17
50 28.3 29.9
24.5 25.55
FPC Connector
FP-5A Series 0.5mm Spacing (SMT)
Features
1. It is possible to correspond to an upper or lower
contact by changing the cover.
2. Upper or lower contact constructed dual so it
makes higher lifted circuit strength.
3. Of the ZIF structure.
4. Only 2.0mm high when mounted.
5. Supplied in emboss-tape packaging for automatic
mounting.
Specifications
1. Rating : 0.5A, 50V AC/DC
2. Contact Resistance : 30m, max., initially
3. InsuIation Resistance : 100M, min. at 100V DC
4. Withstanding Voltage : 100V AC for one minute
5. Operating Temperature Range : –40˚C to +85˚C
Material and Plating
Housing : Polyamide 9T (PA9T), Black, 94V-0
Cover : Polyphenylene Sulfide (PPS),
Upper Contact-Beige, 94V-0
Lower Contact-Brown, 94V-0
Contact : Phosphor Bronze, Au Plating
Upper Contact Type CFP48 -0150F
No. of Pins
0.5
0.5 0.2
(n–1)×0.5=A
0.55.350.15
2
A+3.8=B
A+5.4=C
0.2
(n–1)×0.5=A
A+1.05=D
4.35
1.4
0.35
0.18
0.18
1.35
No. of Pins
A B C
30 18.3 19.914.5
40 23.3 24.919.5
D
15.55
20.55
50 28.3 29.924.5 25.55
No. of Pins
A B C
30 18.3 19.914.5
40 23.3 24.919.5
D
15.55
20.55
Lower Contact Type CFP47 -0150F
No. of Pins
0.5
0.5 0.2
(n–1)×0.5=A
0.5
5.35
1.75
0.15
A+3.8=B
A+5.4=C
0.2
(n–1)×0.5=A
2
A+1.05=D
4.35
1.4
1
0.35
0.18
0.18
P.C. Board Dimension
0.5±0.02 0.3±0.03
A±0.03
0.3±0.03
4.4 0
–0.1
6.4+0.1
0
Applicable FPC Dimension
(t=0.3±0.05)
0.5
2.5min
4min
±0.02 0.35 +0.04
0.5 ±0.1
–0.03
A ±0.03
(A+1.0) ±0.05
FPC plating to recommend : Au plating