDIMM Raw Cards F and H) in one channel is not
validated.
3.2.2.3 Publishing System Memory
The BIOS displays the “Total Memory” of the system during POST if Display Logo is
disabled in the BIOS setup. This is the total size of memory discovered by the BIOS
during POST, and is the sum of the individual sizes of installed DDR3 DIMMs in the
system.
The BIOS displays the “Effective Memory” of the system in the BIOS setup. The term
Effective Memory refers to the total size of all DDR3 DIMMs that are active (not disabled)
and not used as redundant units.
The BIOS provides the total memory of the system in the main page of the BIOS setup.
This total is the same as the amount described by the first bullet above.
If Display Logo is disabled, the BIOS display the total system memory on the diagnostic
screen at the end of POST. This total is the same as the amount described by the first
bullet above.
Note: Some server operating systems do not display the total physical memory installed. What
is displayed is the amount of physical memory minus the approximate memory space used by
system BIOS components. These BIOS components include, but are not limited to:
ACPI (may vary depending on the number of PCI devices detected in the system)
ACPI NVS table
Processor microcode
Memory Mapped I/O (MMIO)
Manageability Engine (ME)
BIOS flash
3.2.2.4 Integrated Memory Controller Operating Modes
3.2.2.4.1 Independent Channel Mode
In non-ECC (Error Correction Code) and x4 Single Device Data Correction (SDDC)
configuration, each channel runs independently (nonlock-step), that is, each cache-line from
memory is provided by a channel. To deliver the 64-byte cache-line of data, each channel
bursts eight 8-byte chunks; back to back data transfer in the same direction and within the same
rank can be sent back-to-back without any dead-cycle. The independent channel mode is the
recommended method to deliver most efficient power and bandwidth as long as the x8 SDDC is
not required.
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3.2.2.4.2 Lockstep Channel Mode
In Lockstep Channel Mode the cache-line is split across channels. This is done to support
Single Device Data Correction (SDDC) for DRAM devices with 8-bit wide data ports. Also, the
same address is used on both channels, such that an address error on any channel is
detectable by bad ECC. The IMC module always accumulates 32-bytes before forwarding data
so there is no latency benefit for disabling ECC.
Lockstep channels must be populated identically. That is, each DIMM in one channel must have
a corresponding DIMM of identical organization (number ranks, number banks, number rows,
and number columns). DIMMs may be of different speed grades, but the IMC module will be
configured to operate all DIMMs according to the slowest parameters present by the Memory
Reference Code (MRC).
Channel 0 and Channel 1 can be in lockstep. Channel 2 and Channel 3 can be in lockstep.
Performance in lockstep mode cannot be as high as with independent channels. The burst
length for DDR3 DIMMs is eight which is shared between two channels that are in lockstep
mode. Each channel of the pair provides 32 bytes to produce the 64-byte cache-line. DRAMs on
independent channels are configured to deliver a burst length of eight. The maximum read
bandwidth for a given rank is half of peak. There is another drawback in using lockstep mode,
that is, higher power consumption since the total activation power is about twice of the
independent channel operation if comparing to same type of DIMMs.
3.2.2.4.3 Mirror Mode
Memory mirroring mode is the mechanism by which a component of memory is mirrored. In
mirrored mode, when a write is performed to one copy, a write is generated to the target
location as well. This guarantees that the target is always updated with the latest data from the
main copy. The IMC module supports mirroring across the corresponding mirroring channel
within the processor socket but not across sockets. DIMM organization in each slot of one
channel must be identical to the DIMM in the corresponding slot of the other channel. This
allows a single decode for both channels. When mirroring mode is enabled, memory image in
Channel 0 is maintained the same as Channel 1 and Channel 2 is maintained the same as
Channel 3.
3.2.2.5 Memory RAS Support
The server board supports the following memory RAS modes:
Single Device Data Correction (SDDC)
Error Correction Code (ECC) Memory
Demand Scrubbing for ECC Memory
Patrol scrubbing for ECC Memory
Rank Sparing Mode
Mirrored Channel Mode
Lockstep Channel Mode
Regardless of RAS mode, the requirements for populating within a channel given in the section
3.2.2.2 must be met at all times. Note that support of RAS modes that require matching DIMM
population between channels (Mirrored and Lockstep) require that ECC DIMMs be populated.
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Independent Channel Mode is the only mode that supports non-ECC DIMMs in addition to ECC
DIMMs.
For Lockstep Channel Mode and Mirroring Mode, processor channels are paired together as a
“Domain”.
CPU1 Mirroring/Lockstep Domain 1= Channel A + Channel B
CPU1 Mirroring/Lockstep Domain 2= Channel C + Channel D
CPU2 Mirroring/Lockstep Domain 1= Channel E + Channel F
CPU2 Mirroring/Lockstep Domain 2= Channel G + Channel H
For RAS modes that require matching populations, the same slot positions across channels
must hold the same DIMM type with regards to size and organization. DIMM timings do not
have to match but timings will be set to support all DIMMs populated (that is, DIMMs with slower
timings will force faster DIMMs to the slower common timing modes).
3.2.2.5.1 Singel Device Data Correction (SDDC)
SDDC – Single Device Data Correction is a technique by which data can be replaced by the
IMC from an entire x4 DRAM device which is failing, using a combination of CRC plus parity.
This is an automatic IMC driven hardware. It can be extended to x8 DRAM technology by
placing the system in Channel Lockstep Mode.
3.2.2.5.2 Error Correction Code (ECC) Memory
ECC uses “extra bits” -64-bit data in a 72-bit DRAM array – to add an 8-bit calculated “Hamming
Code” to each 64 bits of data. This additional encoding enables the memory controller to detect
and report single or multiple bit errors when data is read, and to correct single-bit errors.
3.2.2.5.2.1 Correctable Memory ECC Error Handling
A “Correctable ECC Error” is one in which a single-bit error in memory contents is detected and
corrected by use of the ECC Hamming Code included in the memory data. For a correctable
error, data integrity is preserved, but it may be a warning sign of a true failure to come. Note that
some correctable errors are expected to occur.
The system BIOS has logic to copy with the random factor in correctable ECC errors. Rather
than reporting every correctable error that occurs, the BIOS have a threshold and only logs a
correctable error when a threshold value is reached. Additional correctable errors that occur
after the threshold has been reached are disregarded. In addition, on the expectation the server
system may have extremely long operational runs without being rebooted, there is a “Leaky
Bucket” algorithm incorporated into the correctable error counting and comparing mechanism.
The “Leaky Bucket” algorithm reduces the correctable error count as a function of time – as the
system remains running for a certain amount of time, the correctable error count will “leak out”
of the counting registers. This prevents correctable error counts from building up over an
extended runtime.
The correctable memory error threshold value is a configurable option in the <F2> BIOS Setup
Utility, where you can configure it for 20/10/5/ALL/None.
Once a correctable memory error threshold is reached, the event is logged to the System Event
Log (SEL) and the appropriate memory slot fault LED is lit to indicate on which DIMM the
correctable error threshold crossing occurred.
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3.2.2.5.2.2 Uncorrectable Memory ECC Error Handling
All multi-bit “detectable but not correctable” memory errors are classified as Uncorrectable
Memory ECC Errors. This is generally a fatal error.
However, before returning control to the OS drivers from the Machine Check Exception (MCE)
or Non-Maskable Interrupt (NMI), the Uncorrectable Memory ECC error is logged to the SEL,
the appropriate memory slot fault LED is lit, and the System Status LED state is changed to
solid Amber.
3.2.2.5.3 Demand Scrubbing for ECC Memory
Demand scrubbing is the ability to write corrected data back to the memory once a correctable
error is detected on a read transaction. This allows for correction of data in memory at detect,
and decrease the chances of a second error on the same address accumulating to cause a
multi-bit error (MBE) condition.
Demand Scrubbing is enabled/disabled (default is enabled) in the Memory Configuration screen
in Setup.
3.2.2.5.4 Patrol Scrubbing for ECC Memory
Patrol scrubs are intended to ensure that data with a correctable error does not remain in DRAM
long enough to stand a significant chance of further corruption to an uncorrectable stage.
3.2.2.5.5 Rank Sparing Mode
Rank Sparing Mode enhances the system’s RAS capability by “swapping out” failing ranks of
DIMMs. Rank Sparing is strictly channel and rank oriented. Each memory channel is a Sparing
Domain.
For Rank Sparing to be available as a RAS option, there must be 2 or more single rank or dual
rank DIMMs, or at least one quad rank DIMM installed on each memory channel.
Rank Sparing Mode is enabled/disabled in the Memory RAS and Performance Configuration
screen in the <F2> BIOS Setup Utility.
When Sparing Mode is operational, for each channel, the largest size memory rank is reserved
as a “spare” and is not used during normal operation. The impact on Effective Memory Size is to
subtract the sum of the reserved ranks from the total amount of installed memory.
Hardware registers count the number of Correctable ECC Errors for each rank of memory on
each channel during operations and compare the count against a Correctable Error Threshold.
When the correctable error count for a given rank hits the threshold value, that rank is deemed
to be “failing”, and it triggers a Sparing Fail Over (SFO) event for the channel in which that rank
resides. The data in the failing rank is copied to the Spare Rank for that channel, and the Spare
Rank replaces the failing rank in the IMC’s address translation registers.
An SFO Event is logged to the BMC SEL. The failing rank is then disabled, and any further
Correctable Errors on that now non-redundant channel will be disregarded.
The correctable error that triggered the SFO may be logged to the BMC SEL, if it was the first
one to occur in the system. That first correctable error event will be the only one logged for the
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system. However, since each channel is a Sparing Domain, the correctable error counting
continues for other channels which are still in a redundant state. There can be as many SFO
Events as there are memory channels with DIMMs installed.
3.2.2.5.6 Mirrored Channel Mode
Channel Mirroring Mode gives the best memory RAS capability by maintaining two copies of the
data in main memory. If there is an Uncorrectable ECC error, the channel with the error is
disabled and the system continues with the “good” channel, but in a non-redundant
configuration.
For Mirroring mode to be available as a RAS option, the DIMM population must be identical
between each pair of memory channels that participate. Not all channel pairs need to have
memory installed, but for each pair, the configuration must match. If the configuration is not
matched up properly, the memory operating mode falls back to Independent Channel Mode.
Mirroring Mode is enabled/disabled in the Memory RAS and Performance Configuration screen
in the <F2> BIOS Setup Utility.
When Mirroring Mode is operational, each channel in a pair is “mirrored” by the other channel.
The impact on Effective Memory size is to reduce by half the total amount of installed memory
available for use. When Mirroring Mode is operational, the system treats Correctable Errors the
same way as it would in Independent channel mode. There is a correctable error threshold.
Correctable error counts accumulate by rank, and the first event is logged.
What Mirroring primarily protects against is the possibility of an Uncorrectable ECC Error
occurring with critical data “in process”. Without Mirroring, the system would be expected to
“Blue Screen” and halt, possibly with serious impact to operation. But with Mirroring Mode in
operation, an Uncorrectable ECC Error from one channel becomes a Mirroring Fail Over (MFO)
event instead, in which the IMC retrieves the correct data from the “mirror image” channel and
disables the failed channel. Since the ECC Error was corrected in the process of the MFO Event,
the ECC Error is demoted to a Correctable ECC Error. The channel pair becomes a single non-
redundant channel, but without impacting operations, and the Mirroring Fail Over Event is
logged to SEL to alert the user that there is memory hardware that has failed and needs to be
replaced.
3.2.3 Processor Integrated I/O Module (IIO)
The processor’s integrated I/O module provides features traditionally supported through chipset
components. The integrated I/O module provides the following features:
PCI Express* Interfaces: The integrated I/O module incorporates the PCI Express*
interface and supports up to 40 lanes of PCI Express*. Following are key attributes of
the PCI Express* interface:
o Gen3 speeds up to 8 GT/s
o X16 interface bifurcated down to two x8 or four x4 (or combinations)
o X8 interface bifurcated down to two x4
DMI2 Interface to the PCH: The platform requires an interface to the legacy
Southbridge (PCH) which provides basic, legacy functions required for the server
platform and operating systems. Since only one PCH is required and allowed for the
system, any sockets which do not connect to PCH would use this port as a standard x4
PCI Express* 2.0 interface.
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Integrated IOAPIC: Provides support for PCI Express* devices implementing legacy
interrupt messages without interrupt sharing
Non Transparent Bridge: PCI Express* non-transparent bridge (NTB) acts as a
gateway that enables high performance, low overhead communication between two
intelligent subsystems; the local and the remote subsystems. The NTB allows a local
processor to independently configure and control the local subsystem, provides isolation
of the local host memory domain from the remote host memory domain while enabling
status and data exchange between the two domains.
Intel® QuickData Technology: Used for efficient, high bandwidth data movement
between two locations in memory or from memory to I/O.
Dual GbDual Gb
Dual GbDual Gb
DMI2 PCIe Gen2 x4 (4GB/s)
PCIe Gen3 x16 (32GB/s)
PCIe Gen3 x4 (8 GB/s)
PCIe Gen3 x4 (8 GB/s)
PCIe Gen2 x4 (4GB/s)
Figure 14. Functional Block Diagram of Processor IIO Sub-system
The following sub-sections will describe the server board features that are directly supported by
the processor IIO module. These include the PCI Card Slots, Network Interface, and connectors
for the optional SAS Module. Features and functions of the Intel® C600 Series chipset will be
described in its own dedicated section.
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3.2.3.1 PCI Card Support
The server board provides six PCI card slots identified by PCIe Slot 1 to PCIe Slot 6. The PCIe
slot 1 is routed from Intel® C600 Series Chipset, The PCIe slot 2 and 5 are routed from CPU 1.
The PCIe slot 3, 4, 6 are routed from CPU 2.
Slot 1: PCIe Gen II x4 electrical with x8 physical connector, routed from Intel® C600
Chipset, support half-length card
Slot 2: PCIe Gen III x16 electrical with x16 physical connector, routed from CPU1,
support full length card
Slot 3: PCIe Gen III x16 electrical with x16 physical connector, routed from CPU2,
support full length, double width card
Slot 4: PCIe Gen III x8 electrical with x8 connector, routed from CPU2, support full
length card
Slot 5: PCIe Gen III x16 electrical with x16 connector, routed from CPU1, support full
length, double width card
Slot 6: PCIe Gen III x16 electrical with x16 connector, routed from CPU2, support half-
length card, Intel® PCIe riser card
Note: PCIe Slot 3, 4, 6 can only be used in dual processor configurations.
3.2.3.2 Intel® Integrated RAID Option
The server board provides support for Intel® Integrated RAID modules with PCIe form factor.
These optional modules attach to PCIe slots on the server board and are supported by x8 PCIe
Gen3 signals from the IIO module of the CPU processor. Features of this option include:
SKU options to support full or entry level hardware RAID
Dual-core 6Gb SAS ROC
4 or 8 port and SAS/SATA or SATASKU options to support 512MB or 1GB embedded
memory
Intel® designed flash + optional support for super-cap backup (Maintenance Free Back
Up) or improved Lithium Polymer battery
Table 7. Supported Intel® Integrated RAID Modules
External Name Description Product Code
Intel® Integrated RAID Module
RMS25KB080
8 Port SAS, PCIe Slot
RAID Levels 0,1,1E and 10 RMS25KB080
Intel® Integrated RAID Module
RMS25KB040
4 Port SAS, PCIe Slot
RAID Levels 0,1,1E and10 RMS25KB040
Intel® Integrated RAID Module
RMS25PB080
8 Port SAS/SATA, PCIe Slot
RAID Levels 0,1,10, 5, 50, 6, 60 RMS25PB080
Intel® Integrated RAID Module
RMS25PB040
4 Port SAS/SATA, PCIe Slot
RAID Levels 0,1,10, 5, 50, 6, 60 RMS25PB040
Intel® Integrated RAID Module
RMT3PB080
8 Port SATA, PCIe Slot
RAID Levels 0,1,10, 5, 50, 6, 60 RMT3PB080
For additional product information, please refer the following Intel® documents:
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1. Intel® Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and
RMS25CB040 Hardware/Installation User Guide
2. Intel Integrated RAID Module RMS25KB040, RMS25KB080, RMS25JB040,
RMS25JB080 –Hardware/Installation User Guide
3. Intel Integrated RAID Module RMT3PB080 and RMT3CB080 –Hardware/Installation
User Guide
3.2.3.3 Intel Riser Card Option
The server board provides support for Intel® Riser Card. These optional modules attach to PCIe
slot6 on the server board and are supported by x16 PCIe Gen3 signals from the IIO module of
the CPU 2 processor.
Table 8. Supported Intel® Riser Card
Product Code Description
A
XX2UPCIEX16 2U PCIe x16 riser, 1 slot
x16 electrical/x16 mechanical
A
XX2UPCIEX8X4
2U PCIe x16 riser, 3 slots
one x8 electrical/x16 mechanical
Two x4 electrical/x8 mechanical
A
XX1UPCIEX16 1U PCIe x16 riser, 1 slot
x16 electrical/x16 mechanical
3.2.3.4 Network Interface
Network connectivity is provided by means of an onboard Intel® Ethernet Controller 1350-AM4
providing up to four 10/100/1000 Mb Ethernet ports. The NIC chip is supported by implementing
x4 PCIe Gen3 signals from the IIO module of the CPU 1 processor.
On the Intel® Server Board S2600CO, four external 10/100/1000 Mb RJ45 Ethernet ports are
provided. Each Ethernet port drives two LEDs located on each network interface connector. The
LED at the right of the connector is the link/activity LED and indicates network connection when
on, and transmit/receive activity when blinking. The LED at the left of the connector indicates
link speed as defined in the following table.
Table 9. External RJ45 NIC Port LED Definition
LED Color LED State
NIC State
Left Green
Off LAN link not established
On LAN link is established
Blinking LAN activity is occurring
Right
N/A Off 10 Mb/sec data rate
Amber On 100 Mb/sec data rate
Green On 1000 Mb /sec data rate
The server board has seven MAC addresses programmed at the factory. MAC addresses are
assigned as follows:
NIC 1 MAC address (for OS usage)
NIC 2 MAC address = NIC 1 MAC address + 1 (for OS usage)
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NIC 3 MAC address = NIC 1 MAC address + 2 (for OS usage)
NIC 4 MAC address = NIC 1 MAC address + 3 (for OS usage)
BMC LAN channel 1 MAC address = NIC1 MAC address + 4
BMC LAN channel 2 MAC address = NIC1 MAC address + 5
BMC LAN channel 3 (RMM) MAC address = NIC1 MAC address + 6
3.3 Intel® C600-A Chipset Functional Overview
The following sub-sections will provide an overview of the key features and functions of the
Intel® C600-A chipset used on the server board. For more comprehensive chipset specific
information, refer to the Intel® C600 Series chipset documents listed in the Reference
Documents list.
SCU[7:4] SCU[3:0] P[5:2] P[1:0]
LHSRHS
USB[7,6,5,1]
USB[13,11]
PCIe Gen2 x4 (4GB/s)
Figure 15. Functional Block Diagram - Chipset Supported Features and Functions
On the Intel® Server Boards S2600CO, the chipset provides support for the following on-board
functions:
Low Pin Count (LPC) interface
Serial Peripheral Interface (SPI)
Universal Serial Bus (USB) Controller
Serial Attached SCSI (SAS)/Serial ATA (SATA) Support
Manageability Features
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3.3.1 Non-Transparent Bridge
PCI Express* Non-Transparent Bridge (NTB) acts as a gateway that enables high performance,
low overhead communication between two intelligent subsystems, the local and the remote
subsystems. The NTB allows a local processor to independently configure and control the local
subsystem, provides isolation of the local host memory domain from the remote host memory
domain while enabling status and data exchange between the two domains.
The PCI Express* Port 3A of Intel® Xeon® Processor E5-2600 or E5-2600 v2 Product Families
can be configured to be a transparent bridge or a NTB with x4/x8 link width and
Gen1/Gen2/Gen3 link speed. Also this NTB port could be attached to another NTB port or PCI
Express* Root Port on another subsystem. NTB supports three 64bit BARs as configuration
space or prefetchable memory windows that can access both 32bit and 64bit address space
through 64bit BARs.
There are three NTB supported configuration:
NTB Port to NTB Port Based Connection (Back-to-Back)
NTB Port to Root Port Based Connection - Symmetric Configuration. The NTB port on
the first system is connected to the root port of the second. The second system’s NTB
port is connected to the root port on the first system making this a fully symmetric
configuration.
NTB Port to Root Port Based Connection - Non-Symmetric Configuration. The root port
on the first system is connected to the NTB port of the second system. And it is not
necessary for the first system to be of the Intel® Xeon® Processor E5-2600 or E5-2600
v2 product family.
3.3.2 Low Pin Count (LPC) Interface
The chipset implements an LPC Interface as described in the LPC 1.1 Specification and
provides support for up to two Master/DMI devices. On the server board, the LPC interface is
utilized as an interconnect between the chipset and the Integrated Base Board Management
Controller as well as providing support for the optional Trusted Platform Module (TMP).
3.3.3 Universal Serial Bus (USB) Controller
The chipset has two Enhanced Host Controller Interface (EHCI) host controllers that support
USB high-speed signaling. High-speed USB 2.0 allows data transfers up to 480 Mb/s which is
40 times faster than full-speed USB. The server board utilizes ten USB 2.0 ports from the
chipset. All ports are high-speed, full- speed, and low-speed capable.
Four external USB ports are provided in a stacked housing located on the rear I/O
section of the server board.
Two USB ports are routed to an internal 10-pin connector that can be cabled for front
panel support.
One internal Type ‘A’ USB port.
One eUSB connector intended for use with an optional eUSB SSD device.
Two USB ports are routed to the Integrated BMC.
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3.3.3.1 eUSB SSD Support
The server board provides support for a low profile eUSB SSD storage device. A 2mm 2x5-pin
connector labeled “eUSB SSD” is used to plug this small flash storage device into.
3.3.4 On-board Serial Attached SCSI (SAS)/Serial ATA (SATA)/RAID Support and
Options
The Intel® C600-A chipset provides storage support by two integrated controllers: Advanced
Host Controller Interface (AHCI) and SCU. By default the server board will support up to 6
SATA ports: Two single 6Gb/sec SATA ports routed from the AHCI controller to the two white
SATA connectors labeled “SATA_0” and “SATA_1”, and four 3Gb/sec SATA ports routed from
the SCU to the blue SATA/SAS port connectors labeled “SATA/SAS_0”, “SATA/SAS_1”,
“SATA/SAS_2”, “SATA/SAS_3”.
AHCI SATA_0 port also supports high profile, vertical SATA DOM header with onboard power.
Note: The connectors labeled “SATA/SAS_4” to “SATA/SAT_7” is NOT functional by default
and is only enabled with the addition of an Intel® RAID C600 Upgrade Key option supporting 8
SATA/SAS ports.
The server board is capable of supporting additional chipset embedded SAS, SATA, and RAID
options from the SCU controller when configured with one of several available Intel® RAID C600
Upgrade Keys. Upgrade keys install onto a 4-pin connector on the server board labeled
“STRO_UPG_KEY”.
Figure 16. Intel® RAID C600 Upgrade Key Connector
The following table identifies available upgrade key options and their supported features.
Table 10. Intel® RAID C600 Upgrade Key Options
Intel® RAID C600 Upgrade Key Options Key Color Description
Default – No option key installed N/A 4 Port SATA with Intel
®
ESRT RAID 0,1,10 and
Intel® RSTe RAID 0,1,5,10
RKSATA4R5 Black
4 Port SATA with Intel
®
ESRT2 RAID 0,1, 5, 10
and Intel® RSTe RAID 0,1,5,10
RKSATA8 Blue
8 Port SATA with Intel
®
ESRT2 RAID 0,1, 10
and Intel® RSTe RAID 0,1,5,10
RKSATA8R5 White
8 Port SATA with Intel
®
ESRT2 RAID 0,1, 5, 10
and Intel® RSTe RAID 0,1,5,10
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Intel® RAID C600 Upgrade Key Options Key Color
Description
RKSAS4 Green
4 Port SAS with Intel
®
ESRT2 RAID 0,1, 10 and
Intel® RSTe RAID 0,1,10
RKSAS4R5 Yellow
4 Port SAS with Intel
®
ESRT2 RAID 0,1, 5, 10
and Intel® RSTe RAID 0,1,10
RKSAS8 Orange
8 Port SAS with Intel
®
ESRT2 RAID 0,1, 10 and
Intel® RSTe RAID 0,1,10
RKSAS8R5 Purple
8 Port SAS with Intel
®
ESRT2 RAID 0,1, 5, 10
and Intel® RSTe RAID 0,1,10
Additional information for the on-board RAID features and functionality can be found in the Intel®
RAID Software User’s Guide.
The system includes support for two embedded software RAID options:
Intel® Embedded Server RAID Technology 2 (ESRT2) based on LSI* MegaRAID SW
RAID technology
Intel® Rapid Storage Technology (RSTe)
Using the <F2> BIOS Setup Utility, accessed during system POST, options are available to
enable/disable SW RAID, and select which embedded software RAID option to use.
3.3.4.1 Intel® Embedded Server RAID Technology 2 (ESRT2)
Features of the embedded software RAID option Intel® Embedded Server RAID Technology 2
(ESRT2) include the following:
Based on LSI* MegaRAID Software Stack
Software RAID with system providing memory and CPU utilization
Supported RAID Levels – 0,1,5,10
o 4 & 8 Port SATA RAID 5 support provided with appropriate Intel® RAID C600
Upgrade Key
o 4 & 8 Port SAS RAID 5 support provided with appropriate Intel® RAID C600
Upgrade Key
Maximum drive support = eight (with or without SAS expander option installed)
Open Source Compliance = Binary Driver (includes Partial Source files) or Open Source
using MDRAID layer in Linux*.
OS Support = Microsoft Windows 7*, Microsoft Windows 2008*, Microsoft Windows
2003*, RHEL*, SLES*, other Linux* variants using partial source builds.
Utilities = Microsoft Windows* GUI and CLI, Linux* GUI and CLI, DOS CLI, and EFI CLI
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3.3.4.2 Intel® Rapid Storage Technology (RSTe)
Features of the embedded software RAID option Intel® Rapid Storage Technology (RSTe)
include the following:
Software RAID with system providing memory and CPU utilization
Supported RAID Levels – 0,1,5,10
o Four Port SATA RAID 5 available standard (no option key required)
o Eight Port SATA RAID 5 support provided with appropriate Intel® RAID C600
Upgrade Key
o No SAS RAID 5 support
Maximum drive support = 32 (in arrays with 8 port SAS), 16 (in arrays with 4 port SAS),
128 (JBOD)
Open Source Compliance = Yes (uses MDRAID)
OS Support = Microsoft Windows 7*, Microsoft Windows 2008*, Microsoft Windows
2003*, RHEL* 6.2 and later, SLES* 11 w/SP2 and later, VMware* 5.x.
Utilities = Microsoft Windows* GUI and CLI, Linux* CLI, DOS CLI, and EFI CLI
Uses Matrix Storage Manager for Microsoft Windows*
MDRAID supported in Linux* (does not require a driver)
Note: No boot drive support to targets attached through SAS expander card
3.3.5 Manageability
The chipset integrates several functions designed to manage the system and lower the total
cost of ownership (TCO) of the system. These system management functions are designed to
report errors, diagnose the system, and recover from system lockups without the aid of an
external microcontroller.
TCO Timer. The chipset’s integrated programmable TCO timer is used to detect system
locks. The first expiration of the timer generates an SMI# that the system can use to
recover from a software lock. The second expiration of the timer causes a system reset
to recover from a hardware lock.
Processor Present Indicator. The chipset looks for the processor to fetch the first
instruction after reset. If the processor does not fetch the first instruction, the chipset will
reboot the system.
ECC Error Reporting. When detecting an ECC error, the host controller has the ability
to send one of several messages to the chipset. The host controller can instruct the
chipset to generate SMI #, NMI, SERR#, or TCO interrupt.
Function Disable. The chipset provides the ability to disable the following integrated
functions: LAN, USB, LPC, SATA, and PCI Express* or SMBus*. Once disabled, these
functions no longer decode I/O, memory, or PCI configuration space. Also, no interrupts
or power management events are generated from the disabled functions.
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3.4 Integrated Baseboard Management Controller Overview
The server board utilizes the I/O controller, Graphics Controller, and Baseboard Management
features of the Server Engines* Pilot-III Server Management Controller. The following is an
overview of the features as implemented on the server board from each embedded controller.
Figure 17. Integrated BMC Functional Block Diagram
Figure 18. Integrated BMC Hardware
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3.4.1 Super I/O Controller
The integrated super I/O controller provides support for the following features as implemented
on the server board:
Two Fully Functional Serial Ports, compatible with the 16C550
Serial IRQ Support
Up to 16 Shared direct GPIOs
Serial GPIO support for 80 general purpose inputs and 80 general purpose outputs
available for host processor
Programmable Wake-up Event Support
Plug and Play Register Set
Power Supply Control
Host SPI bridge for system BIOS support
3.4.1.1 Keyboard and Mouse Support
The server board does not support PS/2 interface keyboards and mice. However, the system
BIOS recognizes USB specification-compliant keyboard and mice.
3.4.1.2 Wake-up Control
The super I/O contains functionality that allows various events to power on and power off the
system.
3.4.2 Graphics Controller and Video Support
The integrated graphics controller provides support for the following features as implemented on
the server board:
Integrated Graphics Core with 2D Hardware accelerator
DDR-3 memory interface with 16MB of memory allocated and reported for graphics
memory
High speed Integrated 24-bit RAMDAC
Single lane PCI-Express host interface running at Gen 1 speed
The integrated video controller supports all standard IBM VGA modes. The following table
shows the 2D modes supported for both CRT and LCD:
Table 11. Video Modes
2D Mode 2D Video Mode Support
8 bpp 16 bpp 24 bpp 32 bpp
640x480 Supported Supported Supported Supported
800x600 Supported Supported Supported Supported
1024x768 Supported Supported Supported Supported
1152x864 Supported Supported Supported Supported
1280x1024 Supported Supported Supported Supported
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2D Mode 2D Video Mode Support
8 bpp 16 bpp 24 bpp 32 bpp
1600x1200** Supported Supported
** Video resolutions at 1600x1200 and higher are only supported through the
external video connector located on the rear I/O section of the server board.
