Data Sheet June 1998 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Features The FE050B, FE100B, and FE150B Power Modules use advanced, surface-mount technology and deliver high-quality, compact, dc-dc conversion at an economical price. Applications Redundant and distributed power architectures Telecommunications Options High efficiency: 86% typical Parallel operation with load sharing Low profile: 12.7 mm (0.5 in.) Complete input and output filtering Within FCC requirements for Telecom Constant frequency Case ground pin Input-to-output isolation Remote sense Remote on/off Short-circuit protection Output overvoltage clamp UL* Recognized, CSA Certified, TUV Licensed * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. TUV is a registered trademark of Technischer UberwachungsVerein. Output voltage set-point adjustment (trim) Description The FE050B, FE100B, and FE150B Power Modules are dc-dc converters that operate over an input voltage range of 38 Vdc to 60 Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs, allowing versatile polarity configurations and grounding connections. The modules have maximum power ratings from 50 W to 150 W at a typical full-load efficiency of 86%. Built-in filtering, for both the input and output of each device, eliminates the need for external filters. Two or more modules may be paralleled with forced load sharing for redundant or enhanced power applications. The package, which mounts on a printed-circuit board, accommodates a heat sink for high-temperature applications. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Input Voltage (continuous) I/O Isolation Voltage Operating Case Temperature (See Thermal Considerations section and Figure 18.) Storage Temperature Symbol VI -- TC Min -- -- 0 Max 60 500 90 Unit Vdc V C Tstg -55 125 C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Operating Input Voltage Maximum Input Current (VI = 0 V to 60 V): FE050B FE100B FE150B Inrush Transient Input Reflected-ripple Current, Peak-to-peak (5 Hz to 20 MHz, 12 H source impedance) (See Figure 9.) Input Ripple Rejection (120 Hz) Symbol VI Min 38 Typ 48 Max 60 Unit Vdc II, max II, max II, max i2t -- -- -- -- -- -- -- -- 2 4 6 1.0 A A A A2s -- -- 20 -- mAp-p -- -- 60 -- dB Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow, dc fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data for further information. 2 Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Electrical Specifications (continued) Table 2. Output Specifications Parameter Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life; see Figure 10 and Feature Descriptions.) Output Voltage Set Point (VI = 48 V; IO = IO, max; TC = 25 C): Unit Operating in Parallel or PARALLEL Pin Shorted to SENSE(-) (See Figure 10 and Feature Descriptions.) PARALLEL Pin Open Output Regulation: Line (VI = 36 V to 60 V) Load (IO = IO, min to IO, max) Temperature (TC = 0 C to 90 C) Output Ripple and Noise Voltage (See Figure 5 and Figure 11.): RMS Peak-to-peak (5 Hz to 20 MHz) Output Current (At IO < IO, min, the modules may exceed output ripple specifications.): FE050B FE100B FE150B Output Current-limit Inception (VO = 90% of VO, set; see Figure 2 and Feature Descriptions.) Output Short-circuit Current (VO = 250 mV; see Figure 2.) External Load Capacitance (electrolytic, total for one unit or multiple paralleled units): FE050B FE100B FE150B Efficiency (VI = 48 V; IO = IO, max; TC = 25 C; see Figure 3--Figure 9.): FE050B FE100B FE150B Dynamic Response (IO/t = 1 A/10 s, VI = 48 V, TC = 25 C; see Figure 6 and Figure 7.): Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Lucent Technologies Inc. Symbol VO Min 11.40 Typ -- Max 12.60 Unit Vdc VO, set 11.76 -- 12.24 Vdc VO, set 11.76 -- 12.48 Vdc -- -- -- -- -- -- 0.05 0.2 -- 0.2 0.4 120 % % mV -- -- -- -- -- -- 70 200 mVrms mVp-p IO IO IO -- 1 1 1 103 -- -- -- -- 4.2 8.3 12.5 130 A A A % IO, max -- -- 135 170 % IO, max -- -- -- 0 0 0 -- -- -- 400 400 400 F F F 84 85 85 85 86 86 -- -- -- % % % -- -- -- -- 350 300 -- -- mV s -- -- -- -- 350 300 -- -- mV s 3 