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Non Magnetic MELF PIN Diode
Rev. V2
MA4P7470F-1072T
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under
development. Performance is based on engineering tests. Specifications are typical. Mechanical
outline has been fixed. Engineering samples and/or test data may be available. Commitment to
produce in volume is not guaranteed.
Designed for Automated Assembly
Features
• Non-Magnetic Package Suitable for MRI
Applications
• Rectangular MELF SMQ Ceramic Package
• Hermetically Sealed
• Low Rs for Low Insertion Loss
• Long τL for Low Intermodulation Distortion
• Low Cj for High Series Isolation
• High Average Incident Power Handling
Capability
• RoHS Compliant
Description and Applications
The MA4P7470F-1072T is a surface mountable
PIN diode in a non-magnetic Metal Electrode
Leadless Faced (MELF) package. The device
incorporates M/A-COM Technology Solutions time
proven HIPAX technology to produce a low
inductance ceramic package with no ribbons or
whisker wires. The package utilizes M/A-COM
Technology Solutions new non-magnetic plating
process to provide a hermetically sealed package
with extremely low permeability. Incorporated within
the package is a glass passivated PIN chip that is
full face bonded on both the cathode and anode to
maximize surface area for low electrical and
thermal resistance. The low thermal resistance
provides excellent performance at high incident
power levels of up to 200 watts CW. The
MA4P7470F-1072T has been comprehensively
characterized both electrically and mechanically to
ensure repeatable and predictable performance.
The MA4P7470F-1072T is a non-magnetic device
which has similar electrical performance to its
magnetic counterpart the MA4P7417F-1072T. The
diode is well suited for use in low loss, low
distortion, high power switching circuits. It was
designed to be used in a high magnetic field
environment from HF through UHF frequencies.
This device is designed to meet the most rigorous
electrical and mechanical requirements of MRI
environments.
MELF PIN diodes are designed for high volume tape
and reel assembly. The rectangular package design
is excellent for automatic pick and place assembly
methods. The parallel flat surfaces are suitable for
key jaw or vacuum pickup techniques. All solderable
surfaces are tin plated and compatible with industry
standard reflow and vapor phase soldering methods.
Absolute Maximum Ratings1 @ +25°C
Parameter Absolute Maximum
Operating Temperature -65°C to +125°C
Storage Temperature -65°C to +150°C
Chip Junction Temperature +175°C Continuous
Diode Mounting Temperature +265°C for 10 seconds
Forward D.C. Current +150 mA
Reverse D.C. Voltage @ -10uA - 800V
RF C.W. Incident Power +53dBm C.W.
1. Exceeding any of these limits may cause permanent
damage.