Utilizing the optional front panel video connector may result in lower video
resolutions.
The server board provides one video interfaces. The video interface is accessed using a
standard 15-pin VGA connector found on the back edge of the server board.
The BIOS supports dual-video mode when an add-in video card is installed.
In the single mode (dual monitor video = disabled), the on-board video controller is disabled
when an add-in video card is detected.
In the dual mode (on-board video = enabled, dual monitor video = enabled), the on-board video
controller is enabled and is the primary video device. The add-in video card is allocated
resources and is considered the secondary video device. The BIOS Setup utility provides
options to configure the feature as follows:
Table 12. Video mode
On-board Video Enabled
Disabled
Dual Monitor Video Enabled
Disabled
Shaded if on-board video is set to "Disabled"
3.4.3 Baseboard Management Controller
The server board utilizes the following features of the embedded baseboard management
controller.
IPMI 2.0 Compliant
400MHz 32-bit ARM9 processor with memory management unit (MMU)
Two independent 10/100/1000 Ethernet Controllers with Reduced Media Independent
Interface (RMII)/ Reduced Gigabit Media Independent Interface (RGMII) support
DDR2/3 16-bit interface with up to 800 MHz operation
16 10-bit ADCs
Sixteen fan tachometers
Eight Pulse Width Modulators (PWM)
Chassis intrusion logic
JTAG Master
Eight I2C interfaces with master-slave and SMBus* timeout support. All interfaces are
SMBus* 2.0 compliant.
Parallel general-purpose I/O Ports (16 direct, 32 shared)
Serial general-purpose I/O Ports (80 in and 80 out)
Three UARTs
Platform Environmental Control Interface (PECI)
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Six general-purpose timers
Interrupt controller
Multiple Serial Peripheral Interface (SPI) flash interfaces
NAND/Memory interface
Sixteen mailbox registers for communication between the BMC and host
LPC ROM interface
BMC watchdog timer capability
SD/MMC card controller with DMA support
LED support with programmable blink rate controls on GPIOs
Port 80h snooping capability
Secondary Service Processor (SSP), which provides the HW capability of offloading time
critical processing tasks from the main ARM core.
3.4.3.1 Remote Keyboard, Video, Mourse, and Storage (KVMS) Support
USB 2.0 interface for Keyboard, Mouse and Remote storage such as CD/DVD ROM and
floppy
USB 1.1/USB 2.0 interface for PS2 to USB bridging, remote Keyboard and Mouse
Hardware Based Video Compression and Redirection Logic
Supports both text and Graphics redirection
Hardware assisted Video redirection using the Frame Processing Engine
Direct interface to the Integrated Graphics Controller registers and Frame buffer
Hardware-based encryption engine
3.4.3.2 Integrated BMC Embedded LAN Channel
The Integrated BMC hardware includes two dedicated 10/100 network interfaces. These
interfaces are not shared with the host system. At any time, only one dedicated interface may
be enabled for management traffic. The default active interface is the NIC 1 port.
For these channels, support can be enabled for IPMI-over-LAN and DHCP. For security reasons,
embedded LAN channels have the following default settings:
IP Address: Static.
All users disabled.
For a functional overview of the baseboard management features, refer to Chapter 6.
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4. Technology Support
4.1 Intel® Trusted Execution Technology
The Intel® Xeon® Processor E5 4600/2600/2400/1600 Product Families support Intel® Trusted
Execution Technology (Intel® TXT), which is a robust security environment designed to help
protect against software-based attacks. Intel® Trusted Execution Technology integrates new
security features and capabilities into the processor, chipset and other platform components.
When used in conjunction with Intel® Virtualization Technology and Intel® VT for Directed IO,
with an active TPM, Intel® Trusted Execution Technology provides hardware-rooted trust for
your virtual applications.
4.2 Intel® Virtualization Technology – Intel® VT-x/VT-d/VT-c
Intel® Virtualization Technology consists of three components which are integrated and
interrelated, but which address different areas of Virtualization.
Intel® Virtualization Technology (VT-x) is processor-related and provides capabilities
needed to provide hardware assist to a Virtual Machine Monitor (VMM).
Intel® Virtualization Technology for Directed I/O (VT-d) is primarily concerned with
virtualizing I/O efficiently in a VMM environment. This would generally be a chipset I/O
feature, but in the Second Generation Intel® Core™ Processor Family there is an
Integrated I/O unit embedded in the processor, and the IIO is also enabled for VT-d.
Intel® Virtualization Technology for Connectivity (VT-c) is primarily concerned I/O
hardware assist features, complementary to but independent of VT-d.
Intel ®VT-x is designed to support multiple software environments sharing same hardware
resources. Each software environment may consist of OS and applications. The Intel®
Virtualization Technology features can be enabled or disabled in the BIOS setup. The default
behavior is disabled.
Intel® VT-d is supported jointly by the Intel® Xeon® Processor E5 4600/2600/2400/1600 Product
Families and the C600 chipset. Both support DMA remapping from inbound PCI Express*
memory Guest Physical Address (GPA) to Host Physical Address (HPA). PCI devices are
directly assigned to a virtual machine leading to a robust and efficient virtualization.
The Intel® S4600/S2600/S2400/S1600/S1400 Server Board Family BIOS publishes the DMAR
table in the ACPI Tables. For each DMA Remapping Engine in the platform, one exact entry of
DRHD (DMA Remapping Hardware Unit Definition) structure is added to the DMAR. The DRHD
structure in turn contains a Device Scope structure that describes the PCI endpoints and/or sub-
hierarchies handled by the particular DMA Remapping Engine.
Similarly, there are reserved memory regions typically allocated by the BIOS at boot time. The
BIOS marks these regions as either reserved or unavailable in the system address memory
map reported to the OS. Some of these regions can be a target of DMA requests from one or
more devices in the system, while the OS or executive is active. The BIOS reports each such
memory region using exactly one RMRR (Reserved Memory Region Reporting) structure in the
DMAR. Each RMRR has a Device Scope listing the devices in the system that can cause a
DMA request to the region.
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For more information on the DMAR table and the DRHD entry format, refer to the Intel®
Virtualization Technology for Directed I/O Architecture Specification. For more general
information about VT-x, VT-d, and VT-c, a good reference is Enabling Intel® Virtualization
Technology Features and Benefits White Paper.
4.3 Intel® Intelligent Power Node Manager
Data centers are faced with power and cooling challenges that are driven by increasing
numbers of servers deployed and server density in the face of several data center power and
cooling constraints. In this type of environment, Information Technology (IT) needs the ability to
monitor actual platform power consumption and control power allocation to servers and racks in
order to solve specific data center problems including the following issues:
Table 13. Data Center Problems
IT Challenge Requirement
Over-allocation of power Ability to monitor actual power consumption.
Control capability that can maintain a power budget to
enable dynamic power allocation to each server.
Under-population of rack space Control capability that can maintain a power budget to
enable increased rack population.
High energy costs Control capability that can maintain a power budget to
ensure that a set energy cost can be achieved.
Capacity planning Ability to monitor actual power consumption to enable
power usage modeling over time and a given planning
period.
Ability to understand cooling demand from a
temperature and airflow perspective.
Detection and correction of hot spots Control capability that reduces platform power
consumption to protect a server in a hot-spot.
Ability to monitor server inlet temperatures to enable
greater rack utilization in areas with adequate cooling.
The requirements listed above are those that are addressed by the C600 chipset Management
Engine (ME) and Intel® Intelligent Power Node Manager (NM) technology. The ME/NM
combination is a power and thermal control capability on the platform, which exposes external
interfaces that allow IT (through external management software) to query the ME about platform
power capability and consumption, thermal characteristics, and specify policy directives (for
example, set a platform power budget).
Node Manager (NM) is a platform resident technology that enforces power capping and thermal-
triggered power capping policies for the platform. These policies are applied by exploiting
subsystem knobs (such as processor P and T states) that can be used to control power
consumption. NM enables data center power management by exposing an external interface to
management software through which platform policies can be specified. It also implements
specific data center power management usage models such as power limiting, and thermal
monitoring.
The NM feature is implemented by a complementary architecture utilizing the ME, BMC, BIOS,
and an ACPI-compliant OS. The ME provides the NM policy engine and power control/limiting
functions (referred to as Node Manager or NM) while the BMC provides the external LAN link by
which external management software can interact with the feature. The BIOS provides system
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power information utilized by the NM algorithms and also exports ACPI Source Language (ASL)
code used by OS-Directed Power Management (OSPM) for negotiating processor P and T state
changes for power limiting. PMBus*-compliant power supplies provide the capability to
monitoring input power consumption, which is necessary to support NM.
Following are the some of the applications of Intel® Intelligent Power Node Manager technology.
Platform Power Monitoring and Limiting: The ME/NM monitors platform power
consumption and hold average power over duration. It can be queried to return actual
power at any given instance. The power limiting capability is to allow external
management software to address key IT issues by setting a power budget for each
server. For example, if there is a physical limit on the power available in a room, then IT
can decide to allocate power to different servers based on their usage – servers running
critical systems can be allowed more power than servers that are running less critical
workload.
Inlet Air Temperature Monitoring: The ME/NM monitors server inlet air temperatures
periodically. If there is an alert threshold in effect, then ME/NM issues an alert when the
inlet (room) temperature exceeds the specified value. The threshold value can be set by
policy.
Memory Subsystem Power Limiting: The ME/NM monitors memory power
consumption. Memory power consumption is estimated using average bandwidth
utilization information.
Processor Power monitoring and limiting: The ME/NM monitors processor or socket
power consumption and holds average power over duration. It can be queried to return
actual power at any given instant. The monitoring process of the ME will be used to limit
the processor power consumption through processor P-states and dynamic core
allocation.
Core allocation at boot time: Restrict the number of cores for OS/VMM use by limiting
how many cores are active at boot time. After the cores are turned off, the CPU will limit
how many working cores are visible to BIOS and OS/VMM. The cores that are turned off
cannot be turned on dynamically after the OS has started. It can be changed only at the
next system reboot.
Core allocation at run-time: This particular use case provides a higher level processor
power control mechanism to a user at run-time, after booting. An external agent can
dynamically use or not use cores in the processor subsystem by requesting ME/NM to
control them, specifying the number of cores to use or not use.
4.3.1 Hardware Requirements
NM is supported only on platforms that have the NM FW functionality loaded and enabled on
the Management Engine (ME) in the SSB and that have a BMC present to support the external
LAN interface to the ME. NM power limiting features requires a means for the ME to monitor
input power consumption for the platform. This capability is generally provided by means of
PMBus*-compliant power supplies although an alternative model using a simpler SMBus* power
monitoring device is possible (there is potential loss in accuracy and responsiveness using non-
PMBus* devices). The NM SmaRT/CLST feature does specifically require PMBus*-compliant
power supplies as well as additional hardware on the baseboard.
.
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5. System Security
5.1 BIOS Password Protection
The BIOS uses passwords to prevent unauthorized tampering with the server setup. Passwords
can restrict entry to the BIOS Setup, restrict use of the Boot Popup menu, and suppress
automatic USB device reordering.
There is also an option to require a Power On password entry in order to boot the system. If the
Power On Password function is enabled in Setup, the BIOS will halt early in POST to request a
password before continuing POST.
Both Administrator and User passwords are supported by the BIOS. An Administrator password
must be installed in order to set the User password. The maximum length of a password is
14 characters. A password can have alphanumeric (a-z, A-Z, 0-9) characters and it is case
sensitive. Certain special characters are also allowed, from the following set:
! @ # $ % ^ & * ( ) - _ + = ?
The Administrator and User passwords must be different from each other. An error message will
be displayed if there is an attempt to enter the same password for one as for the other.
The use of “Strong Passwords” is encouraged, but not required. In order to meet the criteria for
a “Strong Password”, the password entered must be at least 8 characters in length, and must
include at least one each of alphabetic, numeric, and special characters. If a “weak” password is
entered, a popup warning message will be displayed, although the weak password will be
accepted.
Once set, a password can be cleared by changing it to a null string. This requires the
Administrator password, and must be done through BIOS Setup or other explicit means of
changing the passwords. Clearing the Administrator password will also clear the User password.
Alternatively, the passwords can be cleared by using the Password Clear jumper if necessary.
Resetting the BIOS configuration settings to default values (by any method) has no effect on the
Administrator and User passwords.
Entering the User password allows the user to modify only the System Time and System Date in
the Setup Main screen. Other setup fields can be modified only if the Administrator password
has been entered. If any password is set, a password is required to enter the BIOS setup.
The Administrator has control over all fields in the BIOS setup, including the ability to clear the
User password and the Administrator password.
It is strongly recommended that at least an Administrator Password be set, since not having set
a password gives everyone who boots the system the equivalent of Administrative access.
Unless an Administrator password is installed, any User can go into Setup and change BIOS
settings at will.
In addition to restricting access to most Setup fields to viewing only when a User password is
entered, defining a User password imposes restrictions on booting the system. In order to
simply boot in the defined boot order, no password is required. However, the F6 Boot popup
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prompts for a password, and can only be used with the Administrator password. Also, when a
User password is defined, it suppresses the USB Reordering that occurs, if enabled, when a
new USB boot device is attached to the system. A User is restricted from booting in anything
other than the Boot Order defined in the Setup by an Administrator.
As a security measure, if a User or Administrator enters an incorrect password three times in a
row during the boot sequence, the system is placed into a halt state. A system reset is required
to exit out of the halt state. This feature makes it more difficult to guess or break a password.
In addition, on the next successful reboot, the Error Manager displays a Major Error code 0048,
which also logs a SEL event to alert the authorized user or administrator that a password
access failure has occurred
5.2 Trusted Platform Module (TPM) Support
The Trusted Platform Module (TPM) option is a hardware-based security device that addresses
the growing concern on boot process integrity and offers better data protection. TPM protects
the system start-up process by ensuring it is tamper-free before releasing system control to the
operating system. A TPM device provides secured storage to store data, such as security keys
and passwords. In addition, a TPM device has encryption and hash functions. The server board
implements TPM as per TPM PC Client Specifications, Revision 1.2 by the Trusted Computing
Group (TCG).
A TPM device is optionally installed onto a high density 14-pin connector labeled “TPM” on the
server board, and is secured from external software attacks and physical theft. A pre-boot
environment, such as the BIOS and operating system loader, uses the TPM to collect and store
unique measurements from multiple factors within the boot process to create a system
fingerprint. This unique fingerprint remains the same unless the pre-boot environment is
tampered with. Therefore, it is used to compare to future measurements to verify the integrity of
the boot process.
After the system BIOS completes the measurement of its boot process, it hands off control to
the operating system loader and in turn to the operating system. If the operating system is TPM-
enabled, it compares the BIOS TPM measurements to those of previous boots to make sure the
system was not tampered with before continuing the operating system boot process. Once the
operating system is in operation, it optionally uses TPM to provide additional system and data
security (for example, Microsoft Vista* supports Bitlocker drive encryption).
5.2.1 TPM security BIOS
The BIOS TPM support conforms to the TPM PC Client Implementation Specification for
Conventional BIOS and to the TPM Interface Specification, and the Microsoft Windows
BitLocker* Requirements. The role of the BIOS for TPM security includes the following:
Measures and stores the boot process in the TPM microcontroller to allow a TPM
enabled operating system to verify system boot integrity.
Produces EFI and legacy interfaces to a TPM-enabled operating system for using TPM.
Produces ACPI TPM device and methods to allow a TPM-enabled operating system to
send TPM administrative command requests to the BIOS.
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Verifies operator physical presence. Confirms and executes operating system TPM
administrative command requests.
Provides BIOS Setup options to change TPM security states and to clear TPM
ownership.
For additional details, refer to the TCG PC Client Specific Implementation Specification, the
TCG PC Client Specific Physical Presence Interface Specification, and the Mic rosoft BitLocker*
Requirement documents.
5.2.2 Physical Presence
Administrative operations to the TPM require TPM ownership or physical presence indication by
the operator to confirm the execution of administrative operations. The BIOS implements the
operator presence indication by verifying the setup Administrator password.
A TPM administrative sequence invoked from the operating system proceeds as follows:
1. User makes a TPM administrative request through the operating system’s security software.
2. The operating system requests the BIOS to execute the TPM administrative command
through TPM ACPI methods and then resets the system.
3. The BIOS verifies the physical presence and confirms the command with the operator.
4. The BIOS executes TPM administrative command(s), inhibits BIOS Setup entry and boots
directly to the operating system which requested the TPM command(s).
5.2.3 TPM Security Setup Options
The BIOS TPM Setup allows the operator to view the current TPM state and to carry out
rudimentary TPM administrative operations. Performing TPM administrative options through the
BIOS setup requires TPM physical presence verification.
Using BIOS TPM Setup, the operator can turn ON or OFF TPM functionality and clear the TPM
ownership contents. After the requested TPM BIOS Setup operation is carried out, the option
reverts to No Operation.
The BIOS TPM Setup also displays the current state of the TPM, whether TPM is enabled or
disabled and activated or deactivated. Note that while using TPM, a TPM-enabled operating
system or application may change the TPM state independent of the BIOS setup. When an
operating system modifies the TPM state, the BIOS Setup displays the updated TPM state.
The BIOS Setup TPM Clear option allows the operator to clear the TPM ownership key and
allows the operator to take control of the system with TPM. You use this option to clear security
settings for a newly initialized system or to clear a system for which the TPM ownership security
key was lost.
5.2.3.1 Security Screen
To enter the BIOS Setup, press the F2 function key during boot time when the OEM or Intel®
logo displays. The following message displays on the diagnostics screen and under the Quiet
Boot logo screen:
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Press <F2> to enter setup
When the Setup is entered, the Main screen displays. The BIOS Setup utility provides the
Security screen to enable and set the user and administrative passwords and to lock out the
front panel buttons so they cannot be used. The Intel® Server Board S5520URT provides TPM
settings through the security screen.
To access this screen from the Main screen, select the Security option.
Main Advanced Security Server Management Boot Options Boot Manager
Administrator Password Status <Installed/Not Installed>
User Password Status <Installed/Not Installed>
Set Administrator Password [1234aBcD]
Set User Password [1234aBcD]
Front Panel Lockout Enabled/Disabled
TPM State <Enabled & Activated/Enabled & Deactivated/Disabled &
Activated/Disabled & Deactivated>
TPM Administrative Control No Operation/Turn On/Turn Off/Clear Ownership
Figure 19. Setup Utility – TPM Configuration Screen
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Table 14. Setup Utility – Security Configuration Screen Fields
Setup Item Options Help Text Comments
TPM State* Enabled and
Activated
Enabled and
Deactivated
Disabled and
Activated
Disabled and
Deactivated
Information only.
Shows the current TPM device
state.
A disabled TPM device will not
execute commands that use TPM
functions and TPM security
operations will not be available.
An enabled and deactivated TPM
is in the same state as a disabled
TPM except setting of TPM
ownership is allowed if not
present already.
An enabled and activated TPM
executes all commands that use
TPM functions and TPM security
operations will be available.
TPM
Administrative
Control**
No Operation
Turn On
Turn Off
Clear Ownership
[No Operation] - No changes to
current state.
[Turn On] - Enables and activates
TPM.
[Turn Off] - Disables and deactivates
TPM.
[Clear Ownership] - Removes the
TPM ownership authentication and
returns the TPM to a factory default
state.
Note: The BIOS setting returns to
[No Operation] on every boot cycle
by default.
5.3 Intel® Trusted Execution Technology
The Intel® Xeon® Processor E5-4600/2600/2400/1600 Product Families support Intel® Trusted
Execution Technology (Intel® TXT), which is a robust security environment. Designed to help
protect against software-based attacks, Intel® Trusted Execution Technology integrates new
security features and capabilities into the processor, chipset and other platform components.
When used in conjunction with Intel® Virtualization Technology, Intel® Trusted Execution
Technology provides hardware-rooted trust for your virtual applications.
This hardware-rooted security provides a general-purpose, safer computing environment
capable of running a wide variety of operating systems and applications to increase the
confidentiality and integrity of sensitive information without compromising the usability of the
platform.
Intel® Trusted Execution Technology requires a computer system with Intel® Virtualization
Technology enabled (both VT-x and VT-d), an Intel® Trusted Execution Technology-enabled
processor, chipset and BIOS, Authenticated Code Modules, and an Intel® Trusted Execution
Technology compatible measured launched environment (MLE). The MLE could consist of a
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virtual machine monitor, an OS or an application. In addition, Intel® Trusted Execution
Technology requires the system to include a TPM v1.2, as defined by the Trusted Comput in g
Group TPM PC Client Specifications, Revision 1.2.
When available, Intel® Trusted Execution Technology can be enabled or disabled in the
processor from a BIOS Setup option.
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6. Platform Management Functional Overview
Platform management functionality is supported by several hardware and software components
integrated on the server board that work together to control system functions, monitor and report
system health, and control various thermal and performance features in order to maintain (when
possible) server functionality in the event of component failure and/or environmentally stressed
conditions.
This chapter provides a high level overview of the platform management features and
functionality implemented on the server board. For more in depth and design level Platform
Management information, please reference the BMC Core Firmware External Product
Specification (EPS) and BIOS Core Ex ternal Pro duct Specification (EPS) for Intel® Server
products based on the Intel® Xeon® processor E5-4600, 2600, 1600 product families.
6.1 Baseboard Management Controller (BMC) Firmware Feature Support
The following sections outline features that the integrated BMC firmware can support. Support
and utilization for some features is dependent on the server platform in which the server board
is integrated and any additional system level components and options that may be installed.
6.1.1 IPMI 2.0 Features
Baseboard Management Controller (BMC)
IPMI Watchdog timer.
Messaging support, including command bridging and user/session support.
Chassis device functionality, including power/reset control and BIOS boot flags support
Event receiver device: The BMC receives and processes events from other platform
subsystems.
Field Replaceable Unit (FRU) inventory device functionality: The BMC supports access
to system FRU devices using IPMI FRU commands.
System Event Log (SEL) device functionality: The BMC supports and provides access to
a SEL.
Sensor Data Record (SDR) repository device functionality: The BMC supports storage
and access of system SDRs.
Sensor device and sensor scanning/monitoring: The BMC provides IPMI management of
sensors. It polls sensors to monitor and report system health.
IPMI interfaces:
o Host interfaces include system management software (SMS) with receive
message queue support, and server management mode (SMM)
o IPMB interface
o LAN interface that supports the IPMI-over-LAN protocol (RMCP, RMCP+)
Serial-over-LAN (SOL)
ACPI state synchronization: The BMC tracks ACPI state changes that are provided by
the BIOS.
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BMC self-test: The BMC performs initialization and run-time self-tests and makes results
available to external entities.
See also the Intelligent Platform Management Interface Specification Second Generation
v2.0.
6.1.2 Non IPMI Features
The BMC supports the following non-IPMI features.
In-circuit BMC firmware update.
Fault resilient booting (FRB): FRB2 is supported by the watchdog timer functionality.
Chassis intrusion detection (dependent on platform support).
Basic fan control using Control version two SDRs.
Fan redundancy monitoring and support.
Power supply redundancy monitoring and support.
Hot-swap fan support.
Acoustic management: Support for multiple fan profiles
Signal testing support: The BMC provides test commands for setting and getting
platform signal states.
The BMC generates diagnostic beep codes for fault conditions.
System GUID storage and retrieval.
Front panel management: The BMC controls the system status LED and chassis ID LED.
It supports secure lockout of certain front panel functionality and monitors button presses.
The chassis ID LED is turned on using a front panel button or a command.
Power state retention
Power fault analysis
Intel® Light-Guided Diagnostics
Power unit management: Support for power unit sensor. The BMC handles power-good
dropout conditions.
DIMM temperature monitoring: New sensors and improved acoustic management using
closed-loop fan control algorithm taking into account DIMM temperature readings.
Address Resolution Protocol (ARP): The BMC sends and responds to ARPs (supported
on embedded NICs).
Dynamic Host Configuration Protocol (DHCP): The BMC performs DHCP (supported on
embedded NICs).
Platform environment control interface (PECI) thermal management support
E-mail alerting
Embedded web server
Integrated KVM
Integrated Remote Media Redirection
Lightweight Directory Access Protocol (LDAP) support
Intel® Intelligent Power Node Manager support
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6.1.3 New Manageability Features
Intel® S2600CO Server Platforms offer a number of changes and additions to the manageability
features that are supported on the previous generation of servers. The following is a list of the
more significant changes that are common to this generation Integrated BMC based on Intel®
Xeon® Processors E5 2600 Families:
Sensor and SEL logging additions/enhancements (for example, additional thermal
monitoring capability)
SEL Severity Tracking and the Extended SEL
Embedded platform debug feature which allows capture of detailed data for later
analysis.
Provisioning and inventory enhancements:
o Inventory data/system information export (partial SMBIOS table)
Enhancements to fan speed control.
DCMI 1.1 compliance (product-specific).
Support for embedded web server UI in Basic Manageability feature set.
Enhancements to embedded web server
o Human-readable SEL
o Additional system configurability
o Additional system monitoring capability
o Enhanced on-line help
Enhancements to KVM redirection
o Support for higher resolution
Support for EU Lot6 compliance
Management support for PMBus* rev1.2 compliant power supplies
BMC Data Repository (Managed Data Region Feature)
Local Control Display Panel
System Airflow Monitoring
Exit Air Temperature Monitoring
Ethernet Controller Thermal Monitoring
Global Aggregate Temperature Margin Sensor
Memory Thermal Management
Power Supply Fan Sensors
Energy Star Server Support
Smart Ride Through (SmaRT)/Closed Loop System Throttling (CLST)
Power Supply Cold Redundancy
Power Supply FW Update
Power Supply Compatibility Check
BMC FW reliability enhancements:
o Redundant BMC boot blocks to avoid possibility of a corrupted boot block resulting
in a scenario that prevents a user from updating the BMC.
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o BMC System Management Health Monitoring
6.2 Advanced Configuration and Power Interface (ACPI)
The server board has support for the following ACPI states:
Table 15. ACPI Power States
State Supported Description
S0 Yes Working.
The front panel power LED is on (not controlled by the BMC).
The fans spin at the normal speed, as determined by sensor inputs.
Front panel buttons work normally.
S1 Yes Sleeping. Hardware context is maintained; equates to processor and chipset clocks being
stopped.
The front panel power LED blinks at a rate of 1 Hz with a 50% duty cycle (not controlled
by the BMC).
The watchdog timer is stopped.
The power, reset, front panel NMI, and ID buttons are unprotected.
Fan speed control is determined by available SDRs. Fans may be set to a fixed state, or
basic fan management can be applied.
The BMC detects that the system has exited the ACPI S1 sleep state when the BIOS SMI
handler notifies it.
S2 No Not supported.
S3 No Not supported.
S4 No
Not supported.
S5 Yes Soft off.
The front panel buttons are not locked.
The fans are stopped.
The power-up process goes through the normal boot process.
The power, reset, front panel NMI, and ID buttons are unlocked.
6.3 Power Control Sources
The server board supports several power control sources which can initiate a power-up or
power-down activity.
Table 16. Power Control Initiators
Source External Signal Name or Internal
Subsystem
Capabilities
Power Button Front Panel power button Turns power on or off
BMC watchdog timer Internal BMC timer Turns power off, or power cycle
Command Routed through command processor Turns power on or off, or power cycle
Power state retention Implemented by means of BMC
internal logic
Turns power on when AC power returns
Chipset Sleep S4/S5 signal (same as
POWER_ON)
Turns power on or off
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Source External Signal Name or Internal
Subsystem
Capabilities
CPU Thermal CPU Thermtrip Turns power off
WOL (Wake On LAN) LAN Turn power on
6.4 BMC Watchdog
The BMC FW is consistently called to perform system functions that are time-critical in that
failure to provide these functions in a timely manner can result in system or component damage.
Intel® S1400/S1600/S2400/S2600/S4600 Server Platforms introduce a BMC watchdog feature
to provide a safe-guard against this scenario by providing an automatic recovery mechanism. It
also can provide automatic recovery of functionality that has failed due to a fatal FW defect
triggered by a rare sequence of events or a BMC hang due to some type of HW glitch (for
example, power).
This feature is comprised of a set of capabilities whose purpose is to detect misbehaving
subsections of BMC firmware, the BMC CPU itself, or HW subsystems of the BMC component,
and to take appropriate action to restore proper operation. The action taken is dependent on the
nature of the detected failure and may result in a restart of the BMC CPU, one or more BMC
HW subsystems, or a restart of malfunctioning FW subsystems.
The BMC watchdog feature will only allow up to three resets of the BMC CPU (such as HW
reset) or entire FW stack (such as a SW reset) before giving up and remaining in the uBOOT
code. This count is cleared upon cycling of power to the BMC or upon continuous operation of
the BMC without a watchdog-generated reset occurring for a period of greater than 30 minutes.
The BMC FW logs a SEL event indicating that a watchdog-generated BMC reset (either soft or
hard reset) has occurred. This event may be logged after the actual reset has occurred. Refer
sensor section for details for the related sensor definition. The BMC will also indicate a
degraded system status on the Front Panel Status LED after a BMC HW reset or FW stack
reset. This state (which follows the state of the associated sensor) will be cleared upon system
reset or (AC or DC) power cycle.
Note: There will no SEL event and front panel LED status change for BMC reset due to Linux*
“kernel panic”.
A reset of the BMC may result in the following system degradations that will require a system
reset or power cycle to correct:
1. Timeout value for the rotation period can be set using this parameter; potentially
incorrect ACPI Power State reported by the BMC.