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Electrical Specifications (continued) Table 3. Isolation Specifications Parameter Isolation Capacitance Isolation Resistance Min -- 10 Typ 1700 -- Max -- -- Unit pF M Min Typ 2,000,000 -- Max Unit hours g (oz.) General Specifications Parameter Calculated MTBF (IO = 80% of IO, max; TC = 40 C) Weight -- 200 (7) Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for further information. Parameter Remote On/Off Signal Interface (VI = 0 V to 60 V; open collector or equivalent compatible; signal referenced to VI (-) terminal; see Figure 12 and Feature Descriptions.): Logic Low--Module On Logic High--Module Off Logic Low: At Ion/off = 1.0 mA At Von/off = 0.0 V Logic High: At Ion/off = 0.0 A Leakage Current Turn-on Time (IO = 80% of IO, max; VO within 1% of steady state) Output Voltage Adjustment (See Feature Descriptions.): Output Voltage Remote-sense Range Output Voltage Set-point Adjustment Range (trim) Parallel Operation Load Sharing (See Feature Descriptions.) Output Overvoltage Clamp 4 Symbol Min Typ Max Unit Von/off Ion/off 0 -- -- -- 1.2 1.0 V mA Von/off Ion/off -- -- -- -- -- -- 5 18 50 10 V A ms -- -- -- -- 90 -- -- -- -- 1.2 110 20 V %VO, nom % IO, max VO, clamp 13.2 14.7 16.0 V Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Characteristic Curves The following figures provide typical characteristics for the FE150B Power Module. The FE050B and FE100B characteristics are similar to the FE150B characteristics provided here, scaled by power level where appropriate. 90 85 6 EFFICIENCY, (%) INPUT CURRENT, II (A) 5 IO = 12.5 A 4 3 2 1 20 30 40 50 60 VI = 48 V 70 VI = 60 V 65 60 50 0.0 0 10 VI = 38 V 75 55 IO = 6.25 A 0 80 70 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VI (V) 8-891 (C) 8-889 (C) Figure 1. Typical FE150B Input Characteristics at Room Temperature Figure 3. Typical FE050B Efficiency vs. Output Current at Room Temperature 88 86 EFFICIENCY, (%) OUTPUT VOLTAGE, VO (V) 14 12 10 8 6 84 VI = 38 V 82 80 VI = 49 V 78 VI = 60 V 76 74 72 4 70 2 0 1 2 3 4 5 6 7 8 9 10 11 12 OUTPUT CURRENT, IO (A) 0 0 2 4 6 8 10 12 14 16 18 8-892 (C) OUTPUT CURRENT, IO (A) 8-890 (C) Figure 4. Typical FE150B Efficiency vs. Output Current at Room Temperature Figure 2. Typical FE150B Output Characteristics at Room Temperature and 48 V Input Lucent Technologies Inc. 5 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Characteristic Curves (continued) 100 mV 50 s OUTPUT CURRENT, IO (A) (525 mA/div) OUTPUT RIPPLE (V) (20 mV/div) OUTPUT VOLTAGE, VO (V) (100 mV/div) 1 s 20 mV TIME, t (50 s/div) TIME, t (1 s/div) 8-895 (C) 8-893 (C) 50 s OUTPUT VOLTAGE, VO (V) (5 V/div) TIME, t (50 s/div) 1 ms TIME, t (1 ms/div) 8-894 (C) Figure 6. Typical FE150B Transient Response to Step Decrease in Load from 50% to 25% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) 6 Figure 7. Typical FE150B Transient Response to Step Increase in Load from 50% to 75% of Full Load at Room Temperature and 48 V Input (Waveform Averaged to Eliminate Ripple Component.) REMOTE ON/OFF PIN, Von/off (V) 100 mV OUTPUT CURRENT, IO (A) (525 mA/div) OUTPUT VOLTAGE, VO (V) (100 mV/div) Figure 5. Typical FE150B Output Ripple Voltage at Room Temperature, 48 V Input, and 12.5 A Output 8-896 (C) Figure 8. Typical FE150B Start-Up Transient at Room Temperature, 48 V Input, and 12.5 A Output Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Test Configurations Design Considerations Input Source Impedance TO OSCILLOSCOPE CURRENT PROBE LTEST V I (+) 12 H CS 220 F ESR < 0.1 33 F @ 20 C, 100 kHz ESR < 0.7 @ 100 kHz BATTERY V I (-) The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. For the test configuration in Figure 9, a 33 F electrolytic capacitor (ESR < 0.7 at 100 kHz) mounted close to the power module helps ensure stability of the unit. For other highly inductive source impedances, consult the factory for further application guidelines. 8-203 (C).l Note: Measure input reflected-ripple current with a simulated source inductance (LTEST) of 12 H. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 9. Input Reflected-Ripple Test Setup PARALLEL SENSE(+) II VI(+) VO(+) VI(-) VO(-) IO If the input meets extra-low voltage (ELV) requirements, then the converter's output is considered ELV. LOAD CONTACT AND DISTRIBUTION LOSSES CONTACT RESISTANCE For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL-1950, CSA 22.2-950, and EN60950. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. SENSE(-) SUPPLY Safety Considerations 8-683 (C) The input to these units is to be provided with a maximum 6 A normal-blow fuse in the ungrounded lead. Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. [VO(+) - VO(-)]IO = -------------------------------------------------- x 100 [VI(+) - VI(-)]II Figure 10. Output Voltage and Efficiency Measurement Test Setup COPPER STRIP V O (+) 0.1 F SCOPE RESISTIVE LOAD V O (-) 8-513 (C) Note: Use a 0.1 F ceramic capacitor. Scope measurement should be made using a BNC socket. Position the load between 50 mm (2 in.) and 76 mm (3 in.) from the module. Figure 11. Peak-to-Peak Output Noise Measurement Test Setup Lucent Technologies Inc. 7 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Electrical Descriptions Data Sheet June 1998 given in the Feature Specifications table, i.e.: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 1.2 V Current Limit To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for an unlimited duration. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the current-limit circuit can exhibit either foldback or tailout characteristics (output-current decrease or increase). The unit operates normally once the output current is brought back into its specified range. The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage clamp voltage as indicated in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim), see Figure 13. If not using the remote-sense feature to regulate the output at the point of load, connect SENSE(+) to VO(+) and SENSE(-) to VO(-) at the module. PARALLEL SENSE(+) Feature Descriptions SENSE(-) Remote On/Off SUPPLY To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(-) terminal (Von/off). The switch can be an open collector or equivalent (see Figure 12). A logic low is Von/off = 0 V to 1.2 V, during which the module is on. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 A. If not using the remote on/off feature, short the ON/OFF pin to VI(-). SENSE(+) ON/OFF + Von/off - VO(-) IO CONTACT RESISTANCE LOAD CONTACT AND DISTRIBUTION LOSSES 8-651 (C) Figure 13. Effective Circuit Configuration for Single-Module Remote-Sense Operation Output Voltage Set-Point Adjustment (Trim) When not using the trim feature, leave the TRIM pin open. Connecting the external resistor (Rtrim-up) between the TRIM and SENSE(-) pins (VO, adj) increases the output voltage set point as defined in the following equation: VO(+) VI(+) VO(-) R trim-up VI(-) 8-580 (C).b Figure 12. Remote On/Off Implementation Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. For single-unit operation, the PARALLEL pin should be connected to SENSE(-). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range 8 VI(-) Output voltage adjustment allows the output voltage set point to be increased or decreased by adjusting an external resistor connected between the TRIM pin and either the SENSE(+) or SENSE(-) pins (see Figure 14 and Figure 15). SENSE(-) Ion/off VO(+) Adjustment with TRIM Pin PARALLEL CASE VI(+) II 1.25 x 17.8 = ----------------------------- k VO, adj - 12 Connecting the external resistor (Rtrim-down) between the TRIM and SENSE(+) pins (VO, adj) decreases the output voltage set point as defined in the following equation: ( V O, adj - 1.25 ) x 17.8 R trim-down = -------------------------------------------------------12 - V O, adj k Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Feature Descriptions (continued) Adjustment Without TRIM Pin Output Voltage Set-Point Adjustment (Trim) (continued) Adjustment with TRIM Pin (continued) The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage clamp voltage as indicated