To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. 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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. R8C/2E Group, R8C/2F Group RENESAS MCU 1. REJ03B0222-0100 Rev.1.00 Dec 14, 2007 Overview 1.1 Features The R8C/2E Group and R8C/2F Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs also use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. Furthermore, the R8C/2F Group has on-chip data flash (1 KB x 2 blocks). The difference between the R8C/2E Group and R8C/2F Group is only the presence or absence of data flash. Their peripheral functions are the same. 1.1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer equipment, etc. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 1 of 39 R8C/2E Group, R8C/2F Group 1.1.2 1. Overview Specifications Tables 1.1 and 1.2 outlines the Specifications for R8C/2E Group and Tables 1.3 and 1.4 outlines the Specifications for R8C/2F Group. Table 1.1 Item CPU Specifications for R8C/2E Group (1) Function Specification Central R8C/Tiny series core processing unit * Number of fundamental instructions: 89 * Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) * Multiplier: 16 bits x 16 bits 32 bits * Multiply-accumulate instruction: 16 bits x 16 bits + 32 bits 32 bits * Operation mode: Single-chip mode (address space: 1 Mbyte) Memory ROM, RAM Refer to Table 1.5 Product List for R8C/2E Group. Power Supply Voltage * Power-on reset Voltage detection circuit * Voltage detection 2 Detection I/O Ports Programmable * Input-only: 3 pins I/O ports * CMOS I/O ports: 25, selectable pull-up resistor * High current drive ports: 8 Clock Clock generation 2 circuits: XIN clock oscillation circuit (with on-chip feedback resistor), circuits On-chip oscillator (high-speed, low-speed) (high-speed on-chip oscillator has a frequency adjustment function) * Oscillation stop detection: XIN clock oscillation stop detection function * Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16 * Low power consumption modes: Standard operating mode (high-speed clock, high-speed on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode Interrupts * External: 4 sources, Internal: 13 sources, Software: 4 sources * Priority levels: 7 levels Watchdog Timer 15 bits x 1 (with prescaler), reset start selectable Timer Timer RA 8 bits x 1 (with 8-bit prescaler) Timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode Timer RB 8 bits x 1 (with 8-bit prescaler) Timer mode (period timer), programmable waveform generation mode (PWM output), programmable one-shot generation mode, programmable wait one-shot generation mode Timer RC 16 bits x 1 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 3 pins), PWM2 mode (PWM output pin) Timer RE 8 bits x 1 Output compare mode Serial UART0 Clock synchronous serial I/O/UART x 1 Interface LIN Module Hardware LIN: 1 (timer RA, UART0) A/D Converter 10-bit resolution x 12 channels, includes sample and hold function D/A Converter 8-bit resolution x 2 circuits Comparator 2 circuits Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 2 of 39 R8C/2E Group, R8C/2F Group Table 1.2 1. Overview Specifications for R8C/2E Group (2) Item Specification Flash Memory * Programming and erasure voltage: VCC = 2.7 to 5.5 V * Programming and erasure endurance: 100 times * Program security: ROM code protect, ID code check * Debug functions: On-chip debug, on-board flash rewrite function Operating Frequency/Supply f(XIN) = 20 MHz (VCC = 3.0 to 5.5 V), f(XIN) = 10 MHz (VCC = 2.7 to 5.5 V) Voltage Current consumption Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz) Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz) Typ. 23 A (VCC = 3.0 V, wait mode (peripheral clock off)) Typ. 0.7 A (VCC = 3.0 V, stop mode) Operating Ambient Temperature -20 to 85C (N version) -40 to 85C (D version)(1) Package 32-pin LQFP Package code: PLQP0032GB-A (previous code: 32P6U-A) NOTE: 1. Specify the D version if D version functions are to be used. