BC68-25PA,115 - NXP Semiconductors

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1. Product profile

1.1 General description

NPN medium power tran sistor series in Surface-Mo unted Device (SMD) plastic p ackages.

[1] Valid for all available selection groups.

1.2 Features and benefits

High current

Two curren t gai n sele ct ion s

High power dissipation capability

Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)

Leadless very small SMD plas tic package with medium power capability (SOT1061)

AEC-Q101 qualified

1.3 Applications

1.4 Quick reference data

BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

Rev. 8 — 18 October 2011 Product data sheet

Table 1. Product overview

Type number[1] Package PNP complement

NXP JEITA JEDEC

BCP68 SOT223 SC-73 - BCP69

BC868 SOT89 SC-62 TO-243 BC869

BC68PA SOT1061 - - BC69PA

Linear voltage regulators Power management

Low-side switches MOSFET drivers

Battery-driven devices Amplifiers

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCEO collector-emitter voltage open base - - 20 V

ICcollector current - - 2 A

ICM peak collector current single pulse; tp1ms - - 3 A

Product data sheet Rev. 8 — 18 October 2011 2 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

[1] Pulse test: tp300 s; = 0.02.

2. Pinning information

hFE DC current gain VCE =1V; I

C=500mA [1] 85 - 375

hFE selection -25 VCE =1V; I

C=500mA [1] 160 - 375

Table 2. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

SOT223

1base

2 collector

3emitter

4 collector

SOT89

1emitter

2 collector

3base

SOT1061

1base

2emitter

3 collector

132

sym016

2, 4

321

sym042

Transparent top view

sym021

Product data sheet Rev. 8 — 18 October 2011 3 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

3. Ordering information

[1] Valid for all available selection groups.

4. Marking

Tabl e 4. Ordering information

Type number[1] Package

Name Description Version

BCP68 SC-73 plastic surface-mounted package with increased

heatsink; 4 leads SOT223

BC868 SC-62 plastic surface-mounted package; exposed die pad for

good heat transfer; 3 leads SOT89

BC68PA HUSON3 plastic thermal enhanced ultra thin small outline

package; no leads; 3 terminals; body 2 20.65 mm SOT1061

Table 5. Marking codes

Type number Marking code

BCP68 BCP68

BCP68-25 BCP68/25

BC868 CAC

BC868-25 CDC

BC68PA AR

BC68-25PA AS

BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011  4 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
5. Limiting values
 
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard 
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 32 V
VCEO collector-emitter voltage open base - 20 V
VEBO emitter-base voltage open collector - 5 V
ICcollector current - 2 A
ICM peak collector current single pulse; 
tp1ms -3A
IBbase current - 0.4 A
IBM peak base current single pulse; 
tp1ms -0.4A
Ptot total power dissipation Tamb 25 C
BCP68 [1] -0.65W
[2] -1.00W
[3] -1.35W
BC868 [1] -0.50W
[2] -0.95W
[3] -1.35W
BC68PA [1] -0.42W
[2] -0.83W
[3] -1.10W
[4] -0.81W
[5] -1.65W
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C

Product data sheet Rev. 8 — 18 October 2011 5 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

(1) FR4 PCB, mounting pad for collector 6 cm2

(2) FR4 PCB, mounting pad for collector 1 cm2

(3) FR4 PCB, standard footprint

(1) FR4 PCB, mounting pad for collector 6 cm2

(2) FR4 PCB, mounting pad for collector 1 cm2

(3) FR4 PCB, standard footprint

Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89

(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2

(2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2

(3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2

(4) FR4 PCB, 4-layer copper, standard footprint

(5) FR4 PCB, single-sided copper, standard footprint

Fig 3. Power derating curves S OT 10 6 1

Tamb (°C)

–75 17512525 75–25

006aac674

0.5

1.0

1.5

Ptot

(W)

0.0

(1)

(2)

(3)

Tamb (°C)

–75 17512525 75–25

006aac675

0.5

1.0

1.5

Ptot

(W)

