PCA9538PW,112 - NXP Semiconductors / Philips Semiconductors

1. General description

The PCA9538 is a 16-pin CMOS device that provides 8 bits of General Purpose parallel

Input/Output (GPIO) expansion with interrupt and reset for I2C-bus/SMBus applications

and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders.

I/O expanders provide a simple solution when additional I/O is needed for ACPI power

switches, sensors, push-buttons, LEDs, fans, etc.

The PCA9538 consists of an 8-bit Conﬁguration register (input or output selection),

8-bit Input Port register, 8-bit Output Port register and an 8-bit Polarity Inversion register

(active HIGH or active LOW operation). The system master can enable the I/Os as either

inputs or outputs by writing to the I/O conﬁguration bits. The data for each input or output

is kept in the corresponding Input Port or Output Port register. The polarity of the Input

Port register can be inverted with the Polarity Inversion register. All registers can be read

by the system master.

The PCA9538 is identical to the PCA9554 except for the removal of the internal I/O pull-up

resistor which greatly reduces power consumption when the I/Os are held LOW,

replacement of A2 with RESET and different address range.

The PCA9538 open-drain interrupt output (INT) is activated when any input state differs

from its corresponding Input Port register state and is used to indicate to the system

master that an input state has changed. The power-on reset sets the registers to their

default values and initializes the device state machine. The RESET pin causes the same

reset/initialization to occur without de-powering the device.

Two hardware pins (A0 and A1) vary the ﬁxed I2C-bus address and allow up to four

devices to share the same I2C-bus/SMBus.

2. Features

n8-bit I2C-bus GPIO with interrupt and reset

nOperating power supply voltage range of 2.3 V to 5.5 V

n5 V tolerant I/Os

nPolarity Inversion register

nActive LOW interrupt output

nActive LOW reset input

nLow standby current

nNoise ﬁlter on SCL/SDA inputs

nNo glitch on power-up

nInternal power-on reset

PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and

reset

Rev. 05 — 28 May 2009 Product data sheet

Product data sheet Rev. 05 — 28 May 2009 2 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

n8 I/O pins which default to 8 inputs

n0 Hz to 400 kHz clock frequency

nESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115 and 1000 V CDM per JESD22-C101

nLatch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

nOffered in three different packages: SO16, TSSOP16 and HVQFN16

3. Ordering information

4. Block diagram

Table 1. Ordering information

amb

−

C to +85

Type number Topside

mark Package

Name Description Version

PCA9538D PCA9538D SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

PCA9538PW PCA9538 TSSOP16 plastic thin shrink small outline package; 16 leads;

body width 4.4 mm SOT403-1

PCA9538BS 9538 HVQFN16 plastic thermal enhanced very thin quad ﬂat package;

no leads; 16 terminals; body 4 ×4×0.85 mm SOT629-1

Remark: All I/Os are set to inputs at reset.

Fig 1. Block diagram of PCA9538

PCA9538

POWER-ON

RESET

002aae667

INPUT

FILTER

SCL

SDA

VDD

IO0

VSS

8-bit

write pulse

read pulse

IO2

IO1

IO3

FILTER

VDD

INT

RESET

IO4

IO6

IO5

IO7

I2C-BUS/SMBus

CONTROL

INPUT/

OUTPUT

PORTS

Product data sheet Rev. 05 — 28 May 2009 3 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

5. Pinning information

5.1 Pinning

Fig 2. Pin conﬁguration for SO16 Fig 3. Pin conﬁguration for TSSOP16

Fig 4. Pin conﬁguration for HVQFN16

PCA9538D

A0 VDD

A1 SDA

RESET SCL

IO0 INT

IO1 IO7

IO2 IO6

IO3 IO5

VSS IO4

002aae668

15 VDD

SDA

SCL

INT

IO7

IO6

IO5

IO4

RESET

IO0

IO1

IO2

IO3

VSS

PCA9538PW

002aae669

002aae670

PCA9538BS

Transparent top view

IO2 IO6

IO1 IO7

IO0 INT

SCL

IO3

VSS

IO4

IO5

VDD

SDA

4 9

3 10

2 11

1 12

terminal 1

index area

RESET

Product data sheet Rev. 05 — 28 May 2009 4 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

5.2 Pin description

[1] HVQFN16 package die supply ground is connected to both the VSS pin and the exposed center pad. The

VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical,

and board-level performance, the exposed pad needs to be soldered to the board using a corresponding

thermal pad on the board, and for proper heat conduction through the board thermal vias need to be

incorporated in the printed-circuit board in the thermal pad region.