in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment (trim), see Figure 13. The output voltage can be adjusted by placing an external resistor (Radj) between the SENSE(+) and VO(+) terminals (see Figure 16). By adjusting Radj, the output voltage can be increased by 10% of the nominal output voltage. The equation below shows the resistance required to obtain the desired output voltage. Radj = (VO, adj - VO, nom) 899 PARALLEL SENSE(-) Rtrim-up SUPPLY TRIM PARALLEL SUPPLY VI(-) VO(-) 8-717 (C).c Figure 14. Circuit Configuration to Trim Up Output Voltage Rtrim-down TRIM PARALLEL SENSE(+) SENSE(-) SUPPLY VI(+) VO(+) VI(-) VO(-) IO II CONTACT RESISTANCE LOAD CONTACT AND DISTRIBUTION LOSSES 8-718 (C).c Figure 15. Circuit Configuration to Trim Down Output Voltage Lucent Technologies Inc. VO(-) IO LOAD CONTACT AND DISTRIBUTION LOSSES LOAD CONTACT AND DISTRIBUTION LOSSES CONTACT RESISTANCE VI(-) Figure 16. Circuit Configuration to Adjust Output Voltage IO II VO(+) 8-710 (C).c SENSE(-) VO(+) VI(+) II CONTACT RESISTANCE SENSE(+) VI(+) Radj SENSE(+) Forced Load Sharing (Parallel Operation) For either redundant operation or additional power requirements, the power modules can be configured for parallel operation with forced load sharing (see Figure 17). For a typical redundant configuration, Schottky diodes or an equivalent should be used to protect against short-circuit conditions. Because of the remote sense, the forward-voltage drops across the Schottky diodes do not affect the set point of the voltage applied to the load. For additional power requirements, where multiple units are used to develop combined power in excess of the rated maximum, the Schottky diodes are not needed. Good layout techniques should be observed for noise immunity. To implement forced load sharing, the following connections must be made: The parallel pins of all units must be connected together. The paths of these connections should be as direct as possible. All remote-sense pins should be connected to the power bus at the same point, i.e., connect all SENSE(+) pins to the (+) side of the power bus at the same point and all SENSE(-) pins to the (-) side of the power bus at the same point. Close proximity and directness are necessary for good noise immunity. 9 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Feature Descriptions (continued) MEASURE CASE TEMPERATURE HERE 76 (3.0) Forced Load Sharing (Parallel Operation) 18 (0.7) (continued) Lucent TRIM PARALLEL When not using the parallel feature, short the PARALLEL pin to SENSE(-). CASE ON/OFF + IN - PARALLEL SENSE(+) FE150B9 DC-DC Power Module + SENSE - - OUT:DC 12V, 12.5A OUT 150W + MADE IN USA Protected by U.S. Patents: 5,036,452 5,179,365 IN:DC 48V, 3.7A TUV Rheinland 8-582 (C).p SENSE(-) Note: Top view, measurements shown in millimeters and (inches). CASE VO(+) ON/OFF VI(+) VO(-) VI(-) Figure 18. Case Temperature Measurement Location The temperature at this location should not exceed 95 C. The maximum case temperature can be limited to a lower value for extremely high reliability. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. CASE VO(+) ON/OFF VI(+) VO(-) VI(-) 8-581 (C) Figure 17. Wiring Configuration for Redundant Parallel Operation Output Overvoltage Clamp The output overvoltage clamp consists of control circuitry, independent of the primary regulation loop, that monitors the voltage on the output terminals. The control loop of the clamp has a higher voltage set point than the primary loop (see Feature Specifications table). This provides a redundant voltage-control that reduces the risk of output overvoltage. Thermal Considerations Introduction The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature occurs at the position indicated in Figure 18. 10 For additional information about these modules, refer to the Lucent Technologies Thermal Management for High-Power Board-Mounted Power Modules Technical Note (TN97-009EPS). Heat Transfer Without Heat Sinks Derating curves for forced-air cooling without a heat sink are shown in Figure 19. These curves can be used to determine the appropriate airflow for a given set of operating conditions. For example, if the unit dissipates 20 W of heat, the correct airflow in a 40 C environment is 1.0 m/s (200 ft./min.). 