© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 1
One world. One KEMET
Overview
KEMET’s Commercial “L” Series with Tin/Lead Termination
surface mount capacitors in C0G dielectric are designed to meet
the needs of critical applications where tin/lead end metallization
is required. KEMET’s tin/lead electroplating process is designed
to meet a 5% minimum lead content and address concerns for
a more robust and reliable lead containing termination system.
As the bulk of the electronics industry moves towards RoHS
compliance, KEMET continues to provide tin/lead terminated
products for military, aerospace and industrial applications and
will ensure customers have a stable and long-term source of
supply.
KEMET’s C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.” The Electronics
Components, Assemblies & Materials Association (EIA)
characterizes C0G dielectric as a Class I material. Components
of this classication are temperature compensating and are suited
for resonant circuit applications or those where Q and stability
of capacitance characteristics are required. C0G exhibits no
change in capacitance with respect to time and voltage and boasts
a negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30 ppm/ºC from
-55°C to +125°C.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric
10 – 200 VDC (Commercial Grade)
Ordering Information
C1206 C104 J 3 G A L TU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1Voltage Dielectric Failure Rate/
Design Termination Finish2Packaging/Grade
(C-Spec)3
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
C = Standard 2 signicant digits +
number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – .99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10 V
4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
G = C0G A = N/A L = SnPb (5%
minimum)
Blank = Bulk
TU = 7" Reel
Unmarked
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination nish options may be available. Contact KEMET for details
3 Additional reeling or packaging options may be available. Contact KEMET for details.
Benets
• -55°C to +125°C operating temperature range
• Reliable and robust termination system
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825,
2220, and 2225 case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V
• Capacitance offerings ranging from 0.5 pF up to 0.47 μF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5 pF, ±1%,
±2%, ±5%, ±10%, and ±20%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
L
Length W
Width T
Thickness B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402 1005 1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
See Table 2 for
Thickness
0.30 (.012) ± 0.10 (.004) 0.30 (.012) Solder Reow Only
0603 1608 1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028) Solder Wave or
Solder Reow
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030)
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only
1808 4520 4.70 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008) 0.60 (.024) ± 0.35 (.014)
1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
1825 4564 4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
2225 5664 5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
Benets cont'd
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and into
the MHz range
• Negligible capacitance change with respect to temperature
from -55°C to +125°C
• No capacitance change with respect to applied rated DC voltage
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• SnPb plated termination nish (5% minimum)
• Flexible termination option available upon request
• Available for other surface mount products, additional dielectrics
and higher voltage ratings upon request
Applications
Typical applications include military, aerospace and other high reliability applications.
Qualication/Certication
Commercial Grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in
Table 4, Performance & Reliability.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Environmental Compliance