Table 2. Pin description

Symbol Pin Description

SO16, TSSOP16 HVQFN16

A0 1 15 address input 0

A1 2 16 address input 1

RESET 3 1 active LOW reset input

IO0 4 2 input/output 0

IO1 5 3 input/output 1

IO2 6 4 input/output 2

IO3 7 5 input/output 3

VSS 86

[1] supply ground

IO4 9 7 input/output 4

IO5 10 8 input/output 5

IO6 11 9 input/output 6

IO7 12 10 input/output 7

INT 13 11 interrupt output (open-drain)

SCL 14 12 serial clock line

SDA 15 13 serial data line

VDD 16 14 supply voltage

Product data sheet Rev. 05 — 28 May 2009 5 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

6. Functional description

Refer to Figure 1 “Block diagram of PCA9538”.

6.1 Device address

6.2 Registers

6.2.1 Command byte

The command byte is the ﬁrst byte to follow the address byte during a write transmission.

It is used as a pointer to determine which of the registers will be written or read.

6.2.2 Register 0 - Input Port register

This register is a read-only port. It reﬂects the incoming logic levels of the pins, regardless

of whether the pin is deﬁned as an input or an output by Register 3. Writes to this register

have no effect.

The default value ‘X’ is determined by the externally applied logic level.

Fig 5. PCA9538 address

R/W

002aae707

1 1 1 0 0 A1 A0

slave address

fixed hardware

selectable

Table 3. Command byte

Command Protocol Function

0 read byte Input Port register

1 read/write byte Output Port register

2 read/write byte Polarity Inversion register

3 read/write byte Conﬁguration register

Table 4. Register 0 - Input Port register bit description

Legend: * default value.

Bit Symbol Access Value Description

7 I7 read only X* value ‘X’ is determined by externally applied

logic level

6 I6 read only X*

5 I5 read only X*

4 I4 read only X*

3 I3 read only X*

2 I2 read only X*

1 I1 read only X*

0 I0 read only X*

Product data sheet Rev. 05 — 28 May 2009 6 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

6.2.3 Register 1 - Output Port register

This register reﬂects the outgoing logic levels of the pins deﬁned as outputs by Register 3.

Bit values in this register have no effect on pins deﬁned as inputs. Reads from this register

return the value that is in the ﬂip-ﬂop controlling the output selection, not the actual pin

value.

6.2.4 Register 2 - Polarity Inversion register

This register allows the user to invert the polarity of the Input Port register data. If a bit in

this register is set (written with 1), the corresponding Input Port data is inverted. If a bit in

this register is cleared (written with a 0), the Input Port data polarity is retained.

Table 5. Register 1 - Output Port register bit description

Legend: * default value.

Bit Symbol Access Value Description

7 O7 R 1* reﬂects outgoing logic levels of pins deﬁned as outputs

by Register 3

6O6 R 1*

5O5 R 1*

4O4 R 1*

3O3 R 1*

2O2 R 1*

1O1 R 1*

0O0 R 1*

Table 6. Register 2 - Polarity Inversion register bit description

Legend: * default value.

Bit Symbol Access Value Description

7 N7 R/W 0* inverts polarity of Input Port register data

0 = Input Port register data retained (default value)

1 = Input Port register data inverted

6 N6 R/W 0*

5 N5 R/W 0*

4 N4 R/W 0*

3 N3 R/W 0*

2 N2 R/W 0*

1 N1 R/W 0*

0 N0 R/W 0*

Product data sheet Rev. 05 — 28 May 2009 7 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

6.2.5 Register 3 - Conﬁguration register

This register conﬁgures the directions of the I/O pins. If a bit in this register is set, the

corresponding port pin is enabled as an input with high-impedance output driver. If a bit in

this register is cleared, the corresponding port pin is enabled as an output. At reset, the

I/Os are conﬁgured as inputs.

6.3 Power-on reset

When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9538 in

a reset condition until VDD has reached VPOR. At that point, the reset condition is released

and the PCA9538 registers and state machine will initialize to their default states.

Thereafter, VDD must be lowered below 0.2 V to reset the device.

For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the

operating voltage.

6.4 RESET input

A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst).