2. Reversion of temporary test modes for the BMC back to normal operational modes.
3. FP status LED and DIMM fault LEDs may not reflect BIOS detected errors.
6.5 Fault Resilient Booting (FRB)
Fault resilient booting (FRB) is a set of BIOS and BMC algorithms and hardware support that
allow a multiprocessor system to boot even if the bootstrap processor (BSP) fails. Only FRB2 is
supported using watchdog timer commands.
FSB2 refers to the FRB algorithm that detects system failures during POST. The BIOS uses the
BMC watchdog timer to back up its operation during POST. The BIOS configures the watchdog
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timer to indicate that it is using the timer for the FRB2 phase of the boot operation. After the
BIOS has identified and saved the BSP information, it sets the FRB2 timer use bit and loads the
watchdog timer with the new timeout internal.
If the watchdog timer expires while the watchdog use bit is set to FRB2, the BMC (if so
configured) logs a watchdog expiration event showing the FRB2 timeout in the event data bytes.
The BMC then hard resets the system, assuming the BIOS-selected reset as the watchdog
timeout action.
The BIOS is responsible for disabling the FRB2 timeout before initiating the option ROM scan
and before displaying a request for a boot password. If the processor fails and causes an FRB2
timeout, the BMC resets the system.
The BIOS gets the watchdog expiration status from the BMC. If the status shows an expired
FRB2 timer, the BIOS enters the failure in the system event log (SEL). In the OEM bytes entry
in the SEL, the last POST code generated during the previous boot attempt is written. FRB2
failure is not reflected in the processor status sensor value.
The FRB2 failure does not affect the front panel LEDs.
6.6 Sensor Monitoring
The BMC monitors system hardware and reports system health. Some of the sensors include
those for monitoring.
Component, board, and platform temperatures
Board and platform voltages
System fan presence and tach
Chassis intrusion
Front Panel NMI
Front Panel Power and System Reset Buttons
SMI timeout
Processor errors
The information gathered from physical sensors is translated into IPMI sensors as part of the
“IPMI Sensor Model”. The BMC also reports various system state changes by maintaining
virtual sensors that are not specifically tied to physical hardware.
See Appendix C – Integrated BMC Sensor Tables for additional sensor information.
6.7 Field Replaceable Unit (FRU) Inventory Device
The BMC implements the interface for logical FRU inventory devices as specified in the
Intelligent Platfor m Management Interface Specifica tion, Version 2.0. This functionality provides
commands used for accessing and managing the FRU inventory information. These commands
can be delivered through all interfaces.
The BMC provides FRU device command access to its own FRU device and to the FRU
devices throughout the server. The FRU device ID mapping is defined in the Platform Specific
Information. The BMC controls the mapping of the FRU device ID to the physical device
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6.8 System Event Log (SEL)
The BMC implements the system event log as specified in the Intelligent Platform Management
Interface Specification, Version 2.0. The SEL is accessible regardless of the system power state
through the BMC's in-band and out-of-band interfaces.
The BMC allocates 65,502 bytes (approximately 64 KB) of non-volatile storage space to store
system events. The SEL timestamps may not be in order. Up to 3,639 SEL records can be
stored at a time. Any command that results in an overflow of the SEL beyond the allocated
space is rejected with an “Out of Space” IPMI completion code (C4h).
Events logged to the SEL can be viewed using Intel®’s SELVIEW utility, Embedded Web Server,
and Active System Console.
6.9 System Fan Management
The BMC controls and monitors the system fans. Each fan is associated with a fan speed
sensor that detects fan failure and may also be associated with a fan presence sensor for hot-
swap support. For redundant fan configurations, the fan failure and presence status determines
the fan redundancy sensor state.
The system fans are divided into fan domains, each of which has a separate fan speed control
signal and a separate configurable fan control policy. A fan domain can have a set of
temperature and fan sensors associated with it. These are used to determine the current fan
domain state.
A fan domain has three states: sleep, nominal, and boost. The sleep and boost states have
fixed (but configurable through OEM SDRs) fan speeds associated with them. The nominal
state has a variable speed determined by the fan domain policy. An OEM SDR record is used to
configure the fan domain policy.
System fan speeds are controlled through pulse width modulation (PWM) signals, which are
driven separately for each domain by integrated PWM hardware. Fan speed is changed by
adjusting the duty cycle, which is the percentage of the time the signal is driven high in each
pulse.
6.9.1 Thermal and Acoustic Management
The Intel® Server Board S2600CO offers multiple thermal and acoustic management features to
maintain comprehensive thermal protection as well as intelligent fan speed control. The features
can be adjusted in BIOS interface with path BIOS>Advanced>System Acoustic and
Performance Configuration.
6.9.1.1 Set Throttling Mode
Select the most appropriate memory thermal throttling mechanism for memory sub-system from
[Auto], [DCLTT], [SCLTT] and [SOLTT].
[Auto] – BIOS automatically detect and identify the appropriate thermal throttling mechanism
based on DIMM type, airflow input, DIMM sensor availability.
[DCLTT] – Dynamic Closed Loop Thermal Throttling: for the SOD DIMM with system airflow
input
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[SCLTT] – Static Close Loop Thermal Throttling: for the SOD DIMM without system airflow
input
[SOLTT] – Static Open Loop Thermal Throttling: for the DIMMs without sensor on DIMM
(SOD)
The default setting is [Auto].
6.9.1.2 Altitude
Select the proper altitude that the system is distributed from [300m or less], [301m-900m],
[901m-1500m], [Above 1500m] options. Lower altitude selection can lead to potential thermal
risk. And higher altitude selection provides better cooling but with undesired acoustic and fan
power consumption. If the altitude is known, higher altitude is recommended in order to provide
sufficient cooling. The default setting is [301m – 900m].
6.9.1.3 Set Fan Profile
[Performance] and [Acoustic] fan profiles are available to select. The Acoustic mode offers best
acoustic experience and appropriate cooling capability covering mainstream and majority of the
add-in cards. Performance mode is designed to provide sufficient cooling capability covering all
kinds of add-in cards on the market. The default setting is [Performance].
6.9.1.4 Fan PWM Offset
This feature is reserved for manual adjustment to the minimum fan speed curves. The valid
range is from [0 to 100] which stands for 0% to 100% PWM adding to the minimum fan speed.
This feature is valid when Quiet Fan Idle Mode is at Enabled state. The default setting is [0].
6.9.1.5 Quiet Fan Idle Mode
This feature can be [Enabled] or [Disabled]. If enabled, the fan will either stopped or shift to a
lower speed when the aggregate sensor temperatures are satisfied indicating the system is at
ideal thermal/light loading conditions. When the aggregate sensor temperatures not satisfied,
the fan will shift back to normal control curves. If disabled, the fan will never stopped or shift into
lower fan speed whatever the aggregate sensor temperatures are satisfied or not. The default
setting is [Disabled].
Note:
1. The above features may or may not be in effective depends on the actual thermal
characters of a specific system.
2. Refer to System Technical Product Specification for the board in Intel® chassis thermal and
acoustic management
3. Refer to Fan Control Whitepaper for the board in third party chassis fan speed control
customization.
6.9.1.6 Thermal Sensor Input for Fan Speed Control
The BMC uses various IPMI sensors as inputs to FSC. Some of the sensors are actual
physical sensor and some are “virtual” sensors derived from calculation.
The following IPMI thermal sensors are used as input to the fan speed control:
Front Panel Temperature Sensor1
Baseboard Temperature Sensor2
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CPU Margin Sensors3,5,6
DIMM Thermal Margin Sensors3,5
Exit Air Temperature Sensor1, 4, 8
PCH Temperature Sensor4,6
On-board Ethernet Controller Temperature Sensors4, 6
Add-In Intel® SAS/IO Module Temperature Sensors4, 6
PSU Thermal Sensor4, 9
CPU VR Temperature Sensors4, 7
DIMM VR Temperature Sensors4, 7
Integrated BMC Temperature Sensor4, 7
Global Aggregate Thermal Margin Sensors3, 8
Note:
1. For fan speed control in Intel® chassis
2. For fan speed control in third party chassis
3. Temperature margin from throttling threshold
4. Absolute temperature
5. PECI value
6. On-die sensor
7. On-board sensor
8. Virtual sensor
9. Available only when PSU has PMBus*
A simplified model is shown as below which gives a high level concept of the fan speed
control structure.
Figure 20. High-level Fan Speed Control Process
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6.9.2 Memory Thermal Throttling
The server board provides support for system thermal management through open loop throttling
(OLTT) and closed loop throttling (CLTT) of system memory. Normal system operation uses
closed-loop thermal throttling (CLTT) and DIMM temperature monitoring as major factors in
overall thermal and acoustics management. In the event that BIOS is unable to configure the
system for CLTT, it defaults to open-loop thermal throttling (OLTT). In the OLTT mode, it is
assumed that the DIMM temperature sensors are not available for fan speed control.
Throttling levels are changed dynamically to cap throttling based on memory and system
thermal conditions as determined by the system and DIMM power and thermal parameters. The
BMC’s fan speed control functionality is linked to the memory throttling mechanism used.
The following terminology is used for the various memory throttling options:
Static Open Loop Thermal Throttling (Static-OLTT): OLTT control registers are
configured by BIOS MRC remain fixed after post. The system does not change any of
the throttling control registers in the embedded memory controller during runtime.
Static Closed Loop Thermal Throttling (Static-CLTT): CLTT control registers are
configured by BIOS MRC during POST. The memory throttling is run as a closed-loop
system with the DIMM temperature sensors as the control input. Otherwise, the system
does not change any of the throttling control registers in the embedded memory
controller during runtime.
Dynamic Open Loop Thermal Throttling (Dynamic-OLTT): OLTT control registers are
configured by BIOS MRC during POST. Adjustments are made to the throttling during
runtime based on changes in system cooling (fan speed).
Dynamic Closed Loop Thermal Throttling (Dynamic-CLTT): CLTT control registers
are configured by BIOS MRC during POST. The memory throttling is run as a closed-
loop system with the DIMM temperature sensors as the control input. Adjustments are
made to the throttling during runtime based on changes in system cooling (fan speed).
Both Static and Dynamic CLTT modes implement a Hybrid Closed Loop Thermal Throttling
mechanism whereby the Integrated Memory Controller estimates the DRAM temperature in
between actual reads of the memory thermal sensors.
6.10 Messaging Interfaces
The BMC supports the following communications interfaces:
Host SMS interface by means of low pin count (LPC)/keyboard controller style (KCS)
interface
Host SMM interface by means of low pin count (LPC)/keyboard controller style (KCS)
interface
Intelligent Platform Management Bus (IPMB) I2C interface
LAN interface using the IPMI-over-LAN protocols
Every messaging interface is assigned an IPMI channel ID by IPMI 2.0.
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Table 17. Standard ID Channel Assignments
Channel ID Interface Support Sessions
0 Primary IPMB No
1 LAN 1 Yes
2 LAN 2 Yes
3 LAN 31 (Provided by the Intel®
Dedicated Server Management NIC)
Yes
4 Reserved Yes
5 USB No
6 Secondary IPMB
No
7 SMM No
8 -0Dh Reserved -
0Eh Self2 -
0Fh SMS/Receive Message Queue No
Notes:
1. Optional hardware supported by the server system.
2. Refers to the actual channel used to send the request.
6.10.1 User Model
The BMC supports the IPMI 2.0 user model. 15 user IDs are supported. These 15 users can be
assigned to any channel. The following restrictions are placed on user-related operations:
1. User names for User IDs 1 and 2 cannot be changed. These are always “” (Null/blank)
and “root” respectively.
2. User 2 (“root”) always has the administrator privilege level.
3. All user passwords (including passwords for 1 and 2) may be modified.
4. User IDs 3-15 may be used freely, with the condition that user names are unique.
Therefore, no other users can be named “” (Null), “root,” or any other existing user name.
6.10.2 IPMB Communication Interface
The IPMB communication interface used the 100 KB/s version of an I2C bus as its physical
medium. For more information on I2C specifications, see the I2C Bus and How to Use It. The
IPMB implementation in the BMC is compliant with the IPMB V1.0, Revision 1.0.
The BMC IPMB slave address is 20h.
The BMC both sends and receives IPMB messages over the IPMB interface. Non-IPMB
messages received by means of the IPMB interface are discarded.
Messages sent by the BMC can either be originated by the BMC, such as initialization agent
operation, or by another source. One example is KCS-IPMB bridging.
6.10.3 LAN interface
The BMC implements both the IPMI 1.5 and IPMI 2.0 messaging models. These provide out-of-
band local area network (LAN) communication between the BMC and the network.
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See the Intelligent Platform Management Interface Specification Second Generation v2.0 for
details about the IPMI-over-LAN protocol.
Run-time determination of LAN channel capabilities can be determined by both standard IPMI
defined mechanisms.
6.10.3.1 RMCP/Alert Standard Forum (ASF Messaging)
The BMC supports RMCP ping discovery in which the BMC responds with a pong message to
an RMCP/ASF ping request. This is implemented per the Intelligent Platform Management
Interface Specification Second Generation v2.0.
6.10.3.2 BMC LAN Channels
The BMC supports three RMII/RGMII ports that can be used for communicating with Ethernet
devices. Two ports are used for communication with the on-board NICs and one is used for
communication with an Ethernet PHY located on an optional RMM4 add-in module.
6.10.3.2.1 Baseboard NICs
The on-board Ethernet controller provides support for a Network Controller Sideband Interface
(NC-SI) manageability interface. This provides a sideband high-speed connection for
manageability traffic to the BMC while still allowing for a simultaneous host access to the OS is
desired.
The NC-SI is a DMTF industry standard protocol for the side band management LAN interface.
This protocol provides a fast multi-drop interface for management traffic.
The baseboard NIC(s) are connected to a single BMC RMII/RGMII port that is configured for
RMII operation. The NC-SI protocol is used for this connection and provides a 100 Mb/s full-
duplex multi-drop interface which allows multiple NICs to be connected to the BMC. The
physical layer is based upon RMII, however RMII is a point-to-point bus whereas NC-SI allows 1
master and up to 4 slaves. The logical layer (configuration commands) is incompatible with RMII.
The server board will provide support for a dedicated management channel that can be
configured to be hidden from the host and only used by the BMC. This mode of operations is
configured from a BIOS setup option.
6.10.3.2.2 Dedicated Management Channel
An additional LAN channel dedicated to BMC usage and not available to host SW is supported
by an optional RMM4 add-in card. There is only a PHY device present on the RMM4 add-in card.
The BMC has a built-in MAC module that uses the RGMII interface to link with the card’s PHY.
Therefore, for this dedicated management interface, the PHY and MAC are located in different
devices.
The PHY on the RMM4 connects to the BMC’s other RMII/RGMII interface (the one that is not
connected to the baseboard NICs). This BMC port is configured for RGMII usage.
In addition to the use of an RMM4 add-in card for a dedicated management channel, on system
that support multiple Ethernet ports on the baseboard, the system BIOS provides a setup option
to allow one of these baseboard ports to be dedicated to the BMC for manageability purpose.
When this is enabled, that port is hidden from the OS.
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6.10.3.2.3 Concurrent Server Management Use of Multiple Ethernet Controllers
The BMC FW supports concurrent OOB LAN management sessions for the following
combination:
Two on-board NIC ports
One on-board NIC ports and the optional dedicated RMM4 add-in management NIC
Two on-board NIC ports and the optional dedicated RMM4 add-in management NIC
All NIC ports must be on different subnets for the above concurrent usage models.
MAC addresses are assigned for management NICs from a pool of up to 3 MAC addresses
allocated specifically for manageability.
The server board has seven MAC addresses programmed at the factory. MAC addresses are
assigned as follows:
NIC 1 MAC address (for OS usage)
NIC 2 MAC address = NIC 1 MAC address + 1 (for OS usage)
NIC 3 MAC address = NIC 1 MAC address + 2 (for OS usage)
NIC 4 MAC address = NIC 1 MAC address + 3 (for OS usage)
BMC LAN channel 1 MAC address = NIC1 MAC address + 4
BMC LAN channel 2 MAC address = NIC1 MAC address + 5
BMC LAN channel 3 (RMM) MAC address = NIC1 MAC address + 6
The printed MAC address on the server board and/or server system is assigned to NIC1 on the
server board.
For security reasons, embedded LAN channels have the following default setting:
IP Address: Static
All users disabled
IPMI-enabled network interfaces may not be placed on the same subnet. This includes the
Intel® Dedicated Server Management NIC and either of the BMC’s embedded network
interfaces.
Host-BMC communication over the same physical LAN connection =also known as “loopback” –
is not supported. This includes “ping” operations.
On server boards with more than two onboard NIC ports, only the first two ports can be used as
BMC LAN channels. The remaining ports have no BMC connectivity.
Maximum bandwidth supported by BMC LAN channels are as follows:
BMC LAN1 (Baseboard NIC port) ----- 100Mb (10Mb in DC off state)
BMC LAN2 (Baseboard NIC port) ----- 100Mb (10Mb in DC off state)
BMC LAN3 (Dedicated NIC) ----- 1000Mb (10Mb in DC off state)
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6.10.3.3 IPV6 Support
In addition to IPv4, the server board has support for IPV6 for manageability channels.
Configuration of IPv6 is provided by extensions to the IPMI Set and Get LAN Configuration
Parameters commands as well as through a Web Console IPv6 configuration web page.
The BMC supports IPv4 and IPv6 simultaneously so they are both configured separately and
completely independently. For example, IPv4 can be DHCP configured while IPv6 is statically
configured or vice versa.
The parameters for IPv6 are similar to the parameters for IPv4 with the following differences:
An IPv6 address is 16 bytes versus 4 bytes for IPv4.
An IPv6 prefix is 0 to 128 bits whereas IPv4 has a 4 byte subnet mask.
There are two variants of automatic IP Address Source configuration versus just DHCP for IPv4.
The three possible IPv6 IP Address Sources for configuring the BMC are:
Static (Manual): The IP, Prefix, and Gateway parameters are manually configured by the user.
The BMC ignores any Router Advertisement messages received over the network.
DHCPv6: The IP comes from running a DHCPv6 client on the BMC and receiving the IP from a
DHCPv6 server somewhere on the network. The Prefix and Gateway are configured by Router
Advertisements from the local router. The IP, Prefix, and Gateway are read-only parameters to
the BMC user in this mode.
Static (Manual): The IP, Prefix, and Gateway parameters are manually configured by the user.
The BMC ignores any Router Advertisement messages received over the network.
DHCPv6: The IP comes from running a DHCPv6 client on the BMC and receiving the IP from a
DHCPv6 server somewhere on the network. The Prefix and Gateway are configured by Router
Advertisements from the local router. The IP, Prefix, and Gateway are read-only parameters to
the BMC user in this mode.
Statel es s auto-confi g: The Prefix and Gateway are configured by the router through Router
Advertisements. The BMC derives its IP in two parts: the upper network portion comes from the
router and the lower unique portion comes from the BMC’s channel MAC address. The 6-byte
MAC address is converted into a 8-byte value per the EUI-64* standard. For example, a MAC
value of 00:15:17:fe:2f:62 converts into a EUI-64 value of 215:17ff:fefe:2f62. If the BMC
receives a Router Advertisement from a router at IP 1:2:3:4::1 with a prefix of 64, it would then
generate for itself an IP of 1:2:3:4:215:17ff:fefe:2f62. The IP, Prefix, and Gateway are read-only
parameters to the BMC user in this mode.
IPv6 can be used with the BMC’s Web Console, JViewer (remote KVM and Media), and
Systems Management Architecture for Server Hardware –Command Line Protocol (SMASH-
CLP) interface (ssh). There is no standard yet on how IPMI RMCP or RMCP + should operate
over IPv6 so that is not currently supported.
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6.10.3.4 LAN Failover
The BMC FW provides a LAN failover capability such that the failure of the system HW
associated with one LAN link will result in traffic being rerouted to an alternate link. This
functionality is configurable by IPMI methods as well as by the BMC’s Embedded UI, allowing
the user to specify the physical LAN links constitute the redundant network paths or physical
LAN links constitute different network paths. BMC will support only all or nothing approach –
that is, all interfaces bonded together, or none are bonded together.
The LAN Failover feature applies only to BMC LAN traffic. It bonds all available Ethernet
devices but only one is active at a time. When enabled, if the active connection’s leash is lost,
one of the secondary connections is automatically configured so that it has the same IP address.
Traffic immediately resumes on the new active connection.
The LAN Failover enable/disable command may be sent at any time. After it has been enabled,
standard IPMI commands for setting channel configuration that specify a LAN channel other
than the first will return an error code.
6.10.3.5 BMC IP Address Configuration
Enabling the BMC’s network interfaces requires using the Set LAN Configuration Parameter
command to configure LAN configuration parameter 4, IP Address Source. The BMC supports
this parameter as follows:
1h, static address (manually configured): Supported on all management NICs. This is
the BMC’s default value.
2h, address obtained by BMC running DHCP: Supported only on embedded
management NICs.
IP Address Source value 4h, address obtained by BMC running other address assignment
protocol, is not supported on any management NIC.
Attempting to set an unsupported IP address source value has no effect, and the BMC returns
error code 0xCC, Invalid data field-in request. Note that values 0h and 3h are no longer
supported, and will return a 0Xcc error completion code.
6.10.3.5.1 Static IP Address (IP Address Source Values 0h, 1h, and 3h)
The BMC supports static IP address assignment on all of its management NICs. The IP address
source parameter must be set to “static” before the IP address; the subnet mask or gateway
address can be manually set.
The BMC takes no special action when the following IP address source is specified as the IP
address source for any management NIC:
1h – Static address (manually configured)
The Set LAN Configuration Parameter command must be used to configure LAN configuration
parameter 3, IP Address, with an appropriate value.
The BIOS does not monitor the value of this parameter, and it does not execute DHCP for the
BMC under any circumstances, regardless of the BMC configuration.
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6.10.3.5.2 Static LAN Configuration Parameters
When the IP Address Configuration parameter is set to 01h (static), the following parameters
may be changed by the user:
LAN configuration parameter 3 (IP Address)
LAN configuration parameter 6 (Subnet Mask)
LAN configuration parameter 12 (Default Gateway Address)
When changing from DHCP to Static configuration, the initial values of these three parameters
will be equivalent to the existing DHCP –set parameters. Additionally, the BMC observes the
following network safety precautions:
1. The user may only set a subnet mask that is valid, per IPv4 and RFC 950 (Internet Standard
Subnetting Procedure). Invalid subnet values return a 0Xcc (Invalid Data Field in Request)
completion code, and the subnet mask is not set. If no valid mask has been previously set,
default subnet mask is 0.0.0.0.
2. The user may only set a default gateway address that can potentially exist within the subnet
specified above. Default gateway addresses outside the BMC’s subnet are technically
unreachable and the BMC will not set the default gateway address to an unreachable value.
The BMC returns a 0Xcc (Invalid Data Field in Request) completion code for default
gateway addresses outside its subnet.
3. If a command is issued to set the default gateway IP address before the BMC’s IP address
and subnet mask are set, the default gateway IP address is not updated and the BMC
returns 0Xcc.
If the BMC’s IP address on a LAN channel changes while a LAN session is in progress over that
channel, the BMC does not take action to close the session except through a normal session
timeout. The remote client must re-sync with the new IP address. The BMC’s new IP address is
only available in-band through the Get LAN Configuration Parameters command.
6.10.3.5.3 Enabling/Disabling Dynamic Host Configuration (DHCP) Protocol
The BMC DHCP feature is activated by using the Set LAN Configuration Parameter command
to set LAN configuration parameter 4, IP Address Source, to 2h:”address obtained by BMC
running DHCP”. Once this parameter is set, the BMC initiates the DHCP process within
approximately 100ms.
If the BMC has previously been assigned an IP address through DHCP or the Set LAN
Configuration Parameter command, it requests that same IP address to be reassigned. If the
BMC does not receive the same IP address, system management software must be
reconfigured to use the new IP address. The new address is only available in-band, through the
IPMI Get LAN Configuration Parameters command.
Changing the IP Address Source parameter from 2h to any other supported value will cause the
BMC to stop the DHCP process. The BMC uses the most recently obtained IP address until it is
reconfigured.
If the physical LAN connection is lost (that is, the cable is unplugged), the BMC will not re-
initiate the DHCP process when the connection is re-established.
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6.10.3.5.4 DHCP-related LAN Configuration Parameters
Users may not change the following LAN parameters while the DHCP is enabled:
LAN configuration parameter 3 (IP Address)
LAN configuration parameter 6 (Subnet Mask)
LAN configuration parameter 12 (Default Gateway Address)
To prevent users from disrupting the BMC’s LAN configuration, the BMC treats these
parameters as read-only while DHCP is enabled for the associated LAN channel. Using the Set
LAN Configuration Parameter command to attempt to change one of these parameters under
such circumstances has no effect, and the BMC returns error code 0Xd5, Cannot Execute
command. Command, or request parameter(s) are not supported in present state.”
6.10.3.6 DHCP BMC Hostname
The BMC allows setting a DHCP Hostname using the Set/Get LAN Configuration Parameter
command.
DHCP Hostname can be set regardless of the IP Address source configured on the BMC.
But this parameter is only used if the IP Address source is set to DHCP.
When Byte 2 is set to “Update in progress”, all the 16 Block Data Bytes (Bytes 3 – 18)
must be present in the request.
When Block Size <16, it must be the last Block request in this series. In other words Byte
2 is equal to “Update is complete” on that request.
Whenever Block Size < 16, the Block data bytes must end with a NULL Character or
Byte (=0).
All Block write requests are updated into a local Memory byte array. When Byte 2 is set
to “Upgrade is Complete”, the Local Memory is committed to the NV Storage. Local
Memory is reset to NULL after changes are committed.
When Byte 1 (Block Selector = 1), firmware resets all the 64 bytes local memory. This
can be used to undo any changes after the last “Update in Progress”.
User should always set the hostname starting from block selector 1 after the last
“Update is complete”. If the user skips block selector 1 while setting the hostname, the
BMC will record the hostname as “NULL”, because the first block contains NULL data.
This scheme effectively does not allow a user to make a partial Hostname change. Any
Hostname change needs to start from Block 1.
Byte 64 (Block Selector 04h byte 16) is always ignored and set to NULL by BMC which
effectively means we can set only 63 bytes.
User is responsible for keeping track of the Set series of commands and Local Memory
contents.
While BMC firmware is in “Set Hostname in Progress” (Update not complete), the firmware
continues using the Previous Hostname for DHCP purpose.
6.10.4 Address Resoluton Protocol (ARP)
The BMC can receive and respond to ARP requests on BMC NICs. Gratuitous ARPs supported,
and disabled by default.
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6.10.5 Internet Control Message Protocol (ICMP)
The BMC supports the following ICMP message types targeting the BMC over integrated NICs:
Echo request (ping): The BMC sends an Echo Reply.
Destination unreachable: If message is associated with an active socket connection
within the BMC, the BMC closes the socket.
6.10.6 Virtual Local Area Network (VLAN)
The BMC supports VLAN as defined by IPMI 2.0 Specification. VLAN is supported internally by
the BMC, not through switches. VLAN provides a way of grouping a set of systems together so
that they form a logical network. This feature can be used to set up a management VLAN where
only devices which are members of the VLAN will receive packets related to management and
members of the VLAN will be isolated from any other network traffic. Please note that VLAN
does not change the behavior of the host network setting, it only affects the BMC LAN
communication.
LAN configuration options are now supported (by means of the Set LAN Config Parameters
command, parameters 20 and 21) that allow support for 802.1Q VLAN (Layer 2). This allows
VLAN headers/packets to be used for IPMI LAN sessions. VLAN IDs are entered and enabled
by means of parameter 20 of the Set LAN Config Parameters IPMI command. When a VLAN ID
is configured and enabled, the BMC only accepts packets with that VLAN tag/ID. Conversely, all
BMC generated LAN packets on the channel include the given VLAN tag/ID. Valid VLAN IDs
are 1 through 4094, VLAN IDs of 0 and 4095 are reserved, per the 802.1Q VLAN Specification.
Only one VLAN can be enabled at any point in time on a LAN channel. If an existing VLAN is
enabled, it must first be disabled prior to configuring a new VLAN on the same LAN channel.
Parameter 12 (VLAN Priority) of the Set LAN Config Parameters IPMI command is now
implemented and a range from 0-7 will be allowed for VLAN Priorities. Please note that bit 3 and
4 of parameter 21 are considered reserved bits.
Parameter 25 (VLAN Destination Address) of the Set LAN Config Parameters IPMI command is
not supported and returns a completion cod of 0x80 (parameter not supported) for any
read/write of parameter 25.
If the BMC IP address source is DHCP, then the following behavior is seen:
If the BMC is first configured for DHCP (prior to enabling VLAN), when VLAN is enabled,
the BMC performs a discovery on the new VLAN in order to obtain a new BMC IP
address.
If the BMC is configured for DHCP (prior to disabling VLAN), when VLAN is disabled, the
BMC performs a discovery on the LAN in order to obtain a new BMC IP address.
If the BMC IP address source is Static, then the following behavior is seen:
If the BMC is first configured for static (prior to enabling VLAN), when VLAN is enabled,
the BMC has the same IP address that was configured before. It is left to management
application to configure a different IP address if that is not suitable for VLAN.
If the BMC is configured for static (prior to disabling VLAN), when VLAN is disabled, the
BMC has the same IP address that was configured before. It is left to management
application to configure a different IP address if that is not suitable for VLAN.
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6.10.7 Secure Shell (SSH)
Secure Shell (SSH) connections are supported for SMASH-CLP sessions to the BMC.
6.10.8 Serial-over-LAN (SOL 2.0)
The BMC supports IPMI 2.0 SOL.
IPMI 2.0 introduced a standard serial-over-LAN feature. This is implemented as a standard
payload type (01h) over RMCP+.
Three commands are implemented for SOL 2.0 configuration.