These devices do not meet RoHS criteria due to the concentration of Pb containment in the termination nish
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±30 ppm/ºC
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0%
Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 0.1%
Insulation Resistance (IR) Limit @ 25°C
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ± 0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ± 0.2 V if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage Capacitance
Value Dissipation Factor
(Maximum %) Capacitance
Shift
Insulation
Resistance
C0G All All 0.5 0.3% or ±0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
Capacitance Cap
Code
Series C0402 C0603 C0805 C1206
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Capacitance Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
0.50 – 0.75 pF 508 – 758 B CDBB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC
1.0 – 1.6 pF 109 – 169 B CDK M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
1.8 – 4.3 pF 189 – 439 B CDJ K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
4.7 – 9.1 pF 479 – 919 B CD G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
10 pF 10 BCD F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
11 pF 110 BCD F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
12 pF 120 BCD F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
13 – 33 pF 130 – 330 CD F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
36 – 62 pF 360 – 620 D F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
68 – 91 pF 680 – 910 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
100 pF 101 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
110 – 180 pF 111 – 181 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
200 – 330 pF 201 – 331 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
360 – 560 pF 361 – 561 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
620 pF 621 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
680 pF 681 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
750 pF 751 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
820 pF 821 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC DC EB EB EB EB EB EB
910 pF 911 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DD DD EB EB EB EB EB EB
1,000 pF 102 F G J K M BB BB BB BB BB CB CB CB CB CB UD DC DC DC DC DD DD EB EB EB EB EB EB
1,100 pF 112 F G J K M BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC UD EB EB EB EB EB EB
1,200 pF 122 F G J K M BB BB BB BB CB CB CB CB CB UD DC DC DC DC DC UD EB EB EB EB EB EB
1,300 pF 132 F G J K M BB BB BB BB CB CB CB CB CB UD DD DD DD DD DD UD EB EB EB EB EC EC
1,500 pF 152 F G J K M BB BB BB BB CB CB CB CB CB UD DD DD DD DD DD UD EB EB EB EB ED EC
1,600 pF 162 F G J K M BB BB BB CB CB CB CB CB UD DD DD DD DD DD UD EB EB EB EB ED ED
1,800 pF 182 FGJ K M BB BB BB CB CB CB CB CB UD DD DD DD DD DD UD EB EB EB EB ED ED
2,000 pF 202 F G J K M BB BB BB CB CB CB CB CB UD DC DC DC DC DC UD EB EB EB EB ED ED
2,200 pF 222 F G J K M BB BB CB CB CB CB CB UD DC DC DC DC DC UD EB EB EB EB EE EE
2,400 pF 242 F G J K M CB CB CB CB CB DC DC DC DC DC UD EB EB EB EB EC EC
2,700 pF 272 F G J K M CB CB CB CB CB DC DC DC DC DC UD EB EB EB EB EC EC
3,000 pF 302 F G J K MCB CB CB CB CB DD DD DD DD DC UD EC EC EC EC EC UD
3,300 pF 332 F G J K M CB CB CB CB CB DD DD DD DD DC UD EC EC EC EC EE UD
3,600 pF 362 F G J K M CB CB CB CB CB DD DD DD DD DC UD EC EC EC EC EE UD
3,900 pF 392 F G J K M CB CB CB CB CB DE DE DE DE DC UD EC EC EC EC EF UD
4,300 pF 432 F G J K M CB CB CB CB CB DE DE DE DE DC UD EC EC EC EC EC UD
4,700 pF 472 F G J K M CB CB CB CB CB DE DE DE DE DC UD EC EC EC EC EC UD
5,100 pF 512 F G J K M CB CB CB CB DE DE DE DE DC UD ED ED ED ED ED UD
5,600 pF 562 F G J K M CB CB CB CB DC DC DC DC DC UD ED ED ED ED ED UD
6,200 pF 622 F G J K M CB CB CB CB DC DC DC DC DC UD EB EB EB EB EB UD
6,800 pF 682 F G J K M CB CB CB CB DC DC DC DC DC UD EB EB EB EB EB UD
7,500 pF 752 F G J K M CB CB CB DC DC DC DC DC UD EB EB EB EB EB UD
8,200 pF 822 F G J K M CB CB CB DC DC DC DC DC UD EC EC EC EC EB UD
9,100 pF 912 F G J K M CB CB CB DC DC DC DC DC EC EC EC EC EB UD