The PCA9538 registers and SMBus/I2C-bus state machine will be held in their default

state until the RESET input is once again HIGH. This input requires a pull-up resistor to

VDD if no active connection is used.

6.5 Interrupt output

The open-drain interrupt output (INT) is activated when one of the port pins changes state

and the pin is conﬁgured as an input. The interrupt is de-activated when the input returns

to its previous state or the Input Port register is read.

Note that changing an I/O from an output to an input may cause a false interrupt to occur

if the state of the pin does not match the contents of the Input Port register.

Table 7. Register 3 - Conﬁguration register bit description

Legend: * default value.

Bit Symbol Access Value Description

7 C7 R/W 1* conﬁgures the directions of the I/O pins

0 = corresponding port pin enabled as an output

1 = corresponding port pin conﬁgured as an input

(default value)

6 C6 R/W 1*

5 C5 R/W 1*

4 C4 R/W 1*

3 C3 R/W 1*

2 C2 R/W 1*

1 C1 R/W 1*

0 C0 R/W 1*

Product data sheet Rev. 05 — 28 May 2009 8 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

6.6 I/O port

When an I/O is conﬁgured as an input, FETs Q1 and Q2 are off, creating a

high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V.

If the I/O is conﬁgured as an output, then either Q1 or Q2 is enabled, depending on the

state of the Output Port register. Care should be exercised if an external voltage is applied

to an I/O conﬁgured as an output because of the low-impedance paths that exist between

the pin and either VDD or VSS.

Remark: At power-on reset, all registers return to default values.

Fig 6. Simpliﬁed schematic of IO0 to IO7

VDD

I/O pin

output port

configuration

CK Q

data from

shift register

write

configuration

pulse

output port

write pulse

polarity inversion

data from

shift register

write polarity

pulse

input port

read pulse

input port

polarity

inversion

002aad723

data from

shift register

VSS

to INT

Product data sheet Rev. 05 — 28 May 2009 9 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

6.7 Bus transactions

Data is transmitted to the PCA9538 registers using the write mode as shown in Figure 7

and Figure 8. Data is read from the PCA9538 registers using the read mode as shown in

Figure 9 and Figure 10. These devices do not implement an auto-increment function so

once a command byte has been sent, the register which was addressed will continue to

be accessed by reads until a new command byte has been sent.

Expanded diagram is shown in Figure 18.

Fig 7. Write to output port register

0 AS

slave address

START condition R/W acknowledge

from slave

002aae708

00000010

command byte

acknowledge

from slave

12345678SCL 9

SDA DATA 1 A

write to port

data out from port

tv(Q)

acknowledge

from slave

DATA 1 VALID

data to port

1100A1A01P

STOP

condition

Fig 8. Write to conﬁguration or polarity inversion registers

0 AS

slave address

START condition R/W acknowledge

from slave

002aae709

0000011/00

command byte

acknowledge

from slave

12345678SCL 9

SDA DATA 1 A

data to register

acknowledge

from slave

data to register

1100A1A01P

STOP

condition

Product data sheet Rev. 05 — 28 May 2009 10 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Fig 9. Read from register

START condition R/W

acknowledge

from slave

002aae710

acknowledge

from slave

SDA

A P

acknowledge

from master

DATA (first byte)

slave address

STOP

condition

(repeated)

START condition

(cont.)

(cont.) 1100A1A01A1

R/W

acknowledge

from slave

slave address

at this moment master-transmitter becomes master-receiver

and slave-receiver becomes slave-transmitter

no acknowledge

from master

COMMAND BYTE

1100A1A01 0

data from register

DATA (last byte)

data from register

This ﬁgure assumes the command byte has previously been programmed with 00h.

Transfer of data can be stopped at any moment by a STOP condition.

Expanded diagram is shown in Figure 17.

Fig 10. Read input port register

1100A1A01AS1

slave address

START condition R/W acknowledge

from slave

002aae711

data from port

acknowledge

from master

SDA NA

no acknowledge

from master

read from

port

data into

port

data from port

DATA 1

DATA 4

INT

DATA 4

DATA 2 DATA 3

STOP

condition

tv(INT) trst(INT)

th(D) tsu(D)

12345678SCL 9

DATA 1

Product data sheet Rev. 05 — 28 May 2009 11 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

7. Application design-in information

Device address is 1110 000x for this example.

