BLF8G22LS-160BV Power LDMOS transistor Rev. 1 -- 25 June 2012 Product data sheet 1. Product profile 1.1 General description 160 W LDMOS power transistor with improved video bandwidth for base station applications at frequencies from 2000 MHz to 2200 MHz. Table 1. Typical performance Typical RF performance at Tcase = 25 C in a common source class-AB production test circuit. Test signal f (MHz) (mA) (V) (W) 2-carrier W-CDMA 2110 to 2170 1300 32 55 [1] IDq VDS PL(AV) D ACPR (dB) (%) (dBc) 18.0 32 31[1] Gp Test signal: 3GPP test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF; carrier spacing 5 MHz. 1.2 Features and benefits Excellent ruggedness High efficiency Low Rth providing excellent thermal stability Decoupling leads to enable improved video bandwidth (100 MHz typical) Lower output capacitance for improved performance in Doherty applications Designed for low memory effects providing excellent pre-distortability Internally matched for ease of use Integrated ESD protection Integrated current sense Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications RF power amplifier for W-CDMA base stations and multi carrier applications in the 2000 MHz to 2200 MHz frequency range BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description 1 drain 2 gate 3 source 4,5 video decoupling 6 sense gate 7 [1] Simplified outline 4 1 Graphic symbol 5 [1] 3 6 sense drain DDD 7 2 Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description BLF8G22LS-160BV - Version earless flanged LDMOST ceramic package; 6 leads SOT1120B 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS Min Max Unit drain-source voltage - 65 V VGS gate-source voltage 0.5 +13 V VGS(sense) sense gate-source voltage 0.5 +9 V Tstg storage temperature 65 +150 C Tj junction temperature - 200 C - 150 C Tcase [1] Conditions [1] case temperature Continuous use at maximum temperature will affect MTTF. 5. Recommended operating conditions Table 5. Operating conditions Symbol Parameter Conditions Tcase case temperature Min Typ Max Unit 40 - C +125 6. Thermal characteristics Table 6. BLF8G22LS-160BV Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case Tcase = 80 C; PL = 55 W 0.27 K/W All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 2 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 7. Characteristics Table 7. Characteristics Tj = 25 C; unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.16 mA Min Typ Max Unit 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 216 mA 1.5 1.9 2.3 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 4.5 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 40 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 450 nA gfs forward transconductance VDS = 10 V; ID = 10.8 A - 16 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 7.56 A - 0.06 - IDq quiescent drain current 1175 1300 1425 mA main transitor: VDS = 32 V sense transitor: IDS = 23.4 mA; VDS = 30.4 V 8. Test information Table 8. Application information Test signal: 2-carrier W-CDMA; PAR 8.4 dB at 0.01 % probability on CCDF; 3GPP test model 1; 64 DPCH; f1 = 2112.5 MHz; f2 = 2117.5 MHz; f3 = 2162.5 MHz; f4 = 2167.5 MHz; RF performance at VDS = 32 V; IDq = 1300 mA; Tcase = 25 C; unless otherwise specified; in a class-AB production test circuit. Symbol Parameter Conditions Min Typ Max Unit Gp power gain PL(AV) = 55 W 16.8 18.0 19.7 dB RLin input return loss PL(AV) = 55 W - 13 7 dB D drain efficiency PL(AV) = 55 W 29 32 - % ACPR5M adjacent channel power ratio (5 MHz) PL(AV) = 55 W - 31 28 dBc Table 9. Application information Mode of operation: 1-carrier W-CDMA; PAR 7.2 dB at 0.01 % probability on CCDF; 3GPP test model 1; 64 DPCH; f = 2167.5 MHz; RF performance at VDS = 32 V; IDq = 1300 mA; Tcase = 25 C; unless otherwise specified; in a class-AB production test circuit. Symbol Parameter Conditions Min Typ Max Unit PARO output peak-to-average ratio PL(AV) = 115 W; at 0.01 % probability on CCDF 3.9 4.3 - dB PL(M) peak output power 290 310 - W 8.1 Ruggedness in class-AB operation The BLF8G22LS-160BV is capable to withstand a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 32 V; IDq = 1300 mA; PL = 160 W; f = 2110 MHz. BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 3 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 8.2 Impedance information Table 10. Typical impedance IDq = 1300 mA; main transistor VDS = 32 V. f ZS[1] ZL[1] (MHz) () () 2110 2.2 j4.6 1.4 j2.8 2140 2.1 j4.5 1.4 j2.6 2170 2.1 j4.3 1.3 j2.4 [1] ZS and ZL defined in Figure 1. drain ZL gate ZS 001aaf059 Fig 1. Definition of transistor impedance 8.3 VBW in class-AB operation The BLF8G22LS-160BV shows 100 MHz (typical) video bandwidth in class-AB test circuit in 2.1 GHz band at 32 V and 1.3 A. BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 4 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 8.4 CW pulse *S G% DDD ' 5/LQ G% 3/ G%P VDS = 32 V; IDq = 1300 mA. DDD 3/ G%P VDS = 32 V; IDq = 1300 mA. (1) Gp at f = 2110 MHz (1) f = 2110 MHz (2) Gp at f = 2140 MHz (2) f = 2140 MHz (3) Gp at f = 2170 MHz (3) f = 2170 MHz (4) D at f = 2110 MHz (5) D at f = 2140 MHz (6) D at f = 2170 MHz Fig 2. Power gain and drain efficiency as function of load power; typical values BLF8G22LS-160BV Product data sheet Fig 3. Input return loss as a function of load power; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 5 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 