1. General description
74HC1G08 and 74HCT1G08 are high-speed, Si-gate CMOS devices. They provide a
2-input AND function.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
The standard output currents are half those of the 74HC08 and 74HCT08.
2. Features
nSymmetrical output impedance
nHigh noise immunity
nLow power dissipation
nBalanced propagation delays
nSOT353-1 and SOT753 package options
3. Ordering information
4. Marking
74HC1G08; 74HCT1G08
2-input AND gate
Rev. 04 — 17 July 2007 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC1G08GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads;
body width 1.25 mm SOT353-1
74HCT1G08GW
74HC1G08GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753
74HCT1G08GV
Table 2. Marking codes
Type number Marking
74HC1G08GW HE
74HCT1G08GW TE
74HC1G08GV H08
74HCT1G08GV T08
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 2 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
5. Functional diagram
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 1. Logic symbol Fig 2. IEC logic symbol
mna113
B
AY
2
14
mna114
24
&
1
Fig 3. Logic diagram
mna115
B
A
Y
Fig 4. Pin configuration
74HC1G08
74HCT1G08
BV
CC
A
GND Y
001aaf102
1
2
3
5
4
Table 3. Pin description
Symbol Pin Description
B 1 data input
A 2 data input
GND 3 ground (0 V)
Y 4 data output
VCC 5 supply voltage
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 3 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
7. Functional description
8. Limiting values
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
9. Recommended operating conditions
Table 4. Function table
H = HIGH voltage level; L = LOW voltage level
Input Output
ABY
LLL
LHL
HLL
HHH
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
[1]
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7.0 V
IIK input clamping current VI < −0.5 V or VI>V
CC + 0.5 V - ±20 mA
IOK output clamping current VO<−0.5 V or VO>V
CC + 0.5 V - ±20 mA
IOoutput current −0.5 V < VO <V
CC + 0.5 V - ±12.5 mA
ICC supply current - 25 mA
IGND ground current −25 - mA
Tstg storage temperature −65 +150 °C
Ptot total power dissipation Tamb = −40 °C to +125 °C[2] - 200 mW
Table 6. Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 74HC1G08 74HCT1G08 Unit
Min Typ Max Min Typ Max
VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
VIinput voltage 0 - VCC 0-V
CC V
VOoutput voltage 0 - VCC 0-V
CC V
Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C
∆t/∆V input transition rise
and fall rate VCC = 2.0 V - - 625 - - - ns/V
VCC = 4.5 V - - 139 - - 139 ns/V
VCC = 6.0 V - - 83 - - - ns/V
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 4 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
10. Static characteristics
Table 7. Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at T
amb
=25
°
C.
Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ Max Min Max
For type 74HC1G08
VIH HIGH-level input
voltage VCC = 2.0 V 1.5 1.2 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - V
VIL LOW-level input
voltage VCC = 2.0 V - 0.8 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 V
VOH HIGH-level output
voltage VI= VIH or VIL
IO=−20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - V
IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - V
IO=−20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - V
IO=−2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V
IO=−2.6 mA; VCC = 6.0 V 5.63 5.81 - 5.2 - V
VOL LOW-level output
voltage VI= VIH or VIL
IO= 20 µA; VCC = 2.0 V - 0 0.1 - 0.1 V
IO= 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 V
IO= 20 µA; VCC = 6.0 V - 0 0.1 - 0.1 V
IO= 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V
IO= 2.6 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V
IIinput leakage current VI=V
CC or GND; VCC = 6.0 V - - 1.0 - 1.0 µA
ICC supply current VI=V
CC or GND; IO=0A;
VCC = 6.0 V - - 10 - 20 µA
CIinput capacitance - 1.5 - - - pF
For type 74HCT1G08
VIH HIGH-level input
voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V
VIL LOW-level input
voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V
VOH HIGH-level output
voltage VI= VIH or VIL
IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - V
IO=−2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V
VOL LOW-level output
voltage VI= VIH or VIL
IO= 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 V
IO= 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V
IIinput leakage current VI=V
CC or GND; VCC = 5.5 V - - 1.0 - 1.0 µA
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 5 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
11. Dynamic characteristics
[1] tpd is the same as tPLH and tPHL.
[2] CPD is used to determine the dynamic power dissipation PD(µW).