IO0, IO2, IO3 conﬁgured as outputs.

IO1, IO4, IO5 conﬁgured as inputs.

IO6, IO7 are not used and need 100 kΩ pull-up resistors to protect them from ﬂoating.

Fig 11. Typical application

PCA9538

IO0

IO1

SCL

SDA

VDD

(5 V)

MASTER

CONTROLLER

SCL

SDA

INT IO2

VDD

VSS

INT

10 kΩSUB-SYSTEM 1

(e.g., temp sensor)

IO3

INT

SUB-SYSTEM 2

(e.g., counter)

RESET

controlled

switch

(e.g., CBT device)

enable

VSS

002aae712

10 kΩ10 kΩ2 kΩ100 kΩ

(× 3)

RESET RESET

10 kΩ

IO4

IO5

IO6

IO7

A0 SUB-SYSTEM 3

(e.g., alarm system)

ALARM

VDD

Product data sheet Rev. 05 — 28 May 2009 12 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

7.1 Minimizing IDD when the I/Os are used to control LEDs

When the I/Os are used to control LEDs, they are normally connected to VDD through a

resistor as shown in Figure 11. Since the LED acts as a diode, when the LED is off the

I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes

lower than VDD.

Designs needing to minimize current consumption, such as battery power applications,

should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.

Figure 12 shows a high value resistor in parallel with the LED. Figure 13 shows VDD less

than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI

at or above VDD and prevents additional supply current consumption when the LED is off.

Fig 12. High value resistor in parallel with

the LED Fig 13. Device supplied by a lower voltage

002aac660

LED

VDD

IOn

100 kΩ

VDD

002aac661

LED

VDD

IOn

3.3 V 5 V

Product data sheet Rev. 05 — 28 May 2009 13 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

8. Limiting values

9. Static characteristics

Table 8. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage −0.5 +6.0 V

IIinput current - ±20 mA

VI/O voltage on an input/output pin VSS −0.5 5.5 V

IO(IOn) output current on pin IOn - ±50 mA

IDD supply current - 85 mA

ISS ground supply current - 100 mA

Ptot total power dissipation - 200 mW

Tstg storage temperature −65 +150 °C

Tamb ambient temperature operating −40 +85 °C

Tj(max) maximum junction temperature - +125 °C

Table 9. Static characteristics

= 2.3 V to 5.5 V; V

=0V; T

amb

−

C to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Supplies

VDD supply voltage 2.3 - 5.5 V

IDD supply current operating mode; VDD = 5.5 V;

no load; fSCL = 100 kHz - 104 175 µA

IstbL LOW-level standby current Standby mode; VDD = 5.5 V;

no load; VI=V

SS;

fSCL = 0 kHz; I/O = inputs

- 0.25 1 µA

IstbH HIGH-level standby current Standby mode; VDD = 5.5 V;

no load; VI=V

DD;

fSCL = 0 kHz; I/O = inputs

- 0.25 1 µA

VPOR power-on reset voltage no load; VI=V

DD or VSS [1] - 1.5 1.65 V

Input SCL; input/output SDA

VIL LOW-level input voltage −0.5 - +0.3VDD V

VIH HIGH-level input voltage 0.7VDD - 5.5 V

IOL LOW-level output current VOL = 0.4 V 3 7 - mA

ILleakage current VI=V

DD =V

SS −1-+1µA

Ciinput capacitance VI=V

SS - 5 10 pF

Product data sheet Rev. 05 — 28 May 2009 14 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

[1] VDD must be lowered to 0.2 V in order to reset part.

[2] Each I/O must be externally limited to a maximum of 25 mA and the device must be limited to a maximum current of 100 mA.

[3] The total current sourced by all I/Os must be limited to 85 mA.