Get SOL 2.0 Configuration Parameters and Set SOL 2.0 Configuration Parameters:
these commands are used to get and set the values of the SOL configuration
parameters. The parameters are implemented on a pre-channel basis. Activating SOL:
This command is not accepted by the BMC. It is sent by the BMC when SOL is activated
to notify a remote client of the switch to SOL.
Activating a SOL session requires an existing IPMI-over-LAN session. If encryption is
used, it should be negotiated when the IPMI-over-LAN session is established.
6.10.9 Platform Event Filter
The BMC includes the ability to generate a selectable action, such as a system power-off or
reset, when a match occurs to one of a configurable set of events. This capability is called
Platform Event Filtering, or PEF. One of the available PEF actions is to trigger the BMC to send
a LAN alert to one or more destinations.
The BMC supports 20 PEF filters. The first twelve entries in the PEF filter table are pre-
configured (but may be changed by the user). The remaining entries are left blank, and may be
configured by the user.
Table 18. Factory Configured PEF Table Entries
Event Filter Number Offset Mask Events
1 Non-critical, critical and non-recoverable Temperature sensor out of range
2 Non-critical, critical and non-recoverable Voltage sensor out of range
3 Non-critical, critical and non-recoverable Fan failure
4 General chassis intrusion Chassis intrusion (security violation)
5 Failure and predictive failure Power supply failure
6 Uncorrectable ECC BIOS
7 POST error BIOS: POST code error
8 FRB2 Watchdog Timer expiration for FRB2
9 Policy Correction Time Node Manager
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Event Filter Number Offset Mask Events
10 Power down, power cycle, and reset Watchdog timer
11 OEM system boot event System restart (reboot)
12 Drive Failure, Predicated Failure Hot Swap Controller
Additionally, the BMC supports the following PEF actions:
Power off
Power cycle
Reset
OEM action
Alerts
The “Diagnostic interrupt” action is not supported.
6.10.10 LAN Alterting
The BMC supports sending embedded LAN alerts, called SNMP PET (Platform Event traps),
and SMTP email alerts.
The BMC supports a minimum of four LAN alert destinations.
6.10.10.1 SNMP Platform Event Traps (PETs)
This feature enables a target system to send SNMP traps to a designated IP address by means
of LAN. These alerts are formatted per the Intelligent Platform Management Interface
Specification Second Generation v2.0. A Module Information Block (MIB) file associated with
the traps is provided with the BMC firmware to facilitate interpretation of the traps by external
software. The format of the MIB file is covered under RFC 2578.
6.10.11 Altert Policy Table
Associated with each PEF entry is an alert policy that determines which IPMI channel the alert
is to be sent. There is a maximum of 20 alert policy entries. There are no pre-configured entries
in the alert policy table because the destination types and alerts may vary by user. Each entry in
the alert policy table contains four bytes for a maximum table size of 80 bytes.
6.10.11.1 E-mail Alerting
The Embedded Email Alerting feature allows the user to receive e-mails alerts indicating issues
with the server. This allows e-mail alerting in an OS-absent (for example, Pre-OS and OS-Hung)
situation. This feature provides support for sending e-mail by means of SMTP.
6.10.12 SM-CLP (SM-CLP Lite)
SMASH refers to Systems Management Architecture for Server Hardware. SMASH is defined
by a suite of specifications, managed by the DMTF, that standardize the manageability
interfaces for server hardware. CLP refers to Command Line Protocol. SM-CLP is defined by
the Server Management Command Line Protocol Specification (SM-CLP), version 1.0, which is
part of the SMASH suite of specifications. The specifications and further information on SMASH
can be found at the DMTF website (http://www.dmtf.org/).
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The BMC provides an embedded “lite” version of SM-CLP that is syntax-compatible but not
considered fully compliant with the DMTF standards.
The SM-CLP utilized by a remote user by connecting a remote system from one of the system
NICs. It is possible for third party management applications to create scripts using this CLP and
execute them on server to retrieve information or perform management tasks such as reboot the
server, configure events, and so on.
The BMC embedded SM-CLP feature includes the following capabilities:
Power on/off/reset the server.
Get the system power state.
Clear the System Event Log (SEL).
Get the interpreted SEL in a readable format.
Initiate/terminate a Serial Over LAN session.
Support “help” to provide helpful information.
Get/set the system ID LED.
Get the system GUID.
Get/set configuration of user accounts.
Get/set configuration of LAN parameters.
Embedded CLP communication should support SSH connection.
Provide current status of platform sensors including current values. Sensors include
voltage, temperature, fans, power supplies, and redundancy (power unit and fan
redundancy).
The embedded web server is supported over any system NIC port that is enabled for server
management capabilities.
6.10.13 Embeded Web Server
Integrated BMC Base manageability provides an embedded web server and an OEM-
customizable web GUI which exposes the manageability features of the Integrated BMC base
feature set. It is supported over all on-board NICs that have management connectivity to the
Integrated BMC as well as an optional dedicated add-in management NIC. At least two
concurrent web sessions from up to two different users is supported.
The embedded web user interface supports strong security (authentication, encryption, and
firewall support) since it enables remote server configuration and control. The user interface
presented by the embedded web user interface shall authenticate the user before allowing a
web session to be initiated. Encryption using 128-bit SSL is supported. User authentication is
based on user id and password.
The GUI presented by the embedded web server authenticates the user before allowing a web
session to be initiated. It presents all functions to all users but grays-out those functions that the
user does not have privilege to execute (for example, if a user does not have privilege to power
control, then the item shall be displayed in grey-out font in that user’s UI display). The web GUI
also provides a launch point for some of the advanced features, such as KVM and media
redirection. These features are grayed out in the GUI unless the system has been updated to
support these advanced features.
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A partial list of additional features supported by the web GUI includes:
Presents all the Basic features to the users.
Power on/off/reset the server and view current power state.
Displays BIOS, BMC, ME and SDR version information.
Display overall system health.
Configuration of various IPMI over LAN parameters for both IPv4 and IPv6
Display system asset information for the product, board, and chassis.
Display of BMC-owned sensors (name, status, current reading, enabled thresholds),
including color-code status of sensors.
Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan and
Power supply related)
Automatic refresh of sensor data with a configurable refresh rate.
On-line help.
Display/clear SEL (display is in easily understandable human readable format).
Supports major industry-standard browsers (Microsoft Windows Internet Explorer* and
Mozilla Firefox*).
Automatically logs out after user-configurable inactivity period.
The GUI session automatically times-out after a user-configurable inactivity period. By
default, this inactivity period is 30 minutes.
Embedded Platform Debug feature - Allow the user to initiate a “diagnostic dump” to a
file that can be sent to Intel® for debug purposes.
Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local
front panel. The displayed LEDs match the current state of the local panel LEDs. The
displayed buttons (for example, power button) can be used in the same manner as the
local buttons.
Display of ME sensor data. Only sensors that have associated SDRs loaded will be
displayed.
Ability to save the SEL to a file.
Ability to force HTTPS connectivity for greater security. This is provided through a
configuration option in the UI.
Display of processor and memory information as is available over IPMI over LAN.
Ability to get and set Node Manager (NM) power policies.
Display of power consumed by the server.
Ability to view and configure VLAN settings.
Warn user the reconfiguration of IP address will cause disconnect.
Capability to block logins for a period of time after several consecutive failed login
attempts. The lock-out period and the number of failed logins that initiates the lock-out
period are configurable by the user.
Server Power Control - Ability to force into Setup on a reset.
6.10.14 Virtual Front Panel
Virtual Front Panel is the module present as “Virtual Front Panel” on the left side in the
embedded web server when "remote Control" tab is clicked.
Main Purpose of the Virtual Front Panel is to provide the front panel functionality virtually.
Virtual Front Panel (VFP) will mimic the status LED and Power LED status and Chassis
ID alone. It is automatically in sync with BMC every 40 seconds.
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For any abnormal status LED state, Virtual Front Panel will get the reason behind the
abnormal or status LED changes and displayed in VFP side.
As Virtual Front Panel uses the chassis control command for power actions. It will not
log the Front button press event since Logging the front panel press event for Virtual
Front Panel press will mislead the administrator.
For Reset through Virtual Front Panel, the reset will be done by a Chassis control
command.
For Reset through Virtual Front Panel, the restart cause will be because of Chassis
control command.
During Power action, Power button/Reset button should not accept the next action until
current Power action is complete and the acknowledgment from BMC is received.
EWS will provide a valid message during Power action until it completes the current
Power action.
The VFP does not have any effect on whether the front panel is locked by Set Front
Panel Enables command.
The chassis ID LED provides a visual indication of a system being serviced. The state of
the chassis ID LED is affected by the following actions:
Toggled by turning the chassis ID button on or off.
There is no precedence or lock-out mechanism for the control sources. When a new
request arrives, previous requests are terminated. For example, if the chassis ID button
is pressed, then the chassis ID LED changes to solid on. If the button is pressed again,
then the chassis ID LED turns off.
Note that the chassis ID will turn on because of the original chassis ID button press and
will reflect in the Virtual Front Panel after VFP sync with BMC. Virtual Front Panel will not
reflect the chassis LED software blinking by the software command as there is no
mechanism to get the chassis ID Led status.
Only Infinite chassis ID ON/OFF by the software command will reflect in EWS during
automatic /manual EWS sync up with BMC.
Virtual Front Panel help should available for virtual panel module.
At present, NMI button in VFP is disabled in Intel® S1400/S1600/S2400/S2600 Server
Platforms. It can be used in future.
6.10.15 Embedded Platform Debug
The Embedded Platform Debug feature supports capturing low-level diagnostic data (applicable
MSRs, PCI config-space registers, and so on). This feature allows a user to export this data into
a file that is retrievable from the embedded web GUI, as well as through host and remote IPMI
methods, for the purpose of sending to an Intel® engineer for an enhanced debugging capability.
The files are compressed, encrypted, and password protected. The file is not meant to be
viewable by the end user but rather to provide additional debugging capability to an Intel®
support engineer.
A list of data that may be captured using this feature includes but is not limited to:
Platform sensor readings – This includes all “readable” sensors that can be accessed by
the BMC FW and have associated SDRs populated in the SDR repository. This does not
include any “event-only” sensors. (All BIOS sensors and some BMC and ME sensors are
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“event-only”; meaning that they are not readable using an IPMI Get Sensor Reading
command but rather are used just for event logging purposes).
SEL – The current SEL contents are saved in both hexadecimal and text format.
CPU/memory register data useful for diagnosing the cause of the following system errors:
CATERR, ERR[2], SMI timeout, PERR, and SERR. The debug data is saved and
timestamped for the last 3 occurrences of the error conditions.
o PCI error registers
o MSR registers
o Integrated Memory Controller (IMC) and Integrated I/O (IIO) modules registers
BMC configuration data
BMC FW debug log (that is, SysLog) – Captures FW debug messages.
Non-volatile storage of captured data. Some of the captured data will be stored
persistently in the BMC’s non-volatile flash memory and preserved across AC power
cycles. Due to size limitations of the BMC’s flash memory, it is not feasible to store all of
the data persistently.
SMBIOS table data. The entire SMBIOS table is captured from the last boot.
PCI configuration data for on-board devices and add-in cards. The first 256 bytes of PCI
configuration data is captured for each device for each boot.
System memory map. The system memory map is provided by BIOS on the current boot.
This includes the EFI memory map and the Legacy (E820) memory map depending on
the current boot.
Power supplies debug capability.
o Capture of power supply “black box” data and power supply asset information.
Power supply vendors are adding the capability to store debug data within the
power supply itself. The platform debug feature provides a means to capture this
data for each installed power supply. The data can be analyzed by Intel® for
failure analysis and possibly provided to the power supply vendor as well. The
BMC gets this data from the power supplies from the PMBus* manufacturer-
specific commands.
o Storage of system identification in power supply. The BMC copies board and
system serial numbers and part numbers into the power supply whenever a new
power supply is installed in the system or when the system is first powered on.
This information is included as part of the power supply black box data for each
installed power supply.
Accessibility from IPMI interfaces. The platform debug file can be accessed by an
external IPMI interface (KCS or LAN).
POST code sequence for the two most recent boots. This is a best-effort data collection
by the BMC as the BMC real-time response cannot guarantee that all POST codes are
captured.
Support for multiple debug files. The platform debug feature provides the ability to save
data to 2 separate files that are encrypted with different passwords.
o File #1 is strictly for viewing by Intel® engineering and may contain BMC log
messages (that is, syslog) and other debug data that Intel® FW developers deem
useful in addition to the data specified in this document.
o File #2 can be viewed by Intel® partners who have signed an NDA with Intel® and
its contents are restricted to specific data items specified in this with the
exception of the BMC syslog messages and power supply “black box” data.
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6.10.15.1 Output Data Format
The diagnostic feature shall output a password-protected compressed HTML file containing
specific BMC and system information. This file is not intended for end-customer usage, this file
is for customer support and engineering only.
6.10.15.2 Output Data Availability
The diagnostic data shall be available on-demand from the embedded web server, KCS, or IPMI
over LAN commands.
6.10.15.3 Output Data Categories
The following tables list the data to be provided in the diagnostic output. For items in Table 19,
this data is collected on detection of CATERR, ERR2, PERR, SERR, and SMI timeout. The data
in Table 20 is accumulated for the three most recent overall errors.
Table 19. Diagnostic Data.
Category Data
Internal BMC Data BMC uptime/load
Process list
Free Memory
Detailed Memory List
Filesystem List/Info
BMC Network Info
BMC Syslog
BMC Configuration Data
External BMC Data Hex SEL listing
Human-readable SEL listing
Human-readable sensor listing
External BIOS Data
POST codes for the two most recent boots
System Data SMBIOS table for the current boot
256 bytes of PCI config data for each PCI device
Table 20. Additional Diagnostics on Error.
Category Data
System Data First 256 bytes of PCI config data for each PCI
device
PCI error registers
MSR registers
6.10.16 Data Center Management Interface (DCMI)
The DCMI Specification is an emerging standard that is targeted to provide a simplified
management interface for Internet Portal Data Center (IPDC) customers. It is expected to
become a requirement for server platforms which are targeted for IPDCs. DCMI is an IPMI-
based standard that builds upon a set of required IPMI standard commands by adding a set of
DCMI-specific IPMI OEM commands. Intel® S1400/S1600/S2400/S2600 Server Platforms will
be implementing the mandatory DCMI features in the BMC firmware (DCMI 1.1 Errata 1
compliance). Please refer to DCMI 1.1 errata 1 spec for details. Only mandatory commands will
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be supported. No support for optional DCMI commands. Optional power management and SEL
roll over feature is not supported. DCMI Asset tag will be independent of baseboard FRU asset
Tag.
6.10.17 Lightweight Directory Authentication Protocol (LDAP)
The Lightweight Directory Access Protocol (LDAP) is an application protocol supported by the
BMC for the purpose of authentication and authorization. The BMC user connects with an LDAP
server for login authentication. This is only supported for non-IPMI logins including the
embedded web UI and SM-CLP. IPMI users/passwords and sessions are not supported over
LDAP.
LDAP can be configured (IP address of LDAP server, port, and do on) from the BMC’s
Embedded Web UI. LDAP authentication and authorization is supported over the any NIC
configured for system management. The BMC uses a standard Open LDAP implementation for
Linux*.
Only open LDAP is supported by BMC. Microsoft Windows* and Novell* LDAP are not
supported.
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7. Advanced Management Features Support (RMM4)
The integrated baseboard management controller has support for advanced management
features which are enabled when an optional Intel® Remote Management Module 4 (RMM4) is
installed. The Intel® RMM4 is available as two option kits:
Table 21. Intel® RMM4 options kits
Intel® Product Code Description
Kit Contents
Benefits
AXXRMM4LITE
Intel
®
Remote
Management Module 4
Lite
RMM4 Lite Activation Key
Enable KVM and Media
redirection from onboard
NIC
AXXRMM4 Intel® Remote
Management Module 4
RMM4 Lite Activation Key
Dedicated NIC Port
Module
Dedicated NIC for
management traffic. Higher
bandwidth connectivity for
KVM and media
Redirection.
Table 22. Enabling Advanced Management Features
Manageability Hardware Benefits
Intel
®
Integrated BMC Comprehensive IPMI based base manageability features
Intel
®
Remote Management Module 4 – Lite
Package contains one module –
1- Key for advance Manageability features.
No dedicated NIC for management
Enables KVM and media redirection from onboard NIC
Intel
®
Remote Management Module 4
Package includes 2 modules –
1 - key for advance features
2 - Dedicated NIC for management
Dedicated NIC for management traffic. Higher bandwidth
connectivity for KVM and media Redirection.
If the optional Dedicated Server Management NIC is not used then the traffic can only go
through the onboard Integrated BMC-shared NIC and will share network bandwidth with the
host system. Advanced manageability features are supported over all NIC ports enabled for
server manageability.
7.1 Keyboard, Video, and Mouse (KVM) Redirection
The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This
feature is available remotely from the embedded web server as a Java applet. This feature is
only enabled when the Intel® RMM4-lite is present. The client system must have a Java Runtime
Environment (JRE) version 6.0 or later to run the KVM or media redirection applets.
The Integrated BMC supports an embedded KVM application (Remote Console) that can be
launched from the embedded web server from a remote console. USB1.1 or USB 2.0 based
mouse and keyboard redirection are supported. It is also possible to use the KVM-redirection
(KVM-r) session concurrently with media-redirection (media-r). This feature allows a user to
interactively use the keyboard, video, and mouse (KVM) functions of the remote server as if the
user were physically at the managed server.
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KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an
entire keyboard that is connected to remote system. The “soft keyboard” functionality supports
the following layouts: English, Dutch, French, German, Italian, Russian, and Spanish.
KVM-redirection feature automatically senses video resolution for best possible screen capture
and provides high-performance mouse tracking and synchronization. It allows remote viewing
and configuration in pre-boot POST and BIOS setup, once BIOS has initialized video.
Other attributes of this feature include:
Encryption of the redirected screen, keyboard, and mouse
Compression of the redirected screen
An option to select a mouse configuration based on the OS type.
Supports user definable keyboard macros.
KVM redirection feature supports the following resolution and refresh rates:
640x480 at 60Hz, 72Hz, 85Hz, 100Hz
800x600 at 60Hz, 72Hz, 75Hz, 85Hz
1024x768 at 60Hz, 72Hz, 75Hz, 85Hz
1280X960 at 60Hz
1280x1024 at 60Hz
1600x1200 at 60Hz
1920x1080 at 60Hz
1920x1200 at 60Hz
1920x1080 (1080p)
1920x1200 (WUXGA)
1650X1080 (WSXGA+)
7.1.1 Remote Console
The Remote Console is the redirected screen, keyboard and mouse of the remote host system.
To use the Remote Console window of your managed host system, the browser must include a
Java* Runtime Environment plug-in. If the browser has no Java support, such as with a small
handheld device, the user can maintain the remote host system using the administration forms
displayed by the browser.
The Remote Console window is a Java Applet that establishes TCP connections to the BMC.
The protocol that is run over these connections is a unique KVM protocol and not HTTP or
HTTPS. This protocol uses ports #7578 for KVM, #5120 for CDROM media redirection, and
#5123 for Floppy/USB media redirection. When encryption is enabled, the protocol uses ports
#7582 for KVM, #5124 for CDROM media redirection, and #5127 for Floppy/USB media
redirection. The local network environment must permit these connections to be made, that is,
the firewall and, in case of a private internal network, the NAT (Network Address Translation)
settings have to be configured accordingly.
7.1.2 Performance
The remote display accurately represents the local display. The feature adapts to changes to
the video resolution of the local display and continues to work smoothly when the system
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transitions from graphics to text or vice-versa. The responsiveness may be slightly delayed
depending on the bandwidth and latency of the network.
Enabling KVM and/or media encryption will degrade performance. Enabling video compression
provides the fastest response while disabling compression provides better video quality.
For the best possible KVM performance, a 2Mb/sec link or higher is recommended.
The redirection of KVM over IP is performed in parallel with the local KVM without affecting the
local KVM operation.
7.1.3 Security
The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES.
The actual algorithm that is used is negotiated with the client based on the client’s capabilities.
7.1.4 Availability
The remote KVM session is available even when the server is powered-off (in stand-by mode).
No re-start of the remote KVM session shall be required during a server reset or power on/off. A
BMC reset (for example, due to an BMC Watchdog initiated reset or BMC reset after BMC FW
update) will require the session to be re-established.
KVM sessions persist across system reset, but not across an AC power loss.
7.1.5 Usage
As the server is powered up, the remote KVM session displays the complete BIOS boot process.
The user is able interact with BIOS setup, change and save settings as well as enter and
interact with option ROM configuration screens.
At least two concurrent remote KVM sessions are supported. It is possible for at least two
different users to connect to same server and start remote KVM sessions.
7.1.6 Force-enter BIOS Setup
KVM redirection can present an option to force-enter BIOS Setup. This enables the system to
enter F2 setup while booting which is often missed by the time the remote console redirects the
video.
7.2 Media Redirection
The embedded web server provides a Java applet to enable remote media redirection. This may
be used in conjunction with the remote KVM feature, or as a standalone applet.
The media redirection feature is intended to allow system administrators or users to mount a
remote IDE or USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server.
Once mounted, the remote device appears just like a local device to the server, allowing system
administrators or users to install software (including operating systems), copy files, update BIOS,
and so on, or boot the server from this device.
The following capabilities are supported:
The operation of remotely mounted devices is independent of the local devices on the
server. Both remote and local devices are useable in parallel.
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Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the
server.
It is possible to boot all supported operating systems from the remotely mounted device
and to boot from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the
Tested/supported Operating System List for more information.
Media redirection shall support redirection for a minimum of two virtual devices
concurrently with any combination of devices. As an example, a user could redirect two
CD or two USB devices.
The media redirection feature supports multiple encryption algorithms, including RC4
and AES. The actual algorithm that is used is negotiated with the client based on the
client’s capabilities.
A remote media session is maintained even when the server is powered-off (in standby
mode). No restart of the remote media session is required during a server reset or power
on/off. An Integrated BMC reset (for example, due to an Integrated BMC reset after
Integrated BMC FW update) will require the session to be re-established
The mounted device is visible to (and useable by) managed system’s OS and BIOS in
both pre-boot and post-boot states.
The mounted device shows up in the BIOS boot order and it is possible to change the
BIOS boot order to boot from this remote device.
It is possible to install an operating system on a bare metal server (no OS present) using
the remotely mounted device. This may also require the use of KVM-r to configure the
OS during install.
USB storage devices will appear as floppy disks over media redirection. This allows for the
installation of device drivers during OS installation.
If either a virtual IDE or virtual floppy device is remotely attached during system boot, both
the virtual IDE and virtual floppy are presented as bootable devices. It is not possible to
present only a single-mounted device type to the system BIOS.
7.2.1 Availability
The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection
sessions persist across system reset but not across an AC power loss or BMC reset.
7.2.2 Network Port Usage
The KVM and media redirection features use the following ports:
5120 – CD Redirection
5123 – FD Redirection
5124 – CD Redirection (Secure)
5127 – FD Redirection (Secure)
7578 – Video Redirection
7582 – Video Redirection
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8. On-board Connector/Header Overview
This section identifies the location and pin-out for on-board connectors and headers of the
server board that provide an interface to system options/features, on-board platform
management, or other user accessible options/features.
8.1 Power Connectors
The server board includes several power connectors that are used to provide DC power to
various devices.
8.1.1 Main Power
Main server board power is supplied from a 24-pin power connector. The connector is labeled
as “MAIN PWR” on the server board. The following tables provide the pin-out of “MAIN PWR”
connector.
Table 23. Main Power Connector Pin-out (“MAIN PWR”)
Pin
Signal name Pin
Signal name
1 P3V3 13 P3V3
2 P3V3 14 N12V
3 GND 15 GND
4 P5V 16 FM_PS_EN_PSU_N
5 GND 17 GND
6 P5V 18 GND
7 GND 19 GND
8 PWRGD_PS_PWROK_PSU_R1 20 NC_PS_RES_TP
9 P5V_STBY_PSU 21 P5V
10 P12V 22 P5V
11 P12V 23 P5V
12 P3V3 24 GND
8.1.2 CPU Power Connectors
On the server board there are two white 8-pin 12V CPU power connectors labeled “CPU_1
PWR” and “CPU_2 PWR”. The following table provides the pin-out for both connectors.
Table 24. CPU Power Connector Pin-out (“CPU_1 PWR” and “CPU_2 PWR”)
Pin Signal name
Pin
Signal name
1 GND 5 +12V
2 GND 6 +12V
3 GND 7 +12V
4 GND 8 +12V
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8.1.3 PCIe Card Power Connectors
The server board includes one 4-pin power connectors that provide support for add-in cards that
require more power than is supported from the PCIe slots direct. The connector is labeled as
OPT_12V_PWR.
Table 25. PCIe Card Power Connector Pin-out (“OPT_12V_PWR”)
Pin Signal name
Pin
Signal name
1 GND 3 +12V
2 GND 4 +12V
8.2 Front Panel Headers and Connectors
The server board includes several connectors that provide various possible front panel options.
This section provides a functional description and pin-out for each connector.
8.2.1 SSI Front Panel Header
Included on the front edge of the server board is a 30-pin SSI compatible front panel header
which provides for various front panel features including:
Power/Sleep Button
System ID Button
System Reset Button
NMI Button
NIC Activity LEDs
Hard Drive Activity LEDs
System Status LED
System ID LED
On the server board, this header is labeled “SSI FRONT PANEL”. The following table provides
the pin-out for this header.
Table 26. SSI Front Panel Header Pin-out (“SSI Front Panel”)
Pin Signal Name Pin
Signal Name
1 SB3.3V 2 SB3.3V
KEY 4 SB5V
5 Power LED Cathode 6 System ID LED Cathode
7 3.3V 8 System Fault LED Anode
9 HDD Activity LED Cathode 10 System Fault LED Cathode
11 Power Switch 12 NIC#1 Activity LED
13 GND (Power Switch) 14 NIC#1 Link LED
15 Reset Switch 16 I
2
C SDA
17 GND (Reset/ID/NMI Switch) 18 I
2
C SCL
19 System ID Switch 20 Chassis Intrusion
21 Pull Down 22 NIC#2 Activity LED
23 NMI to CPU Switch 24 NIC#2 Link LED
KEY KEY
27 NIC#3 Activity LED 28 NIC#4 Activity LED
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Pin Signal Name Pin
Signal Name
29 NIC#3 Link LED 30 NIC#4 Link LED
8.2.1.1 Power/Sleep Button and LED Support
Pressing the Power button will toggle the system power on and off. This button also functions as
a sleep button if enabled by an ACPI compliant operating system. Pressing this button will send
a signal to the integrated BMC, which will power on or power off the system. The power LED is
a single color and is capable of supporting different indicator states as defined in the following
table.
Table 27. Power/Sleep LED Functional States
State Power Mode LED Description
Power-off Non-ACPI Off System power is off, and the BIOS has not initialized the chipset.
Power-on Non-ACPI On System power is on
S5 ACPI Off Mechanical is off, and the operating system has not saved any context
to the hard disk.
S4 ACPI Off Mechanical is off. The operating system has saved context to the hard
disk.
S3-S1 ACPI Slow blink
1
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
S0 ACPI Steady on System and the operating system are up and running.
8.2.1.2 System ID Button and LED Support
Pressing the System ID Button will toggle both the ID LED on the front panel and the Blue ID
LED on the server board on and off. The System ID LED is used to identify the system for
maintenance when installed in a rack of similar server systems. The System ID LED can also be
toggled on and off remotely using the IPMI “Chassis Identify” command which will cause the
LED to blink for 15 seconds.
8.2.1.3 System Reset Button Support
When pressed, this button will reboot and re-initialize the system
8.2.1.4 NMI Button Support
When the NMI button is pressed, it puts the server in a halt state and causes the BMC to issue
a non-maskable interrupt (NMI). This can be useful when performing diagnostics for a given
issue where a memory download is necessary to help determine the cause of the problem.
Once an NMI has been generated by the BMC, the BMC does not generate another NMI until
the system has been reset or powered down.
The following actions cause the BMC to generate an NMI pulse:
Receiving a Chassis Control command to pulse the diagnostic interrupt. This command
does not cause an event to be logged in the SEL.
Watchdog timer pre-timeout expiration with NMI/diagnostic interrupt pre-timeout action
enabled.
The following table describes behavior regarding NMI signal generation and event logging by
the BMC.
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Table 28. NMI Signal Generation and Event Logging
Causal Event
NMI
Signal
Generation
Front Panel Diag Interrupt Sensor Event Logging Support
Chassis Control command (pulse diagnostic interrupt) X –
Front panel diagnostic interrupt button pressed X X
Watchdog Timer pre-timeout expiration with
NMI/diagnostic interrupt action
X X
8.2.1.5 NIC Activity LED Support
The Front Control Panel includes an activity LED indicator for each on-board Network Interface
Controller (NIC). When a network link is detected, the LED will turn on solid. The LED will blink
once network activity occurs at a rate that is consistent with the amount of network activity that
is occurring.
8.2.1.6 Hard Drive Activity LED Support
The drive activity LED on the front panel indicates drive activity from the on-board hard disk
controllers. The server board also provides a header giving access to this LED for add-in
controllers.
8.2.1.7 System Status LED Support
The System Status LED is a bi-color (Green/Amber) indicator that shows the current health of
the server system. The system provides two locations for this feature; one is located on the
Front Control Panel, the other is located on the back edge of the server board, viewable from
the back of the system. Both LEDs are tied together and will show the same state. The System
Status LED states are driven by the on-board platform management sub-system. The following
table provides a description of each supported LED state.
Table 29. System Status LED State Definitions
Color State Criticality Description
Off System is
not
operating
Not ready 1. System is powered off (AC and/or DC).
2. System is in EuP Lot6 Off Mode.
3. System is in S5 Soft-Off State.
4. System is in S4 Hibernate Sleep State.
Green Solid on Ok Indicates that the System is running (in S0 State) and its status is
‘Healthy’. The system is not exhibiting any errors. AC power is
present and BMC has booted and manageability functionality is up
and running.
