Distributed I/O device 6DL2804-xxxxx 1 ___________________ Introduction 2 ___________________ Safety information SIMATIC Distributed I/O Distributed I/O device 6DL2804-xxxxx 3 ___________________ Description 4 ___________________ Mounting 5 ___________________ Maintenance and servicing 6 ___________________ Technical specifications Hardware Installation Manual Ground points in the 7 ___________________ enclosure 8 ___________________ Dimension drawings 9 ___________________ ESD Guidelines 10 ___________________ Service and support 03/2014 A5E34318119 Legal information Warning notice system This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are graded according to the degree of danger. DANGER indicates that death or severe personal injury will result if proper precautions are not taken. WARNING indicates that death or severe personal injury may result if proper precautions are not taken. CAUTION indicates that minor personal injury can result if proper precautions are not taken. NOTICE indicates that property damage can result if proper precautions are not taken. If more than one degree of danger is present, the warning notice representing the highest degree of danger will be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property damage. Qualified Personnel The product/system described in this documentation may be operated only by personnel qualified for the specific task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified personnel are those who, based on their training and experience, are capable of identifying risks and avoiding potential hazards when working with these products/systems. Proper use of Siemens products Note the following: WARNING Siemens products may only be used for the applications described in the catalog and in the relevant technical documentation. If products and components from other manufacturers are used, these must be recommended or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and maintenance are required to ensure that the products operate safely and without any problems. The permissible ambient conditions must be complied with. The information in the relevant documentation must be observed. Trademarks All names identified by (R) are registered trademarks of Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their own purposes could violate the rights of the owner. Disclaimer of Liability We have reviewed the contents of this publication to ensure consistency with the hardware and software described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in this publication is reviewed regularly and any necessary corrections are included in subsequent editions. Siemens AG Industry Sector Postfach 48 48 90026 NURNBERG GERMANY Order number: A5E00378896F 06/2014 Subject to change Copyright (c) Siemens AG 2008 - 2014. All rights reserved Table of contents 1 2 3 4 Introduction ............................................................................................................................................. 5 1.1 Purpose of this documentation ...................................................................................................... 5 1.2 History ............................................................................................................................................ 5 Safety information ................................................................................................................................... 7 2.1 General information ....................................................................................................................... 7 2.2 Laws and directives ....................................................................................................................... 7 2.3 Qualified personnel ........................................................................................................................ 7 2.4 Measures ....................................................................................................................................... 8 Description .............................................................................................................................................. 9 3.1 Overview ........................................................................................................................................ 9 3.2 Area of application ......................................................................................................................... 9 3.3 Product features ...........................................................................................................................10 3.4 Structure of the type designation .................................................................................................11 3.5 Design of enclosure .....................................................................................................................12 3.6 Details of the enclosure ...............................................................................................................15 Mounting ............................................................................................................................................... 19 4.1 Transport and storage ..................................................................................................................20 4.2 Mounting the enclosure ................................................................................................................20 4.3 Installing the enclosure outdoors .................................................................................................22 4.4 Optional installation components .................................................................................................23 4.5 Use of I/O device at temperatures down to -40 C ......................................................................24 5 Maintenance and servicing .................................................................................................................... 