I/Os

VIL LOW-level input voltage −0.5 - +0.8 V

VIH HIGH-level input voltage 2.0 - 5.5 V

IOL LOW-level output current VOL = 0.5 V

VDD = 2.3 V [2] 810- mA

VDD = 3.0 V [2] 814- mA

VDD = 4.5 V [2] 817- mA

VOL = 0.7 V

VDD = 2.3 V [2] 10 13 - mA

VDD = 3.0 V [2] 10 19 - mA

VDD = 4.5 V [2] 10 24 - mA

VOH HIGH-level output voltage IOH =−8mA

VDD = 2.3 V [3] 1.8 - - V

VDD = 3.0 V [3] 2.6 - - V

VDD = 4.5 V [3] 4.1 - - V

IOH =−10 mA

VDD = 2.3 V [3] 1.7 - - V

VDD = 3.0 V [3] 2.5 - - V

VDD = 4.5 V [3] 4.0 - - V

ILI input leakage current VI=V

DD =V

SS −1-+1µA

Ciinput capacitance - 5 10 pF

Interrupt INT

IOL LOW-level output current VOL = 0.4 V 3 13 - mA

Select inputs A0, A1, RESET

VIL LOW-level input voltage −0.5 - +0.8 V

VIH HIGH-level input voltage 2.0 - 5.5 V

ILI input leakage current −1-+1µA

Table 9. Static characteristics

…continued

= 2.3 V to 5.5 V; V

=0V; T

amb

−

C to +85

C; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 05 — 28 May 2009 15 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

10. Dynamic characteristics

[1] tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW.

[2] tVD;DAT = minimum time for the SDA data out to be valid following SCL LOW.

[3] Cb = total capacitance of one bus line in pF.

Table 10. Dynamic characteristics

Symbol Parameter Conditions Standard-mode

I2C-bus Fast-mode I2C-bus Unit

Min Max Min Max

fSCL SCL clock frequency 0 100 0 400 kHz

tBUF bus free time between a STOP and

START condition 4.7 - 1.3 - µs

tHD;STA hold time (repeated) START condition 4.0 - 0.6 - µs

tSU;STA set-up time for a repeated START

condition 4.7 - 0.6 - µs

tSU;STO set-up time for STOP condition 4.0 - 0.6 - µs

tHD;DAT data hold time 0 - 0 - ns

tVD;ACK data valid acknowledge time [1] 0.3 3.45 0.1 0.9 µs

tVD;DAT data valid time [2] 300 - 50 - ns

tSU;DAT data set-up time 250 - 100 - ns

tLOW LOW period of the SCL clock 4.7 - 1.3 - µs

tHIGH HIGH period of the SCL clock 4.0 - 0.6 - µs

trrise time of both SDA and SCL signals - 1000 20 + 0.1Cb[3] 300 ns

tffall time of both SDA and SCL signals - 300 20 + 0.1Cb[3] 300 ns

tSP pulse width of spikes that must be

suppressed by the input ﬁlter - 50 - 50 ns

Port timing

tv(Q) data output valid time - 200 - 200 ns

tsu(D) data input set-up time 100 - 100 - ns

th(D) data input hold time 1 - 1 - µs

Interrupt timing

tv(INT) valid time on pin INT - 4 - 4 µs

trst(INT) reset time on pin INT - 4 - 4 µs

RESET

tw(rst) reset pulse width 4 - 4 - ns

trec(rst) reset recovery time 0 - 0 - ns

trst reset time 400 - 400 - ns

Product data sheet Rev. 05 — 28 May 2009 16 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Fig 14. Deﬁnition of timing

tSP

tBUF

tHD;STA PP S

tLOW

tHD;DAT

tHIGH tSU;DAT tSU;STA

tHD;STA

tSU;STO

SDA

SCL

002aaa986

Rise and fall times refer to VIL and VIH.

Fig 15. I2C-bus timing diagram

SCL

SDA

tHD;STA tSU;DAT tHD;DAT

tBUF

tSU;STA tLOW tHIGH

tVD;ACK

002aab285

tSU;STO

protocol START

condition

(S)

bit 7

MSB

(A7)

bit 6

(A6) bit 1

(D1) bit 0

(D0)

1 / fSCL

tVD;DAT

acknowledge

(A)

STOP

condition

(P)

Fig 16. Deﬁnition of RESET timing

SDA

SCL

002aad732

trst

50 %

30 %

50 % 50 %

50 %

trec(rst) tw(rst)

RESET

IOn after reset,

I/Os reconfigured

as inputs

START

trst

ACK or read cycle

Product data sheet Rev. 05 — 28 May 2009 17 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Fig 17. Expanded view of read input port register

Fig 18. Expanded view of write to output port register

SCL

002aae641

210AP

70 %

30 %

SDA

input 50 %

INT

tv(INT) trst(INT)

th(D)

tsu(D)

SCL

002aad735

210AP

70 %

SDA

output 50 %

tv(Q)

Product data sheet Rev. 05 — 28 May 2009 18 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

11. Test information

RL = load resistor.