Green ~1 Hz blink Degraded -
system is
operating in a
degraded state
although still
functional, or
system is
operating in
a redundant state
but with an
impending failure
warning
System degraded:
Redundancy loss, such as power-supply or fan. Applies only if
the associated platform sub-system has redundancy
capabilities.
Fan warning or failure when the number of fully operational fans
is more than minimum number needed to cool the system.
Non-critical threshold crossed – Temperature (including HSBP
temp), voltage, input power to power supply, output current for
main power rail from power supply and Processor Thermal
Control (Therm Ctrl) sensors.
Power supply predictive failure occurred while redundant power
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Color State Criticality Description
supply configuration was present.
Unable to use all of the installed memory (one or more DIMMs
failed/disabled but functional memory remains available)
Correctable Errors over a threshold and migrating to a spare
DIMM (memory sparing). This indicates that the user no longer
has spared DIMMs indicating a redundancy lost condition.
Corresponding DIMM LED lit.
Uncorrectable memory error has occurred in memory Mirroring
Mode, causing Loss of Redundancy.
Correctable memory error threshold has been reached for a
failing DDR3 DIMM when the system is operating in fully
redundant RAS Mirroring Mode.
Battery failure.
BMC executing in uBoot. (Indicated by Chassis ID blinking at
Blinking at 3Hz). System in degraded state (no manageability).
BMC uBoot is running but has not transferred control to BMC
Linux*. Server will be in this state 6-8 seconds after BMC reset
while it pulls the Linux* image into flash
BMC booting Linux*. (Indicated by Chassis ID solid ON).
System in degraded state (no manageability). Control has been
passed from BMC uBoot to BMC Linux* itself. It will be in this
state for ~10-~20 seconds.
BMC Watchdog has reset the BMC.
Power Unit sensor offset for configuration error is asserted.
HDD HSC is off-line or degraded.
Amber ~1 Hz blink Non-critical -
System is
operating in a
degraded state
with an impending
failure warning,
although still
functioning
Non-fatal alarm – system is likely to fail:
Critical threshold crossed – Voltage, temperature (including
HSBP temp), input power to power supply, output current for
main power rail from power supply and PROCHOT (Therm Ctrl)
sensors.
VRD Hot asserted.
Minimum number of fans to cool the system not present or failed
Hard drive fault
Power Unit Redundancy sensor – Insufficient resources offset
(indicates not enough power supplies present)
In non-sparing and non-mirroring mode if the threshold of
correctable errors is crossed within the window
Correctable memory error threshold has been reached for a
failing DDR3 DIMM when the system is operating in a non-
redundant mode
Amber Solid on Critical, non-
recoverable –
System is halted
Fatal alarm – system has failed or shutdown:
CPU CATERR signal asserted
MSID mismatch detected (CATERR also asserts for this case).
CPU 1 is missing
CPU Thermal Trip
No power good – power fault
DIMM failure when there is only 1 DIMM present and hence no
good memory present1.
Runtime memory uncorrectable error in non-redundant mode.
DIMM Thermal Trip or equivalent
SSB Thermal Trip or equivalent
CPU ERR2 signal asserted
BMC\Video memory test failed. (Chassis ID shows blue/solid-on
for this condition)
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Color State Criticality Description
Both uBoot BMC FW images are bad. (Chassis ID shows
blue/solid-on for this condition)
240VA fault
Fatal Error in processor initialization:
Processor family not identical
Processor model not identical
Processor core/thread counts not identical
Processor cache size not identical
Unable to synchronize processor frequency
Unable to synchronize QPI link frequency
8.2.2 Front Panel USB Connector
The server board includes a 10-pin connector, that when cabled, can provide up to two USB
ports to a front panel. On the server board the connector is labeled “USB5-6”. The following
table provides the connector pin-out.
Table 30. Front Panel USB Connector Pin-out (USB5-6)
Pin Signal Name
Pin
Signal Name
1 +5V 2 +5V
3 USB_N 4 USB_N
5 USB_P 6 USB_P
7 GND 8 GND
10
8.2.3 Intel® Local Control Panel Connector
The server board includes a 7-pin connector that is used when the system is configured with
Intel® Local Control Panel with LCD support. On the server board this connector is labeled
LCPand is located on the front edge of the board. The following table provides the pin-out for
this connector.
Table 31. Intel® Local Control Pane Connector Pin-out (LCP)
Pin Signal Name
1 SMB_SENSOR_3V3STBY_DATA_R0
2 GROUND
3 SMB_SENSOR_3V3STBY_CLK
4 P3V3_AUX
5 FM_LCP_ENTER_N_R
6 FM_LCP_LEFT_N_R
7 FM_LCP_RIGHT_N_R
8.3 On-Board Storage Connectors
The server board provides connectors for support of several storage device options. This
section provides a functional overview and pin-out of each connector.
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8.3.1 SATA Only Connectors: 6 Gbps
The server board includes two white single port SATA only connectors capable of transfer rates
of up to 6Gb/s. On the server board these connectors are labeled as SATA_0 and SATA_1. The
following table provides the pin-out for both connectors.
Table 32. SATA Only Connector Pin-out (SATA_0 and SATA_1)
Pin
Signal Name
1 GND
2 SATA_TX_P
3 SATA_TX_N
4 GND
5 SATA_RX_N
6 SATA_RX_P
7 GND
Note: As an option, SATA_0 supports vertical, high profile SATA_DOM.
8.3.2 SATA/SAS Connectors
The server board includes eight SATA/SAS connectors. On the server board, these connectors
are labeled as SATA/SAS_ 0 to SATA/SAS_7. By default, only the connector labeled
SATA/SAS_0 to SATA/SAS_3 are enabled and has support for up to four SATA ports capable
of transfer rates of up to 3Gb/s. The connector labeled SATA/SAS_4 to SATA/SAS_7 is only
enabled when an optional Intel® RAID C600 Upgrade Key is installed. See Table 10 for a
complete list of supported storage upgrade keys. The following tables provide the pin-out for
each connector.
Table 33. SATA/SAS Connector Pin-out (SATA/SAS_0 to SATA/SAS_7)
Pin
Signal Name
1 GND
2 SATA_TX_P
3 SATA_TX_N
4 GND
5 SATA_RX_N
6 SATA_RX_P
7 GND
8.3.3 SAS SGPIO Connectors
Table 34. SAS SGPIO Connector Pin-out (SAS_SPGIO_0 and SAS_SPGIO_1)
Pin Signal Name
Pin#
Signal Name
1 CLOCK 2 LOAD
3 GND 4 DATAOUT
5 DATAIN
8.3.4 Intel® RAID C600 Upgrade Key Connector
The server board provides one connector to support Intel® RAID C600 Upgrade Key. The Intel®
RAID C600 Upgrade Key is a small PCB board that enables different versions of RAID 5
software stack and/or upgrade from SATA to SAS storage functionality. On the server board,
the connector is labeled as STRO UPG KEY. The pin configuration of connector is identical and
defined in the following table.
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Table 35. Intel® RAID C600 Upgrade Key Connector Pin-out (STRO UPG KEY)
Pin Signal Name
1 GND
2 FM_PBG_DYN_SKU_KEY
3 GND
4 FM_SSB_SAS_SATA_RAID_KEY
8.3.5 HSBP_I2C Header
Table 36. HSBP_I2C Header Pin-out (HSBP_I2C)
Pin Signal Name
1 SMB_HSBP_3V3STBY_DATA
2 GND
3 SMB_HSBP_3V3STBY_CLK
8.3.6 HDD LED Header
The server board includes a 2-pin hard drive activity LED header used with some SATA/SAS
controller add-in cards. On the server board, this header is labeled HDD LED. The header has
the following pin-out.
Table 37. Hard Drive Acitivity Header Pin-out (HDD_LED)
Pin
Signal Name
1 LED_HDD_ACT_N
2 TP_LED_HDD_ACT
8.3.7 Internal Type-A USB Connector
The server board includes one internal Type-A USB connector labeled USB_4. The following
table provides the pin-out for this connector.
Table 38. Internal Type-A USB 2.0 Connector Pin-out (USB_4)
Pin
Signal Description
1 +5V
2 USB_N
3 USB_P
4 GND
8.3.8 Internal 2mm Low Profile eUSB SSD Connector
The server board includes one 10-pin 2mm low profile connector with an intended usage of
supporting low profile eUSB SSD devices. On the server board this connector is labeled
eUSB_SSD. The following table provides the pin-out for this connector.
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Table 39. Internal eUSB Connector Pin-out (eUSB_SSD)
Pin Signal Name Pin Signal Name
1 +5V 2 NC
3 USB_N 4 NC
5 USB_P 6 NC
7 GND 8 NC
10 LED#
8.4 Management and Security Connectors
8.4.1 RMM4_Lite Connector
A 7-pin Intel® RMM4 Lite Connector is included on the server board to support the optional
Intel® Remote Management Module 4. There is no support for third-party management cards on
this server board. On the server board this connector is labeled as RMM4_Lite. The following
table provides the pin-out for this connector.
Table 40. RMM4_Lite Connector Pin-out (RMM4_Lite)
Pin Signal Name Pin
Signal Name
1 P3V3_AUX 2 SPI_IBMC_BK_DI
4 SPI_IBMC_BK_CLK
5 SPI_IBMC_BK_DO 6 GND
7 SPI_IBMC_BK_CS_N 8 GND
8.4.2 RMM4_NIC connector
Table 41. RMM4_NIC Connector Pin-out (RMM4_NIC)
Pin Signal Name
Pin
Signal Name
1 3V3_AUX 2 MDIO
3 3V3_AUX 4 MDC
5 GND 6 TXD_0
7 GND 8TXD_1
9 GND 10 TXD_2
11 GND 12 TXD_3
13 GND 14 TX_CTL
15 GND 16 RX_CTL
17 GND 18 RXD_0
19 GND 20 RXD_1
21 GND 22 RXD_2
23 GND 24 RXD_3
25 GND 26 TX_CLK
27 GND 28 RX_CLK
29 GND 30 PRESENT#
8.4.3 TPM Connector
Table 42. TPM Connector Pin-out (TPM)
Pin Signal Name
Pin
Signal Name
2 LPC_LAD<1>
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Pin Signal Name Pin
Signal Name
3 LPC_LAD<0> 4 GND
5 IRQ_SERIAL 6 LPC_FRAME_N
7 P3V3 8GND
9 RST_IBMC_NIC_N_R2 10 CLK_33M_TPM
11 LPC_LAD<3> 12 GND
13 GND 14 LPC_LAD<2>
8.4.4 PMBus* Connector
Table 43. PMBus* Connector Pin-out (SMB_PMBUS*)
Pin Signal Name
1 SMB_PMBUS_CLK_R
2 SMB_PMBUS_DATA_R
3 IRQ_SML1_PMBUS_ALERT_RC_N
4 GND
5 P3V3
8.4.5 Chassis Intrustion Header
The server board includes a 2-pin chassis intrusion header which can be used when the chassis
is configured with a chassis intrusion switch. On the server board, this header is labeled CHAS
INTR. The header has the following pin-out.
Table 44. Chassis Intrusion Header Pin-out (CHAS INTR)
Pin Signal Description
1 FP_CHASSIS_INTRUSION
2 GND
Table 45. Chassis Instrusion Header State Description
Header state Description
PINS 1 and 2 CLOSED IBMC_CHASSIS_N is pulled HIGH. Chassis cover is closed.
PINS 1 and 2 OPEN IBMC_CHASSIS_N is pulled LOW. Chassis cover is removed.
8.4.6 IPMB Connector
Table 46. IPMB Connector Pin-out (IPMB)
Pin Signal Description
1 SMB_IPMB_5VSTBY_DATA
2 GND
3 SMB_IPMB_5VSTBY_CLK
4 P5V_STBY
8.5 Fan Connectors
The server board provides support for nine fans. Seven of them are system cooling fans; two of
them are CPU fans.
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8.5.1 System FAN Connectors
The server board provides support for seven system cooling fans. Each connector is monitored
and controlled by on-board platform management. On the server board, each system fan
connector is labeled SYS_FAN_#, where # = 1 thru 7. The six system cooling fan connectors
near the front edge of the board (SYS_FAN_1 to SYS_FAN_6 are 6-Pin connectors; the one
system cooling fan near rear edge of the board is a 4-Pin connectors (SYS_FAN_7). Following
table provides the pin-out for all system fan connectors.
Table 47. 6-pin System FAN Connector Pin-out (SYS_FAN_1 to SYS_FAN_6)
Pin
Signal Description
1 GND
2 12V
3 TACH
4 PWM
5 PRSNT
6 FAULT
Table 48. 4-pin System FAN Connector Pin-out (SYS_FAN_7)
Pin
Signal Description
1 GND
2 12V
3 TACH
4 PWM
8.5.2 CPU FAN Connector
The server board also provides support for two CPU cooling fans. Each 4-pin connector is
monitored and controlled by platform management. On the server board each CPU fan
connector is labeled as CPU_1FAN and CPU_2FAN. The following table provides the pin-out
for both fan connectors.
Table 49. CPU Fan Connector Pin-out (CPU_1 FAN and CPU_2 FAN)
Pin
Signal Description
1 GND
2 12V
3 TACH
4 PWM
8.6 Serial Port Connectors
The server board includes two serial port connectors.
8.6.1 Serial Port A connector (DB9)
Serial-A is an external RJ45 type connector labeled as SERIAL_A and has the following pin-out
configuration:
Table 50. Serial Port A Connector Pin-out (SERIAL_A)
Pin Signal Name Pin
Signal Name
1 SPA_DCD 2 SPA_SIN_N
3 SPA_OUT_N 4 SPA_DTR
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Pin Signal Name Pin
Signal Name
5 GND 6 SPA_DSR
7 SPA_RTS 8 SPA_CTS
9 SPA_RI
8.6.2 Serial Port B Connector
Serial-B is an internal 10-pin DH-10 connector labeled as SERIAL_B and has the following pin-
out:
Table 51. Serial-B Connector Pin-out (SERIAL_B)
Pin Signal Name Pin
Signal Name
1 SPA_DCD 2 SPA_DSR
3 SPA_SIN_N 4 SPA_RTS
5 SPA_SOUT_N 6 SPA_CTS
7 SPA_DTR 8 SPA_RI
9 GND
8.6.3 Video Connector
The following table details the pin-out definition of the external VGA connector:
Table 52. Rear VGA Video Connector Pinout (VGA)
Pin Signal Name
1 RED
2 GREEN
3 BLUE
4 N/C
5 GND
6 GND
7 GND
8 GND
9 P5V (fuse not populated)
10 GND
11 N/C
12 DDC_SDA
13 HSYNC
14 VSYNC
15 DDC_SCL
Figure 21. Other Connectors and Headers
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8.7 Other Connectors and Headers
8.7.1 FAN BOARD_I2C Connector
Note: Only Intel® Server Board S2600CO4 includes this FAN BOARD_I2C connector.
The server board includes a 4-pin I2C header that is intend to be used for third party fan control
circuits using a Maxim 72408 controller. On the server board, this header is labeled FAN
BOARD_I2C. The header has the following pin-out.
Table 53. HSBP 4-PIN I2C BU S Connec t o r pin ou t (F AN BOARD_ I2C)
Pin
Signal Name
1 SMB_3V3SB_DAT
2 GND
3 SMB_3V3SB_CLK
4 P3V_SB
8.7.2 IEEE 1394b Connector
Note: Only Intel® Server Board S2600COE includes these two IEEE 1394b connectors.
The server board includes two red 10-pin IEEE 1394b connectors. On the server board, this
header is labeled FRONT_1394B_0 and FRONT_1394B_1. The header has the following pin-
out.
Table 54. IEEE 1394b Connector pin out
Pin Signal Name
Pin
Signal Name
1 GND
3 +12V (Fused) 4 +12V (Fused)
5 TPB- 6 TPB+
7 TPB_REF 8 TPA_REF
9 TPA_ 10 TPA+
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9. Reset and Recovery Jumpers
The server board includes several jumper blocks which are used to as part of a process to
restore a board function back to a normal functional state. The following diagram and sections
identify the location of each jumper block and provides a description of their use.
The following symbol identifies Pin 1 on each jumper block on the silkscreen: ▼
Figure 22. Server Board Jumper Block Locations (J1E2, J1E3, J1E4, J1E6, J2J2)
Note:
1. For safety purposes, the power cord should be disconnected from a system before
removing any system components or moving any of the on-board jumper blocks.
2. System Update and Recovery files are included in the System Update Packages (SUP)
posted to Intel®’s web site.
Table 55. Server Board Jumpers (J1E2, J1E3, J1E4, J1E6, J1J2)
Jumper Name Pins System Results
J1E6: BIOS
Recovery
1-2 Pins 1-2 should be connected for normal system operation. (Default)
2-3 The main system BIOS does not boot with pins 2-3 connected. The system only boots
from EFI-bootable recovery media with a recovery BIOS image present.
J2J2: BIOS
1-2 These pins should have a jumper in place for normal system operation. (Default)
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Jumper Name Pins System Results
Default (that is,
CMOS Clear) 2-3 If pins 2-3 are connected when AC power unplugged, the CMOS settings clear in 5
seconds. Pins 2-3 should not be connected for normal system operation.
J1E3: ME
Force Update
1-2 ME Firmware Force Update Mode – Disabled (Default)
2-3 ME Firmware Force Update Mode – Enabled
J1E4: BMC
Force Update
1-2 BMC Firmware Force Update Mode – Disabled (Default)
2-3 BMC Firmware Force Update Mode – Enabled
J1E2:
Password Clear
1-2 These pins should have a jumper in place for normal system operation. (Default)
2-3
To clear administrator and user passwords, power on the system with pins 2-3 connected.
The administrator and user passwords clear in 5-10 seconds after power on. Pins 2-3
should not be connected for normal system operation.
9.1 BIOS Default (that is, CMOS Clear) and Password Reset Usage Procedure
The BIOS Default (that is, CMOS Clear) and Password Reset recovery features are designed
such that the desired operation can be achieved with minimal system downtime. The usage
procedure for these two features has changed from previous generation Intel® server boards.
The following procedure outlines the new usage model.
9.1.1 Set BIOS to default (that is, Clearing the CMOS)
To clear the CMOS, perform the following steps:
1. Power down the server. Do not unplug the power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
3. Move jumper from the default operating position (covering pins 1 and 2) to the
reset/clear position (covering pins 2 and 3).
4. Wait five seconds.
5. Remove AC power.
6. Move the jumper back to the default position (covering pins 1 and 2).
7. Close the server chassis.
8. Power up the server.
The CMOS is now cleared and can be reset by going into the BIOS setup.
Note: Removing AC power before performing the CMOS clear operation causes the system to
automatically power up and immediately power down, after the procedure is followed and AC
power is re-applied. If this happens, remove the AC power cord again, wait 30 seconds, and re-
install the AC power cord. Power up the system and proceed to the <F2> BIOS Setup utility to
reset the preferred settings.
9.1.2 Clearing the Password
To clear the password, perform the following steps:
1. Power down the server. Do not unplug the power cord.
2. Open the chassis. For instructions, see your server chassis documentation.
3. Move jumper from the default operating position (covering pins 1 and 2) to the password
clear position (covering pins 2 and 3).
4. Close the server chassis.
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5. Power up the server and wait 10 seconds or until POST completes.
6. Power down the server.
7. Open the chassis and move the jumper back to the default position (covering pins 1
and 2).
8. Close the server chassis.
9. Power up the server.
The password is now cleared and can be reset by going into the BIOS setup.
9.2 Integrated BMC Force Update Procedure
When performing the standard Integrated BMC firmware update procedure, the update utility
places the Integrated BMC into an update mode, allowing the firmware to load safely onto the
flash device. In the unlikely event the Integrated BMC firmware update process fails due to the
Integrated BMC not being in the proper update state, the server board provides an Integrated
BMC Force Update jumper, which forces the Integrated BMC into the proper update state. The
following procedure should be completed in the event the standard Integrated BMC firmware
update process fails.
1. Power down and remove the AC power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
3. Move jumper from the default operating position (covering pins 1 and 2) to the enabled
position (covering pins 2 and 3).
4. Close the server chassis.
5. Reconnect the AC cord and power up the server.
6. Perform the Integrated BMC firmware update procedure as documented in the
README.TXT file that is included in the given Integrated BMC firmware update package.
After successful completion of the firmware update process, the firmware update utility
may generate an error stating that the Integrated BMC is still in
update mode.
7. Power down and remove the AC power cord.
8. Open the server chassis.
9. Move jumper from the enabled position (covering pins 2 and 3) to the disabled position
(covering pins 1 and 2).
10. Close the server chassis.
11. Reconnect the AC cord and power up the server.
Note: Normal Integrated BMC functionality is disabled with the Force Integrated BMC Update
jumper set to the enabled position. The server should never be run with the Integrated BMC
Force Update jumper set in this position. This jumper setting should only be used when the
standard firmware update process fails. This jumper should remain in the default/disabled
position when the server is running normally.
9.3 ME Force Update Jumper
When performing the standard ME force update procedure, the update utility places the ME into
an update mode, allowing the ME to load safely onto the flash device. In the unlikely event ME
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firmware update process fails due to ME not being in the proper update state, the server board
provides an Integrated BMC Force Update jumper, which forces the ME into the proper update
state. The following procedure should be completed in the event the standard ME firmware
update process fails.
1. Power down and remove the AC power cord.
2. Open the server chassis. For instructions, see your server chassis documentation.
3. Move jumper from the default operating position (covering pins 1 and 2) to the enabled
position (covering pins 2 and 3).
4. Close the server chassis.
5. Reconnect the AC cord and power up the server.
6. Perform the ME firmware update procedure as documented in the README.TXT file
that is included in the given ME firmware update package (same package as BIOS).
7. Power down and remove the AC power cord.
8. Open the server chassis.
9. Move jumper from the enabled position (covering pins 2 and 3) to the disabled position
(covering pins 1 and 2).
10. Close the server chassis.
11. Reconnect the AC cord and power up the server.
9.4 BIOS Recovery Jumper
The following procedure boots the recovery BIOS and flashes the normal BIOS:
1. Turn off the system power.
2. Move the BIOS recovery jumper to the recovery state.
3. Insert a bootable BIOS recovery media containing the new BIOS image files.
4. Turn on the system power.
The BIOS POST screen will appear displaying the progress, and the system will boot to the EFI
shell. The EFI shell then executes the Startup.nsh batch file to start the flash update process.
The user should then switch off the power and return the recovery jumper to its normal position.
The user should not interrupt the BIOS POST on the first boot after recovery.
When the flash update completes:
1. Remove the recovery media.
2. Turn off the system power.
3. Restore the jumper to its original position.
4. Turn on the system power.
5. Re-flash any custom blocks, such as user binary or language blocks.
The system should now boot using the updated system BIOS.
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10. Light Guided Diagnostics
The server board includes several on-board LED indicators to aid troubleshooting various board
level faults. This section provides a description of the location and function of each LED on the
server boards.
10.1 5 Volt Stand-by LED
Several server management features of these server boards require a 5V stand-by voltage
supplied from the power supply. The features and components that require this voltage must be
present when the system is powered down. The LED is illuminated when AC power is applied to
the platform and 5V stand-by voltage is supplied to the server board by the power supply.
Figure 23. 5 Volt Stand-by Status LED Location
10.2 Fan Fault LEDs
Fan fault LEDs are present for the two CPU fans and the one rear system fan. The fan fault
LEDs illuminate when the corresponding fan has fault.
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Figure 24. Fan Fault LED’s Location
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10.3 DIMM Fault LEDs
The server board provide memory fault LED for each DIMM socket. These LEDs are located as
shown in the following figure. The DIMM fault LED illuminates when the corresponding DIMM
slot has memory installed and a memory error occurs.
Figure 25. DIMM Fault LED’s Location
10.4 System ID LED, System Status LED and POST Code Diagnostic LEDs
The server boards provide LEDs for system ID, system status and POST code. These LEDs are
located in the rear I/O area of the server board as shown in the following figure.
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Callout Description
A System Status LED
B System ID LED
LSB 1 2 3 4 5 6 MSB POST Code Diagnostic LEDs
Figure 26. Location of System Status, System ID and POST Code Diagnostic LEDs
10.4.1 System ID LED
You can illuminate the blue System ID LED using either of the following two mechanisms:
By pressing the System ID Button on the system front control panel, the ID LED displays
a solid blue color until the button is pressed again.
By issuing the appropriate hex IPMI “Chassis Identify” value, the ID LED will either blink
blue for 15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI
Chassis Identify value is issued to turn it off.
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10.4.2 System Status LED
The bi-color (green/amber) System Status LED operates as follows:
Table 56. System Status LED
Color State Criticality Description
Green Solid on System OK System booted and ready.
Green Blink Degraded
System degraded
Non-critical temperature threshold asserted
Non-critical voltage threshold asserted
o Non-critical fan threshold asserted
o Fan redundancy lost, sufficient system cooling
maintained. This does not apply to non-redundant
systems.
o Power supply predictive failure
o Power supply redundancy lost. This does not apply to
non-redundant systems.
Correctable errors over a threshold of 10 and migrating to
a mirrored DIMM (memory mirroring). This indicates the
user no longer has spare DIMMs indicating a redundancy
lost condition. The corresponding DIMM LED should light
up.
Amber Blink Non-critical
Non-fatal alarm – system is likely to fail:
Critical temperature threshold asserted
o CATERR asserted
o Critical voltage threshold asserted
o VRD hot asserted
o SMI Timeout asserted
Amber Solid on Critical, non-
recoverable
Fatal alarm – system has failed or shut down
CPU Missing
Thermal Trip asserted
o Non-recoverable temperature threshold asserted
o Non-recoverable voltage threshold asserted
o Power fault/Power Control Failure
o Fan redundancy lost, insufficient system cooling. This
does not apply to non-redundant systems.
o Power supply redundancy lost insufficient system
power. This does not apply to non-redundant systems.
Note: This state also occurs when AC power is first applied to
the system. This indicates the BMC is booting.
Off N/A Not ready
AC power off, if no degraded, non-critical, critical, or non-
recoverable conditions exist.
o System is powered down or S5 states, if no degraded,
non-critical, critical, or non-recoverable conditions
exist.
* When the server is powered down (transitions to the DC-off state or S5), the BMC is still on standby power and
retains the sensor and front panel status LED state established before the power-down event. If the system status is
normal when the system is powered down (the LED is in a solid green state), the system status LED is off.
10.4.3 POST Code Diagnostic LEDs
During the system boot process, the BIOS execute a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS display the given POST code to the POST code diagnostic LEDs on
the back edge of the server boards. To assist in troubleshooting a system hang during the
POST process, you can use the diagnostic LEDs to identify the last POST process executed.
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Table 57. POST Code Diagnostic LEDs
A. Diagnostic LED #7 (MSB LED) E. Diagnostic LED #3
B. Diagnostic LED #6 F. Diagnostic LED #2
C. Diagnostic LED #5 G. Diagnostic LED #1
D. Diagnostic LED #4 H. Diagnostic LED #0 (LSB LED)
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11. Environmental Limits Specification
The following table defines the Intel® Server Board S2600CO operating and non-operating
environmental limits. Operation of the Intel® Server Board S2600CO at conditions beyond those
shown in the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
Table 58. Server Board Design Specifications
Operating Temperature 0ºC to 55ºC 1 (32ºF to 131ºF)
Non-Operating Temperature -40ºC to 70ºC (-40ºF to 158ºF)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 35g , 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
Note:
1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel® ensures through its own chassis development and testing that
when Intel® server building blocks are used together, the fully integrated system will meet the intended
thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note: Intel® ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
11.1 Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel® processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (TCASE)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system. The Intel® Server board S2600CO4 is
designed to support the Intel® Xeon® Processor E5-2600 or E5-2600 v2 product family TDP
guidelines up to and including 135W. The Intel® Server board S2600COE is designed to support
the Intel® Xeon® Processor E5-2600 or E5-2600 v2 product family TDP guidelines up to and
including 150W with possible configuration limits.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel® ensures through its own
chassis development and testing that when Intel® server building blocks are used together, the
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fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel® developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
11.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
Calculation Model: Telcordia* Issue 1, method I case 3
Operating Temperature: Server in 30°C ambient air
Operating Environment: Ground Benign, Controlled
Duty Cycle: 100%
Quality Level: II
Table 59. MTBF Estimate
Assembly Name Failure Rate MTBF
Mother board 4,447.80 224,830
Integrated Circuits 946.69 1,056,313
Transistor Bipolar 127.02 7,782,934
Transistor_MOSFET 389.76 2,565,714
Diodes 31.49 31,756,974
Diodes_LED 30.00 33,330,661
Resistors 1041.23 960,398
Capacitors 341.86 2,925,173
E-Cap 461.62 2,166,305
Inductors 89.89 11,125,319
Connections 1,176.13 850,245
Misc 80.72 12,388,387
Intel® Server Board S2600CO Family TPS Power Supply Specification Guidelines
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12. Power Supply Specification Guidelines
This section provides power supply specification guidelines recommended for providing the
specified server platform with stable operating power requirements.
Note: The power supply data provided in this section is for reference purposes only. It reflects
Intel®’s own DC power out requirements for a 550W power supply as used in an Intel® designed
4U server platform. The intent of this section is to provide customers with a guide to assist in
defining and/or selecting a power supply for custom server platform designs that utilize the
server boards detailed in this document.
For additional power supply information which are used in Intel® designed supported chassis
please refer to the following Intel® documents: Intel® Server Chassis P4000M Family Technical
Product Specification.
12.1 Power Supply DC Output Specification
12.1.1 Output Power/Currents
The following tables define the minimum power and current ratings. The power supply must
meet both static and dynamic voltage regulation requirements for all conditions.
