MB05S
THRU
MB10S
0.5 Amp Single Phase
Glass Passivated
Bridge Rectifier
50 to 1000 Volts
Features
Mechanical Data
MCC
Part
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
MB05S MB05S 50V 35V 50V
MB1S MB1S 100V 70V 100V
MB2S MB2S 200V 140V 200V
MB4S MB4S 400V 280V 400V
MB6S MB6S 600V 420V 600V
MB8S MB8S 800V 480V 800V
MB10S MB10S 1000V 700V 1000V
Electrical Characteristics @ 25OC Unless Otherwise Specified
Average Forward
Current
IF(AV) 0.5 A(2)
0.8 A(3) See Fig.1
Peak Forward Surge
Current
IFSM 35A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
VF1.0V IFM = 0.4A;
TA = 25OC
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR
100uA
TA = 25
TA = 125
Typical Thermal
Resistance
RthJA
RthJA
RthJL
85/W(2)
70/W(3)
20/W(2)
per leg
Typical Junction
Capacitance
CJ 13pF Measured at
1.0MHz, VR=4.0V
Rating For Fusing I2t 5.0A2s t<8.30ms
Operating Junction
and Storage
Temperature Range
TJ
TSTG
-55to+150
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
MBS -1
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.252 .272 6.40 6.90
 6 2.70
.019 .031 0.50 0.80
.090 .106 2.30 2.70
.004 .008 0.10 0.20
.027 .043 0.70 1.10
.058 .062 1.47 1.57
.195 .205 4.95 5.21
B
C
D
A
F
G
H
E
+
-
K
J
M
N
C .150 .165 3.80 4.20
D .179 .195 4.55 4.95
Revision: B 2012/02/17
omponents
20736 Marilla Street Chatsworth
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MCC
0.272MAX.
(6.91MAX.)
0.105 (2.67)
0.095 (2.41)
0.030 MIN.
(0.76 MIN.)
0.023 MIN.
(0.58 MIN.)
Mounting Pad Layout
Glass Passivated Diode Construction
High Temperature Soldering Guaranteed:260 C/10 Second
Saves Space On Printed Circuit Board
Epoxy meets UL 94 V-0 flammability rating and MSL Rating 1
per J-STD-020C
Teminals: Plated leads Solderable per MIL-STD-750,Method 2026
www.mccsemi.com
1 of 3
O
C
5uA
O
C
O
C
O
C
O
C
O
C
M .039 .049 0.99 1.24
N .006 .016 0.15 0.41
TM
Micro Commercial Components
Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix
designates RoHS Compliant. See ordering information)
2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads
3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted
on 0.05 x 0.05”(1.3x 1.3mm) solder pad
~
~
-
+
Case Style
x UL Recognized File # E165989
o
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MB05S thru MB10S
Instantaneous Reverse Leakage Current - MicroAmperes versus
Percent Of Rated Peak Reverse Voltage - Volts%
Instantaneous Forward Current - Amperes versus
Instantaneous Forward Voltage - Volts
Figure 3
Typical Forward Characteristics
4
6
20
10
Amps
.4 .6 .8 1.0 1.2 1.4
.01
.02
.04
.06
.1
.2
.4
.6
1
2
25°C
Volts
Figure 2
Typical Reverse Characteristics
Volts%
4
6
20
10
µ
Am
p
s
20 120
40 60 80 100
.01
.02
.04
.06
.1
.2
.4
.6
1
2
TA=25°C
40
60
100
14
0
MCC
Revision: B 2012/02/17
1 100
4
0
10
20
30
8
Figure 5
Peak Forward Surge Current
Peak Forward Surge Current - Amperes versus
Number Of Cycles At 50Hz - Cycles
Amps
Cycles
261020 60 80
40
40
50
60
TM
Micro Commercial Components
www.mccsemi.com
2 of 3
Figure 1. Derating Curve for Output Rectified Current
020 40 60 80 100 120 140 160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Aluminum Substrate
Glass
Epoxy
P. C . B .
Resistive or Inductive Load
Average Forward Rectified Current (A)
Ambient Temperature (°C)
MCC
Revision: B 2012/02/17
TM
Micro Commercial Components
www.mccsemi.com
3 of 3
Ordering Information
Device Packing
(Part Number)-TP Tape&Reel;3Kpcs/Reel
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make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
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represented on our website, harmless against all damages.
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approval of Micro Commercial Components Corporation.
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