27 6 Technical specifications ........................................................................................................................ 29 7 Ground points in the enclosure .............................................................................................................. 33 8 Dimension drawings .............................................................................................................................. 35 8.1 Installation: ET200iSP components .............................................................................................35 8.2 Installation: Heating .....................................................................................................................37 8.3 Installation: FO conductor ............................................................................................................38 9 ESD Guidelines .................................................................................................................................... 39 10 Service and support .............................................................................................................................. 41 Index..................................................................................................................................................... 43 Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 3 Table of contents Tables Table 6- 1 Technical specifications 6DL2804-xxDxx / xxExx / xxFxx / xxGxx .............................................. 29 Table 6- 2 Technical specifications 6DL2804-xMDxx / xMExx ..................................................................... 30 Table 6- 3 Technical specifications 6DL2804-xxKxx / xxTxx / xxUxx ........................................................... 31 Figures Figure 3-1 Standard enclosure 6DL2804-0xD...Gxx ..................................................................................... 12 Figure 3-2 Standard enclosure 6DL2804-0xH...Wxx, view 1 ........................................................................ 13 Figure 3-3 Standard enclosure 6DL2804-0xH...Wxx, view 2 ........................................................................ 14 Figure 4-1 Drilling template for securing the device ...................................................................................... 20 Figure 4-2 Temperature response with 100 W heater for 6DL2804-xxDxx / -xxExx ..................................... 24 Figure 4-3 Temperature response with 200 W heater for 6DL2804-xxKxx / -xxUxx ..................................... 25 Figure 7-1 Fixed and detachable connections to ground and equipotential bonding rail .............................. 33 Figure 8-1 Distributed I/O device 6DL2804-xxD...Gxx with installation of ET 200iSP .................................. 35 Figure 8-2 Distributed I/O device 6DL2804-xxH...Wxx with installation of ET200iSP ................................... 36 Figure 8-3 Distributed I/O device with installation of heating ........................................................................ 37 Figure 8-4 Distributed I/O device with installation of FO coupler: single and redundant designs ................. 38 Figure 9-1 Electrostatic voltages on an operator ........................................................................................... 40 Distributed I/O device 6DL2804-xxxxx 4 Hardware Installation Manual, 03/2014, A5E00378896F-03 1 Introduction 1.1 Purpose of this documentation This manual contains all the information that you will require to install and use the device. It is intended for persons who install the device mechanically, connect it electrically, set parameters and commission it, as well as for service and maintenance technicians. 1.2 History The most important changes in the documentation compared with the previous edition are shown in the following table. Edition Comment 01/2008 First edition 08/2009 * Troubleshooting * New functions (see technical specifications) * Update owing to new standards 03/2014 Content changes: Safety instructions, enclosure Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 5 Introduction 1.2 History Distributed I/O device 6DL2804-xxxxx 6 Hardware Installation Manual, 03/2014, A5E00378896F-03 Safety information 2.1 2 General information This device left the factory in a perfect state with regard to safety. To maintain this status and to ensure safe operation of the device, note and follow the instructions and warnings in this manual. 2.2 Laws and directives Observe the provisions of the test certification valid for your country. Electrical connection in potentially explosive atmospheres When making electrical connections, observe the national regulations and laws for hazardous areas valid for your country. In Germany, for example, the following apply: Ordinance on Industrial Safety and Health Standard relating to the installation of electrical systems in hazardous areas DIN EN 60079-14 (previously VDE 0165, T1) 2.3 Qualified personnel Qualified personnel are people who are familiar with the installation, mounting, commissioning, and operation of the product. These people have the following qualifications: They are authorized, trained or instructed in operating and maintaining devices and systems according to the safety regulations for electrical circuits, high pressures and aggressive as well as dangerous media. For devices intended for use in explosive atmospheres: They are authorized, trained, or instructed in working on electrical circuits for systems in potentially explosive atmospheres. They are trained or instructed in maintenance and use of appropriate safety equipment according to the safety regulations. They should be trained in first aid. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 7 Safety information 2.4 Measures 2.4 Measures In the interest of safety, observe the following precautionary measures: WARNING Type of protection "Flameproof enclosure d" Devices with "pressure-resistant encapsulation" protection may only be opened when the power has been disconnected. Type of protection "Intrinsic safety i" "Intrinsically-safe" devices lose their certification as soon as they are operated on circuits which do not correspond with the test certification valid in your country. Type of protection "Increased safety e" Devices with the type of protection "Increased safety" must not produce sparks or electric arcs during operation under normal conditions. Electrical equipment and parts must not exceed a rated voltage of 11 kV. Type of protection "Mold encapsulation m" Devices with the type of protection "Mold encapsulation" are potted in casting compound. Type of protection "By means of enclosure t" Devices with the type of protection "By means of enclosure" prevent the penetration of dust or reduce it to a harmless level. Explosive equipment can be installed. The temperature on the housing must not ignite the surrounding atmosphere. WARNING Use in environments with aggressive and dangerous media The device can be operated both at high pressure and with aggressive and hazardous media. Therefore, improper use of this device may lead to serious injury and or considerable damage to property. Above all, it must be noted when the device was in use and is to be exchanged. CAUTION Electrostatic sensitive devices This device contains electrostatic sensitive devices. ESD devices can be destroyed by voltages well below the threshold of human perception. These static voltages develop when you touch a component or electrical connection of a device without having discharged the static charges present on your body. The damage to a module as a result of overvoltage cannot usually be detected immediately. It may only become apparent after a long period of operation. Distributed I/O device 6DL2804-xxxxx 8 Hardware Installation Manual, 03/2014, A5E00378896F-03 3 Description 3.1 Overview The device is used as a control, switching and distribution unit in hazardous areas (gas: Zones 1, 2; dust: 21, 22; mining: M2). The product satisfies the requirements of the following standards EN/IEC 60079-0 General requirements EN/IEC 60079-7 Enhanced safety EN/ICE 60079-31 Protection by means of enclosure The device consists of the wall-mounted enclosure and the components installed in it, for each of which there are separate certificates. The device is also identified by the standards of the installed components. The supplied ATEX certificate applies to the device and to the components installed by the manufacturer. 3.2 Area of application The wall-mounted enclosure is suitable for installation and operation of distributed I/Os, e.g. ET 200iSP or ET 200, in the following hazardous areas: - Device group I (mining, M2) - Device group II (Zones 1 + 2 gas, and Zones 21 + 22 dust) The device consists of the wall-mounted enclosure (6DL2804-0xxxx) and the installed electronic components. The device has been tested and certified for use in these hazardous areas. Note Product information on the Internet You will find further information on installing and connecting the electronic components, for example in: * ET 200iSP manual (A5E00247482) * Principles of explosion protection manual (6ES7398-8RA00-8BA0) This information is available on the Internet on the Siemens home page. Only open the enclosure in Zones 21 and 22 if no ignitable dust atmosphere is present. The device is identified depending on: - The installed components - Use for the following hazardous areas: gas, dust or mining Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 9 Description 3.3 Product features 3.3 Product features The device consists of a separately certified wall-mounted enclosure (6DL2804-0xxxx). The enclosure is made of stainless steel and is intended for wall mounting. The device is intended for the installation of control and measuring devices such as: Distributed I/O systems: - ET 200iSP for use in Zones 1 and 2 (gas), Zones 21 and 22 (dust), and M2 (mining) Modular electro-pneumatic automation system AirLine Ex (type 8650, from the company Burkert) Buffer stages and safety barriers Relays, buffer elements and fuses Separate terminals for intrinsically safe and non-intrinsically safe circuits Command and signaling devices Temperature sensors Heating and thermostat Lightning protection components FO coupler Distributed I/O device 6DL2804-xxxxx 10 Hardware Installation Manual, 03/2014, A5E00378896F-03 Description 3.4 Structure of the type designation 3.4 Structure of the type designation The device has type designation: The enclosure sizes D...G have a cover which pivots upwards by means of gas-filled dampers. The enclosure sizes H...W have doors with right-hand hinges (close on left). Z***: This additional data (e.g. ZA01, ZA02, ...) serves to identify design versions which are not included in the data positions of the type designation. The additional data is only specified if required. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 11 Description 3.5 Design of enclosure 3.5 Design of enclosure Standard enclosure 6DL2804-0xD...Gxx Mounting plate Drainage/pressure compensation nozzle Equipotential bonding rail with terminals M16 or M20 cable glands Figure 3-1 M20 cable glands M32 cable glands M6 grounding screw Removable connection to enclosure ground Standard enclosure 6DL2804-0xD...Gxx W x H x D: See Structure of the type designation (Page 11) Distributed I/O device 6DL2804-xxxxx 12 Hardware Installation Manual, 03/2014, A5E00378896F-03 Description 3.5 Design of enclosure Standard enclosure 6DL2804-0xH...Wxx Figure 3-2 Standard enclosure 6DL2804-0xH...Wxx, view 1 Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 13 Description 3.5 Design of enclosure Mounting plate Equipotential bonding rail with terminals Drainage/pressure compensation nozzle M16 or M20 cable glands *) M32 cable glands *) Removable connection to enclosure ground Optional power supply terminals M6 grounding screw M20 cable glands *) *) The size and number of cable glands can be defined specific to the project. Figure 3-3 Standard enclosure 6DL2804-0xH...Wxx, view 2 Distributed I/O device 6DL2804-xxxxx 14 Hardware Installation Manual, 03/2014, A5E00378896F-03 Description 3.6 Details of the enclosure 3.6 Details of the enclosure Degree of protection The degree of protection depends on the enclosure size and the parts used such as cable entries, dummy plugs and climate nozzles. The nameplate specifies the degree of protection for which the enclosure is designed. The minimum degrees of protection are: Device group I: IP54/IP55 Device group II: IP54 to IP66 (Zones 1 + 2) Device group II: IP64 to IP66 (Zones 21 + 22) Operating temperature The operating temperature range of the enclosure depends on the temperature range of the parts used, and can differ from the actual operating temperature range: -40 C to +75 C: only for the enclosure versions 6DL2804-0xxx1 0 C to +75 C The nameplate specifies the permissible operating temperature range in each case. Prior to installation of components, check the operating temperature range of the complete setup. The operating temperature range for the complete setup may be limited by the maximum permissible operating temperature of the components and the dissipated heat produced in the enclosure. Climate nozzles provide pressure compensation and drainage in the event of varying climatic conditions. In the case of aggressive environments, check whether use of the enclosure is possible with the material in question. Delivery of enclosures with appropriate surface protection is possible for use with aggressive environmental conditions. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 15 Description 3.6 Details of the enclosure Cable and wiring entries (CWE) When fitting cables, observe the manufacturer's data on the tightening torques of the cable and wiring entries. Use the tightening torque of the clamping screw when connecting the cables. Relieve the tension on the cables outside the enclosure so that the cable gland is not stressed. For additional information and technical specifications, refer the respective manufacturer documentation, in particular: - Technical specifications, clamping ranges for cables - Notes on use, installation, mounting, commissioning and maintenance Note Use the supplied red dummy plugs to close any cable glands not in use. Only then is it ensured that the degree of protection is retained. Equipotential bonding rail The equipotential bonding rail (10 x 3 mm) with terminals (up to 4 mm) is used to contact the cable shields. Alternatively, you can also use other terminals here, e.g. KLBuCo from the company Weidmuller (not included in the scope of delivery) Connect the equipotential bonding wire to the bonding terminal (0.75 to 35 mm). Short lines connect the equipotential bonding rail to the mounting plate and thus to the enclosure. In cases where the ground and equipotential bonding conductors are installed separately, this connection can be disconnected. Note Also observe the installation guidelines in the ET200iSP operating instructions, Section 5.2 "Using ET 200iSP with equipotential bonding". Wall supports Screw the wall supports onto the enclosures using M6/M8 screws depending on the enclosure size. These are included with the enclosure accessories. To secure the enclosure, use 8 mm diameter screws and lock washers. Grounding connection The M6/M8 ground connection screw is used for the PE conductor; use a cable with lug for this. To prevent the screw from becoming loose, make sure you use the lock washer. Connecting the grounding cable avoids static charge which is important, in particular, for dust explosion protection. Distributed I/O device 6DL2804-xxxxx 16 Hardware Installation Manual, 03/2014, A5E00378896F-03 Description 3.6 Details of the enclosure Installed components The enclosure nameplate specifies the parameters within which the installed components can be used. Observe the following if you subsequently connect equipment and the required cables on site: Read and observe the manufacturer's instructions, especially notes, warnings and information on special features. Electrical equipment as well as combinations of equipment can impair the intrinsic safety of the circuits as a result of their electrical parameters. Prior to installing equipment, check that the intrinsic safety of the circuit is still guaranteed. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 17 Description 3.6 Details of the enclosure Distributed I/O device 6DL2804-xxxxx 18 Hardware Installation Manual, 03/2014, A5E00378896F-03 4 Mounting Note * When installing control and measuring devices in the Ex enclosure, keep to the instructions in the relevant product descriptions and the technical specifications in the data sheets. * All control and measuring devices installed in the enclosure must be separately certified for the relevant hazardous zone. * Run the tests prescribed in the relevant national regulations for the installed control and measuring devices. Note * Install and operate the distributed I/O device in hazardous areas according to the specifications of the EC-type examination certificate according to ATEX and these operating instructions or the standards and directives valid in your country. * Assembly, installation, commissioning and maintenance may only be performed by qualified personnel. * The devices and installed components must only be used for their intended purpose. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 19 Mounting 4.1 Transport and storage 4.1 Transport and storage Pack and store the enclosure for transport or storage so that there can be no undue strain on the enclosure, particularly on its top cover. If there is too much strain on the top cover of the enclosure, this can damage the seal. Do not place the enclosure on the cable glands fitted in its base, otherwise the glands will be damaged. 4.2 Mounting the enclosure The enclosure is intended for wall mounting and should be secured with the wall supports supplied with it. Use the following template for the drilling. Figure 4-1 Drilling template for securing the device CAUTION Danger of injury when the enclosure is opened When opening the enclosure with pivoting cover, the cover is pressed upwards by means of the pressure of the dampers. When opening, press against the cover with your hand. Note * Remember the maximum thermal load on the cables and wiring. The degree of protection is only ensured when suitable cables and wires are used and correctly installed. * Note that it is only permitted to connect and disconnect the cables to the power supply module if the module has been powered down. * The degree of protection is reduced when the enclosure is mounted vertically. Distributed I/O device 6DL2804-xxxxx 20 Hardware Installation Manual, 03/2014, A5E00378896F-03 Mounting 4.2 Mounting the enclosure Procedure 1. To open the enclosure, unlock using a double-bit key (included with the enclosure). Hold the cover firmly while unlocking to make sure that it does not spring up as a result of the pressure of the dampers. 2. Mount the wall support (included in the enclosure accessories) to the rear panel of the enclosure in accordance with Fig. 4-1. Secure the enclosure using 8 mm diameter screws and lock washers at the location of use. 3. Install and secure the cables entering the enclosure and make sure they have adequate strain relief. The cable entry may only be used for strain relief if suitable cable glands are used. 4. Route the cables from below through the associated glands and tighten the clamping screw of the gland at the torque specified in the manufacturer's instructions. 5. Make a short connection between the cable screen and the equipotential bonding rail. 6. If you remove the the detachable connections between equipotential bonding rail and mounting plate, you can install the bonding rail ungrounded if required (see Figure 3-1 Standard enclosure 6DL2804-0xD...Gxx (Page 12)). 7. Route and connect in accordance with EN 60079-11: - The power supply cable - The bus cable - The signal cables In hazardous areas, the installation regulations according to EN 60079-14 and the national regulations must also be observed. 8. If you replace installed components, follow the instructions in the manufacturer's description of the device. See also Design of enclosure (Page 12) Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 21 Mounting 4.3 Installing the enclosure outdoors 4.3 Installing the enclosure outdoors The enclosure should have at least IP56 protection when installing outdoors. This prevents damaging amounts of dirt or water from penetrating the enclosure under normal ambient conditions. Take the following additional protective measures depending on the environment of the installation location: Avoid subjecting the enclosure permanently to water (for example, snow). Remember that direct sunlight can cause excessive temperatures in the interior of the enclosure. In locations where this can occur, provide additional protection with some form of roofing. Note that opening the enclosure at ambient temperatures below 0 C can damage the seal as a result of freezing. Condensation may be produced within the enclosure due to temperature variations. Climate nozzles are therefore installed to permit drainage and pressure compensation. Ensure when mounting the enclosure that the climate nozzles are at the lowest position. If you want to use the device in an aggressive environment, check whether this is possible with the material in question. Distributed I/O device 6DL2804-xxxxx 22 Hardware Installation Manual, 03/2014, A5E00378896F-03 Mounting 4.4 Optional installation components 4.4 Optional installation components The following separately certified components can be installed optionally: Terminals: - Ex e for the connection of cable cross-sections >4 mm, - Ex i for wiring of intrinsically safe signals (blue); these may only be used for Ex i signals. Make sure when arranging intrinsically safe and non-intrinsically safe terminals that they are separated ("thread measure") by at least 50 mm. Temperature sensors: For monitoring the temperature inside the enclosure, Relays, disconnectors and fuses: For interrupting, switching or protecting individual signal circuits. Command and signaling devices: For manual switching (control switch) or optical display (indicator lamps) in the enclosure wall. FO couplers: For connecting the PROFIBUS of the ET 200iSP by means of FO cable Lightning protection components: For protecting the ET 200iSP components from lighting strikes when the enclosure is installed in exposed locations. Heater: To prevent condensation in the enclosure at low temperatures, it is recommendable to install a heater. The heater must be dimensioned in accordance with the enclosure size. A heater permits operation of the devices at temperatures below -20 C. Note If components with a supply voltage of 120 / 230 V AC are installed, you must fuse these devices according to DIN 41571 and/or IEC 60127 or in accordance with the manufacturer's data. Modular electro-pneumatic automation system AirLine Ex (type 8650, from the company Burkert): Connected to the ET 200iSP components to form an automation system for processing electrical and pneumatic variables. When connecting and operating, observe the manufacturer's descriptions and manuals. When installing a pneumatic system, exit the air passing through the exhaust connections out of the enclosure. NOTICE Damage to seal or screwed glands Make sure that the vent of the pneumatic system does not blow directly into the enclosure. The pressure resulting in the enclosure would otherwise damage the seal and screwed glands, and the degree of protection would no longer be provided. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 23 Mounting 4.5 Use of I/O device at temperatures down to -40 C 4.5 Use of I/O device at temperatures down to -40 C You must install a heater in the enclosure in order to operate the devices at temperatures down to -40 C. Note the following: When using a closed enclosure, only switch the installed components on following a specific warming-up time which depends on the enclosure size and heating power: With enclosure types 6DL2804-xxDxx and -xxExx, the warming-up time is at least 2 hours. With enclosure types 6DL2804-xxKxx and -xxUxx, the warming-up time is at least 3 hours. Figure 4-2 Temperature response with 100 W heater for 6DL2804-xxDxx / -xxExx Temperature response inside the enclosure following switching-on of the heater at an outdoor temperature of -40 C. After > 2 hours, the internal temperature is above the minimum permissible operating temperature of the installed components of -20 C. Distributed I/O device 6DL2804-xxxxx 24 Hardware Installation Manual, 03/2014, A5E00378896F-03 Mounting 4.5 Use of I/O device at temperatures down to -40 C Figure 4-3 Temperature response with 200 W heater for 6DL2804-xxKxx / -xxUxx Temperature response inside the enclosure following switching-on of the heater at an outdoor temperature of -40 C. After > 3 hours, the internal temperature is above the minimum permissible operating temperature of the installed components of -20 C. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 25 Mounting 4.5 Use of I/O device at temperatures down to -40 C Distributed I/O device 6DL2804-xxxxx 26 Hardware Installation Manual, 03/2014, A5E00378896F-03 Maintenance and servicing 5 Select maintenance cycles so that problems can be recognized in good time. Check the following: - The device for visible damage - That the permitted temperatures are not exceeded - That the cables are securely connected, - Damage to cable and wiring entries - Enclosure gaskets for cracks and damage - Bonding of seal on the enclosure cover and at the bonding positions - Surface of seal for damage If the seal is damaged, replace the complete cover if necessary. If there is damage to the enclosure, there is a risk that the degree of protection is no longer valid. In some cases, this might necessitate replacement of the enclosure. If there is damage to cable and wiring entries, only replacement with original parts is permitted. Check regularly, once a year, that the cable and line entries are securely in place and properly sealed. Check the tightening torques. If necessary, re-tighten the glands to the torques specified by the manufacturer. For information on the torques, refer to the respective manufacturer documentation. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 27 Maintenance and servicing Distributed I/O device 6DL2804-xxxxx 28 Hardware Installation Manual, 03/2014, A5E00378896F-03 6 Technical specifications Table 6- 1 Technical specifications 6DL2804-xxDxx / xxExx / xxFxx / xxGxx 6DL2804- xxDxx xxExx Wall-mounted enclosure xxGxx Type 6DL2804-0xxxx, DMT 02 ATEX E 249 U Ex marking Degree of protection xxFxx See Ex marking IP54 to IP66 1) Dimensions: W x H x D 650 x 450 x 230 Material Weight [kg] 950 x 450 x 230 650 x 450 x 350 950 x 450 x 350 Stainless steel: DIN 1.4404, plate thickness 1.5 mm 30 43 31 Cover seal 43 Silicone rubber Cable entries for Voltage (cable-O in mm) 2 M32 Ex e (13 to 21) Bus (cable-O in mm) Signals (cable-O in mm) 4 M20 Ex e (6 to 13) M16 (4 to 9) M16 (4 to 9) M20 (6 to 13) M20 (6 to 13) 3 rows (xxx3x) 39 66 36 57 5 rows (xxx5x) 65 110 60 95 Equipotential bonding rail Bonding terminals 3 x 10 mm Cu 0.75 to 35 mm Ex e for equipotential bonding cable, 4 mm for shield connection Protective conductor connector Rated voltage/current 2) M6 screw, at least 16 mm These values depend on the installed components. Operating temperature range 6DL2804-1xxxx with installation of ET200iSP 6DL2804-1xxx1 with installation and heater 6DL2804-2xxxx with installation of ET200iSP and electro-pneumatic system AirLine Ex Typ 8650 Permissible humidity -20 C to +xx C3) -40 C to +xx C3) 4) 0 C to +xx C3) Max. 95% 1) The degree of protection of the enclosure depends on that of the installed parts and the enclosure size. 2) The actual electrical values depend on the electrical equipment installed. The manufacturer specifies the final values within the framework of these limits. 3) The specified permissible operating temperature range is only valid if the enclosure is installed horizontally. A vertical installation can reduce the maximum permissible temperature (for information on this refer also to the ET200iSP manual). The max. operating temperature is defined depending on the dissipated heat of the installed components, and specified on the nameplate. Note that the operating temperature of the complete setup must be checked again if further components are subsequently fitted. 4) The temperature range of -40 C only applies to the enclosure types 6DL2804-1xxx1 (metal cable entries). Installation of a heater is required for this. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 29 Technical specifications Table 6- 2 Technical specifications 6DL2804-xMDxx / xMExx 6DL2804- xMDxx xMExx Wall-mounted enclosure Type 6DL2804-0xxxx, DMT 02 ATEX E 249 U Ex marking See Ex marking Degree of protection 1) Dimensions: W x H x D Material IP54/IP55 650 x 450 x 230 950 x 450 x 230 Stainless steel: DIN 1.4404, plate thickness 1.5 mm Weight [kg] 35 39 Cover seal Silicone rubber Cable entries for Voltage (cable-O in mm) 6 M25 (Ex e) (9 to 12 ) Bus (cable-O in mm) Signals (cable-O in mm) M32 (18 to 21) M32 (18 to 21) 3 / 1 row (1Mxxx) 6 9 5 / 2 rows (1Mxxx) 12 18 Equipotential bonding rail Bonding terminals Protective conductor connector Rated voltage/current 3 x 10 mm Cu 0.75 to 35 mm Ex e for equipotential bonding cable, 4 mm for shield connection 2) M6 screw, at least 16 mm These values depend on the installed components. Operating temperature range 6DL2804-1xxxx with installation of ET200iSP Permissible humidity -20 C to +xx C3) Max. 95% 1) The degree of protection of the enclosure depends on that of the installed parts and the enclosure size. 2) The actual electrical values depend on the electrical equipment installed. The manufacturer specifies the final values within the framework of these limits. 3) The specified permissible operating temperature range is only valid if the enclosure is installed horizontally. A vertical installation can reduce the maximum permissible temperature (for information on this refer also to the ET200iSP manual). The max. operating temperature is defined depending on the dissipated heat of the installed components, and specified on the nameplate. Note that the operating temperature of the complete setup must be checked again if further components are subsequently fitted. Distributed I/O device 6DL2804-xxxxx 30 Hardware Installation Manual, 03/2014, A5E00378896F-03 Technical specifications Table 6- 3 Technical specifications 6DL2804-xxKxx / xxTxx / xxUxx 6DL2804- xxKxx xxTxx Wall-mounted enclosure xxUxx Type 6DL2804-0xxxx, DMT 02 ATEX E 249 U Ex marking See Ex marking Degree of protection 1) IP54 to IP66 Dimensions [mm]: WxHxD 800 x 800 x 300 Material 1 000 x 1 000 x 300 1 000 x 1 200 x 300 Stainless steel: DIN 1.4301, plate thickness: 1.5 mm with edge length up to 800 mm, 2.0 mm with edge length 1 000 mm or more Weight [kg] 65 92 Cover seal 100 Silicone rubber Cable entries Made of plastic or metal; size and number depending on requirements Equipotential bonding rail 3 x 10 mm galvanized Cu with terminals 4 to 35 mm Protective conductor connector M8 screw, at least 16 mm with cable lug Rated voltage/current 2) Max. 1 000 V / 100 A Operating temperature range 3) -20 C to +xx C or -40 C to +xx C4)or 0 C to xx C Permissible humidity Max. 95% 1) The degree of protection of the enclosure depends on that of the installed parts and the enclosure size. 2) The actual electrical values depend on the electrical equipment installed. The manufacturer specifies the final values within the framework of these limits. 3) The specified permissible operating temperature range is only valid if the enclosure is installed horizontally. A vertical installation can reduce the maximum permissible temperature (for information on this refer also to the ET200iSP manual). The max. operating temperature is defined depending on the dissipated heat of the installed components, and specified on the nameplate. Note that the operating temperature of the complete setup must be checked again if further components are subsequently fitted. 4) The temperature range of -40 C only applies to the enclosure types 6DL2804-1xxx1 (metal cable entries). Installation of a heater is required for this. Ex marking II 2 (1) G Ex e d ib [ia Ga] IIC T4 Gb (with heater T3) or II 2 (1) G Ex e d mb ib [ia Ga] [ia op is Ga] IIC T4 Gb (with heater T3) or II 2 (1) D Ex tb [ia IIIC Da] IIIC T130C Db or II 2 (1) D Ex tb [ia IIIC Da] [Ex ia Da] IIIC T130C Db I M2 Ex e d ib [ia Ga] I Mb or I M2 Ex e d mb ib [ia Ga] I Mb Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 31 Technical specifications Distributed I/O device 6DL2804-xxxxx 32 Hardware Installation Manual, 03/2014, A5E00378896F-03 7 Ground points in the enclosure Fixed galvanic electrical clamp or screw connection inside enclosure Power supply terminal module with componentry IM / EM terminal module with IM componentry (IM = interface module, EM = electronic module) EM / EM terminal module (EM = electronic module) Mounting plate Mounting rail Equipotential bonding rail with terminals Figure 7-1 Cable connection can be disconnected inside enclosure Connection from the equipotential bonding rail to the enclosure Cable for signal lines shield on equipotential bonding rail PROFIBUS cable to IM Bonding cable Power supply (line to power supply) M6 grounding connection external Fixed and detachable connections to ground and equipotential bonding rail Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 33 Ground points in the enclosure Distributed I/O device 6DL2804-xxxxx 34 Hardware Installation Manual, 03/2014, A5E00378896F-03 8 Dimension drawings 8.1 Installation: ET200iSP components Power supply (PS) terminal module IM/EM terminal module with IM component (IM = interface module, EM = electronic module) EM/EM terminal module with I/O component (I/O = input/output) Termination module Mounting rail Figure 8-1 Equipotential bonding rail with terminals Cable entry for signal lines M16 (4 to 9 mm) or M20 (6 to 13 mm) Cable and wiring entry for PROFIBUS M20 Screw gland for pressure/climate compensation Cable and wiring entry for power supply M32 (13 to 21 mm) Distributed I/O device 6DL2804-xxD...Gxx with installation of ET 200iSP Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 35 Dimension drawings 8.1 Installation: ET200iSP components Cable duct Mounting plate Equipotential bonding rail with terminals Cable glands Figure 8-2 Venting nozzle PE connection Removable connection to enclosure ground Optional power supply terminals Distributed I/O device 6DL2804-xxH...Wxx with installation