40 POWER DISSIPATION, PD (W) PARALLEL SENSE(+) SENSE(-) 0.5 m/s (100 ft./min.) 1.0 m/s (200 ft./min.) 1.5 m/s (300 ft./min.) 2.0 m/s (400 ft./min.) 2.5 m/s (500 ft./min.) 3.0 m/s (600 ft./min.) 3.5 m/s (700 ft./min.) 4.0 m/s (800 ft./min.) 30 20 10 0.1 m/s (20 ft./min.) NATURAL CONVECTION 0 0 20 40 60 80 100 LOCAL AMBIENT TEMPERATURE, TA (C) 8-587 (C) Figure 19. Power Derating vs. Local Ambient Temperature and Air Velocity Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Heat Transfer with Heat Sinks The power modules have threaded #4-40 fasteners, which enable heat sinks or cold plates to be attached to the module. The mounting torque must not exceed 0.56 N-m (5 in.-lb.). Thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. Total module thermal resistance (ca) is defined as the maximum case temperature rise (TC, max) divided by the module power dissipation (PD): THERMAL RESISTANCE, (C/W) The location to measure case temperature (TC) is shown in Figure 18. Case-to-ambient thermal resistance vs. airflow for various heat sink configurations is shown in Figure 20 and Figure 21. These curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. 5.0 NO HEAT SINK 0.25 in. HEAT SINK 0.5 in. HEAT SINK 3.0 1 in. HEAT SINK 0.25 in. HEAT SINK 0.5 in. HEAT SINK 3.0 1 in. HEAT SINK 2.0 1.0 0.0 NAT CONV 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) Figure 21. Heat Sink Resistance Curves; Fins Oriented Along Length These measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are generally lower than the resistance of the heat sink by itself. The module used to collect the data in Figure 20 and Figure 21 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. To choose a heat sink, determine the power dissipated as heat by the unit for the particular application. Figure 22 shows typical heat dissipation for a range of output currents and three voltages for the FE050B, FE100B, and FE150B. 2.0 1.0 0.0 NAT CONV NO HEAT SINK 4.0 8-697 (C).a PD 4.0 5.0 AIR VELOCITY MEASURED IN m/s (ft./min.) (TC - TA) C, max ca = T --------------------- = -----------------------PD THERMAL RESISTANCE, (C/W) Thermal Considerations (continued) 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) AIR VELOCITY MEASURED IN m/s (ft./min.) 8-696 (C).a Figure 20. Heat Sink Resistance Curves; Fins Oriented Along Width Lucent Technologies Inc. 11 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Thermal Considerations (continued) Heat Transfer with Heat Sinks (continued) Use Figure 20 and Figure 21 to determine air velocity for the 0.5 inch heat sink. The minimum airflow necessary for the FE150B module depends on heat sink fin orientation and is shown below: 0.4 m/s (80 ft./min.) (oriented along width) 0.45 m/s (90 ft./min.) (oriented along length) 30 POWER DISSIPATION (W) Data Sheet June 1998 25 VI = 49 V 20 Custom Heat Sinks VI = 38 V 15 VI = 60 V 10 5 0 0 2 4 6 8 10 12 A more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. The total module resistance can be separated into a resistance from case-to-sink (cs) and sink-to-ambient (sa) shown below (Figure 23). OUTPUT CURRENT, IO (A) 8-897 (C) PD TC Figure 22. FE150B Power Dissipation as Heat vs. Output Current TS cs TA sa 8-1304 (C) Example If an 85 C case temperature is desired, what is the minimum airflow necessary? Assume the FE150B module is operating at low line and an output current of 12.5 A, maximum ambient air temperature of 40 C, and the heat sink is 0.5 inch. Figure 23. Resistance from Case-to-Sink and Sinkto-Ambient For a managed interface using thermal grease or foils, a value of cs = 0.1 C/W to 0.3 C/W is typical. The solution for heat sink resistance is: (TC - TA) Solution sa = ------------------------- - cs Given: VI = 38 V IO = 12.5 A TA = 40 C TC = 85 C Heat sink = 0.5 inch. Determine PD by using Figure 22: PD This equation assumes that all dissipated power must be shed by the heat sink. Depending on the userdefined application environment, a more accurate model, including heat transfer from the sides and bottom of the module, can be used. This equation provides a conservative estimate for such instances. PD = 24 W Then solve the following equation: (TC - TA) ca = ----------------------PD Layout Considerations Copper paths must not be routed beneath the power module standoffs. 