0.0

(1)

(2)

(3)

Tamb (°C)

–75 17512525 75–25

006aac676

1.0

0.5

1.5

2.0

Ptot

(W)

0.0

(1)

(2)

(3)

(4)

(5)

BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011  6 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
6. Thermal characteristics
 
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from 
junction to ambient in free air
BCP68 [1] --192K/W
[2] --125K/W
[3] --93K/W
BC868 [1] --250K/W
[2] --132K/W
[3] --93K/W
BC68PA [1] --298K/W
[2] --151K/W
[3] --114K/W
[4] --154K/W
[5] --76K/W
Rth(j-sp) thermal resistance from 
junction to solder poi nt
BCP68 - - 16 K/W
BC868 - - 16 K/W
BC68PA - - 20 K/W

Product data sheet Rev. 8 — 18 October 2011 7 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, standard footprint

Fig 4. Transient thermal impedance from junc tio n to ambient as a function of pulse duration for SO T223;

typical values

FR4 PCB, mounting pad for collector 1 cm2

Fig 5. Transient thermal impedance from junc tio n to ambient as a function of pulse duration for SO T223;

typical values

006aac677

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.02

0.05 0.1

0.2 0.33

0.5 0.75

006aac678

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.02

0.05 0.1

0.2 0.33

0.5 0.75

Product data sheet Rev. 8 — 18 October 2011 8 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, mounting pad for collector 6 cm2

Fig 6. Transient thermal impedance from junc tio n to ambient as a function of pulse duration for SO T223;

typical values

FR4 PCB, standard footprint

Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;

typical values

006aac679

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.02

0.05 0.1

0.2 0.33

0.5 0.75

006aac680

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.02

0.05 0.1

0.2 0.33

0.5 0.75

Product data sheet Rev. 8 — 18 October 2011 9 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, mounting pad for collector 1 cm2

Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;

typical values

FR4 PCB, mounting pad for collector 6 cm2

Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;

typical values

006aac681

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.02

0.05 0.1

0.2 0.33

0.5 0.75

006aac682

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1

0.2 0.33

0.5 0.75

0.02

Product data sheet Rev. 8 — 18 October 2011 10 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, single-sided copper, standard footprint

Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;

typical values

FR4 PCB, single-sided copper, mounting pad for collector 1 cm2

Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;

typical values

006aac683

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1 0.2

0.33

0.5 0.75

0.02

0.25

006aac684

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1 0.2

0.33

0.5 0.75

0.02

0.25

Product data sheet Rev. 8 — 18 October 2011 11 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, single-sided copper, mounting pad for collector 6 cm2

Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;

typical values

FR4 PCB, 4-layer copper, standard footprint

Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;

typical values

006aac685

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1 0.2

0.33

0.5 0.75

0.02

0.25

006aac686

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1 0.2

0.33

0.5 0.75

0.02

0.25

Product data sheet Rev. 8 — 18 October 2011 12 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2

Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;

typical values

006aac687

102

103

Zth(j-a)

(K/W)

10–1

10–5 1010–2

10–4 102

10–1 tp (s)

10–3 103

duty cycle = 1

0.01

0.05

0.1 0.2

0.33

0.5 0.75

0.02

0.25

Product data sheet Rev. 8 — 18 October 2011 13 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

7. Characteristics

[1] Pulse test: tp300 s; = 0.02.

Table 8. Characteristics

Tamb =25



C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

ICBO collector-base cut-off

current VCB =25V; I

E= 0 A - - 100 nA

VCB =25V; I

E=0A;