10,000 pF 103 F G J K M CB CB CB DC DC DC DC DD ED ED ED ED EB UD
12,000 pF 123 F G J K M CB CB CB DC DC DC DC DE EB EB EB EB EB UD
15,000 pF 153 F G J K M CB CB CB DC DC DC DD DG EB EB EB EB EB UD
18,000 pF 183 F G J K M DC DC DC DD EB EB EB EB EB UD
22,000 pF 223 F G J K M DD DD DD DF EB EB EB EB EC UD
27,000 pF 273 F G J K M DF DF DF EB EB EB EB EE
33,000 pF 333 F G J K M DG DG DG EB EB EB EB EE
39,000 pF 393 F G J K M DG DG DG EC EC EC EE EH
47,000 pF 473 F G J K M DG DG DG EC EC EC EE EH
56,000 pF 563 F G J K M ED ED ED EF
Capacitance Cap
Code
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 2 1 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0402 C0603 C0805 C1206
UD = Under development
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Capacitance Cap
Code
Series C0402 C0603 C0805 C1206
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Capacitance Tolerance Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
68,000 pF 683 F G J K M EF EF EF EH
82,000 pF 823 F G J K M EH EH EH EH
0.10 µF 104 F G J K M EH EH EH
Capacitance Cap
Code
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 2 1 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0402 C0603 C0805 C1206
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes)
Capacitance Cap
Code
Series C1210 C1808 C1812 C1825 C2220 C2225
Voltage Code 843512512512512312512
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1.0 – 1.6 pF 109 – 169 B CDK M FB FB FB FB FB FB
1.8 – 4.3 pF 189 – 439 B CDJ K M FB FB FB FB FB FB
4.7 – 9.1 pF 479 – 919 B CD G J K M FB FB FB FB FB FB
10 – 12 pF 100 – 120 B CD F G J K M FB FB FB FB FB FB
13 – 33 pF 130 – 330 CD F G J K M FB FB FB FB FB FB
36 – 62 pF 360 – 620 D F G J K M FB FB FB FB FB FB
68 – 91 pF 680 – 910 F G J K M FB FB FB FB FB FB
100 – 300 pF 101 – 301 F G J K M FB FB FB FB FB FB
330 – 430 pF 331 – 431 F G J K M FB FB FB FB FB FB LF LF LF
470 – 910 pF 471 – 911 F G J K MFB FB FB FB FB FB LF LF LF GB GB GB
1,000 pF 102 F G J K M FB FB FB FB FB FB LF LF LF GB GB GB
1,100 pF 112 F G J K M FB FB FB FB FB FB LF LF LF GB GB GB
1,200 pF 122 F G J K M FB FB FB FB FB FB LF LF LF GB GB GB
1,300 pF 132 F G J K M FB FB FB FB FB FC LF LF LF GB GB GB
1,500 pF 152 F G J K M FB FB FB FB FB FE LF LF LF GB GB GB
1,600 pF 162 F G J K M FB FB FB FB FB FE LF LF LF GB GB GB
1,800 pF 182 F G J K M FB FB FB FB FB FE LF LF LF GB GB GB
2,000 pF 202 F G J K M FB FB FB FB FC FE LF LF LF GB GB GB
2,200 pF 222 F G J K M FB FB FB FB FC FG LF LF LF GB GB GB
2,400 pF 242 F G J K M FB FB FB FB FC FC LF LF LF
2,700 pF 272 F G J K M FB FB FB FB FC FC LF LF LF GB GB GB
3,000 pF 302 F G J K M FB FB FB FB FC FF LF LF
3,300 pF 332 F G J K M FB FB FB FB FF FF LF LF GB GB GB
3,600 pF 362 F G J K M FB FB FB FB FF FF LF LF
3,900 pF 392 F G J K M FB FB FB FB FF FF LF LF GB GB GB HB HB HB
4,300 pF 432 F G J K M FB FB FB FB FF FF LF LF
4,700 pF 472 F G J K M FF FF FF FF FG FG LF LF GB GB GD HB HB HB KE KE KE
5,100 pF 512 F G J K M FB FB FB FB FG FG KE KE KE
5,600 pF 562 F G J K M FB FB FB FB FG FG GB GB GH HB HB HB KE KE KE
6,200 pF 622 F G J K M FB FB FB FB FG UD KE KE KE
6,800 pF 682 F G J K M FB FB FB FB FG UD GB GB GJ HB HB HB JE JE KE KE KE
7,500 pF 752 F G J K M FC FC FC FC FC UD KE KE KE
8,200 pF 822 F G J K M FC FC FC FC FC UD GB GH UD HB HB HB JE JE KE KE KE
Capacitance Cap
Code
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
Voltage Code 843512512512512312512
Series C1210 C1808 C1812 C1825 C2220 C2225
UD = Under development
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd
UD = Under development
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Capacitance Cap
Code
Series C1210 C1808 C1812 C1825 C2220 C2225
Voltage Code 843512512512512312512
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
9,100 pF 912 F G J K M FE FE FE FE FE UD KE KE KE
10,000 pF 103 F G J K M FF FF FF FF FF UD GB GH UD HB HB HE JE JE KE KE KE
12,000 pF 123 F G J K M FG FG FG FG FB UD GB GG UD HB HB HE JE JE KE KE KE
15,000 pF 153 F G J K M FG FG FG FG FB UD GB GB UD HB HB JE JE KE KE KE
