DPG80C300HB HiPerFRED VRRM = 300 V I FAV = 2x 40 A t rr = 35 ns High Performance Fast Recovery Diode Low Loss and Soft Recovery Common Cathode Part number DPG80C300HB Backside: cathode 1 2 3 Features / Advantages: Applications: Package: TO-247 Planar passivated chips Very low leakage current Very short recovery time Improved thermal behaviour Very low Irm-values Very soft recovery behaviour Avalanche voltage rated for reliable operation Soft reverse recovery for low EMI/RFI Low Irm reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch Antiparallel diode for high frequency switching devices Antisaturation diode Snubber diode Free wheeling diode Rectifiers in switch mode power supplies (SMPS) Uninterruptible power supplies (UPS) Industry standard outline RoHS compliant Epoxy meets UL 94V-0 IXYS reserves the right to change limits, conditions and dimensions. (c) 2013 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20131125a DPG80C300HB Ratings Fast Diode Conditions Symbol VRSM Definition max. non-repetitive reverse blocking voltage TVJ = 25C max. 300 Unit V VRRM max. repetitive reverse blocking voltage TVJ = 25C 300 V IR reverse current, drain current VF I FAV average forward current VF0 threshold voltage rF slope resistance R thJC thermal resistance junction to case typ. VR = 300 V TVJ = 25C 1 A VR = 300 V TVJ = 150C 0.2 mA TVJ = 25C 1.36 V 1.71 V 1.07 V IF = forward voltage drop min. 40 A IF = 80 A IF = 40 A IF = 80 A TVJ = 150 C TC = 135C rectangular 1.44 V T VJ = 175 C 40 A TVJ = 175 C 0.64 V d = 0.5 for power loss calculation only 9.2 m 0.7 K/W R thCH thermal resistance case to heatsink Ptot total power dissipation I FSM max. forward surge current t = 10 ms; (50 Hz), sine; VR = 0 V TVJ = 45C CJ junction capacitance VR = 150 V f = 1 MHz TVJ = 25C 60 pF I RM max. reverse recovery current TVJ = 25 C 3 A t rr reverse recovery time IF = IXYS reserves the right to change limits, conditions and dimensions. (c) 2013 IXYS all rights reserved K/W 0.25 TC = 25C 40 A; VR = 200 V -di F /dt = 200 A/s 215 450 W A C 8.5 A TVJ = 25 C 35 ns TVJ = 65 ns TVJ = C Data according to IEC 60747and per semiconductor unless otherwise specified 20131125a DPG80C300HB Package Ratings TO-247 Symbol I RMS Definition Conditions RMS current per terminal min. TVJ virtual junction temperature T op operation temperature Tstg storage temperature -55 typ. max. 70 Unit A -55 175 C -55 150 C 150 C 1) Weight 6 MD mounting torque FC mounting force with clip Product Marking 0.8 1.2 Nm 20 120 N Part number D P G 80 C 300 HB IXYS Logo g = = = = = = = Diode HiPerFRED extreme fast Current Rating [A] Common Cathode Reverse Voltage [V] TO-247AD (3) XXXXXXXXX Part No. Zyyww Assembly Line abcd Assembly Code Date Code Ordering Standard Part Number DPG80C300HB Equivalent Circuits for Simulation I V0 R0 Marking on Product DPG80C300HB * on die level Delivery Mode Tube Code No. 506868 T VJ = 175 C Fast Diode V 0 max threshold voltage 0.64 V R 0 max slope resistance * 7.6 m IXYS reserves the right to change limits, conditions and dimensions. (c) 2013 IXYS all rights reserved Quantity 30 Data according to IEC 60747and per semiconductor unless otherwise specified 20131125a DPG80C300HB Outlines TO-247 A E A2 O P1 OP D2 S Q D1 D 2x E2 4 1 2 3 L1 E1 L 2x b2 b4 3x b C A1 2x e 1 IXYS reserves the right to change limits, conditions and dimensions. (c) 2013 IXYS all rights reserved 2 Sym. Inches min. max. Millimeter min. max. A A1 A2 D E E2 e L L1 OP Q S b b2 b4 c D1 D2 E1 O P1 0.185 0.209 0.087 0.102 0.059 0.098 0.819 0.845 0.610 0.640 0.170 0.216 0.215 BSC 0.780 0.800 0.177 0.140 0.144 0.212 0.244 0.242 BSC 0.039 0.055 0.065 0.094 0.102 0.135 0.015 0.035 0.515 0.020 0.053 0.530 0.29 4.70 5.30 2.21 2.59 1.50 2.49 20.79 21.45 15.48 16.24 4.31 5.48 5.46 BSC 19.80 20.30 4.49 3.55 3.65 5.38 6.19 6.14 BSC 0.99 1.40 1.65 2.39 2.59 3.43 0.38 0.89 13.07 0.51 1.35 13.45 7.39 3 Data according to IEC 60747and per semiconductor unless otherwise specified 20131125a DPG80C300HB Fast Diode 18 0.6 80 16 0.5 60 IF = 60 A 30 A 0.4 15 A Qrr IF IF = 60 A 30 A 15 A 14 IRM 12 40 TVJ = 150C [A] [A] 10 [C] 0.3 8 20 0.2 25C TVJ = 125C TVJ = 125C 6 VR = 200 V VR = 200 V 0.1 0.0 0.4 0.8 1.2 1.6 4 0 2.0 V F [ V] Fig. 1 Forward current IF versus VF 200 400 600 0 -diF /dt [A/s] Fig. 2 Typ. reverse recov. charge Qrr versus -diF /dt 1.4 200 400 700 80 VFR TVJ = 125C VR = 200 V 1.2 600 -diF /dt [A/s] Fig. 3 Typ. reverse recov. current IRM versus -diF /dt tfr 600 7 6 70 1.0 500 trr Kf 0.8 60 IRM TVJ = 125C VR = 200 V IF = 30 A 400 [ns] [ns] 0.6 5 tfr IF = 60 A 30 A 15 A 50 0.4 VFR 4 [V] 300 3 200 2 Qrr 0.2 40 0 40 80 120 160 100 0 400 600 0 -diF /dt [A/s] TVJ [C] 200 400 1 600 -diF /dt [A/s] Fig. 6 Typ. forward recovery voltage VFR & time tfr versus diF /dt Fig. 5 Typ. reverse recov. time trr versus -diF /dt Fig. 4 Typ. dynamic parameters Qrr, IRM versus TVJ 12 200 0.8 TVJ = 125C VR = 200 V 10 0.6 8 IF = 60 A 6 30 A 15 A Erec ZthJC 0.4 [K/W] [J] 4 0.2 2 0 0.0 0 200 400 600 -diF /dt [A/s] Fig. 7 Typ. recovery energy Erec versus -diF /dt IXYS reserves the right to change limits, conditions and dimensions. (c) 2013 IXYS all rights reserved 1 10 100 1000 10000 t [ms] Fig. 8 Transient thermal impedance junction to case Data according to IEC 60747and per semiconductor unless otherwise specified 20131125a