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 3 of 39 R8C/2E Group, R8C/2F Group Table 1.3 Item CPU 1. Overview Specifications for R8C/2F Group (1) Function Specification Central R8C/Tiny series core processing unit * Number of fundamental instructions: 89 * Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 3.0 to 5.5 V) 100 ns (f(XIN) = 10 MHz, VCC = 2.7 to 5.5 V) * Multiplier: 16 bits x 16 bits 32 bits * Multiply-accumulate instruction: 16 bits x 16 bits + 32 bits 32 bits * Operation mode: Single-chip mode (address space: 1 Mbyte) Memory ROM, RAM Refer to Table 1.6 Product List for R8C/2F Group. Power Supply Voltage detection * Power-on reset Voltage circuit * Voltage detection 2 Detection I/O Ports Programmable * Input-only: 3 pins I/O ports * CMOS I/O ports: 25, selectable pull-up resistor * High current drive ports: 8 Clock Clock generation 2 circuits: XIN clock oscillation circuit (with on-chip feedback resistor), circuits On-chip oscillator (high-speed, low-speed) (high-speed on-chip oscillator has a frequency adjustment function) * Oscillation stop detection: XIN clock oscillation stop detection function * Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16 * Low power consumption modes: Standard operating mode (high-speed clock, high-speed on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode Interrupts * External: 4 sources, Internal: 13 sources, Software: 4 sources * Priority levels: 7 levels Watchdog Timer 15 bits x 1 (with prescaler), reset start selectable Timer Timer RA 8 bits x 1 (with 8-bit prescaler) Timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period measurement mode Timer RB 8 bits x 1 (with 8-bit prescaler) Timer mode (period timer), programmable waveform generation mode (PWM output), programmable one-shot generation mode, programmable wait one-shot generation mode Timer RC 16 bits x 1 (with 4 capture/compare registers) Timer mode (input capture function, output compare function), PWM mode (output 3 pins), PWM2 mode (PWM output pin) Timer RE 8 bits x 1 Output compare mode Serial UART0 Clock synchronous serial I/O/UART x 1 Interface LIN Module Hardware LIN: 1 (timer RA, UART0) A/D Converter 10-bit resolution x 12 channels, includes sample and hold function D/A Converter 8-bit resolution x 2 circuits Comparator 2 circuits Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 4 of 39 R8C/2E Group, R8C/2F Group Table 1.4 1. Overview Specifications for R8C/2F Group (2) Item Specification Flash Memory * Programming and erasure voltage: VCC = 2.7 to 5.5 V * Programming and erasure endurance: 10,000 times (data flash) 1,000 times (program ROM) * Program security: ROM code protect, ID code check * Debug functions: On-chip debug, on-board flash rewrite function Operating Frequency/Supply f(XIN) = 20 MHz (VCC = 3.0 to 5.5 V), f(XIN) = 10 MHz (VCC = 2.7 to 5.5 V) Voltage Current consumption Typ. 10 mA (VCC = 5.0 V, f(XIN) = 20 MHz) Typ. 6 mA (VCC = 3.0 V, f(XIN) = 10 MHz) Typ. 23 A (VCC = 3.0 V, wait mode (peripheral clock off)) Typ. 0.7 A (VCC = 3.0 V, stop mode) Operating Ambient Temperature -20 to 85C (N version) -40 to 85C (D version)(1) Package 32-pin LQFP Package code: PLQP0032GB-A (previous code: 32P6U-A) NOTE: 1. Specify the D version if D version functions are to be used. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 5 of 39 R8C/2E Group, R8C/2F Group 1.2 1. Overview Product List Table 1.5 lists Product List for R8C/2E Group, Figure 1.1 shows a Part Number, Memory Size, and Package of R8C/2E Group, Table 1.6 lists Product List for R8C/2F Group, and Figure 1.2 shows a Part Number, Memory Size, and Package of R8C/2F Group. Table 1.5 Product List for R8C/2E Group Current of Dec. 2007 Part No. R5F212E2NFP R5F212E4NFP R5F212E2DFP R5F212E4DFP R5F212E2NXXXFP R5F212E4NXXXFP ROM Capacity 8 Kbytes 16 Kbytes 8 Kbytes 16 Kbytes 8 Kbytes 16 Kbytes RAM Capacity 512 bytes 1 Kbyte 512 bytes 1 Kbyte 512 bytes 1 Kbyte Package Type PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A R5F212E2DXXXFP R5F212E4DXXXFP 8 Kbytes 16 Kbytes 512 bytes 1 Kbyte PLQP0032GB-A PLQP0032GB-A Remarks N version D version N version Factory programming product(1) D version Factory programming product(1) NOTE: 1. The user ROM is programmed before shipment. Part No. R 5 F 21 2E 2 N XXX FP Package type: FP: PLQP0032GB-A ROM number (only factory programming product) Classification N: Operating ambient temperature -20C to 85C D: Operating ambient temperature -40C to 85C ROM capacity 2: 8 KB 4: 16 KB R8C/2E Group R8C/Tiny Series Memory type F: Flash memory version Renesas MCU Renesas semiconductor Figure 1.1 Part Number, Memory Size, and Package of R8C/2E Group Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 6 of 39 R8C/2E Group, R8C/2F Group Table 1.6 1. Overview Product List for R8C/2F Group R5F212F2NFP R5F212F4NFP R5F212F2DFP R5F212F4DFP R5F212F2NXXXFP R5F212F4NXXXFP ROM Capacity Program ROM Data flash 8 Kbytes 1 Kbyte x 2 16 Kbytes 1 Kbyte x 2 8 Kbytes 1 Kbyte x 2 16 Kbytes 1 Kbyte x 2 8 Kbytes 1 Kbyte x 2 16 Kbytes 1 Kbyte x 2 R5F212F2DXXXFP R5F212F4DXXXFP 8 Kbytes 16 Kbytes Part No. Current of Dec. 2007 RAM Capacity 512 bytes 1 Kbyte 512 bytes 1 Kbyte 512 bytes 1 Kbyte Package Type PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A PLQP0032GB-A Remarks N version D version N version Factory programming product(1) 1 Kbyte x 2 512 bytes PLQP0032GB-A D version 1 Kbyte x 2 1 Kbyte PLQP0032GB-A Factory programming product(1) NOTE: 1. The user ROM is programmed before shipment. Part No. R 5 F 21 2F 2 N XXX FP Package type: FP: PLQP0032GB-A ROM number (only factory programming product) Classification N: Operating ambient temperature -20C to 85C D: Operating ambient temperature -40C to 85C ROM capacity 2: 8 KB 4: 16 KB R8C/2F Group R8C/Tiny Series Memory type F: Flash memory version Renesas MCU Renesas semiconductor Figure 1.2 Part Number, Memory Size, and Package of R8C/2F Group Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 7 of 39 R8C/2E Group, R8C/2F Group 1.3 1. Overview Block Diagram Figure 1.3 shows a Block Diagram. I/O ports 8 8 6 Port P0 Port P1 Port P3 1 3 2 Port P4 Port P5 Peripheral functions System clock generation circuit A/D converter (10 bits x 12 channels) Timers Timer RA (8 bits x 1) Timer RB (8 bits x 1) Timer RC (16 bits x 1) Timer RE (8 bits x 1) XIN-XOUT High-speed on-chip oscillator Low-Speed on-chip oscillator D/A converter (8 bits x 2) Comparator (x 2) UART or clock synchronous serial I/O (8 bits x 1) LIN module Watchdog timer (15 bits) R8C/Tiny Series CPU core R0H R1H R0L R1L R2 R3 SB ROM(1) USP ISP INTB A0 A1 FB Memory RAM(2) PC FLG Multiplier NOTES: 1. ROM size varies with MCU type. 2. RAM size varies with MCU type. Figure 1.3 Block Diagram Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 8 of 39 R8C/2E Group, R8C/2F Group 1.4 1. Overview Pin Assignment P1_4/TXD0 P1_3/KI3/AN11/(TRBO)(2) P1_1/KI1/AN9/TRCIOA/TRCTRG VREF/P4_2 P1_2/KI2/AN10/TRCIOB P1_0/KI0/AN8 P3_4/(TRCIOC)(2) P3_3/INT3/TRCCLK Figure 1.4 shows Pin Assignments (Top View). Table 1.7 outlines the Pin Name Information by Pin Number. 24 23 22 21 20 19 18 17 P0_7/AN0/DA1 25 P0_6/AN1/DA0 P0_5/AN2/AVREF0 P0_4/AN3/TREO/ACMP0 P0_3/AN4/AVREF1 P0_2/AN5/ACMP1 P0_1/AN6 P0_0/AN7 26 16 15 R8C/2E Group, R8C/2F Group 27 14 13 28 29 12 PLQP0032GB-A (32P6U-A) (top view) 30 31 11 10 9 5 6 7 8 MODE 4 VSS/AVSS XIN/P4_6 3 RESET XOUT/P4_7 (1) 2 P3_5/(TRCIOD)(2) P3_7/TRAO 1 VCC/AVCC 32 P1_5/RXD0/(TRAIO)/(INT1)(2) P1_6/CLK0 P5_3/TRCIOC/ACOUT0 P5_4/TRCIOD/ACOUT1 P3_1/TRBO P3_6/(INT1)(2) P1_7/TRAIO/INT1 P4_5/INT0 NOTES: 1. P4_7 is an input-only port. 2. Can be assigned to the pin in parentheses by a program. 