Tj= 150 C--10A

IEBO emitter-base cut-of f

current VEB =5V; I

C= 0 A - - 100 nA

hFE DC current gain VCE =10V

IC=5mA 50 - -

DC curren t ga in VCE =1V

IC=500mA [1] 85 - 375

IC=1 A [1] 60 - -

IC=2 A [1] 40 - -

DC curren t ga in VCE =1V

hFE selection -25 IC=500mA [1] 160 - 375

VCEsat collector-emitter

saturation voltage IC=1A; I

B= 100 mA [1] --0.5V

IC=2A; I

B= 200 mA [1] --0.6V

VBE base-emitter vo ltage VCE =10V; I

C=5mA [1] --0.7V

VCE =1V; I

C=1A [1] --1V

Cccollector capacitance VCB =10V; I

E=i

e=0A;

f=1MHz -22-pF

fTtransition frequency VCE =5V; I

C=50mA;

f=100MHz 40 170 - MHz

Product data sheet Rev. 8 — 18 October 2011 14 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

VCE =1V

(1) Tamb = 100 C

(2) Tamb =25C

(3) Tamb =55 C

Tamb =25C

Fig 15. DC current gain as a function of collector

current; typical values Fig 16. Collector current as a function of

collector-emitter voltage; typical values

VCE =1V

(1) Tamb =55 C

(2) Tamb =25C

(3) Tamb = 100 C

IC/IB=10

(1) Tamb = 100 C

(2) Tamb =25C

(3) Tamb =55 C

Fig 17. Ba se-emitter voltage as a function of collector

current; typical values Fig 18. Collector- em itter saturatio n voltage as a

function of collector current; typical values

006aac694

200

100

300

400

hFE

IC (A)

10–4 10110–3 10–1

10–2

(1)

(2)

(3)

VCE (V)

054231

006aac710

0.8

1.6

2.4

(A)

0.0

IB (mA) = 10

006aac695

0.4

0.8

1.2

VBE

(V)

IC (A)

10–1 104

103

110

(1)

(2)

(3)

006aac696

10–1

10–2

VCEsat

(V)

10–3

IC (mA)

10–1 104

103

110

(1)

(2)

(3)

Product data sheet Rev. 8 — 18 October 2011 15 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

9. Package outline

Fig 19. Package outline SOT223 (SC-73)

Fig 20. Package outline SOT89 (SC-62/TO-243)

04-11-10Dimensions in mm

6.7

6.3

3.1

2.9

1.8

1.5

7.3

6.7 3.7

3.3

1.1

0.7

132

4.6

2.3 0.8

0.6 0.32

0.22

06-08-29Dimensions in mm

4.6

4.4

1.8

1.4

1.6

1.4

1.2

0.8

1.5 0.48

0.35 0.44

0.23

0.53

0.40

2.6

2.4 4.25

3.75

123

Product data sheet Rev. 8 — 18 October 2011 16 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

[2] Valid for all available selection groups.

[3] T1: normal taping

[4] T3: 90 rotated taping

Fig 21. Package outline SOT1061 (HUSON3)

09-11-12Dimensions in mm

0.65

max

2.1

1.9

1.6

1.4

0.35

0.25 0.45

0.35

2.1

1.9

1.1

0.9

0.3

0.2

1.05

0.95

1.3

Table 9. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type

number[2] Package Description Packing quantity

1000 3000 4000

BCP68 SOT223 8 mm pitch, 12 mm tape and reel -115 - -135

BC868 SOT89 8 mm pitch, 12 mm tape and reel; T1 [3] -115 - -135

8 mm pitch, 12 mm tape and reel; T3 [4] -146 - -

BC68PA SOT1061 4 mm pitch, 8 mm tape and reel - -115 -

Product data sheet Rev. 8 — 18 October 2011 17 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

11. Soldering

Fig 22. Reflow soldering footprint SOT223 (SC-73)

Fig 23. Wave soldering footprint SOT223 (SC-73)

sot223_fr

1.2

(4×)

1.2

(3×)

1.3

(4×)

1.3

(3×)

6.15

3.85

3.6

3.5

0.3

3.9 7.65

2.3 2.3

6.1

231

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sot223_fw

1.9

6.7

8.9

8.7

1.9

(3×)

1.9

(2×)

1.1

6.2

2.7 2.7

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 8 — 18 October 2011 18 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)

Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)

solder lands

solder resist

occupied area

solder paste

sot089_fr

1.2

1.9

2.25

4.75

(3×)

0.7

(3×)

0.6

(3×)

1.1

(2×)

1.2

0.85 0.2

0.5

1.7

4.85

3.95

4.6

1.51.5

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot089_fw

0.7

5.3

6.6

2.4

3.5

0.5

1.8

(2×)

1.5

(2×)

7.6

1.9 1.9

Dimensions in mm

Product data sheet Rev. 8 — 18 October 2011 19 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

Reflow soldering is the only recommended soldering method.