CL = load capacitance includes jig and probe capacitance.

RT = termination resistance should be equal to the output impedance Zo of the pulse generators.

Fig 19. Test circuitry for switching times

Fig 20. Test circuit

Table 11. Test data

Test Load Switch

RLCL

tv(Q) 500 Ω50 pF 2 ×VDD

PULSE

GENERATOR

50 pF

500 Ω

002aab880

VDD

DUT

VDD

open

VSS

50 pF

002aac226

500 Ω

from output under test 2VDD

open

GND

500 Ω

Product data sheet Rev. 05 — 28 May 2009 19 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

12. Package outline

Fig 21. Package outline SOT162-1 (SO16)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

99-12-27

03-02-19

Product data sheet Rev. 05 — 28 May 2009 20 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Fig 22. Package outline SOT403-1 (TSSOP16)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 5.1

4.9 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.40

0.06 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1 MO-153 99-12-27

03-02-18

0.25

16 9

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

max.

1.1

pin 1 index

Product data sheet Rev. 05 — 28 May 2009 21 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Fig 23. Package outline SOT629-1 (HVQFN16)

terminal 1

index area

0.651

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 4.1

3.9

2.25

1.95

4.1

3.9 2.25

1.95

0.38

0.23

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT629-1 MO-220 - - -- - -

0.75

0.50

0.1

0.05

0 2.5 5 mm

scale

SOT629-1

HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;

16 terminals; body 4 x 4 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

16 13

01-08-08

02-10-22

terminal 1

index area

1/2 e

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

Product data sheet Rev. 05 — 28 May 2009 22 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

13. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in

JESD625-A

or equivalent standards.

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

•Board speciﬁcations, including the board ﬁnish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

Product data sheet Rev. 05 — 28 May 2009 23 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

•Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath speciﬁcations, including temperature and impurities

14.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

•Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 24) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 12 and 13

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 24.

Table 12. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 13. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 05 — 28 May 2009 24 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

For further information on temperature proﬁles, refer to Application Note

AN10365

“Surface mount reﬂow soldering description”

15. Abbreviations

MSL: Moisture Sensitivity Level

Fig 24. Temperature proﬁles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 14. Abbreviations

Acronym Description

ACPI Advanced Conﬁguration and Power Interface

CBT Cross-Bar Technology

CDM Charged-Device Model

CMOS Complementary Metal-Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

FET Field-Effect Transistor

FF Flip-Flop

GPIO General Purpose Input/Output

HBM Human Body Model

I2C-bus Inter-Integrated Circuit bus

I/O Input/Output

LED Light Emitting Diode

LP Low-Pass

MM Machine Model

POR Power-On Reset

SMBus System Management Bus

Product data sheet Rev. 05 — 28 May 2009 25 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

16. Revision history

Table 15. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PCA9538_5 20090528 Product data sheet - PCA9538_4

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Pin names changed from “I/On” to “IOn”

•Table 2 “Pin description”: added Table note [1] and its reference at HVQFN16 pin 6.

•Section 6.4 “RESET input”, 1st sentence: changed symbol from “tW” to “tw(rst)”.

•Figure 7 “Write to output port register”: changed symbol from “tpv” to “tv(Q)”

•Figure 10 “Read input port register”:

–changed symbol from “tph” to “th(D)”

–changed symbol from “tps” to “tsu(D)”

–changed symbol from “tiv” to “tv(INT)”

–changed symbol from “tir” to “trst(INT)”

•Figure 12: changed signal name from “LEDx” to “IOn”

•Figure 13: changed signal name from “LEDx” to “IOn”

•Table 8 “Limiting values”:

–parameter description for symbol VI/O changed from “DC output current on an I/O”

to “voltage on an input/output pin”

–symbol/parameter changed from “II/O, DC output current on an I/O” to “IO(IOn), output current

on pin IOn”

–parameter description for symbol ISS changed from “supply current” to “ground supply current”

•Table 9 “Static characteristics”:

–sub-section “Supplies”: symbol/parameter changed from “Istbl, Standby current” to

“IstbL, LOW-level standby current”

–sub-section “Supplies”: symbol/parameter changed from “Istbh, Standby current” to

“IstbH, HIGH-level standby current”

–sub-section “Input SCL; input/output SDA”: Typ value for IOL changed from “<tbd>” to “7 mA”