8.5 2-carrier W-CDMA *S G% DDD 3/ G%P DDD $&350 G%F ' 3/ G%P VDS = 32 V; VGS = 32 V; f = 5 MHz; = 46 %. VDS = 32 V; IDq = 1300 mA. (1) Gp at f = 2115 MHz (1) ACPR5M at f = 2115 MHz (2) Gp at f = 2140 MHz (2) ACPR5M at f = 2140 MHz (3) Gp at f = 2165 MHz (3) ACPR5M at f = 2165 MHz (4) D at f = 2115 MHz (4) ACPR10M at f = 2115 MHz (5) D at f = 2140 MHz (5) ACPR10M at f = 2140 MHz (6) D at f = 2165 MHz (6) ACPR10M at f = 2165 MHz Fig 4. $&350 G%F Power gain and drain efficiency as function of load power; typical values 3$5 G% Fig 5. Adjacent channel power ratio (5MHz) and adjacent channel power ratio (10MHz) as function of load power; typical values DDD 3/ G%P VDS = 32 V; IDq = 1300 mA. (1) f = 2115 MHz (2) f = 2140 MHz (3) f = 2165 MHz Fig 6. Peak to average power ratio as a function of load power; typical values BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 6 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 8.6 2-tone VBW ,0' G%F DDD FDUULHUVSDFLQJ 0+] VDS = 32 V; IDq = 1300 mA; fc = 2140 MHz. (1) IMD3 low (2) IMD3 high (3) IMD5 low (4) IMD5 high (5) IMD7 low (6) IMD7 high Fig 7. BLF8G22LS-160BV Product data sheet VBW capability in class-AB test circuit All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 7 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 8.7 Test circuit 50 mm 50 mm R3 R5 C4 R2 C15 R4 C3 R1 C2 C5 C16 C17 C18 C10 C1 60 mm BLF8G22LS 160BV OUTPUT REV5 NXP C6 C12 C19 C11 C13 C14 BLF8G22LS 160BV INPUT REV5 aaa-004157 Printed-Circuit Board (PCB): Taconic RF35; r = 3.5; thickness = 0.765 mm; thickness copper plating = 35 m. See Table 11 for a list of components. Fig 8. Component layout for class-AB production test circuit Table 11. List of components For test circuit see [8]. Component BLF8G22LS-160BV Product data sheet Description Value Remarks C1, C2, C10, C11, C13, multilayer ceramic chip capacitor C15 12 pF [1] C5, C6 multilayer ceramic chip capacitor 120 pF [1] ATC100B C3, C4, C12, C16, C18, C19 multilayer ceramic chip capacitor 4.7 F, 50 V [2] Murata C14 multilayer ceramic chip capacitor 4.7 F, 100 V [3] TDK C15 electrolytic capacitor 470 F, 63 V R1 SMD resistor 4.7 Philips 1206 R2 SMD resistor 470 Philips 1206 ATC100B R3 SMD resistor 820 Philips 1206 R4 SMD resistor 12 Philips 1206 R5 SMD resistor 2200 Philips 1206 [1] American Technical Ceramics type 100B or capacitor of same quality. [2] Murata or capacitor of same quality. [3] TDK or capacitor of same quality. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 8 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 9. Package outline Earless flanged LDMOST ceramic package; 6 leads SOT1120B D A F 3 D1 L D c U1 1 4 5 y H Z2 U2 Z1 Z 6 E1 E 7 2 b1 b w2 0 Q D 5 10 mm scale Dimensions Unit(1) mm A max 4.75 nom min 3.45 b b1 1.83 12.83 c D D1 E E1 F H L 0.18 20.02 19.96 9.53 9.53 1.14 19.94 3.56 Q(2) U1 U2 w2 1.70 20.70 9.91 Z1 Z2 y Z 0.15 4.60 9.53 15.52 64 4.32 8.71 14.50 60 0.51 1.57 12.57 0.10 19.61 19.66 9.27 9.25 0.89 18.92 3.30 1.45 20.45 9.65 0.0059 0.181 0.375 0.611 64 max 0.187 0.072 0.505 0.007 0.788 0.786 0.375 0.375 0.045 0.785 0.140 0.067 0.815 0.39 0.02 inches nom 0.170 0.343 0.571 60 min 0.136 0.062 0.495 0.004 0.772 0.774 0.365 0.364 0.035 0.745 0.130 0.057 0.805 0.38 Note 1. millimeter dimensions are derived from the original inch dimensions. 2. dimension is measured 0.030 inch (0.76 mm) from the body. Outline version References IEC JEDEC JEITA Issue date 12-04-11 12-06-14 SOT1120B Fig 9. sot1120b_po European projection Package outline SOT1120B BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 9 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 10. Abbreviations Table 12. Abbreviations Acronym Description 3GPP Third Generation Partnership Project CCDF Complementary Cumulative Distribution Function DPCH Dedicated Physical CHannel ESD ElectroStatic Discharge LDMOS Laterally Diffused Metal Oxide Semiconductor LDMOST Laterally Diffused Metal Oxide Semiconductor Transistor MTTF Mean Time To Failure PAR Peak-to-Average Ratio SMD Surface Mounted Device VBW Video BandWidth VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code Division Multiple Access 11. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes BLF8G22LS-160BV v.1 20120625 Product data sheet - - BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 10 of 13 BLF8G22LS-160BV NXP Semiconductors Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". 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BLF8G22LS-160BV Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. 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The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BLF8G22LS-160BV Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 -- 25 June 2012 (c) NXP B.V. 2012. All rights reserved. 12 of 13 NXP Semiconductors BLF8G22LS-160BV Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Recommended operating conditions. . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ruggedness in class-AB operation . . . . . . . . . 4 Impedance information . . . . . . . . . . . . . . . . . . . 4 VBW in class-AB operation . . . . . . . . . . . . . . . 4 CW pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2-carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 6 2-tone VBW . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 June 2012 Document identifier: BLF8G22LS-160BV