Fig 26. Reflow soldering footprint SOT1061 (HUSON3)

occupied area

solder paste = solder lands Dimensions in mm

sot1061_fr

solder resist

0.4

2.1

1.3

0.25

0.25 0.25

1.1 1.2

0.55

0.6

2.3

0.5 (2×)

0.5 (2×) 0.6 (2×)

0.4 (2×)

0.5

1.6

1.7

1.05

BCP68_BC868_BC68PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 18 October 2011  20 of 23
NXP Semiconductors BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
12. Revision history
 
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BCP68_BC868_BC68PA v.8 20111018 Product data sheet - BC868 v.7
BCP68 v.4
Modifications: •The format of this document has been redesigned to comply with the new identity 
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Type number BC68PA added
•Section 1 “Product profile”: updated
•Section 2 “Pinning informa tion”: updated
•Section 3 “Ordering information”: updated
•Section 4 “Marking”: updated
•Section 8 “Test information”: added
•Section 9 “Package outline”: updated
•Section 10 “Packing information”: added
•Section 11 “Soldering”: added
•Table 6, 7 and 8: updated according to latest measurements
•Figure 1, 2, 6, 8, 15 to 18: updated
•Figure 3, 4, 5, 7, 9, 10 to 13: added
BC868 v.7 20041108 Product specification - BC868 v.6
BC868 v.6 200312 02 Product specification - BC868 v.5
BC868 v.5 199904 08 Product specification - BC868 v.4
BC868 v.4 19980716 Product specification - BC868_CNV v.3
BC868_CNV v.3 19970319 Product specification - BC868_CNV v.2
BC868_CNV v. 2 199703 07 Product specification - -
BCP68 v. 4 20031125 Product specification - BCP68 v.3
BCP68 v. 3 19990408 Product specification - BCP68_CNV v. 2
BCP68_CNV v.2 19970409 Product specification - -

Product data sheet Rev. 8 — 18 October 2011 21 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyri ghts, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from competent authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objecti ve specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 8 — 18 October 2011 22 of 23

NXP Semiconductors BCP68; BC868; BC68PA

20 V, 2 A NPN medium power transistors

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristi cs sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BCP68; BC868; BC68PA
V, 2 A NPN medium power transistors
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 18 October 2011
Document identifier: BCP68_BC868_BC68PA
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’. 
Contents
Product profile. . . . . . . . . . . . . . . . . . . . . . . . . .  1
1  General description  . . . . . . . . . . . . . . . . . . . . .  1
2  Features and benefits. . . . . . . . . . . . . . . . . . . .  1
3  Applications  . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
4  Quick reference data  . . . . . . . . . . . . . . . . . . . .  1
Pinning information. . . . . . . . . . . . . . . . . . . . . .  2
Ordering information. . . . . . . . . . . . . . . . . . . . .  3
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  4
Thermal characteristics  . . . . . . . . . . . . . . . . . .  6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . .  13
Test information. . . . . . . . . . . . . . . . . . . . . . . .  15
1  Quality information . . . . . . . . . . . . . . . . . . . . .  15
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  15
Packing information  . . . . . . . . . . . . . . . . . . . .  16
Soldering  . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  20
Legal information. . . . . . . . . . . . . . . . . . . . . . .  21
1  Data sheet status . . . . . . . . . . . . . . . . . . . . . .  21
2  Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
3  Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .  21
4  Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .  22
Contact information. . . . . . . . . . . . . . . . . . . . .  22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  23

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