AQY221
❍
2S
7
8. Soldering
When soldering this terminals, the following conditions are recommended.
(1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method (3) Double wave soldering method
T1
T2
T3
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
t1t2
T2
T1
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 40 s or less
T2
T1
t1t2t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
(4) Soldering iron method
Tip temperature: 280 to 300°C 536 to
572 °F
Wattage: 30 to 60 W
Soldering time: within 5 s
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surf ace of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
9. The following shows the packaging format
1) Tape and reel
Type Tape dimensions Dimensions of paper tape reel
SO package
4-pin type
(1)
When picked from 1/2-pin side: Part No.AQY
❍❍❍
SX (Shown adove)
(2) When picked from 3/4-pin side: Part No. AQY
❍❍❍
SZ
0.3±0.05
.012±.002
Tractor feed holes Direction of picking
7.2±0.1
.284±.004 1.75±0.1
.069±.004
1.55±0.05 dia.
.061±.002 dia.
2.8±0.3
.110±.012
Device mounted
on tape
5.5
±
0.1
.217
±
.004
4.7
±
0.1
.185
±
.004
12±0.1
.472±.004
1.55±0.1 dia.
.061±.004 dia.
4±0.1
.157±.004
2±0.1
.079±.004
12±0.3
.472±.012
2) Tube
(1) De vices are packaged in a tube so pin
No. 1 is on the stopper B side.
Observe correct orientation when mount-
ing them on PC boards.
(SOP type)
2) Storage
PhotoMOS relays implemented in SO
packages are sensitive to moisture and
come in sealed moisture-proof packages.
Observe the following cautions on storage.
• After the moisture-proof package is un-
sealed, take the de vices out of storage as
soon as possible (within 1 month at the
most).
• If the de vices are to be left in storage f or
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
10. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay. Han-
dle the outer and inner boxes with care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
11. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute maxi-
mum rating, internal elements will deteri-
orate because of the e xcessive v oltage or
current. In extreme cases, wiring may
melt, or silicon P/N junctions may be de-
stroyed.
As a result, the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
(Use at 15 VDC or lower and 9 VAC or
lower is recommended.)
12. Deterioration and destruction
caused by discharge of static electricity
This phenomenon is gener ally called static
electricity destruction. This occurs when
static electricity generated by various fac-
tors is discharged while the rela y terminals
are in contact. The result can produce in-
ternal destruction of the element.
To prev ent problems from static electricity,
the following precautions and measures
should be taken when using your device.
1) Employees handling relays should
wear anti-static clothing and should be
grounded through protective resistance
of 500 k
Ω
to 1 M
Ω
.
2) A conductive metal sheet should be
placed over the work table. Measuring in-
struments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also recom-
mended.)
4) Devices and equipment used in as-
sembly should also be grounded.
5) When packing printed circuit boards
and equipment, av oid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an elec-
trostatic charge.
6) When storing or transporting relays, the
environment should not be conducive to
generating static electricity (for instance,
the humidity should be between 45 and
60%). Relays should always be protected
by using non-conductive packing materials.
StopperB (green) StopperA (gray)
mm inch
9/14/2001 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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