Table 60. Ove r Voltage Protection Limits
Parameter Min Max. Peak Unit
3.3V 0.5 18.0 A
5V 0.3 15.0 A
12V1 0.7 24.0 28.0 A
12V2 0.7 24.0 28.0 A
12V3 1.5 18.0
3.3V 0.5 18.0 A
12V 0.0 0.5 A
5Vstby 0.0 3.0 3.5 A
Notes:
1. Max combined power for all output shall not exceed 550W.
2. Peak combined power for all outputs shall not exceed 630W for 20 seconds.
3. Max combined power of 12V1, 12V2 and 12V3 shall not exceed 530W.
4. Max combined power on 3.3V and 5V shall not exceed 120W.
12.1.2 Cross Loading
The power supply maintains voltage regulation limit when operated over the following cross
loading conditions.
Table 61. Loading Conditions
3.3V 5.0V 12V1 12V2 12V3 -12V 5.0Vstby Total
Power
12V
Power
3.3V/5V
Power
Load1 18 12.1 12 12 11.7 0 0.3 550 428 120
Load2 13.5 15 12 12 11.2 0.5 0.3 549 422 120
Load3 2.5 2 20 20 4.2 0 0.3 550 530 18
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3.3V 5.0V 12V1 12V2 12V3 -12V 5.0Vstby Total
Power
12V
Power
3.3V/5V
Power
Load4 2.5 2 13.1 13.1 18 0 0.3 550 530 18
Load5 0.5 0.3 15 15 6.5 0.5 3 462 438 3
Load6 16 4 1 1 3.5 0 0.3 140 66 73
Load7 16 13 1 1 9 0.5 3 271 132 118
12.1.3 Standby Output
The 5VSB output is present when an AC input greater than the power supply turn on voltage is
applied.
12.1.3.1 Voltage Regulation
The power supply output voltages stay within the following voltage limits when operating at
steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
These shall be measured at the output connectors.
Table 62. Voltage Regulation Limits
Parameter Tolerance Min Nom Max Units
+3.3V - 3%/+5% +3.20 +3.30 +3.46 Vrms
+5V - 4%/+5% +4.80 +5.00 +5.25 Vrms
+12V1 - 4%/+5% +11.52 +12.00 +12.60 Vrms
+12V2 - 4%/+5% +11.52 +12.00 +12.60 Vrms
+12V3 - 4%/+5% +11.52 +12.00 +12.60 Vrms
- 12V - 10%/+10% - 13.20 -12.00 -10.80 Vrms
+5VSB - 4%/+5% +4.80 +5.00 +5.25 Vrms
12.1.3.2 Dynamic Loading
The output voltages remain within limits specified for the step loading and capacitive loading
specified in the table below. The load transient repetition rate is tested between 50Hz and 5kHz
at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test
specification. The step load may occur anywhere within the MIN load to the MAX
load conditions.
Table 63. Transient Load Requirements
Output Step Load Size
(See note 2)
Load Slew Rate Test capacitive Load
+3.3V 6.0A
0.5 A/
sec 970 F
+5V 4.0A
0.5 A/
sec 400 F
12V1+12V2+12V3 23.0A 0.5 A/
sec 2200 F 1,2
+5VSB 0.5A
0.5 A/
sec 20 F
Notes:
1. Step loads on each 12V output may happen simultaneously.
2. The +12V should be tested with 2200F evenly split between the four +12V rails
3. This will be tested over the range of load conditions in section 12.1.2.
12.1.3.3 Capacitive Loading
The power supply is stable and meets all requirements with the following capacitive loading
ranges:
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Table 64. Capacitive Loading Conditions
Output Min Max Units
+3.3V 250 5000
F
+5V 400 5000
F
+12V 500 8000
F
-12V 1 350
F
+5VSB 20 350
F
12.1.3.4 Grounding
The output ground of the pins of the power supply provides the output power return path. The
output connector ground pins are connected to the safety ground (power supply enclosure).
This grounding is well designed to ensure passing the max allowed Common Mode Noise levels.
The power supply is provided with a reliable protective earth ground. All secondary circuits are
connected to protective earth ground. Resistance of the ground returns to chassis does not
exceed 1.0 m. This path may be used to carry DC current.
12.1.3.5 Residual Voltage Immunity in Standby mode
The power supply is immune to any residual voltage placed on its outputs (Typically a leakage
voltage through the system from standby output) up to 500mV. There is neither additional heat
generated, nor stressing of any internal components with this voltage applied to any individual
or all outputs simultaneously. It also does not trip the protection circuits during turn on.
The residual voltage at the power supply outputs for no load condition does not exceed 100mV
when AC voltage is applied and the PSON# signal is de-asserted.
12.1.3.6 Common Mode Noise
The Common Mode noise on any output does not exceed 350mV pk-pk over the frequency
band of 10Hz to 20MHz.
The measurement is made across a 100Ω resistor between each of DC outputs, including
ground at the DC power connector and chassis ground (power subsystem enclosure).
The test set-up shall use a FET probe such as Tektronix* model P6046 or equivalent.
12.1.3.7 Ripple/Noise
The maximum allowed ripple/noise output of the power supply is defined in the table below. This
is measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A
10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of
measurement.
Table 65. Ripples and Noise
+3.3V +5V +12V 1, 2, 3 -12V +5VSB
50mVp-p 50mVp-p 120mVp-p 200mVp-p 50mVp-p
Power Supply Specification Guidelines Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
110
The test set-up is as shown below:
AC HOT
POWER SUPPLY
AC NEUTRAL V
OUT
RETURN
V
AC GROUND
LOAD
SCOPE
LOAD MUST BE
ISOLATED FROM
THE GROUND OF
THE POWER
SUPPLY
10uF .1uF
GENERAL NOTES:
1. LOAD THE OUTPUT WITH ITS MINIMUM
LOAD CURRENT.
2. CONNECT THE PROBES AS SHOWN.
3. REPEAT THE MEASUREMENTS WITH THE
MAXIMUM LOAD ON THE OUTPUT.
SCOPE NOTE:
USE A TEKTRONI X 7834 OSCILLOSCOPE WITH 7A13 AND
DIFFER EN TI AL P RO BE P 60 55 OR EQUIVA LE NT .
Figure 27. Differ ential Noise test setup
Note: When performing this test, the probe clips and capacitors should be located close to
the load.
12.1.3.8 Timing Requirements
These are the timing requirements for the power supply operation. The output voltages rise from
10% to within regulation limits (Tvout_rise) within 2 to 50ms, except for 5VSB - it is allowed to rise
from 1 to 25ms. The +3.3V, +5V and +12V1, +12V2, +12V3 output voltages start to rise
approximately at the same time. All outputs rise monotonically. Each output voltage reach
regulation within 50ms (Tvout_on) of each other during turn on the power supply. Each output
voltage fall out of regulation within 400ms (Tvout_off) of each other during turn off. The table below
shows the timing requirements for the power supply being turned on and off from the AC input,
with PSON held low and the PSON signal, with the AC input applied. All timing requirements are
met for the cross loading condition.
Table 66. Output Voltage Timing
Item Description MIN MAX UNITS
Tvout_rise Output voltage rise time from each main output. 2 50 ms
Output rise time for the 5Vstby output. 1 25 ms
Tvout_on All main outputs must be within regulation of each
other within this time.
50 ms
T vout_off All main outputs must leave regulation within this
time.
400 ms
Intel® Server Board S2600CO Family TPS Power Supply Specification Guidelines
Revision 1.4
Intel order number G42278-004
111
Figure 28. Output Voltage Timing
Table 67. Turn On/Off Timing
Item Description MIN MAX UNITS
Tsb_on_delay Delay from AC being applied to 5VSB being within
regulation. 1500
ms
Tac_on_delay Delay from AC being applied to all output voltages
being within regulation. 2500
ms
Tvout_holdup Time all output voltages stay within regulation
after loss of AC. Tested at 75% of maximum load. 13 ms
Tpwok_holdup Delay from loss of AC to de-assertion of PWOK.
Tested at 75% of maximum load. 12 ms
Tpson_on_delay Delay from PSON# active to output voltages
within regulation limits. 5 400
ms
Tpson_pwok Delay from PSON# deactivate to PWOK being de-
asserted. 50
ms
Tpwok_on Delay from output voltages within regulation limits
to PWOK asserted at turn on. 100 500 ms
Tpwok_off Delay from PWOK de-asserted to output voltages
(3.3V, 5V, 12V, -12V) dropping out of regulation
limits.
1
ms
Tpwok_low Duration of PWOK being in the de-asserted state
during an off/on cycle using AC or the PSON
signal.
100
ms
Tsb_vout Delay from 5VSB being in regulation to O/Ps
being in regulation at AC turn on. 10 1000
ms
T5VSB_holdup Time the 5VSB output voltage stays within
regulation after loss of AC. 70 ms
Vout
10%
Vout
Tvout rise
Tvout_on
Tvout_off
V1
V2
V3
V4
Power Supply Specification Guidelines Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
112
Figure 29. Turn On/Off Timing (Power Supply Signals)
AC Input
Vout
PWOK
5VSB
PSON
T
sb_on_delay
T
AC_on_delay
T
pwok_on
Tvout_holdup
T
pwok_holdup
Tpson_on_delay
Tsb_on_delay Tpwok_on
Tpwok_off T
pwok_off
T
pson_pwok
Tpwok_low
T
sb_vout
AC turn on/off cycle
PSON turn on/off cycle
T5VSB_holdup
Intel® Server Board S2600CO Family TPS Appendix A: Integration and Usage Tips
Revision 1.4
Intel order number G42278-004
113
Appendix A: Integration and Usage Tips
When adding or removing components or peripherals from the server board, AC power
must be removed. With AC power plugged into the server board, 5-V standby is still
present even though the server board is powered off.
This server board supports The Intel® Xeon® Processor E5-2600 or E5-2600 v2 product
family with a Thermal Design Power (TDP) of up to and including 135 W. Previous
generations of the Intel® Xeon® processors are not supported. Server systems using this
server board may or may not meet the TDP design limits of the server board. Validate
the TDP limits of the server system before selecting a processor.
Processors must be installed in order. CPU 1 must be populated for the server board to
operate.
The server board includes a pre-installed CPU power cable harness. The cable harness
must be installed and fully seated in each connector for the server board to operate.
On the back edge of the server board are eight diagnostic LEDs that display a sequence
of amber POST codes during the boot process. If the server board hangs during POST,
the LEDs display the last POST event run before the hang.
This server board only supports registered DDR3 DIMMs (RDIMMs) and unbuffered
DDR3 DIMMs (UDIMMs). Mixing of RDIMMs and UDIMMs is not supported.
For the best performance, the number of DDR3 DIMMs installed should be balanced
across both processor sockets and memory channels. For example, a two-DIMM
configuration performs better than a one-DIMM configuration. In a two-DIMM
configuration, DIMMs should be installed in DIMM sockets A1 and D1. A six-DIMM
configuration (DIMM sockets A1, B1, C1, D1, E1, and F1) performs better than a three-
DIMM configuration (DIMM sockets A1, B1, and C1).
The Intel® Remote Management Module 4 (Intel® RMM4) connector is not compatible
with any previous versions of the Intel® Remote Management Module (Product Order
Code – AXXRMM, AXXRMM2, and AXXRMM3).
Clear the CMOS with AC power cord plugged. Removing the AC power before
performing the CMOS clear operation causes the system to automatically power up and
immediately power down after the CMOS clear procedure is followed and AC power is
re-applied. If this happens, remove the AC power cord, wait 30 seconds, and then re-
connect the AC power cord. Power up the system and proceed to the <F2> BIOS Setup
utility to reset the desired settings.
Normal Integrated BMC functionality is disabled with the BMC Force Update jumper set
to the “enabled” position (pins 2-3). The server should never be run with the BMC Force
Update jumper set in this position and should only be used when the standard firmware
update process fails. This jumper should remain in the default (disabled) position (pins 1-
2) when the server is running normally.
When performing a normal BIOS update procedure, the BIOS recovery jumper must be
set to its default position (pins 1-2).
Appendix B: Compatible Intel® Server Chassis Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
114
Appendix B: Compatible Intel® Server Chassis
Intel® Server Chassis P4000M Family is 4U pedestal, 25'' length server chassis that is designed
to support Intel® Server Board S2600CO. It also provides a rackable feature.
A. 550-W Fixed Power supply
B. I/O Ports
C. Alternate RMM4 Knockout
D. PCI Add-in Board Slot Covers
E. AC Input Power Connector
F. Serial Port Knockout
G. A Kensington* Cable Lock Mounting Hole
H. Padlock Loop
I. Alternate RMM4 Knockout
J. Front Control Panel
K. 5.25’’ Peripheral Bays
L. CPU Zone System Fan (Fixed System Fan 2)
M. Fixed Hard Drive Carrier Tray
N. PCI Zone System Fan (Fixed System Fan 1)
O. PCI Card Retainer
Figure 30. Intel® Server Chassis P4000M with Fixed Power Supply, Fixed Hard Drives and
Fixed System Fans
Intel® Server Board S2600CO Family TPS Appendix B: Compatible Intel® Server Chassis
Revision 1.4
Intel order number G42278-004
115
A. 750-W Hot Swap Power Supply (Two)
B. AC Input Power Connector (Two)
C. I/O Ports
D. Alternate RMM4 Knockout
E. PCI Add-in Board Slot Covers
F. Serial Port Knockout
G. A Kensington* Cable Lock Mounting Hole
H. Padlock Loop
I. Alternate RMM4 Knockout
J. Hot-swap System Fan 5
K. Front Control Panel
L. Hot-swap System Fan 4
M. 5.25’’ Peripheral Bays
N. Hot-swap System Fan 3
O. Hot-swap System Fan 2
P. 8x3.5’’ Hot-swap HDD Cage
Q. Hot-swap System Fan 1
R. PCI Card Retainer
Figure 31. Intel® Server Chassis P4000M with Hot-swap Power Supply, Hot-swap Hard Drives
and Hot-swap System Fans
Appendix B: Compatible Intel® Server Chassis Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
116
The following figure shows the server chassis/system product code naming conventions:
Figure 32. Chassis/System Product Code Naming Conventions
The Intel® Server Chassis P4000M family comes with the following configurations:
1. P4308XXMFEN – one 550-W non-redundant fixed PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" fixed hard drives.
2. P4308XXMHEN – one 550-W non-redundant fixed PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" hot-swap hard drives.
3. P4308XXMFGN – one 750-W hot-swap PSU, two non-redundant fixed 120x38mm
system fans and up to eight 3.5" fixed hard drives.
4. P4308XXMHGC – two 750-W redundant hot-swap PSU, five redundant hot-swap
80x38mm system fans and up to eight 3.5" hot-swap hard drives.
5. P4308XXMHJC – two 1200-W redundant hot-swap PSU, five redundant hot-swap
80x38mm system fans and up to eight 3.5" hot-swap hard drives.
6. P4208XXMHEN – one 550-W non-redundant fixed PSU, two non-redundant fixed
120x38mm system fans and up to eight 2.5" hot-swap hard drives.
7. P4208XXMHDR – two 460-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 2.5" hot-swap hard drives.
8. P4208XXMHGR – two 750-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 2.5" hot-swap hard drives.
9. P4208XXMHGC – two 750-W redundant hot-swap PSU, five redundant hot-swap
80x38mm system fans and up to eight 2.5" hot-swap hard drives.
10. P4216XXMHJC – two 1200-W redundant hot-swap PSU, five redundant hot-swap
80x38mm system fans and up to sixteen 2.5" hot-swap hard drives.
11. P4216XXMHGC – two 750-W redundant hot-swap PSU, five redundant hot-swap
80x38mm system fans and up to sixteen 2.5" hot-swap hard drives.
12. P4216XXMHGR – two 750-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to sixteen 2.5" hot-swap hard drives.
Intel® Server Board S2600CO Family TPS Appendix B: Compatible Intel® Server Chassis
Revision 1.4
Intel order number G42278-004
117
13. P4216XXMHEN – one 550-W non-redundant fixed PSU, two non-redundant fixed
120x38mm system fans and up to sixteen 2.5" hot-swap hard drives.
14. P4308XXMHGR – two 750-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" hot-swap hard drives.
15. P4308XXMHGN – one 750-W hot-swap PSU, two non-redundant fixed 120x38mm
system fans and up to eight 3.5" hot-swap hard drives.
16. P4308XXMFGR – two 750-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" fixed hard drives.
17. P4308XXMHDR – two 460-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" hot-swap hard drives.
18. P4308XXMHDN – one 460-W hot-swap PSU, two non-redundant fixed 120x38mm
system fans and up to eight 3.5" hot-swap hard drives.
19. P4308XXMFDR – two 460-W redundant hot-swap PSU, two non-redundant fixed
120x38mm system fans and up to eight 3.5" fixed hard drives.
20. P4308XXMFDN – one 460-W hot-swap PSU, two non-redundant fixed 120x38mm
system fans and up to eight 3.5" fixed hard drives.
21. P4304XXMHEN – one 550-W non-redundant fixed PSU, two non-redundant fixed
120x38mm system fans and up to four 3.5" hot-swap hard drives.
The following table summarizes the features for all chassis combinations:
Table 68. Intel® Server Chassis P4000M family Features
Configuration P4308XXMFEN P4308XXMHEN P4308XXMFGN P4308XXMHGC
P4308XXMHJC
Intel
®
Server
Board
Support
Intel
®
Server Board S2600CP
Intel® Server Board S2600CO
Intel® Server Board S2400SC
Intel® Server Board S2400GP
Power 550W non-redundant fixed
power supply
One 750W hot-
swap power
supply with
high current
PDB
Two 750W
redundant
hot-swap
power supply
with high
current PDB
Two 1200W redundant hot-
swap power supply with high
current PDB
System
Cooling
Two 120x38mm non-redundant fans Five 80x38mm redundant hot swap fans
Peripherals
Bays
Three (3) half height 5-1/4" bays for optical devices.
Drive Bays Includes one
fixed drive
bay. Supports
up to eight 3.5"
fixed hard
drives
Includes one
8x3.5" hot-
swap hard
drive cage.
Supports up to
eight 3.5” hot-
swap hard
drives.
Includes one
fixed drive bay.
Supports up to
eight 3.5" fixed
hard
Includes one 8x3.5" hot-swap hard drive cage.
Supports up to eight 3.5” hot-swap hard drives.
Expansion
Slots
Support up to six (6) full height, full length PCI form factor cards mechanically.
Front Panel Power Button with LED, Reset Button, NMI Button, ID Button with LED, Four NIC LEDs, Hard drive
Appendix B: Compatible Intel® Server Chassis Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
118
Configuration P4308XXMFEN P4308XXMHEN P4308XXMFGN P4308XXMHGC
P4308XXMHJC
activity LED, System status LED, two USB ports, Optional front serial port/VGA port
Appearance Color: Cosmetic black (GE 701 or equivalent), service Intel
®
blue, hot swap Intel
®
green.
Support for Intel® standard front panel or LCD
Dimensions
Pedestal
17.24 in (438 mm) x 6.81 in (173mm) x 25 in (612 mm) (Height X Width X Depth)
Optional
Accessory
Kits
Zephyr flash storage, RMM4-lite modules, TPM module, dedicated NIC module, Expander Card module,
Configuration P4208XXMHEN P4208XXMHDR P4208XXMHGR
P4208XXMHGC
P4216XXMHJC
Intel
®
Server
Board
Support
Intel
®
Server Board S2600CP
Intel® Server Board S2600CO
Intel® Server Board S2400SC
Intel® Server Board S2400GP
Power 550W non-
redundant
fixed power
supply
Two 460W
redundant hot-
swap power
supply with
low current
PDB
Two 750W redundant hot-swap
power supply with high current
PDB
Two 1200W redundant hot-
swap power supply with high
current PDB
System
Cooling
Two 120x38mm non-redundant fans Five 80x38mm redundant hot swap fans
Peripherals
Bays
Three (3) half height 5-1/4" bays for optical devices.
Drive Bays Include one 8x2.5” hot-swap hard drive cage. Supports up to eight
2.5” hot-swap hard drives.
Include two 8x2.5” hot-swap
hard drive cage. Supports up to
sixteen 2.5” hot-swap hard
drives.
Expansion
Slots
Support up to six (6) full height, full length PCI form factor cards mechanically
Front Panel Power Button with LED, Reset Button, NMI Button, ID Button with LED, Four NIC LEDs, Hard drive
activity LED, System status LED, two USB ports, Optional front serial port/VGA port
Appearance Color: Cosmetic black (GE 701 or equivalent), service Intel
®
blue, hot swap Intel
®
green.
Support for Intel® standard front panel or LCD
Dimensions
Pedestal
17.24 in (438 mm) x 6.81 in (173mm) x 25 in (612 mm) (Height X Width X Depth)
Optional
Accessory
Kits
Zephyr flash storage, RMM4-lite modules, TPM module, dedicated NIC module, Expander Card module
Configuration P4216XXMHGC P4216XXMHGR P4308XXMHGR P4308XXMFGR
P4308XXMHGN
Intel
®
Server
Board
Support
Intel
®
Server Board S2600CP
Intel® Server Board S2600CO
Intel® Server Board S2400SC
Intel® Server Board S2400GP
Power Two 750W redundant hot-swap power supply with high current PDB
One 750W hot-swap power
supply with high current PDB
System
Cooling
Five 80x38mm
redundant hot
swap fans
Two 120x38mm non-redundant fans
Peripherals
Bays
Three (3) half height 5-1/4" bays for optical devices.
Drive Bays Include two 8x2.5” hot-swap
hard drive cage. Supports up to
Include one
8x3.5” hot-
Includes one
fixed drive
Include one 8x3.5” hot-swap
hard drive cage. Supports up to
Intel® Server Board S2600CO Family TPS Appendix B: Compatible Intel® Server Chassis
Revision 1.4
Intel order number G42278-004
119
Configuration P4308XXMFEN P4308XXMHEN P4308XXMFGN P4308XXMHGC
P4308XXMHJC
sixteen 2.5” hot-swap hard
drives.
swap hard drive
cage. Supports
up to eight 3.5”
hot-swap hard
drives.
bay. Supports
up to eight
3.5” fixed hard
eight 3.5” hot-swap hard drives.
Expansion
Slots
Support up to six (6) full height, full length PCI form factor cards mechanically.
Front Panel Power Button with LED, Reset Button, NMI Button, ID Button with LED, Four NIC LEDs, Hard drive
activity LED, System status LED, two USB ports, Optional front serial port/VGA port
Appearance Color: Cosmetic black (GE 701 or equivalent), service Intel
®
blue, hot swap Intel
®
green.
Support for Intel® standard front panel or LCD
Dimensions
Pedestal
17.24 in (438 mm) x 6.81 in (173mm) x 25 in (612 mm) (Height X Width X Depth)
Optional
Accessory
Kits
Zephyr flash storage, RMM4-lite modules, TPM module, dedicated NIC module, Expander Card module,
Configuration P4216XXMHEN P4308XXMHDR P4308XXMHDN
P4308XXMFDR
P4308XXMFDN P4304XXMHEN
Intel
®
Server
Board
Support
Intel
®
Server Board S2600CP
Intel® Server Board S2600CO
Intel® Server Board S2400SC
Intel® Server Board S2400GP
Power 550W non-
redundant
fixed power
supply
Two 460W
redundant hot-
swap power
supply with
low current
PDB
One 460W
hot-swap
power
supply with
low current
PDB
Two 460W
redundant hot-
swap power
supply with low
current PDB
One 460W
hot-swap
power supply
with low
current PDB
550W non-
redundant
fixed power
supply
System
Cooling
Two 120x38mm non-redundant fans
Peripherals
Bays
Three (3) half height 5-1/4" bays for optical devices.
Drive Bays Include two
8x2.5" hot-
swap hard
drive cage.
Supports up to
sixteen 2.5"
hot-swap hard
drives.
Include one 8x3.5" hot-swap hard
drive cage. Supports up to eight 3.5"
hot-swap hard drives.
Includes one fixed drive
bay. Supports up to eight
3.5" fixed hard
Include one
4x3.5" hot-swap
hard drive cage.
Supports up to
four 3.5" hot-
swap hard drives.
Expansion
Slots
Support up to six (6) full height, full length PCI form factor cards mechanically.
Front Panel Power Button with LED, Reset Button, NMI Button, ID Button with LED, Four NIC LEDs, Hard drive
activity LED, System status LED, two USB ports, Optional front serial port/VGA port
Appearance Color: Cosmetic black (GE 701 or equivalent), service Intel
®
blue, hot swap Intel
®
green.
Support for Intel® standard front panel or LCD
Dimensions
Pedestal
17.24 in (438 mm) x 6.81 in (173mm) x 25 in (612 mm) (Height X Width X Depth)
Optional
Accessory
Kits
Zephyr flash storage, RMM4-lite modules, TPM module, dedicated NIC module, Expander Card module,
For additional support on Intel® Server Chassis, please refer Intel® Server Chassis P4000M
Family Technical Product Specification.
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
120
Appendix C: Integrated BMC Sensor Tables
This appendix provides BMC core sensor information common to all Intel® server boards within
this generation of product. Specific server boards and/or server platforms may only implement a
sub-set of sensors and/or may include additional sensors. The actual sensor name associated
with a sensor number may vary between server boards or systems.
Sensor Type
The Sensor Type values are the values enumerated in the Sensor Type Codes table in
the IPMI specification. The Sensor Type provides the context in which to interpret the
sensor, such as the physical entity or characteristic that is represented by this sensor.
Event/Reading Type
The Event/Reading Type values are from the Event/Reading Type Code Ranges and
Generic Event/Reading Type Codes tables in the IPMI specification. Digital sensors are
a specific type of discrete sensor, which have only two states.
Event Offset/Triggers
Event Thresholds are event-generating thresholds for threshold types of sensors.
o [u,l][nr,c,nc]: upper non-recoverable, upper critical, upper non-critical, lower non-
recoverable, lower critical, lower non-critical
o uc, lc: upper critical, lower critical
Event Triggers are supported event-generating offsets for discrete type sensors. The
offsets can be found in the Generic Event/Reading Type Codes or Sensor Type Codes
tables in the IPMI specification, depending on whether the sensor event/reading type is
generic or a sensor-specific response.
Assertion/De-assertion Enables
Assertion and de-assertion indicators reveal the type of events the sensor generates:
o As: Assertions
o De: De-assertion
Readable Value/Offsets
o Readable Value indicates the type of value returned for threshold and other non-
discrete type sensors.
o Readable Offsets indicate the offsets for discrete sensors that are readable with
the Get Sensor Reading command. Unless otherwise indicated, all event triggers
are readable; Readable Offsets consist of the reading type offsets that do not
generate events.
Event Data
Event data is the data that is included in an event message generated by the sensor. For
threshold-based sensors, the following abbreviations are used:
o R: Reading value
o T: Threshold value
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
121
Rearm Sensors
The rearm is a request for the event status for a sensor to be rechecked and updated
upon a transition between good and bad states. Rearming the sensors can be done
manually or automatically. This column indicates the type supported by the sensor. The
following abbreviations are used to describe a sensor:
o A: Auto-rearm
o M: Manual rearm
Default Hysteresis
The hysteresis setting applies to all thresholds of the sensor. This column provides the
count of hysteresis for the sensor, which can be 1 or 2 (positive or negative hysteresis).
Criticality
Criticality is a classification of the severity and nature of the condition. It also controls the
behavior of the Control Panel Status LED.
Standby
Some sensors operate on standby power. These sensors may be accessed and/or
generate events when the main (system) power is off, but AC power is present.
Note: All sensors listed below may not be present on all platforms. Please check platform EPS
section for platform applicability and platform chassis section for chassis specific sensors.
Redundancy sensors will be only present on systems with appropriate hardware to support
redundancy (for instance, fan or power supply).
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
122
Table 69. BMC Core Sensors
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm Stand-
by
Power Unit Status
(Pwr Unit Status) 01h All Power Unit
09h
Sensor
Specific
6Fh
00 - Power down OK
As
and
De
– Trig Offset A X
02 - 240 VA power
down Fatal
04 - A/C lost OK
05 - Soft power
control failure
Fatal
06 - Power unit failure
Power Unit RedundancyNote1
(Pwr Unit Redund) 02h Chassis-
specific
Power Unit
09h
Generic
0Bh
00 - Fully Redundant OK
As
and
De
– Trig Offset A X
01 - Redundancy lost Degraded
02 - Redundancy
degraded
Degraded
03 - Non-redundant:
sufficient resources.
Transition from full
redundant state.
Degraded
04 – Non-redundant:
sufficient resources.
Transition from
insufficient state.
Degraded
05 - Non-redundant:
insufficient resources
Fatal
06 – Redundant:
degraded from fully
redundant state.
Degraded
07 – Redundant:
Transition from non-
redundant state.
Degraded
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
123
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
IPMI Watchdog
(IPMI Watchdog) 03h All
Watchdog 2
23h
Sensor
Specific
6Fh
00 - Timer expired,
status only
OK As –
Trig Offset
A X
01 - Hard reset
02 - Power down
03 - Power cycle
08 - Timer interrupt
Physical Security
(Physical Scrty) 04h
Chassis
Intrusion is
chassis-
specific
Physical
Security
05h
Sensor
Specific
6Fh
00 - Chassis intrusion
OK
As
and
De
– Trig Offset A X
04 - LAN leash lost
FP Interrupt
(FP NMI Diag Int) 05h Chassis -
specific
Critical
Interrupt
13h
Sensor
Specific
6Fh
00 - Front panel
NMI/diagnostic
interrupt
OK As – Trig Offset A –
SMI Timeout
(SMI Timeout) 06h All
SMI Timeout
F3h
Digital
Discrete
03h
01 – State asserted
Fatal
As
and
De
– Trig Offset A –
System Event Log
(System Event Log) 07h All
Event
Logging
Disabled
10h
Sensor
Specific
6Fh
02 - Log area
reset/cleared OK As – Trig Offset A X
System Event
(System Event) 08h All
System
Event
12h
Sensor
Specific
6Fh
02 - Undetermined
system H/W failure
04 – PEF action
Fatal
OK
As
and
De
As
- Trig Offset A X
Button Sensor
(Button) 09h All
Button/Switch
14h
Sensor
Specific
6Fh
00 – Power Button
02 – Reset Button OK AS _ Trig Offset A X
BMC Watchdog 0Ah All
Mgmt System
Health
28h
Digital
Discrete
03h
01 – State Asserted Degraded As – Trig Offset A -
Voltage Regulator Watchdog
(VR Watchdog) 0Bh All Voltage
02h
Digital
Discrete
03h
01 – State Asserted Fatal
As
and
De
– Trig Offset M X
Fan RedundancyNote1 0Ch Chassis- Fan Generic 00 - Fully redundant OK As – Trig Offset A –
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
124
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
(Fan Redundancy) specific 04h 0Bh 01 - Redundancy lost Degraded and
De
02 - Redundancy
degraded Degraded
03 - Non-redundant:
Sufficient resources.