85 - 40 ) ca = (----------------------24 ca = 1.88 C/W 12 Lucent Technologies Inc. FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Outline Diagram Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.), x.xx mm 0.25 mm (x.xxx in. 0.010 in.) Top View 121.9 (4.80) 5.3 (0.21) Lucent TRIM OPTION ONLY TRIM PARALLEL FE150B9 DC-DC Power Module 52.83 (2.080) 63.5 (2.50) CASE IN:DC 48V, 3.7A OUT:DC 12V, 12.5A 150W ON/OFF + IN - 5.3 (0.21) + SENSE - - OUT MADE IN USA Protected by U.S. Patents: 5,036,452 5,179,365 TUV Rheinland 55.63 (2.190) + 55.63 (2.190) FOR OPTIONAL HEAT SINK MOUNTING #4-40 THD 4.6 (0.18) DEEP 6 PLCS Side View SIDE MARKING 1.0 (0.04) 12.7 (0.50) 4.1 0.076 (0.16 0.030) 1.57 (0.062) 0.05 (0.002) DIA TIN-PLATED BRASS TYP 12 PLCS 3.8 (0.15) TYP 8 PLCS Bottom View 4.3 (0.17) 5.08 (0.200) 10.16 (0.400) 113.54 (4.470) 12.2 (0.48) 20.32 (0.800) 25.40 30.48 (1.000) (1.200) 35.56 (1.400) 15.24 (0.600) TRIM OPTION ONLY 8-719 (C).m Lucent Technologies Inc. 13 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). TRIM OPTION ONLY TRIM 15.24 (0.600) PARALLEL + SENSE - - 10.16 (0.400) OUT 35.56 30.48 (1.400) 25.40 (1.200) 20.32 (1.000) (0.800) + 12.2 (0.48) 5.08 (0.200) 4.3 (0.17) 113.43 (4.470) 8-719 (C).m Ordering Information This family of modules is not recommended for new designs. For new designs, we recommend the JFW family of power modules. Please refer to the Lucent Technologies Power Systems Selection Guide or to individual data sheets. For further assistance, you may call the Lucent Technologies Power Systems Technical Hotline (1-800-526-7819 or 972-284-2626). Optional TRIM pin is designated by the ending 9 in device code name. Input Voltage 48 V 48 V 48 V 48 V 48 V 48 V 14 Output Voltage 12 V 12 V 12 V 12 V 12 V 12 V Output Power 50 W 100 W 150 W 50 W 100 W 150 W Trim Yes Yes Yes No No No Device Code FE050B9 FE100B9 FE150B9 FE050B FE100B FE150B Comcode Not Available Not Available Not Available 106258304 106258353 105775530 Lucent Technologies Inc. Data Sheet June 1998 FE050B, FE100B, FE150B Power Modules: dc-dc Converters; 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Notes Lucent Technologies Inc. 15 FE050B, FE100B, FE150B Power Modules: dc-dc 38 Vdc to 60 Vdc Input, 12 Vdc Output; 50 W to 150 W Data Sheet June 1998 For additional information, contact your Lucent Technologies Account Manager or the following: POWER SYSTEMS UNIT: Network Products Group, Lucent Technologies Inc., 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626, FAX +1-972-329-8202) (product-related questions or technical assistance) INTERNET: http://www.lucent.com E-MAIL: techsupport@lucent.com ASIA PACIFIC: Lucent Technologies Singapore Pte. Ltd., 750A Chai Chee Road #05-01, Chai Chee Industrial Park, Singapore 469001 Tel. (65) 240 8041, FAX (65) 240 8053 JAPAN: Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141-0022, Japan Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700 LATIN AMERICA: Lucent Technologies Inc., Room 9N128, One Alhambra Plaza, Coral Gables, FL 33134, USA Tel. +1-305-569-4722, FAX +1-305-569-3820 EUROPE: Data Requests: DATALINE: Tel. (44) 1189 324 299, FAX (44) 1189 328 148 Technical Inquiries:GERMANY: (49) 89 95086 0 (Munich), UNITED KINGDOM: (44) 1344 865 900 (Bracknell), FRANCE: (33) 1 48 83 68 00 (Paris), SWEDEN: (46) 8 600 7070 (Stockholm), FINLAND: (358) 9 4354 2800 (Helsinki), ITALY: (39) 2 6608131 (Milan), SPAIN: (34) 1 807 1441 (Madrid) Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Copyright (c) 1998 Lucent Technologies Inc. All Rights Reserved Printed in U.S.A. June 1998 DS97-532EPS (Replaces DS92-060EPS) Printed On Recycled Paper