18,000 pF 183 F G J K M FB FB FB FB FB UD GB GB UD HB HE JE JE KE KE
22,000 pF 223 F G J K M FB FB FB FB FB UD GB GB UD HB HE JE JB KE KE
27,000 pF 273 F G J K M FB FB FB FB FB UD GB GB UD HB HG JE JB KE KE
33,000 pF 333 F G J K M FB FB FB FB FB UD GB GB UD JB JB KE
39,000 pF 393 F G J K M FB FB FB FB FE UD GB GB UD JB JB
47,000 pF 473 F G J K M FB FB FB FB FE UD GB GB UD JB JB
56,000 pF 563 F G J K M FB FB FB FB FF GB GB UD JB JB
68,000 pF 683 F G J K M FB FB FB FC FG GB GB UD JB JB
82,000 pF 823 F G J K M FC FC FC FF FH GB GB UD JB JB
0.10 µF 104 F G J K M FE FE FE FG FM GB GD UD JB JB
0.12 µF 124 F G J K M FG FG FG FH GB GH JB JB
0.15 µF 154 F G J K M FH FH FH FM GD GN JB JB
0.18 µF 184 F G J K M FJ FJ FJ GH JB JD
0.22 µF 224 F G J K M FK FK FK GK JB JD
0.27 µF 274 F G J K M JB JF
0.33 µF 334 F G J K M JD JG
0.39 µF 394 F G J K M JG
0.47 µF 474 F G J K M JG
Capacitance Cap
Code
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
50
100
200
Voltage Code 843512512512512312512
Series C1210 C1808 C1812 C1825 C2220 C2225
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code Case
Size Thickness ±
Range (mm) Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50 ± 0.05
CB
0603
0.80 ± 0.07
DC
0805
0.78 ± 0.10
DD
0805
0.90 ± 0.10
DE
0805
1.00 ± 0.10
DF
0805
1.10 ± 0.10
DG
0805
1.25 ± 0.15
EB
1206
0.78 ± 0.10
EC
1206
0.90 ± 0.10
ED
1206
1.00 ± 0.10
EE
1206
1.10 ± 0.10
EF
1206
1.20 ± 0.15
EH
1206
1.60 ± 0.20
FB
1210
0.78 ± 0.10
FC
1210
0.90 ± 0.10
FE
1210
1.00 ± 0.10
FF
1210
1.10 ± 0.10
FG
1210
1.25 ± 0.15
FH
1210
1.55 ± 0.15
FM
1210
1.70 ± 0.20
FJ
1210
1.85 ± 0.20
FK
1210
2.10 ± 0.20
LF
1808
1.00 ± 0.15
GB
1812
1.00 ± 0.10
GD
1812
1.25 ± 0.15
GH
1812
1.40 ± 0.15
GG
1812
1.55 ± 0.10
GK
1812
1.60 ± 0.20
GJ
1812
1.70 ± 0.15
GN
1812
1.70 ± 0.20
HB
1825
1.10 ± 0.15
HE
1825
1.40 ± 0.15
HG
1825
1.60 ± 0.20
JB
2220
1.00 ± 0.15
JD
2220
1.30 ± 0.15
JE
2220
1.40 ± 0.15
JF
2220
1.50 ± 0.15
JG
2220
1.70 ± 0.15
KE
2225
1.40 ± 0.15
Thickness
Code Case
Size Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on nished chip thickness specications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
01005 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50
0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 2 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 2 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurement at 24 hours +/- 2 hours after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
Construction
Reference Item Material
ATermination
System
Finish SnPb (5% minimum)
B Barrier Layer Ni
CBase Metal Cu
DInner Electrode Ni
EDielectric Material CaZrO3
Note: Image is exaggerated in order to clearly identify all components of construction.
Capacitor Marking (Optional):
Laser Marking option is not available on C0G and Y5V dielectric devices. These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
Table 5 – Carrier Tape Con guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size Tape Size (W)* Lead Space (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance speci cations.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/-0.0 (0.059
+0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05 (0.079
±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm) 4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm) 12.1
(0.476)
14.25
(0.561)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10 (0.315
±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1 Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1019_C0G_SnPb_SMD • 10/5/2012 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, C0G Dielectric, 10 – 200 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 8 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC–286 and EIAJ 7201
Unit mm *Reference
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
68 ± 0.1
88 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
EIA Size
Code Metric Size
Code L Length W Width B Bandwidth S Separation
Minimum T Thickness Number of
Pieces/Cassette
0402 1005 1.0 ±0.05 0.5 ±0.05 0.2 to 0.4 0.3 0.5 ±0.05 50,000
0603 1608 1.6 ±0.07 0.8 ±0.07 0.2 to 0.5 0.7 0.8 ±0.07 15,000