Transition from
redundant
Degraded
04 - Non-redundant:
Sufficient resources.
Transition from
insufficient.
Degraded
05 - Non-redundant:
insufficient resources. Non-Fatal
06 – Non-Redundant:
degraded from fully
redundant.
Degraded
07 - Redundant
degraded from non-
redundant
Degraded
SSB Thermal Trip
(SSB Therm Trip) 0Dh All
Temperature
01h
Digital
Discrete
03h
01 – State Asserted Fatal
As
and
De
– Trig Offset M X
IO Module Presence
(IO Mod Presence) 0Eh Platform-
specific
Module/Boar
d
15h
Digital
Discrete
08h
01 – Inserted/Present OK
As
and
De
– Trig Offset M X
SAS Module Presence
(SAS Mod Presence) 0Fh Platform-
specific
Module/Boar
d
15h
Digital
Discrete
08h
01 – Inserted/Present OK
As
and
De
– Trig Offset M X
BMC Firmware Health
(BMC FW Health) 10h All
Mgmt Health
28h
Sensor
Specific
6Fh
04 – Sensor Failure Degraded
As - Trig Offset A X
System Airflow
(System Airflow) 11h All
Other Units
0Bh
Threshold
01h – – – Analog – – –
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
125
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Baseboard Temperature 1
(Platform Specific) 20h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Front Panel Temperature
(Front Panel Temp) 21h All
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
SSB Temperature
(SSB Temp) 22h All Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Baseboard Temperature 2
(Platform Specific) 23h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Baseboard Temperature 3
(Platform Specific) 24h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Baseboard Temperature 4
(Platform Specific) 25h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
IO Module Temperature
(I/O Mod Temp) 26h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
PCI Riser 1 Temperature
(PCI Riser 1 Temp) 27h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
IO Riser Temperature
(IO Riser Temp) 28h Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Hot-swap Backplane 1
Temperature
(HSBP 1 Temp)
29h Chassis-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Hot-swap Backplane 2
Temperature
(HSBP 2 Temp)
2Ah Chassis-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
126
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Hot-swap Backplane 3
Temperature
(HSBP 3 Temp)
2Bh Chassis-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
PCI Riser 2 Temperature
(PCI Riser 2 Temp) 2Ch Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
SAS Module Temperature
(SAS Mod Temp) 2Dh Platform-
specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Exit Air Temperature
(Exit Air Temp) 2Eh
Chassis and
Platform
Specific
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Network Interface Controller
Temperature
(LAN NIC Temp) 2Fh All
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Fan Tachometer Sensors
(Chassis specific
sensor names)
30h–
3Fh
Chassis and
Platform
Specific
Fan
04h
Threshold
01h [l] [c,nc]
nc =
Degraded
c = Non-
fatalNote2
As
and
De
Analog R, T M -
Fan Present Sensors
(Fan x Present) 40h–
4Fh
Chassis and
Platform
Specific
Fan
04h
Generic
08h 01 - Device inserted OK
As
and
De
- Triggered
Offset Auto -
Power Supply 1 Status
(PS1 Status) 50h Chassis-
specific
Power
Supply
08h
Sensor
Specific
6Fh
00 - Presence OK
As
and
De
– Trig Offset A X
01 - Failure Degraded
02 – Predictive Failure Degraded
03 - A/C lost Degraded
06 – Configuration
error OK
Power Supply 2 Status
(PS2 Status) 51h Chassis-
specific
Power
Supply
08h
Sensor
Specific
6Fh
00 - Presence OK
As
and
De
– Trig Offset A X
01 - Failure Degraded
02 – Predictive Failure Degraded
03 - A/C lost Degraded
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
127
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
06 – Configuration
error OK
Power Supply 1
AC Power Input
(PS1 Power In ) 54h Chassis-
specific
Other Units
0Bh
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Power Supply 2
AC Power Input
(PS2 Power In ) 55h Chassis-
specific
Other Units
0Bh
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Power Supply 1 +12V % of
Maximum Current Output
(PS1 Curr Out %)
58h Chassis-
specific
Current
03h
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Power Supply 2 +12V % of
Maximum Current Output
(PS2 Curr Out %)
59h Chassis-
specific
Current
03h
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Power Supply 1 Temperature
(PS1 Temperature) 5Ch Chassis-
specific
Temperature
01h
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Power Supply 2 Temperature
(PS2 Temperature) 5Dh Chassis-
specific Temperature Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Hard Disk Drive 16 - 24
Status
(HDD 16 - 24 Status)
60h
–
68h
Chassis-
specific
Drive Slot
0Dh
Sensor
Specific
6Fh
00 - Drive Presence OK
As
and
De
– Trig Offset A X
01- Drive Fault Degraded
07 - Rebuild/Remap in
progress
Degraded
Processor 1 Status
(P1 Status) 70h All Processor
07h
Sensor
Specific
6Fh
01 - Thermal trip Fatal As
and
De
– Trig Offset M X
07 - Presence OK
Processor 2 Status
(P2 Status) 71h All Processor
07h
Sensor
Specific
6Fh
01 - Thermal trip Fatal As
and
De
– Trig Offset M X
07 - Presence OK
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
128
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Processor 1 Thermal Margin
(P1 Therm Margin) 74h All
Temperature
01h
Threshold
01h - - - Analog R, T A –
Processor 2 Thermal Margin
(P2 Therm Margin) 75h All
Temperature
01h
Threshold
01h - - - Analog R, T A –
Processor 1 Thermal
Control %
(P1 Therm Ctrl %)
78h All
Temperature
01h
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog Trig Offset A –
Processor 2 Thermal
Control %
(P2 Therm Ctrl %)
79h All
Temperature
01h
Threshold
01h [u] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog Trig Offset A –
Processor 1 ERR2 Timeout
(P1 ERR2) 7Ch All Processor
07h
Digital
Discrete
03h
01 – State Asserted fatal
As
and
De
– Trig Offset A –
Processor 2 ERR2 Timeout
(P2 ERR2) 7Dh All Processor
07h
Digital
Discrete
03h
01 – State Asserted fatal
As
and
De
– Trig Offset A –
Catastrophic Error
(CATERR) 80h All Processor
07h
Digital
Discrete
03h
01 – State Asserted fatal
As
and
De
– Trig Offset M –
Processor0 MSID Mismatch
(P0 MSID Mismatch) 81h All Processor
07h
Digital
Discrete
03h
01 – State Asserted fatal
As
and
De
– Trig Offset M –
Processor Population Fault
(CPU Missing) 82h All Processor
07h
Digital
Discrete
03h
01 – State Asserted Fatal
As
and
De
– Trig Offset M –
Processor1 MSID Mismatch
(P1 MSID Mismatch) 87h All Processor
07h
Digital
Discrete
03h
01 – State Asserted fatal
As
and
De
– Trig Offset M –
Processor 1 VRD
Temperature
(P1 VRD Hot)
90h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset M –
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
129
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Processor 2 VRD
Temperature
(P2 VRD Hot)
91h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset M –
Processor 1 Memory VRD
Hot 0-1
(P1 Mem01 VRD Hot) 94h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset A –
Processor 1 Memory VRD
Hot 2-3
(P1 Mem23 VRD Hot) 95h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset A –
Processor 2 Memory VRD
Hot 0-1
(P2 Mem01 VRD Hot) 96h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset A –
Processor 2 Memory VRD
Hot 2-3
(P2 Mem23 VRD Hot) 97h All
Temperature
01h
Digital
Discrete
05h
01 - Limit exceeded Non-fatal
As
and
De
– Trig Offset A –
Power Supply 1 Fan
Tachometer 1
(PS1 Fan Tach 1)
A0h Chassis-
specific
Fan
04h
Generic –
digital
discrete 01 – State Asserted Non-fatal
As
and
De
- Trig Offset M -
Power Supply 1 Fan
Tachometer 2
(PS1 Fan Tach 2)
A1h Chassis-
specific
Fan
04h
Generic –
digital
discrete 01 – State Asserted Non-fatal
As
and
De
- Trig Offset M -
Power Supply 2 Fan
Tachometer 1
(PS2 Fan Tach 1)
A4h Chassis-
specific
Fan
04h
Generic –
digital
discrete 01 – State Asserted Non-fatal
As
and
De
- Trig Offset M -
Power Supply 2 Fan
Tachometer 2
(PS2 Fan Tach 2)
A5h Chassis-
specific
Fan
04h
Generic –
digital
discrete 01 – State Asserted Non-fatal
As
and
De
- Trig Offset M -
Processor 1 DIMM Aggregate
Thermal Margin
(P1 DIMM Thrm Mrgn) B0h All
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Processor 2 DIMM Aggregate
Thermal Margin
(P2 DIMM Thrm Mrgn) B1h All
Temperature
01h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
130
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Processor 1 DIMM
Thermal Trip
(P1 Mem Th rm Trip) C0h All
Temperature
01h
Digital
Discrete
03h
01 – State Asserted Fatal
As
and
De
– Trig Offset M X
Processor 2 DIMM
Thermal Trip
(P2 Mem Th rm Trip) C1h All
Temperature
01h
Digital
Discrete
03h
01 – State Asserted Fatal
As
and
De
– Trig Offset M X
Global Aggregate
Temperature Margin 1
(Agg Therm Mrgn 1) C8h Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 2
(Agg Therm Mrgn 2) C9h Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 3
(Agg Therm Mrgn 3) CAh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 4
(Agg Therm Mrgn 4) CBh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 5
(Agg Therm Mrgn 5) CCh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 6
(Agg Therm Mrgn 6) CDh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 7
(Agg Therm Mrgn 7) CEh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Global Aggregate
Temperature Margin 8
(Agg Therm Mrgn 8) CFh Platform
Specific
Temperature
01h
Threshold
01h - - - Analog R, T A –
Baseboard +12V
(BB +12.0V) D0h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +5V
(BB +5.0V) D1h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Intel® Server Board S2600CO Family TPS Appendix C: Integrated BMC Sensor Tables
Revision 1.4
Intel order number G42278-004
131
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Baseboard +3.3V
(BB +3.3V) D2h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +5V Stand-by
(BB +5.0V STBY) D3h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Baseboard +3.3V Auxiliary
(BB +3.3V AUX) D4h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A X
Baseboard +1.05V Processor
1 Vccp
(BB +1.05Vccp P1) D6h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.05V Processor
1 Vccp
(BB +1.05Vccp P2) D7h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.5V P1 Memory
AB VDDQ
(BB +1.5 P1MEM AB) D8h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.5V P1 Memory
CD VDDQ
(BB +1.5 P1ME M CD) D9h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.5V P2 Memory
AB VDDQ
(BB +1.5 P2MEM AB) DAh All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.5V P2 Memory
CD VDDQ
(BB +1.5 P2ME M CD) DBh All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.8V Aux
(BB +1.8V AUX) DCh All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.1V Stand-by
(BB +1.1V STBY) DDh All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Appendix C: Integrated BMC Sensor Tables Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
132
Full Sensor Name
(Sensor name in SDR)
Sensor
#
Platform
Applicability
Sensor Type
Event/
Reading
Type
Event Offset Triggers Contrib. To
System Status
Assert/
De-
assert
Readable
Value/
Offsets
Event
Data
Rearm
Stand-
by
Baseboard CMOS Battery
(BB +3.3 V Vbat) DEh All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.35V P1 Low
Voltage Memory AB VDDQ
(BB +1.35 P1LV AB) E4h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.35V P1 Low
Voltage Memory CD VDDQ
(BB +1.35 P1LV CD) E5h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.35V P2 Low
Voltage Memory AB VDDQ
(BB +1.35 P2LV AB) E6h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +1.35V P2 Low
Voltage Memory CD VDDQ
(BB +1.35 P2LV CD) E7h All Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +3.3V Riser 1
Power Good
(BB +3.3 RSR1 PGD) EAh Platform
Specific
Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Baseboard +3.3V Riser 2
Power Good
(BB +3.3 RSR2 PGD) EBh Platform
Specific
Voltage
02h
Threshold
01h [u,l] [c,nc]
nc =
Degraded
c = Non-fatal
As
and
De
Analog R, T A –
Hard Disk Drive 1 -15 Status
(HDD 1 - 15 Status)
F0h
-
FEh
Chassis-
specific
Drive Slot
0Dh
Sensor
Specific
6Fh
00 - Drive Presence OK
As
and
De
– Trig Offset A X
01- Drive Fault Degraded
07 - Rebuild/Remap in
progress
Degraded
Notes:
1. Redundancy sensors will be only present on systems with appropriate hardware to support redundancy (for instance, fan or power supply).
2. This is only applicable when the system does not support redundant fans. When fan redundancy is supported, then the contribution to system state is driven by the fan
redundancy sensor.
Intel® Server Board S2600CO Family TPS Appendix D: Intel® Server Board S2600CO Family Specific Sensors
Revision 1.4
Intel order number G42278-004
133
Appendix D: Intel® Server Board S2600CO Family Specific
Sensors
Product ID
Bytes 11:12 (product ID) of Get Device ID command response: 5Dh 00h
ACPI S3 Sleep State Support
Not supported.
Processor Support for Intel® Server Board S2600CO
Intel® Xeon® processor E5-2600 or E5-2600 v2 product family up to 150 W
Intel® Xeon® processor E5-2600 or E5-2600 v2 product family up to 150 W
Supported Chassis
Intel® Server Chassis P4208 (UPM with fixed fan 4U/general SKU)
Intel® Server Chassis P4216 (UPM with fixed fan 4U/general SKU)
Intel® Server Chassis P4304 (UPM with fixed fan 4U/general SKU)
Intel® Server Chassis P4308 (UPM with fixed fan 4U/general SKU)
Intel® Server Chassis P4208 (UPM with fixed fan 4U/150W SKU)
Intel® Server Chassis P4216 (UPM with fixed fan 4U/150W SKU)
Intel® Server Chassis P4308 (UPM with fixed fan 4U/150W SKU)
Intel® Server Chassis P4208 (UPM with redundant fan 4U)
Intel® Server Chassis P4216 (UPM with redundant fan 4U)
Intel® Server Chassis P4308 (UPM with redundant fan 4U)
Table 70. Chassis-specific Sensors
Intel® Server Chassis Fan Tachometer sensors
Fan Presence sensors
Physical security
(Chassis intrusion)
Sensor
FP interrupt (FP NMI
Diag Int)
P4208/P4216/P430
4/P4308 (UPM with
fixed fan
4U/general SKU)
System Fan 1 (30h) NA Physical Scrty (04h) FP NMI Diag Int (05h)
System Fan 2 (31h) NA NA NA
P4208/P4216/P430
8 (UPM with fixed
fan 4U/150W SKU)
System Fan 1 (30h) NA Physical Scrty (04h) FP NMI Diag Int (05h)
System Fan 2 (31h) NA NA NA
Processor 1 Fan (36h) NA NA NA
Processor 2 Fan (37h)detected NA NA NA
P4208
/P4216/P4308
(UPM with
redundant fan 4U)
System Fan 1 (30h) Fan 1 Present (40h) Physical Scrty (04h) FP NMI Diag Int (05h)
System Fan 2 (31h) Fan 2 Present (41h) NA NA
System Fan 3 (32h) Fan 3 Present (42h) NA NA
System Fan 4 (33h) Fan 4 Present (43h) NA NA
System Fan 5 (34h) Fan 5 Present (44h) NA NA
Appendix D: Intel® Server Board S2600CO Family Specific Sensors Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
134
Hot-plug fan support
Supported on:
Intel® Server Chassis P4208 (UPM with redundant fan 4U)
Intel® Server Chassis P4216 (UPM with redundant fan 4U)
Intel® Server Chassis P4308 (UPM with redundant fan 4U)
Fan redundancy support
Supported on:
Intel® Server Chassis P4208 (UPM with redundant fan 4U)
Intel® Server Chassis P4216 (UPM with redundant fan 4U)
Intel® Server Chassis P4308 (UPM with redundant fan 4U)
Table 71. Fan Domain Definition
Chassis Fan Domain Major Components Cooled
(Temperature sensor number)
Fans
(Sensor number)
P4208/P4216/P4304/P4308
(UPM with fixed fan
4U/general SKU)
0
SSB Temp (22h)
BB BMC Temp (23h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
LAN NIC Temp (2Fh)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3 (B2h)
System Fan 1 (30h)
1
BB P2 VR Temp (24h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
P1 Therm Margin (74h)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 1 (B0h)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3 (B2h)
DIMM Thrm Mrgn 4 (B3h)
System Fan 2 (31h)
P4208/P4216/P4308 (UPM
with fixed fan 4U/150W SKU)
0
SSB Temp (22h)
BB BMC Temp (23h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
LAN NIC Temp (2Fh)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3 (B2h)
System Fan 1 (30h)
1
BB P2 VR Temp (24h)
BB MEM VR Temp (25h) System Fan 2 (31h)
Intel® Server Board S2600CO Family TPS Appendix D: Intel® Server Board S2600CO Family Specific Sensors
Revision 1.4
Intel order number G42278-004
135
Chassis Fan Domain Major Components Cooled
(Temperature sensor number)
Fans
(Sensor number)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
P1 Therm Margin (74h)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 1 (B0h)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3(B2h)
DIMM Thrm Mrgn 4 (B3h)
6 P1 MEM01 VRD Hot (94h) Processor 1 Fan (36h)
7
P1 MEM23 VRD Hot (95h)
BB P2 VR Temp (24h) Processor 2 Fan (37h)
P4208/
P4308/
P4216 (UPM with
redundant fan 4U)
0
SSB Temp (22h)
BB BMC Temp (23h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
LAN NIC Temp (2Fh)
System Fan 1 (30h)
1
SSB Temp (22h)
BB BMC Temp (23h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
LAN NIC Temp (2Fh)
P1 Therm Margin (74h)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3 (B2h)
System Fan 2 (31h)
2
BB P2 VR Temp (24h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
P1 Therm Margin (74h)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 1 (B0h)
DIMM Thrm Mrgn 2 (B1h)
DIMM Thrm Mrgn 3 (B2h)
DIMM Thrm Mrgn 4 (B3h)
System Fan 3 (32h)
3
BB P2 VR Temp (24h)
BB MEM VR Temp (25h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
System Fan 4 (33h)
Appendix D: Intel® Server Board S2600CO Family Specific Sensors Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
136
Chassis Fan Domain Major Components Cooled
(Temperature sensor number)
Fans
(Sensor number)
P1 Therm Margin (74h)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 1 (B0h)
DIMM Thrm Mrgn 2 B1h)
DIMM Thrm Mrgn 3 (B2h)
DIMM Thrm Mrgn 4 (B3h)
4
BB P2 VR Temp (24h)
HSBP 1 Temp (29h)
HSBP 2 Temp (2Ah)
Exit Air Temp (2Eh)
PS1 Temperature (5Ch)
PS2 Temperature (5Dh)
P2 Therm Margin (75h)
DIMM Thrm Mrgn 1 (B0h)
DIMM Thrm Mrgn 4 (B3h)
System Fan 5 (34h)
HSC Availability
Intel® Server Chassis P4208(UPM)
o 8-bay 2.5'' HDD – FXX8X25HSBP
Intel® Server Chassis P4216 (UPM)
o 8-bay 2.5'' HDD – FXX8X25HSBP
Intel® Server Chassis P4304(UPM)
o 4-bay 3.5'' HDD – FUP4X35HSBP
Intel® Server Chassis P4308 (UPM)
o 8-bay 3.5'' HDD – FUP8X35HSBP
Power unit support
Intel® Server Chassis P4208/P4216/P4304/P4308 (Intel® Server Chassis P4000M
Family)
Table 72. Power Supply Support
PS Module
Number PMBus*
Product Name (in
product area of the
FRU)
PSU Redundant
Cold
Redundant
Fans in
each PS
460W HS
Power Supply Supported DPS-460KB A
Not supported
(One PSU
configuration)
Not
supported 1 PS fan
460W HS
Power Supply Supported DPS-460KB A Supported Supported 1 PS fan
550W Fixed
Power Supply
Not
supported
No FRU Not supported Not
supported
NA
750W HS
Power Supply Supported DPS-750XB A
Not supported
(One PSU
configuration)
Not
supported 1 PS fan
750W HS
Power Supply Supported DPS-750XB A Supported Supported 1 PS fan
Intel® Server Board S2600CO Family TPS Appendix D: Intel® Server Board S2600CO Family Specific Sensors
Revision 1.4
Intel order number G42278-004
137
PS Module
Number PMBus*
Product Name (in
product area of the
FRU)
PSU Redundant
Cold
Redundant
Fans in
each PS
1200W HS
Power Supply
Supported DPS-1200TB A Supported Supported 2 PS fan
Redundant Fans only for Intel® Server Chassis
Intel® Server Chassis P4208 (UPM with redundant fan 4U)
Intel® Server Chassis P4216 (UPM with redundant fan 4U)
Intel® Server Chassis P4308 (UPM with redundant fan 4U)
Fan Fault LED support
Fan fault LEDs are available on the hot-swap redundant fans available on the on
below chassis:
Intel® Server Chassis P4208 (UPM with redundant fan 4U)
Intel® Server Chassis P4216 (UPM with redundant fan 4U)
Intel® Server Chassis P4308 (UPM with redundant fan 4U)
Memory Throttling support
Baseboard supports this feature.
Appendix E: Management Engine Generated SEL Event Messages Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
138
Appendix E: Management Engine Generated SEL Event
Messages
This appendix lists the OEM System Event Log message format of events generated by the
Management Engine (ME). This includes the definition of event data bytes 10-16 of the
Management Engine generated SEL records. For System Event Log format information, see the
Intelligent Platfor m Management Interface Specifica tion, Version 2.0.
Table 73. Server Platform Services Firmware Health Event
Server Platform Services
Firmware Health Event Request
Byte 1 - EvMRev
=04h (IPMI2.0 format)
Byte 2 – Sensor Type
=DCh (OEM)
Byte 3 – Sensor Number
=23 – Server Platform Services Firmware Health
Byte 4 – Event Dir | Event Type
[7] – Event Dir
=0 Assertion Event
[6-0] – Event Type
=75h (OEM)
Byte 5 – Event Data 1
[7,6]=10b – OEM code in byte 2
[5,4]=10b – OEM code in byte 3
[3..0] – Health Event Type
=00h –Firmware Status
Byte 6 – Event Data 2
=0 - Forced GPIO recovery. Recovery Image loaded due to MGPIO<n>
(default recovery pin is MGPIO1) pin asserted.
Repair action: Deassert MGPIO1 and reset the ME
=1 - Image execution failed. Recovery Image loaded because
operational image is corrupted. This may be either caused by Flash
device corruption or failed upgrade procedure.
Repair action: Either the Flash device must be replaced (if error is
p
ersistent) or the upgrade procedure must be started again.
=2 - Flash erase error. Error during Flash erases procedure probably
due to Flash part corruption.
Repair action: The Flash device must be replaced.
=3 – Flash corrupted. Error while checking Flash consistency probably
due to Flash part corruption.
Repair action: The Flash device must be replaced (if error is
p
ersistent).
=4 – Internal error. Error during firmware execution.
Repair action: FW Watchdog Timeout
Operational image shall be upgraded to other version or hardware
board repair is needed (if error is persistent).
=5..255 – Reserved
Byte 7 – Event Data 3
=<Extended error code. Should be used when reporting an error to the
support>
Intel® Server Board S2600CO Family TPS Appendix E: Management Engine Generated SEL Event Messages
Revision 1.4
Intel order number G42278-004
139
Table 74. Node Manager Health Event
Node Manager Health Event Request
Byte 1 - EvMRev
=04h (IPMI2.0 format)
Byte 2 – Sensor Type
=DCh (OEM)
Byte 3 – Sensor Number
(Node Manager Health sensor)
Byte 4 – Event Dir | Event Type
[0:6] – Event Type
= 73h (OEM)
[7] – Event Dir
=0 Assertion Event
Byte 5 – Event Data 1
[0:3] – Health Event Type
=02h – Sensor Node Manager
[4:5]=10b – OEM code in byte 3
[6:7]=10b – OEM code in byte 2
Byte 6 – Event Data 2
[0:3] – Domain Id (Currently, supports only one domain,
Domain 0)
[4:7] – Error type
=0-9 - Reserved
=10 – Policy Misconfiguration
=11 – Power Sensor Reading Failure
=12 – Inlet Temperature Reading Failure
=13 – Host Communication error
=14 – Real-time clock synchronization failure
=15 – Reserved
Byte 7 – Event Data 3
if error indication = 10 <PolicyId>
if error indication = 11 <PowerSensorAddress>
if error indication = 12 <InletSensorAddress>
Otherwise set to 0.
Appendix F: POST Code Diagnostic LED Decoder Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
140
Appendix F: POST Code Diagnostic LED Decoder
As an aid to assist in troubleshooting a system hang that occurs during a system’s Power-On
Self Test (POST) process, the server board includes a bank of eight POST Code Diagnostic
LEDs on the back edge of the server board.
During the system boot process, Memory Reference Code (MRC) and System BIOS execute a
number of memory initialization and platform configuration processes, each of which is assigned
a specific hex POST code number. As each is started, the given POST code number is
displayed to the POST Code Diagnostic LEDs on the back edge of the server board.
During a POST system hang, the displayed post code can be used to identify the last POST
routine that was run prior to the error occurring, helping to isolate the possible cause of the hang
condition.
Each POST code is represented by eight LEDs; four green and four Amber. The POST codes
are divided into two nibbles, an upper nibble and a lower nibble. The upper nibble bits are
represented by Amber Diagnostic LEDs #4, #5, #6, and #7. The lower nibble bits are
represented by Green Diagnostics LEDs #0, #1, #2, and #3. If the bit is set in the upper and
lower nibbles, then the corresponding LED is lit. If the bit is clear, then the corresponding LED is
off.
The diagnostic LED #7 is labeled as “MSB”, and the diagnostic LED #0 is labeled as “LSB”.
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The
LEDs are decoded as follows:
Note: Diagnostic LEDs are best read and decoded when viewing the LEDs from the back of the
system
Table 75. POST Progress Code LED Example
LEDs
Upper Nibble AMBER LEDs Lower Nibble GREEN LEDs
MSB LSB
LED #7 LED #6 LED #5
LED #4
LED #3
LED #2
LED #1 LED #0
8h 4h 2h 1h 8h 4h 2h 1h
Status ON OFF ON OFF ON ON OFF OFF
Results 1 0 1 0 1 1 0 0
Ah Ch
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are
concatenated as ACh.
Intel® Server Board S2600CO Family TPS Appendix F: POST Code Diagnostic LED Decoder
Revision 1.4
Intel order number G42278-004
141
The following table provides a list of all POST progress codes:
Table 76. Diagnostic LED POST Code Decoder
Checkpoint
Diagnostic LED Decoder
Description
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB LSB
8h 4h 2h 1h
8h 4h 2h 1h
LED # #7 #6 #5 #4 #3 #2 #1 #0
SEC Phase
01h 0 0 0 00 0 0 1 First POST code after CPU reset
02h 0 0 0 00 0 1 0 Microcode load begin
03h 0 0 0 00 0 1 1 CRAM initialization begin
04h 0 0 0 00 1 0 0 Pei Cache When Disabled
05h 0 0 0 00 1 0 1 SEC Core At Power On Begin.
06h 0 0 0 00 1 1 0 Early CPU initialization during Sec Phase.
07h 0 0 0 00 1 1 1 Early SB initialization during Sec Phase.
08h 0 0 0 01 0 0 0 Early NB initialization during Sec Phase.
09h 0 0 0 01 0 0 1 End Of Sec Phase.
0Eh 0 0 0 01 1 1 0 Microcode Not Found.
0Fh 0 0 0 01 1 1 1 Microcode Not Loaded.