3. Confirm the pin 1 position on the package by referring to the package dimensions. Figure 1.4 Pin Assignments (Top View) Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 9 of 39 R8C/2E Group, R8C/2F Group Table 1.7 Pin Number Pin Name Information by Pin Number Control Pin 1 4 5 6 7 8 Port Interrupt P3_7 RESET XOUT VSS/AVSS XIN VCC/AVCC MODE P4_6 P4_5 INT0 10 P1_7 INT1 (INT1)(1) 11 P3_6 12 13 14 15 P3_1 P5_4 P5_3 P1_6 16 P1_5 17 P1_4 TRAIO TRBO TRCIOD TRCIOC ACOUT1 ACOUT0 CLK0 (INT1)(1) (TRAIO)(1) P1_3 KI3 (TRBO)(1) AN11 RXD0 TXD0 P1_2 KI2 TRCIOB AN10 P4_2 P1_1 KI1 TRCIOA/ TRCTRG AN9 22 P1_0 KI0 23 P3_3 24 P3_4 25 26 27 28 29 30 31 32 P0_7 P0_6 P0_5 P0_4 P0_3 P0_2 P0_1 P0_0 19 20 21 VREF INT3 AN8 TRCCLK (TRCIOC)(1) TREO NOTE: 1. Can be assigned to the pin in parentheses by a program. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Comparator P4_7 9 18 I/O Pin Functions for of Peripheral Modules Serial A/D D/A Timer Interface Converter Converter (TRCIOD)(1) TRAO P3_5 2 3 1. Overview Page 10 of 39 AN0 AN1 AN2 AN3 AN4 AN5 AN6 AN7 DA1 DA0 AVREF0 ACMP0 AVREF1 ACMP1 R8C/2E Group, R8C/2F Group 1.5 1. Overview Pin Functions Table 1.8 list Pin Functions. Table 1.8 Pin Functions Type Symbol I/O Type Description Power supply input VCC, VSS I Apply 2.7 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin. Analog power supply input AVCC, AVSS I Power supply for the A/D converter. Connect a capacitor between AVCC and AVSS. Reset input RESET I Input "L" on this pin resets the MCU. MODE MODE I Connect this pin to VCC via a resistor. XIN clock input XIN I XIN clock output XOUT O These pins are provided for XIN clock generation circuit I/O. Connect a ceramic resonator or a crystal oscillator between the XIN and XOUT pins.(1) To use an external clock, input it to the XIN pin and leave the XOUT pin open. INT interrupt input INT0, INT1, INT3 I INT interrupt input pins Key input interrupt KI0 to KI3 I Key input interrupt input pins Timer RA TRAO O Timer RA output pin TRAIO I/O Timer RA I/O pin Timer RB TRBO O Timer RB output pin Timer RC TRCCLK I External clock input pin TRCTRG TRCIOA, TRCIOB, TRCIOC, TRCIOD I External trigger input pin I/O Sharing output-compare output / input-capture input / PWM / PWM2 output pins Timer RE TREO O Timer RE output pin Serial interface CLK0 I/O Clock I/O pin RXD0 I Receive data input pin TXD0 O Transmit data output pin Reference voltage input VREF I Reference voltage input pin to A/D converter A/D converter AN0 to AN11 I Analog input pins to A/D converter D/A converter DA0 to DA1 O Output pins from D/A converter Comparator AVREF0 to AVREF1 I Reference voltage input pins to comparator ACMP0 to ACMP1 I Analog voltage input pins to comparator ACOUT0 to ACOUT1 O Comparison result output pins of comparator I/O port P0_0 to P0_7, P1_0 to P1_7, P3_1, P3_3 to P3_7, P4_5, P5_3, P5_4 I/O CMOS I/O ports. Each port has an I/O select direction register, allowing each pin in the port to be directed for input or output individually. Any port set to input can be set to use a pull-up resistor or not by a program. P1_0 to P1_7 also function as LED drive ports. Input port P4_2, P4_6, P4_7 I Input-only ports I: Input O: Output I/O: Input and output NOTE: 1. Refer to the oscillator manufacturer for oscillation characteristics. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 11 of 39 R8C/2E Group, R8C/2F Group 2. 