of ET200iSP Distributed I/O device 6DL2804-xxxxx 36 Hardware Installation Manual, 03/2014, A5E00378896F-03 Dimension drawings 8.2 Installation: Heating 8.2 Installation: Heating Heating Thermostat Infeed terminals Figure 8-3 Distributed I/O device with installation of heating Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 37 Dimension drawings 8.3 Installation: FO conductor 8.3 Installation: FO conductor FO coupler Terminals for power supply and distribution 24 V DC Figure 8-4 Distributed I/O device with installation of FO coupler: single and redundant designs Distributed I/O device 6DL2804-xxxxx 38 Hardware Installation Manual, 03/2014, A5E00378896F-03 ESD Guidelines 9 What does ESD mean? All electronic modules are equipped with large-scale integrated ICs or components. Due to their design, these electronic elements are highly sensitive to overvoltage, and thus to any electrostatic discharge. The electrostatic sensitive components/modules are commonly referred to as ESD devices. This is also the international abbreviation for such devices. ESD modules are identified by the following symbol: NOTICE ESD devices can be destroyed by voltages well below the threshold of human perception. These static voltages develop when you touch a component or electrical connection of a device without having discharged the static charges present on your body. The electrostatic discharge current may lead to latent failure of a module, that is, this damage may not be significant immediately, but in operation may cause malfunction. Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 39 ESD Guidelines Electrostatic charging Every person without a conductive connection to the electrical potential of his/her surroundings can be electrostatically charged. The figure below shows the maximum electrostatic charge that can build up on a person coming into contact with the materials indicated. These values correspond to IEC 801-2 specifications. Figure 9-1 Electrostatic voltages on an operator Basic protective measures against electrostatic discharge Ensure good equipotential bonding: When handling electrostatic sensitive devices, ensure that your body, the workplace and packaging are grounded. This prevents electrostatic charge. Avoid direct contact: As a general rule, only touch electrostatic sensitive devices when this is unavoidable (e.g. during maintenance work). Handle the modules without touching any chip pins or PCB traces. In this way, the discharged energy can not affect the sensitive devices. Discharge your body before you start taking any measurements on a module. Do so by touching grounded metallic parts. Always use grounded measuring instruments. Distributed I/O device 6DL2804-xxxxx 40 Hardware Installation Manual, 03/2014, A5E00378896F-03 Service and support 10 Local information If you have questions about the products described in this document, you can find help at: http://www.siemens.com/automation/partner Technical documentation for SIMATIC products Further documentation for SIMATIC products and systems can be found at: http://www.siemens.de/simatic-tech-doku-portal Easy shopping with the A&D Mall Catalog & online ordering system: http://www.siemens.com/automation/mall Training All the training options are listed at: http://www.siemens.com/sitrain Find a contact at: Phone: +49(911) 895-3200 Technical support Tel +49 180 5050 222 Fax +49 180 5050 223 http://www.siemens.com/automation/service You will find support request web form at: http://www.siemens.de/automation/support-request If you contact customer support, please have the following information available for the technician: Order No. (MLFB) of the device Online support Product information, support and service, right through to the technical forum, can be found at: http://www.siemens.com/automation/service&partner Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 41 Service and support Distributed I/O device 6DL2804-xxxxx 42 Hardware Installation Manual, 03/2014, A5E00378896F-03 Index B G Bus cable, 21 Guidelines ESD guidelines, 39 C Cycles Maintenance, 27 H History, 5 D I Damage, 27 Dimension drawing I/O device 6DL2804-xxD...Gxx, 35 I/O device 6DL2804-xxH...Wxx, 36 Installation FO conductor, 38 Installation of heater, 37 Distributed I/O ET 200, 9 ET 200iSP, 9 Distributed I/O systems Buffer elements, 10 Buffer stages, 10 Command and signaling devices, 10 Electro-pneumatic automation system, 10 ET 200iSP, 10 ET 200M, 10 ET 200S, 10 Fuses, 10 Heating, 10 Lightning protection components, 10 Relay, 10 Safety barriers, 10 Temperature sensors, 10 Terminals, 10 Double-bit key, 21 Drilling template for securing the device, 20 Increased safety, 8 Installed electronic components, 9 Intrinsic safety, 8 E EC type examination certificate, 19 Enclosure Design, 12 Environmental conditions, 22 ESD guidelines, 39 M Maintenance Cycles, 27 Maintenance technicians, 5 Media Aggressive, 8 Dangerous, 8 Modules Electrostatic sensitive, 8 Mold encapsulation, 8 O Online support, 41 Optional components, 23 P Power supply cable, 21 Pressure-resistant encapsulation, 8 Principles Protection against explosion, 9 Product information, 9 Protection against explosion Principles, 9 Distributed I/O device 6DL2804-xxxxx Hardware Installation Manual, 03/2014, A5E00378896F-03 43 Index Q Qualified personnel, 7 S Safety precautions, 8 Seal, 20 Service technicians, 5 Signal line, 21 Storage, 20 T Technical specifications I/O device, 29, 30 Technical support, 41 Test certification, 7 The Ordinance on Industrial Safety and Health, 7 Training, 41 Transport, 20 Type of protection By means of enclosure, 8 Increased safety, 8 Intrinsic safety, 8 Mold encapsulation, 8 Pressure-resistant encapsulation, 8 W Wall mounting, 20 Wall-mounted enclosure, 9, 10 Distributed I/O device 6DL2804-xxxxx 44 Hardware Installation Manual, 03/2014, A5E00378896F-03