PEI Phase
10h 0 0 0 10 0 0 0 PEI Core
11h 0 0 0 10 0 0 1 CPU PEIM
15h 0 0 0 10 1 0 1 NB PEIM
19h 0 0 0 11 0 0 1 SB PEIM
MRC Process Codes – MRC Progress Code Sequence is executed - See Table 77
PEI Phase continued…
31h 0 0 1 10 0 0 1 Memory Installed
32h 0 0 1 10 0 1 0 CPU PEIM (Cpu Init)
33h 0 0 1 10 0 1 1 CPU PEIM (Cache Init)
34h 0 0 1 10 1 0 0 CPU PEIM (BSP Select)
35h 0 0 1 10 1 0 1 CPU PEIM (AP Init)
36h 0 0 1 10 1 1 0 CPU PEIM (CPU SMM Init)
4Fh 0 1 0 01 1 1 1 Dxe IPL started
DXE Phase
60h 0 1 1 00 0 0 0 DXE Core started
61h 0 1 1 00 0 0 1 DXE NVRAM Init
62h 0 1 1 00 0 1 0 SB RUN Init
63h 0 1 1 00 0 1 1 Dxe CPU Init
68h 0 1 1 01 0 0 0 DXE PCI Host Bridge Init
69h 0 1 1 01 0 0 1 DXE NB Init
6Ah 0 1 1 01 0 1 0 DXE NB SMM Init
70h 0 1 1 10 0 0 0 DXE SB Init
71h 0 1 1 10 0 0 1 DXE SB SMM Init
72h 0 1 1 10 0 1 0 DXE SB devices Init
78h 0 1 1 11 0 0 0 DXE ACPI Init
79h 0 1 1 11 0 0 1 DXE CSM Init
90h 1 0 0 10 0 0 0 DXE BDS Started
91h 1 0 0 10 0 0 1 DXE BDS connect drivers
92h 1 0 0 10 0 1 0 DXE PCI Bus begin
93h 1 0 0 10 0 1 1 DXE PCI Bus HPC Init
94h 1 0 0 10 1 0 0 DXE PCI Bus enumeration
95h 1 0 0 10 1 0 1 DXE PCI Bus resource requested
96h 1 0 0 10 1 1 0 DXE PCI Bus assign resource
97h 1 0 0 10 1 1 1 DXE CON_OUT connect
98h 1 0 0 11 0 0 0 DXE CON_IN connect
Appendix F: POST Code Diagnostic LED Decoder Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
142
Checkpoint
Diagnostic LED Decoder
Description
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB
LSB
8h 4h 2h 1h
8h 4h 2h 1h
LED # #7 #6 #5 #4 #3 #2 #1 #0
99h 1 0 0 11 0 0 1 DXE SIO Init
9Ah 1 0 0 11 0 1 0 DXE USB start
9Bh 1 0 0 11 0 1 1 DXE USB reset
9Ch 1 0 0 11 1 0 0 DXE USB detect
9Dh 1 0 0 11 1 0 1 DXE USB enable
A1h 1 0 1 00 0 0 1 DXE IDE begin
A2h 1 0 1 00 0 1 0 DXE IDE reset
A3h 1 0 1 00 0 1 1 DXE IDE detect
A4h 1 0 1 00 1 0 0 DXE IDE enable
A5h 1 0 1 00 1 0 1 DXE SCSI begin
A6h 1 0 1 00 1 1 0 DXE SCSI reset
A7h 1 0 1 00 1 1 1 DXE SCSI detect
A8h 1 0 1 01 0 0 0 DXE SCSI enable
A9h 1 0 1 01 0 0 1 DXE verifying SETUP password
ABh 1 0 1 01 0 1 1 DXE SETUP start
ACh 1 0 1 01 1 0 0 DXE SETUP input wait
ADh 1 0 1 01 1 0 1 DXE Ready to Boot
AEh 1 0 1 01 1 1 0 DXE Legacy Boot
AFh 1 0 1 01 1 1 1 DXE Exit Boot Services
B0h 1 0 1 10 0 0 0 RT Set Virtual Address Map Begin
B1h 1 0 1 10 0 0 1 RT Set Virtual Address Map End
B2h 1 0 1 10 0 1 0 DXE Legacy Option ROM init
B3h 1 0 1 10 0 1 1 DXE Reset system
B4h 1 0 1 10 1 0 0 DXE USB Hot plug
B5h 1 0 1 10 1 0 1 DXE PCI BUS Hot plug
B6h 1 0 1 10 1 1 0 DXE NVRAM cleanup
B7h 1 0 1 10 1 1 1 DXE Configuration Reset
00h 0 0 0 00 0 0 0INT19
S3 Resume
E0h 1 1 0 10 0 0 0 S3 Resume PEIM (S3 started)
E1h 1 1 0 10 0 0 1 S3 Resume PEIM (S3 boot script)
E2h 1 1 0 10 0 1 0 S3 Resume PEIM (S3 Video Repost)
E3h 1 1 0 10 0 1 1 S3 Resume PEIM (S3 OS wake)
BIOS Recovery
F0h 1 1 1 10 0 0 0 PEIM which detected forced Recovery condition
F1h 1 1 1 10 0 0 1 PEIM which detected User Recovery condition
F2h 1 1 1 10 0 1 0 Recovery PEIM (Recovery started)
F3h 1 1 1 10 0 1 1 Recovery PEIM (Capsule found)
F4h 1 1 1 10 1 0 0 Recovery PEIM (Capsule loaded)
Post Memory Initialization MRC Dia gnostic Codes
There are two Types of POST Diagnostic Codes displayed by the MRC during memory
initialization; Progress Codes and Fatal Error Codes.
The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in
the MRC operational path at each step.
Intel® Server Board S2600CO Family TPS Appendix F: POST Code Diagnostic LED Decoder
Revision 1.4
Intel order number G42278-004
143
Table 77. MRC Progress Codes
Checkpoint
Diagnostic LED Decoder
Description
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB LSB
8h 4h 2h 1h 8h 4h
2h
1h
LED #7 #6 #5 #4 #3 #2
#1
#0
MRC Progress Codes
B0h 1 0 1 1 0 0 0 0 Detect DIMM population
B1h 1 0 1 1 0 0 01 Set DDR3 frequency
B2h 1 0 1 1 0 0 1 0 Gather remaining SPD data
B3h 1 0 1 1 0 0 1 1 Program registers on the memory controller level
B4h 1 0 1 1 0 1 0 0 Evaluate RAS modes and save rank information
B5h 1 0 1 1 0 1 0 1 Program registers on the channel level
B6h 1 0 1 1 0 1 1 0 Perform the JEDEC defined initialization sequence
B7h 1 0 1 1 0 1 1 1 Train DDR3 ranks
B8h 1 0 1 1 1 0 0 0 Initialize CLTT/OLTT
B9h 1 0 1 1 1 0 0 1 Hardware memory test and init
BAh 1 0 1 1 1 0 1 0 Execute software memory init
BBh 1 0 1 1 1 0 1 1 Program memory map and interleaving
BCh 1 0 1 1 1 1 0 0 Program RAS configuration
BFh 1 0 1 1 1 1 1 1 MRC is done
Memory Initialization at the beginning of POST includes multiple functions, including: discovery,
channel training, validation that DIMM population is acceptable and functional, initialization of
the IMC and other hardware settings, and initialization of applicable RAS configurations.
When a major memory initialization error occurs and prevents the system from booting with data
integrity, a beep code is generated, the MRC will display a fatal error code on the diagnostic
LEDs, and a system halt command is executed. Fatal MRC error halts do NOT change the state
of the System Status LED, and do NOT get logged as SEL events. The following table lists all
MRC fatal errors that are displayed to the Diagnostic LEDs.
Table 78. MRC Fatal Error Codes
Checkpoint
Diagnostic LED Decoder
Description (with MRC Internal Minor Code)
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB LSB
8h 4h 2h
1h 8h 4h
2h
1h
LED #7 #6 #5 #4 #3 #2 #1 #0
MRC Fatal Error Codes
E8h
1 1 1 0 1 0 0 0
No usable memory error
01h = No memory was detected from the SPD read, or
invalid config that causes no operable memory.
02h = Memory DIMMs on all channels of all sockets are
disabled due to hardware memtest error.
Appendix F: POST Code Diagnostic LED Decoder Intel® Server Board S2600CO Family TPS
Revision 1.4
Intel order number G42278-004
144
Checkpoint
Diagnostic LED Decoder
Description (with MRC Internal Minor Code)
1 = LED On, 0 = LED Off
Upper Nibble Lower Nibble
MSB LSB
8h 4h 2h
1h 8h 4h
2h
1h
LED #7 #6 #5 #4 #3 #2 #1 #0
03h = No memory installed. All channels are disabled.
E9h 1 1 1 0 1 0 0 1 Memory is locked by Intel
®
Trusted Execution Technology
and is inaccessible
EAh
1 1 1 0 1 0 1 0
DDR3 channel training error
01h = Error on read DQ/DQS (Data/Data Strobe) init
02h = Error on Receive Enable
03h = Error on Write Leveling
04h = Error on write DQ/DQS (Data/Data Strobe
EBh
1 1 1 0 1 0 1 1
Memory test failure
01h = Software memtest failure.
02h = Hardware memtest failed.
03h = Hardware memtest failure in Lockstep Channel
mode requiring a channel to be disabled. This is a fatal
error which requires a reset and calling MRC with a
different RAS mode to retry.
EDh
1 1 1 0 1 1 0 1
DIMM configuration population error
01h = Different DIMM types (UDIMM, RDIMM, LRDIMM)
are detected installed in the system.
02h = Violation of DIMM population rules.
03h = The third DIMM slot cannot be populated when QR
DIMMs are installed.
04h = UDIMMs are not supported in the third DIMM slot.
05h = Unsupported DIMM Voltage.
EFh 1 1 1 0 1 1 1 1 Indicates a CLTT table structure error
Intel® Server Board S2600CO Family TPS Appendix G: Post Code Errors
Revision 1.4
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Appendix G: POST Code Errors
Most error conditions encountered during POST are reported using POST Err or Co d e s. These
codes represent specific failures, warnings, or informational messages. POST Error Codes may
be displayed in the Error Manager display screen, and are always logged to the System Event
Log (SEL). Logged events are available to System Management applications, including Remote
and Out of Band (OOB) management.
There are exception cases in early initialization where system resources are not adequately
initialized for handling POST Error Code reporting. These cases are primarily Fatal Error
condition resulting from initialization of processors and memory, and they are handed by a
Diagnostic LED display with a system halt.
The following table lists the supported POST Error Codes. Each error code is assigned an error
type which determines the action the BIOS will take when the error is encountered. Error types
include Minor, Major, and Fatal. The BIOS action for each is defined as follows:
Minor: The error message is displayed on the screen or on the Error Manager screen,
and an error is logged to the SEL. The system continues booting in a degraded state.
The user may want to replace the erroneous unit. The POST Error Pause option setting
in the BIOS setup does not have any effect on this error.
Major: The error message is displayed on the Error Manager screen, and an error is
logged to the SEL. The POST Error Pause option setting in the BIOS setup determines
whether the system pauses to the Error Manager for this type of error so the user can
take immediate corrective action or the system continues booting.
Note that for 0048 “Password check failed”, the system halts, and then after the next
reset/reboot will displays the error code on the Error Manager screen.
Fatal: The system halts during post at a blank screen with the text “Unrecoverable
fatal error found. System will not boot until the error is resolved” and “Press <F2>
to enter setup” The POST Error Pause option setting in the BIOS setup does not have
any effect with this class of error.
When the operator presses the F2 key on the keyboard, the error message is displayed
on the Error Manager screen, and an error is logged to the SEL with the error code. The
system cannot boot unless the error is resolved. The user needs to replace the faulty
part and restart the system.
Note: The POST error codes in the following table are common to all current generation Intel®
server platforms. Features present on a given server board/system will determine which of the
listed error codes are supported.
Table 79. POST Error Codes and Messages
Error Code Error Message Response
0012 System RTC date/time not set Major
0048 Password check failed Major
0140 PCI component encountered a PERR error Major
0141 PCI resource conflict Major
0146 PCI out of resources error Major
0191 Processor core/thread count mismatch detected Fatal
Appendix G: POST Code Errors Intel® Server Board S2600CO Family TPS
Revision 1.4
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146
Error Code Error Message Response
0192 Processor cache size mismatch detected Fatal
0194 Processor family mismatch detected Fatal
0195 Processor Intel
®
QPI link frequencies unable to synchronize Fatal
0196 Processor model mismatch detected Fatal
0197 Processor frequencies unable to synchronize Fatal
5220 BIOS Settings reset to default settings Major
5221 Passwords cleared by jumper Major
5224 Password clear jumper is Set Major
8130 Processor 01 disabled Major
8131 Processor 02 disabled Major
8132 Processor 03 disabled Major
8133 Processor 04 disabled Major
8160 Processor 01 unable to apply microcode update Major
8161 Processor 02 unable to apply microcode update Major
8162 Processor 03 unable to apply microcode update Major
8163 Processor 04 unable to apply microcode update Major
8170 Processor 01 failed Self Test (BIST) Major
8171 Processor 02 failed Self Test (BIST) Major
8172 Processor 03 failed Self Test (BIST) Major
8173 Processor 04 failed Self Test (BIST) Major
8180 Processor 01 microcode update not found Minor
8181 Processor 02 microcode update not found Minor
8182 Processor 03 microcode update not found Minor
8183 Processor 04 microcode update not found Minor
8190 Watchdog timer failed on last boot Major
8198 OS boot watchdog timer failure Major
8300 Baseboard management controller failed self-test Major
8305 Hot Swap Controller failure Major
83A0 Management Engine (ME) failed Selftest Major
83A1 Management Engine (ME) Failed to respond. Major
84F2 Baseboard management controller failed to respond Major
84F3 Baseboard management controller in update mode Major
84F4 Sensor data record empty Major
84FF System event log full Minor
8500 Memory component could not be configured in the selected RAS mode Major
8501 DIMM Population Error Major
8520 DIMM_A1 failed test/initialization Major
8521 DIMM_A2 failed test/initialization Major
8522 DIMM_A3 failed test/initialization Major
8523 DIMM_B1 failed test/initialization Major
8524 DIMM_B2 failed test/initialization Major
8525 DIMM_B3 failed test/initialization Major
8526 DIMM_C1 failed test/initialization Major
8527 DIMM_C2 failed test/initialization Major
8528 DIMM_C3 failed test/initialization Major
8529 DIMM_D1 failed test/initialization Major
Intel® Server Board S2600CO Family TPS Appendix G: Post Code Errors
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Error Code Error Message Response
852A DIMM_D2 failed test/initialization Major
852B DIMM_D3 failed test/initialization Major
852C DIMM_E1 failed test/initialization Major
852D DIMM_E2 failed test/initialization Major
852E DIMM_E3 failed test/initialization Major
852F DIMM_F1 failed test/initialization Major
8530 DIMM_F2 failed test/initialization Major
8531 DIMM_F3 failed test/initialization Major
8532 DIMM_G1 failed test/initialization Major
8533 DIMM_G2 failed test/initialization Major
8534 DIMM_G3 failed test/initialization Major
8535 DIMM_H1 failed test/initialization Major
8536 DIMM_H2 failed test/initialization Major
8537 DIMM_H3 failed test/initialization Major
8538 DIMM_I1 failed test/initialization Major
8539 DIMM_I2 failed test/initialization Major
853A DIMM_I3 failed test/initialization Major
853B DIMM_J1 failed test/initialization Major
853C DIMM_J2 failed test/initialization Major
853D DIMM_J3 failed test/initialization Major
853E DIMM_K1 failed test/initialization Major
853F
(Go to
85C0)
DIMM_K2 failed test/initialization Major
8540 DIMM_A1 disabled Major
8541 DIMM_A2 disabled Major
8542 DIMM_A3 disabled Major
8543 DIMM_B1 disabled Major
8544 DIMM_B2 disabled Major
8545 DIMM_B3 disabled Major
8546 DIMM_C1 disabled Major
8547 DIMM_C2 disabled Major
8548 DIMM_C3 disabled Major
8549 DIMM_D1 disabled Major
854A DIMM_D2 disabled Major
854B DIMM_D3 disabled Major
854C DIMM_E1 disabled Major
854D DIMM_E2 disabled Major
854E DIMM_E3 disabled Major
854F DIMM_F1 disabled Major
8550 DIMM_F2 disabled Major
8551 DIMM_F3 disabled Major
8552 DIMM_G1 disabled Major
8553 DIMM_G2 disabled Major
8554 DIMM_G3 disabled Major
8555 DIMM_H1 disabled Major
8556 DIMM_H2 disabled Major
Appendix G: POST Code Errors Intel® Server Board S2600CO Family TPS
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Error Code Error Message Response
8557 DIMM_H3 disabled Major
8558 DIMM_I1 disabled Major
8559 DIMM_I2 disabled Major
855A DIMM_I3 disabled Major
855B DIMM_J1 disabled Major
855C DIMM_J2 disabled Major
855D DIMM_J3 disabled Major
855E DIMM_K1 disabled Major
855F
(Go to
85D0)
DIMM_K2 disabled Major
8560 DIMM_A1 encountered a Serial Presence Detection (SPD) failure Major
8561 DIMM_A2 encountered a Serial Presence Detection (SPD) failure Major
8562 DIMM_A3 encountered a Serial Presence Detection (SPD) failure Major
8563 DIMM_B1 encountered a Serial Presence Detection (SPD) failure Major
8564 DIMM_B2 encountered a Serial Presence Detection (SPD) failure Major
8565 DIMM_B3 encountered a Serial Presence Detection (SPD) failure Major
8566 DIMM_C1 encountered a Serial Presence Detection (SPD) failure Major
8567 DIMM_C2 encountered a Serial Presence Detection (SPD) failure Major
8568 DIMM_C3 encountered a Serial Presence Detection (SPD) failure Major
8569 DIMM_D1 encountered a Serial Presence Detection (SPD) failure Major
856A DIMM_D2 encountered a Serial Presence Detection (SPD) failure Major
856B DIMM_D3 encountered a Serial Presence Detection (SPD) failure Major
856C DIMM_E1 encountered a Serial Presence Detection (SPD) failure Major
856D DIMM_E2 encountered a Serial Presence Detection (SPD) failure Major
856E DIMM_E3 encountered a Serial Presence Detection (SPD) failure Major
856F DIMM_F1 encountered a Serial Presence Detection (SPD) failure Major
8570 DIMM_F2 encountered a Serial Presence Detection (SPD) failure Major
8571 DIMM_F3 encountered a Serial Presence Detection (SPD) failure Major
8572 DIMM_G1 encountered a Serial Presence Detection (SPD) failure Major
8573 DIMM_G2 encountered a Serial Presence Detection (SPD) failure Major
8574 DIMM_G3 encountered a Serial Presence Detection (SPD) failure Major
8575 DIMM_H1 encountered a Serial Presence Detection (SPD) failure Major
8576 DIMM_H2 encountered a Serial Presence Detection (SPD) failure Major
8577 DIMM_H3 encountered a Serial Presence Detection (SPD) failure Major
8578 DIMM_I1 encountered a Serial Presence Detection (SPD) failure Major
8579 DIMM_I2 encountered a Serial Presence Detection (SPD) failure Major
857A DIMM_I3 encountered a Serial Presence Detection (SPD) failure Major
857B DIMM_J1 encountered a Serial Presence Detection (SPD) failure Major
857C DIMM_J2 encountered a Serial Presence Detection (SPD) failure Major
857D DIMM_J3 encountered a Serial Presence Detection (SPD) failure Major
857E DIMM_K1 encountered a Serial Presence Detection (SPD) failure Major
857F
(Go to
85E0)
DIMM_K2 encountered a Serial Presence Detection (SPD) failure Major
85C0 DIMM_K3 failed test/initialization Major
85C1 DIMM_L1 failed test/initialization Major
Intel® Server Board S2600CO Family TPS Appendix G: Post Code Errors
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Error Code Error Message Response
85C2 DIMM_L2 failed test/initialization Major
85C3 DIMM_L3 failed test/initialization Major
85C4 DIMM_M1 failed test/initialization Major
85C5 DIMM_M2 failed test/initialization Major
85C6 DIMM_M3 failed test/initialization Major
85C7 DIMM_N1 failed test/initialization Major
85C8 DIMM_N2 failed test/initialization Major
85C9 DIMM_N3 failed test/initialization Major
85CA DIMM_O1 failed test/initialization Major
85CB DIMM_O2 failed test/initialization Major
85CC DIMM_O3 failed test/initialization Major
85CD DIMM_P1 failed test/initialization Major
85CE DIMM_P2 failed test/initialization Major
85CF DIMM_P3 failed test/initialization Major
85D0 DIMM_K3 disabled Major
85D1 DIMM_L1 disabled Major
85D2 DIMM_L2 disabled Major
85D3 DIMM_L3 disabled Major
85D4 DIMM_M1 disabled Major
85D5 DIMM_M2 disabled Major
85D6 DIMM_M3 disabled Major
85D7 DIMM_N1 disabled Major
85D8 DIMM_N2 disabled Major
85D9 DIMM_N3 disabled Major
85DA DIMM_O1 disabled Major
85DB DIMM_O2 disabled Major
85DC DIMM_O3 disabled Major
85DD DIMM_P1 disabled Major
85DE DIMM_P2 disabled Major
85DF DIMM_P3 disabled Major
85E0 DIMM_K3 encountered a Serial Presence Detection (SPD) failure Major
85E1 DIMM_L1 encountered a Serial Presence Detection (SPD) failure Major
85E2 DIMM_L2 encountered a Serial Presence Detection (SPD) failure Major
85E3 DIMM_L3 encountered a Serial Presence Detection (SPD) failure Major
85E4 DIMM_M1 encountered a Serial Presence Detection (SPD) failure Major
85E5 DIMM_M2 encountered a Serial Presence Detection (SPD) failure Major
85E6 DIMM_M3 encountered a Serial Presence Detection (SPD) failure Major
85E7 DIMM_N1 encountered a Serial Presence Detection (SPD) failure Major
85E8 DIMM_N2 encountered a Serial Presence Detection (SPD) failure Major
85E9 DIMM_N3 encountered a Serial Presence Detection (SPD) failure Major
85EA DIMM_O1 encountered a Serial Presence Detection (SPD) failure Major
85EB DIMM_O2 encountered a Serial Presence Detection (SPD) failure Major
85EC DIMM_O3 encountered a Serial Presence Detection (SPD) failure Major
85ED DIMM_P1 encountered a Serial Presence Detection (SPD) failure Major
85EE DIMM_P2 encountered a Serial Presence Detection (SPD) failure Major
85EF DIMM_P3 encountered a Serial Presence Detection (SPD) failure Major
Appendix G: POST Code Errors Intel® Server Board S2600CO Family TPS
Revision 1.4
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Error Code Error Message Response
8604 POST Reclaim of non-critical NVRAM variables Minor
8605 BIOS Settings are corrupted Major
8606 NVRAM variable space was corrupted and has been reinitialized Major
92A3 Serial port component was not detected Major
92A9 Serial port component encountered a resource conflict error Major
A000 TPM device not detected. Minor
A001 TPM device missing or not responding. Minor
A002 TPM device failure. Minor
A003 TPM device failed self test. Minor
A100 BIOS ACM Error Major
A421 PCI component encountered a SERR error Fatal
A5A0 PCI Express component encountered a PERR error Minor
A5A1 PCI Express component encountered an SERR error Fatal
A6A0 DXE Boot Service driver: Not enough memory available to shadow a Legacy
Option ROM
Minor
POST Error Beep Codes
The following table lists the POST error beep codes. Prior to system video initialization, the
BIOS uses these beep codes to inform users on error conditions. The beep code is followed by
a user-visible code on the POST Progress LEDs.
Table 80. POST Error Beep Codes
Beeps Error Message POST Progress Code Description
1 USB device action NA Short beep sounded whenever a USB device is discovered
in POST, or inserted or removed during runtime
1 long Intel
®
TXT security
violation
0xAE, 0xAF System halted because Intel
®
Trusted Execution
Technology detected a potential violation of system
security.
3 Memory error Multiple System halted because a fatal error related to the memory
was detected.
The following Beep Codes are sounded during BIOS Recovery.
2 BIOS Recovery
started
NA Recovery boot has been initiated
4 BIOS Recovery
failure
NA BIOS recovery has failed. This typically happens so quickly
after recovery us initiated that it sounds like a 2-4 beep
code.
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes
are sounded each time the problem is discovered, such as on each power-up attempt, but are
not sounded continuously. Codes that are common across all Intel® server boards and systems
that use same generation chipset are listed in the following table. Each digit in the code is
represented by a sequence of beeps whose count is equal to the digit.
Intel® Server Board S2600CO Family TPS Appendix G: Post Code Errors
Revision 1.4
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Table 81. Integrated BMC Beep Codes
Code Reason for Beep Associated Sensors
1-5-2-1 CPU socket population error CPU1 socket is empty, or sockets are populated
incorrectly
CPU1 must be populated before CPU2.
1-5-2-4 MSID Mismatch MSID mismatch occurs if a processor is installed
into a system board that has incompatible power
capabilities.
1-5-4-2 Power fault DC power unexpectedly lost (power good dropout)
– Power unit sensors report power unit failure
offset
1-5-4-4 Power control fault Power good assertion timeout – Power unit
sensors report soft power control failure offset
1-5-1-2 VR Watchdog Timer VR controller DC power on sequence was not
completed in time.
1-5-1-4 Power Supply Status The system does not power on or unexpectedly
powers off and a Power Supply Unit (PSU) is
present that is an incompatible model with one or
more other PSUs in the system.
Glossary Intel® Server Board S2600CO Family TPS
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Glossary
This appendix contains important terms used in the preceding chapters. For ease of use,
numeric entries are listed first (for example, 82460GX) with alpha entries following (for example,
AGP 4x). Acronyms are then entered in their respective place, with non-acronyms following.
Term Definition
ACPI Advanced Configuration and Power Interface
AP Application Processor
APIC Advanced Programmable Interrupt Control
ASIC Application Specific Integrated Circuit
BIOS Basic Input/Output System
BIST Built-In Self Test
BMC Baseboard Management Controller
Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other
BSP Bootstrap Processor
byte 8-bit quantity.
CBC Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK Common Enabling Kit
CHAP Challenge Handshake Authentication Protocol
CMOS In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
DPC Direct Platform Control
EEPROM Electrically Erasable Programmable Read-Only Memory
EHCI Enhanced Host Controller Interface
EMP Emergency Management Port
EPS External Product Specification
FMB Flexible Mother Board
FMC Flex Management Connector
FMM Flex Management Module
FRB Fault Resilient Booting
FRU Field Replaceable Unit
FSB Front Side Bus
GB 1024MB
GPIO General Purpose I/O
GTL Gunning Transceiver Logic
HSC Hot-Swap Controller
Hz Hertz (1 cycle/second)
I
2
C Inter-Integrated Circuit Bus
IA Intel
®
Architecture
IBF Input Buffer
ICH I/O Controller Hub
ICMB Intelligent Chassis Management Bus
IERR Internal Error
IFB I/O and Firmware Bridge
Intel® Server Board S2600CO Family TPS Glossary
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Term Definition
INTR Interrupt
IP Internet Protocol
IPMB Intelligent Platform Management Bus
IPMI Intelligent Platform Management Interface
IR Infrared
ITP In-Target Probe
KB 1024 bytes
KCS Keyboard Controller Style
LAN Local Area Network
LCD Liquid Crystal Display
LED Light Emitting Diode
LPC Low Pin Count
LUN Logical Unit Number
MAC Media Access Control
MB 1024KB
mBMC National Semiconductor* PC87431x mini BMC
MCH Memory Controller Hub
MD2 Message Digest 2 – Hashing Algorithm
MD5 Message Digest 5 – Hashing Algorithm – Higher Security
ms milliseconds
MTTR Memory Tpe Range Register
Mux Multiplexor
NIC Network Interface Controller
NMI Nonmaskable Interrupt
OBF Output Buffer
OEM Original Equipment Manufacturer
Ohm Unit of electrical resistance
PEF Platform Event Filtering
PEP Platform Event Paging
PIA Platform Information Area (This feature configures the firmware for the platform hardware)
PLD Programmable Logic Device
PMI Platform Management Interrupt
POST Power-On Self Test
PSMI Power Supply Management Interface
PWM Pulse-Width Modulation
RAM Random Access Memory
RASUM Reliability, Availability, Serviceability, Usability, and Manageability
RISC Reduced Instruction Set Computing
ROM Read Only Memory
RTC Real-Time Clock (Component of ICH peripheral chip on the server board)
SDR Sensor Data Record
SECC Single Edge Connector Cartridge
SEEPROM Serial Electrically Erasable Programmable Read-Only Memory
SEL System Event Log
SIO Server Input/Output
Glossary Intel® Server Board S2600CO Family TPS
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Term Definition
SMI Server Management Interrupt (SMI is the highest priority nonmaskable interrupt)
SMM Server Management Mode
SMS Server Management Software
SNMP Simple Network Management Protocol
TBD To Be Determined
TIM Thermal Interface Material
UART Universal Asynchronous Receiver/Transmitter
UDP User Datagram Protocol
UHCI Universal Host Controller Interface
UTC Universal time coordinare
VID Voltage Identification
VRD Voltage Regulator Down
Word 16-bit quantity
ZIF Zero Insertion Force
Intel® Server Board S2600CO Family TPS Reference Documents
Revision 1.4
Intel order number G42278-004
155
Reference Documents
1. Advanced Configuration and Power Interface Specification, Revision 3.0,
http://www.acpi.info/
2. Intelligent Platform Manage ment Bus Communications Protocol Specification, Version 1.0.
1998. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation, Dell* Computer
Corporation
3. Intelligent Platform Manage ment In terface Specification, Version 2.0. 2004. Intel Corporation,
Hewlett-Packard* Company, NEC* Corporation, Dell* Computer Corporation
4. Platform Support for Serial-over-LAN (SOL), TMode, and Terminal Mode External
Architecture Specification, Version 1.1, 02/01/02, Intel Corporation
5. Intel® Remote Management Module User’s Guide, Intel Corporation
6. Alert Standard Format (ASF) Specification, Version 2.0, 23 April 2003, © 2000-2003,
Distributed Management Task Force, Inc., http://www.dmtf.org
7. BIOS for EPSD Platforms Based on Intel® Xeon Processor E5-4600/2600/2400/1600
Product Families External Product Specification
8. EPSD Platforms Based On Intel Xeon® Processor E5 4600/2600/2400/1600 Product
Families BMC Core Firmware External Product Specification
9. Intel® Integrated RAID Module RMS25PB080, RMS25PB040, RMS25CB080, and
RMS25CB040 Hardware/Installation User Guide
10. Intel® Integrated RAID Module RMS25KB040, RMS25KB080, RMS25JB040, RMS25JB080
– Hardware/Installation User Guide
11. Intel Integrated RAID Module RMT3PB080 and RMT3CB080 – Hardware/Installation User
Guide
12. Intel® Server Chassis P4000M Family Technical Product Specification
13. Intel® Server Chassis P4000M Family Service Guide
14. Intel® Remote Management Module 4 Technical Product Specification
15. Intel® Remote Management Module 4 and Integrated BMC Web Console User’s Guide