PD=C
PD ×VCC2×fi+∑(CL×VCC2×fo) where:
fi= input frequency in MHz
fo= output frequency in MHz
CL= output load capacitance in pF
VCC = supply voltage in Volts
∑(CL×VCC2×fo) = sum of outputs
ICC supply current VI=V
CC or GND; IO=0A;
VCC = 5.5 V - - 10 - 20 µA
∆ICC additional supply
current per input; VCC = 4.5 V to 5.5 V;
VI=V
CC −2.1 V; IO=0A - - 500 - 850 µA
CIinput capacitance - 1.5 - - - pF
Table 7. Static characteristics
…continued
Voltages are referenced to GND (ground = 0 V). All typical values are measured at T
amb
=25
°
C.
Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ Max Min Max
Table 8. Dynamic characteristics
GND = 0 V; t
r
= t
f
≤
6.0 ns; All typical values are measured at T
amb
=25
°
C. For test circuit see Figure 6
Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit
Min Typ Max Min Max
For type 74HC1G08
tpd propagation delay A and B to Y; see Figure 5 [1]
VCC = 2.0 V; CL= 50 pF - 25 115 - 135 ns
VCC = 4.5 V; CL=50pF - 9 23 - 27 ns
VCC = 5.0 V; CL=15pF - 7 - - - ns
VCC = 6.0 V; CL=50pF - 8 20 - 23 ns
CPD power dissipation
capacitance VI= GND to VCC [2] -19- - -pF
For type 74HCT1G08
tpd propagation delay A and B to Y; see Figure 5 [1]
VCC = 4.5 V; CL= 50 pF - 11 23 - 27 ns
VCC = 5.0 V; CL=15pF - 11 - - - ns
CPD power dissipation
capacitance VI= GND to VCC −1.5 V [2] -21- - -pF
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 6 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
12. Waveforms
For 74HC1G08: VM = 0.5 × VCC; VI = GND to VCC
For 74HCT1G08: VM = 1.3 V; VI = GND to 3.0 V Test data is given in Table 8. Definitions for test
circuit:
CL = Load capacitance including jig and probe
capacitance
RT = Termination resistance should be equal to the
output impedance Zo of the pulse generator
Fig 5. The input (A and B) to output (Y) propagation
delays Fig 6. Load circuitry for switching times
mna116
A, B input
Y output
tPHL tPLH
VM
VM
mna101
VCC
VIVO
RTCL
PULSE
GENERATOR DUT
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 7 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
13. Package outline
Fig 7. Package outline SOT353-1 (TSSOP5)
UNIT A1
A
max. A2A3bpLHELpwyv
ceD(1) E(1) Z(1) θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.1
01.0
0.8 0.30
0.15 0.25
0.08 2.25
1.85 1.35
1.15 0.65
e1
1.3 2.25
2.0 0.60
0.15 7°
0°
0.1 0.10.30.425
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
0.46
0.21
SOT353-1 MO-203 SC-88A 00-09-01
03-02-19
wM
bp
D
Z
e
e1
0.15
13
54
θ
A
A2
A1
Lp
(A3)
detail X
L
HE
E
c
vMA
X
A
y
1.5 3 mm0
scale
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1
1.1
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 8 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
Fig 8. Package outline SOT753 (SC-74A)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT753 SC-74A
wBM
bp
D
e
A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
45
Plastic surface-mounted package; 5 leads SOT753
UNIT A1bpcDEHELpQywv
mm 0.100
0.013 0.40
0.25 3.1
2.7
0.26
0.10 1.7
1.3
e
0.95 3.0
2.5 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.6
0.2 0.33
0.23
A
1.1
0.9
02-04-16
06-03-16
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 9 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
14. Abbreviations
15. Revision history
Table 9. Abbreviations
Acronym Description
DUT Device Under Test
TTL Transistor-Transistor Logic
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT1G08_4 20070717 Product data sheet - 74HC_HCT1G08_3
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Package SOT353 changed to SOT353-1 in Table 1 and Figure 7.
•Quick Reference Data and Soldering sections removed.
•Section 2 “Features” updated.
74HC_HCT1G08_3 20020517 Product specification - 74HC_HCT1G08_2
74HC_HCT1G08_2 20010302 Product specification - 74HC_HCT1G08_1
74HC_HCT1G08_1 19981110 Preliminary specification - -
74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 17 July 2007 10 of 11
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 74HC1G08; 74HCT1G08
2-input AND gate
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 July 2007
Document identifier: 74HC_HCT1G08_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Functional description . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Recommended operating conditions. . . . . . . . 3
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
17 Contact information. . . . . . . . . . . . . . . . . . . . . 10
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
