INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1009N-R07 1
CPC1009N
100V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1009N 4-Pin SOP (100/tube)
CPC1009NTR 4-Pin SOP (2000/reel)
Parameter Ratings Units
Load Voltage 100 VP
Load Current 150 mArms / mADC
On-Resistance (max) 8
Output Leakage, Off-State 20 nA
Applications
Features
Description
Ordering Information
Pin Configuration
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
• Extremely Low Output Leakage: 20nA
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
CPC1009N is a miniature low voltage, low
on-resistance, low off-state leakage, normally-open
(1-Form-A) solid state relay in a 4-pin SOP package.
The MOSFET switches and photovoltaic die use IXYS
Integrated Circuits' patented OptoMOS® architecture
to provide 1500 Vrms of input to output isolation. The
optically coupled output is controlled by a highly effi-
cient infrared LED.
The CPC1009N uses IXYS Integrated Circuits' state
of the art double-molded vertical construction to
produce one of the world’s smallest 4-pin relays,
which offers board space savings of 20% over the
competitor’s larger 4-pin SOP relay.
Approvals
Switching Characteristics
of Normally-Open Devices
1
23
4
+ Control
– Control
Load
Load
Form-A
IF
ILOAD
10%
90%
ton toff
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R07
CPC1009N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 170 mW
Total PowerDissipation 2400 mW
Isolation voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 150 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=150mA RON -58
Off-State Leakage Current VL=100VP , T=115ºC ILEAK - - 20 nA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --2
ms
Turn-Off toff - - 0.5
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -6-pF
Input Characteristics
Input Control Current to Activate IL=150mA IF- 0.87 2 mA
Input Control Current to Deactivate - IF0.3 0.86 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Input/Output Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1-pF
1 Load current derates linearly from 150mA @ 25oC to120mA @85oC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC1009N
www.ixysic.com 3
R07
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
PERFORMANCE DATA*
35
30
25
20
15
10
5
0
106 112 118 124109 115 121
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
35
30
25
20
15
10
5
0
4.40 4.80 5.20 5.604.60 5.00 5.40
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=150mA)
On-Resistance (:)
0.25 0.35 0.45 0.550.30 0.40 0.50
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=150mA)
0.21 0.23 0.25 0.270.260.240.22
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mA)
25
20
15
10
5
0
0.80 0.90 1.000.75 0.85 0.95 1.05
LED Current (mA)
Device Count (N)
Typical IF for Switch Operation
(N=50, IL=100mA)
25
20
15
10
5
0
0.75 0.85 0.950.70 0.80 0.90 1.00
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Forward Voltage Drop (V)
Temperature (ºC)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R07
CPC1009N
PERFORMANCE DATA*
Turn-On Time (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On Time vs. Temperature
(IL=100mA)
Temperature (ºC)
IF=5mA
IF=10mA
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IL=100mA)
Temperature (ºC)
IF=10mA
IF=5mA
Typical On-Resistance vs. Temperature
(IL=150mA)
-40 -20 0 20406080100
12
10
8
6
4
2
0
IF=10mA
IF=5mA
Instantaneous
IF=5mA
Steady State
Temperature (ºC)
On-Resistance (:)
Load Current (mA)
190
180
170
160
150
140
130
120
110
100
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
Typical Maximum Load Current
vs. Temperature
IF=10mA
IF=5mA
Blocking Voltage (VP)
-40
122
121
120
119
118
117
116
115
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-20
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0 20 40 60 80 100 120
Leakage (nA)
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=100VP)
Load Voltage (V)
0 25 50 75 100
Output Capacitnace (pF)
0
10
20
30
40
50
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz) Energy Rating Curve
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms 100ms 1s10ms 10s 100s
10Ps 100Ps
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current vs. Load Voltage
(IF=5mA)
Typical Turn-On Time
vs. LED Forward Current
(IL=120mA)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mA)
0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5 101520253035404550
LED Forward Current (mA)
Turn-Off Time (ms)
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
INTEGRATED CIRCUITS DIVISION
CPC1009N
www.ixysic.com 5
R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1009N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1009N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
For additional information please visit our website at: www.ixysic.com
CPC1009N
6
Specification: DS-CPC1009N-R07
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/1/2018
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
User Direction o
f
Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1009N
CPC1009NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
3.85
(0.152)
1.54
(0.061)
0.60
(0.024)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 ± 0.025
(0.015 ± 0.001)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(
0-0.004
)
0.481
(0.019)
0.203 ± 0.025
(0.008 ± 0.001)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