–sub-section “I/Os”: symbol “IIL” (input leakage current) changed to “ILI”

–sub-section “Interrupt INT”: Typ value for IOL changed from “<tbd>” to “13 mA”

•Table 10 “Dynamic characteristics”: parameter description for symbol fSCL changed from

“operating frequency” to “SCL clock frequency”

•Table 10 “Dynamic characteristics”, sub-section “Port timing”:

–symbol/parameter changed from “tPV, Output data valid” to “tv(Q), data output valid time”

–symbol/parameter changed from “tPS, Input data setup time” to “tsu(D), data input set-up time”

–symbol/parameter changed from “tPH, Input data hold time” to “th(D), data input hold time”

•Table 10 “Dynamic characteristics”, sub-section “Interrupt timing”:

–symbol/parameter changed from “tIV, Interrupt valid” to “tv(INT), valid time on pin INT”

–symbol/parameter changed from “tIR, Interrupt reset” to “trst(INT), reset time on pin INT”

•Table 10 “Dynamic characteristics”, sub-section “RESET”:

–symbol/parameter changed from “tW, Reset pulse width” to “tw(rst), reset pulse width”

–symbol/parameter changed from “tREC, Reset recovery time” to “trec(rst), reset recovery time”

–symbol/parameter changed from “tRESET, Time to reset” to “trst, reset time”

Product data sheet Rev. 05 — 28 May 2009 26 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

Modiﬁcations:

(continued) •Figure 16 “Deﬁnition of RESET timing”:

–symbol changed from “tW” to “tw(rst)”

–symbol changed from “tREC” to “trec(rst)”

–symbol changed from “tRESET” to “trst”

•Figure 17 “Expanded view of read input port register”:

–symbol changed from “tPS” to “tsu(D)”

–symbol changed from “tPH” to “th(D)”

–symbol changed from “tIV” to “tv(INT)”

–symbol changed from “tIR” to “trst(INT)”

•Figure 18 “Expanded view of write to output port register”: symbol changed from “tPV” to “tv(Q)”

•(old) Figure 19, “Test circuit” replaced with Figure 20 “Test circuit” and Table 11 “Test data”;

symbol “tpv” changed to “tv(Q)”

•Added soldering information

•Added Section 15 “Abbreviations”

PCA9538_4 20060921 Product data sheet - PCA9538_3

PCA9538_3

(9397 750 14176) 20041005 Product data sheet - PCA9538_2

PCA9538_2

(9397 750 14049) 20040930 Objective data sheet - PCA9538_1

PCA9538_1

(9397 750 12881) 20040820 Objective data sheet - -

Table 15. Revision history

…continued

Document ID Release date Data sheet status Change notice Supersedes

Product data sheet Rev. 05 — 28 May 2009 27 of 28

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

17.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

17.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

I2C-bus — logo is a trademark of NXP B.V.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors PCA9538

8-bit I2C-bus and SMBus low power I/O port with interrupt and reset

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 28 May 2009

Document identifier: PCA9538_5

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Functional description . . . . . . . . . . . . . . . . . . . 5

6.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2.1 Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2.2 Register 0 - Input Port register . . . . . . . . . . . . . 5

6.2.3 Register 1 - Output Port register. . . . . . . . . . . . 6

6.2.4 Register 2 - Polarity Inversion register . . . . . . . 6

6.2.5 Register 3 - Conﬁguration register . . . . . . . . . . 7

6.3 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.4 RESET input. . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.5 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.6 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

6.7 Bus transactions. . . . . . . . . . . . . . . . . . . . . . . . 9

7 Application design-in information . . . . . . . . . 11

7.1 Minimizing IDD when the I/Os are used to

control LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . 12

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13

9 Static characteristics. . . . . . . . . . . . . . . . . . . . 13

10 Dynamic characteristics . . . . . . . . . . . . . . . . . 15

11 Test information. . . . . . . . . . . . . . . . . . . . . . . . 18

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

13 Handling information. . . . . . . . . . . . . . . . . . . . 22

14 Soldering of SMD packages . . . . . . . . . . . . . . 22

14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 22

14.2 Wave and reﬂow soldering . . . . . . . . . . . . . . . 22

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 22

14.4 Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 23

15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25

17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 27

17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27

17.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 27

18 Contact information. . . . . . . . . . . . . . . . . . . . . 27

19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28