
      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DRS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
DMeets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
DOperates With 3-V to 5.5-V VCC Supply
DOperates Up To 250 kbit/s
DTwo Drivers and Two Receivers
DLow Supply Current . . . 300 µA Typical
DExternal Capacitors ...4 × 0.1 µF
DAccepts 5-V Logic Input With 3.3-V Supply
DAlternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3232
DApplications
Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC (D)
Tube of 40 MAX3232CD
MAX3232C
SOIC (D) Reel of 2500 MAX3232CDR MAX3232C
SOIC (DW)
Tube of 40 MAX3232CDW
MAX3232C
−0°C to 70°C
SOIC (DW) Reel of 2000 MAX3232CDWR MAX3232C
−0°C to 70°C
SSOP (DB)
Tube of 80 MAX3232CDB
MA3232C
SSOP (DB) Reel of 2000 MAX3232CDBR MA3232C
TSSOP (PW)
Tube of 90 MAX3232CPW
MA3232C
TSSOP (PW) Reel of 2000 MAX3232CPWR MA3232C
SOIC (D)
Tube of 40 MAX3232ID
MAX3232I
SOIC (D) Reel of 2500 MAX3232IDR MAX3232I
SOIC (DW)
Tube of 40 MAX3232IDW
MAX3232I
−40°C to 85°C
SOIC (DW) Reel of 2000 MAX3232IDWR MAX3232I
−40°C to 85°C
SSOP (DB)
Tube of 80 MAX3232IDB
MB3232I
SSOP (DB) Reel of 2000 MAX3232IDBR MB3232I
TSSOP (PW)
Tube of 90 MAX3232IPW
MB3232I
TSSOP (PW)
Reel of 2000 MAX3232IPWR
MB3232I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
  !"# $ %&'# "$  (&)*%"# +"#'
+&%#$ %! # $('%%"#$ (' #,' #'!$  '-"$ $#&!'#$
$#"+"+ .""#/ +&%# (%'$$0 +'$ # '%'$$"*/ %*&+'
#'$#0  "** (""!'#'$

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
description/ordering information (continued)
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate. Function Tables
EACH DRIVER
INPUT
DIN OUTPUT
DOUT
L H
H L
H = high level, L = low
level
EACH RECEIVER
INPUT
RIN OUTPUT
ROUT
L H
H L
Open H
H = high level, L = low
level, Open = input
disconnected or
connected driver off
logic diagram (positive logic)
DIN1 DOUT1
RIN1ROUT1
DIN2 DOUT2
RIN2ROUT2
11
10
12
9
14
7
13
8

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC (see Note 1) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive output supply voltage range, V+ (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative output supply voltage range, V− (see Note 1) 0.3 V to −7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage difference, V+ V− (see Note 1) 13 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Drivers −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receivers −25 V to 25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO: Drivers −13.2 V to 13.2 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receivers −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 82°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 57°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 4)
MIN NOM MAX UNIT
Supply voltage
VCC = 3.3 V 3 3.3 3.6
V
Supply voltage VCC = 5 V 4.5 5 5.5 V
VIH
Driver high-level input voltage
DIN
VCC = 3.3 V 2
V
VIH Driver high-level input voltage DIN VCC = 5 V 2.4 V
VIL Driver low-level input voltage DIN 0.8 V
VI
Driver input voltage DIN 0 5.5
V
VIReceiver input voltage −25 25 V
TA
Operating free-air temperature
MAX3232C 0 70
°C
T
A
Operating free-air temperature
MAX3232I −40 85 °
C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
ICC Supply current No load, VCC = 3.3 V or 5 V 0.3 1 mA
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VOH High-level output voltage DOUT at RL = 3 kto GND, DIN = GND 5 5.4 V
VOL Low-level output voltage DOUT at RL = 3 kto GND, DIN = VCC −5 −5.4 V
IIH High-level input current VI = VCC ±0.01 ±1µA
IIL Low-level input current VI at GND ±0.01 ±1µA
IOS
VCC = 3.6 V, VO = 0 V
±35
±60
mA
I
OS
Short-circuit output current VCC = 5.5 V, VO = 0 V ±35 ±60 mA
roOutput resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M W
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
Maximum data rate CL = 1000 pF,
One DOUT switching, RL = 3 k,
See Figure 1 150 250 kbit/s
tsk(p) Pulse skew§CL = 150 pF to 2500 pF RL = 3 k to 7 k,
See Figure 2 300 ns
SR(tr)
Slew rate, transition region
RL = 3 k
to 7 k
,
CL = 150 pF to 1000 pF 6 30
V/µs
SR(tr)
Slew rate, transition region
(see Figure 1)
RL = 3 k to 7 k,
VCC = 3.3 V CL = 150 pF to 2500 pF 4 30
V/
µ
s
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
VOH High-level output voltage IOH = −1 mA VCC−0.6 V VCC−0.1 V V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+
Positive-going input threshold voltage
VCC = 3.3 V 1.5 2.4
V
VIT+ Positive-going input threshold voltage VCC = 5 V 1.8 2.4 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V 0.6 1.2
V
VIT− Negative-going input threshold voltage VCC = 5 V 0.8 1.5 V
Vhys Input hysteresis (VIT+ − VIT−) 0.3 V
riInput resistance VI = ±3 V to ±25 V 3 5 7 kW
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 3)
PARAMETER TEST CONDITIONS MIN TYPMAX UNIT
tPLH Propagation delay time, low- to high-level output
CL= 150 pF
300 ns
tPHL Propagation delay time, high- to low-level output CL= 150 pF 300 ns
tsk(p) Pulse skew300 ns
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
PARAMETER MEASUREMENT INFORMATION
50
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
1.5 V 1.5 V
3 V
−3 V
3 V
−3 V
Figure 1. Driver Slew Rate

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
tPHL
50% 50%
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
1.5 V 1.5 V
50
Generator
(see Note B) RL
RS-232
Output
CL
(see Note A)
Figure 2. Driver Pulse Skew
TEST CIRCUIT VOLTAGE WAVEFORMS
50
50%
50%
−3 V
3 V
1.5 V
1.5 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns.
Figure 3. Receiver Propagation Delay Times

      
 ±  
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
APPLICATION INFORMATION
11
10
8
1
2
3
4
7
ROUT2
DIN2
9
RIN1
16
13
12
15
14
DIN1
5
6
+
C3
VCC
C2+
C1
C2
C1+
GND
C1−
ROUT1
C2−
+
CBYPASS
= 0.1µF
V+
+
+
RIN2
C4+
VCC C1 C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
VCC vs CAPACITOR VALUES
DOUT1
DOUT2
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V−
5 k
5 k
Figure 4. Typical Operating Circuit and Capacitor Values
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MAX3232CD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDB ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDBE4 ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDBG4 ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MAX3232CPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232ID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDB ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDBE4 ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDBG4 ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MAX3232IDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDWE4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN003232CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 4
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3232 :
Enhanced Product: MAX3232-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3232CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
MAX3232CDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX3232CPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
MAX3232CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
MAX3232CPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
MAX3232IDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
MAX3232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX3232IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3232CDBR SSOP DB 16 2000 367.0 367.0 38.0
MAX3232CDWR SOIC DW 16 2000 366.0 364.0 50.0
MAX3232CPWR TSSOP PW 16 2000 364.0 364.0 27.0
MAX3232CPWR TSSOP PW 16 2000 367.0 367.0 35.0
MAX3232CPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0
MAX3232IDBR SSOP DB 16 2000 367.0 367.0 38.0
MAX3232IDWR SOIC DW 16 2000 366.0 364.0 50.0
MAX3232IPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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