2. Central Processing Unit (CPU) Central Processing Unit (CPU) Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a register bank. There are two sets of register bank. b31 b15 R2 R3 b8b7 b0 R0H (high-order of R0) R0L (low-order of R0) R1H (high-order of R1) R1L (low-order of R1) Data registers(1) R2 R3 A0 A1 FB b19 b15 Address registers(1) Frame base register(1) b0 Interrupt table register INTBL INTBH The 4 high order bits of INTB are INTBH and the 16 low order bits of INTB are INTBL. b19 b0 Program counter PC b15 b0 USP User stack pointer ISP Interrupt stack pointer SB Static base register b15 b0 FLG b15 b8 IPL b7 Flag register b0 U I O B S Z D C Carry flag Debug flag Zero flag Sign flag Register bank select flag Overflow flag Interrupt enable flag Stack pointer select flag Reserved bit Processor interrupt priority level Reserved bit NOTE: 1. These registers comprise a register bank. There are two register banks. Figure 2.1 CPU Registers Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 12 of 39 R8C/2E Group, R8C/2F Group 2.1 2. Central Processing Unit (CPU) Data Registers (R0, R1, R2, and R3) R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is analogous to R2R0. 2.2 Address Registers (A0 and A1) A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 to be used as a 32-bit address register (A1A0). 2.3 Frame Base Register (FB) FB is a 16-bit register for FB relative addressing. 2.4 Interrupt Table Register (INTB) INTB is a 20-bit register that indicates the start address of an interrupt vector table. 2.5 Program Counter (PC) PC is 20 bits wide and indicates the address of the next instruction to be executed. 2.6 User Stack Pointer (USP) and Interrupt Stack Pointer (ISP) The stack pointers (SP), USP, and ISP, are each 16 bits wide. The U flag of FLG is used to switch between USP and ISP. 2.7 Static Base Register (SB) SB is a 16-bit register for SB relative addressing. 2.8 Flag Register (FLG) FLG is an 11-bit register indicating the CPU state. 2.8.1 Carry Flag (C) The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit. 2.8.2 Debug Flag (D) The D flag is for debugging only. Set it to 0. 2.8.3 Zero Flag (Z) The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0. 2.8.4 Sign Flag (S) The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0. 2.8.5 Register Bank Select Flag (B) Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1. 2.8.6 Overflow Flag (O) The O flag is set to 1 when an operation results in an overflow; otherwise to 0. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 13 of 39 R8C/2E Group, R8C/2F Group 2.8.7 2. Central Processing Unit (CPU) Interrupt Enable Flag (I) The I flag enables maskable interrupts. Interrupt are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0 when an interrupt request is acknowledged. 2.8.8 Stack Pointer Select Flag (U) ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1. The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software interrupt numbers 0 to 31 is executed. 2.8.9 Processor Interrupt Priority Level (IPL) IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7. If a requested interrupt has higher priority than IPL, the interrupt is enabled. 2.8.10 Reserved Bit If necessary, set to 0. When read, the content is undefined. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 14 of 39 R8C/2E Group, R8C/2F Group 3. 3. Memory Memory 3.1 R8C/2E Group Figure 3.1 is a Memory Map of R8C/2E Group. The R8C/2E group has 1 Mbyte of address space from addresses 00000h to FFFFFh. The internal ROM is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine. The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 1-Kbyte internal RAM area is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged. Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users. 00000h 002FFh SFR (Refer to 4. Special Function Registers (SFRs)) 00400h Internal RAM 0XXXh 0FFDCh Undefined instruction Overflow BRK instruction Address match Single step Watchdog timer/oscillation stop detection/voltage monitor 2 0YYYYh (Reserved) (Reserved) Reset Internal ROM (program ROM) 0FFFFh 0FFFFh FFFFFh NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Internal ROM Part Number R5F212E2NFP, R5F212E2DFP, Internal RAM Size Address 0YYYYh Size Address 0XXXXh 8 Kbytes 0E000h 512 bytes 005FFh 16 Kbytes 0C000h 1 Kbyte 007FFh R5F212E2NXXXFP, R5F212E2DXXXFP R5F212E4NFP, R5F212E4DFP, R5F212E4NXXXFP, R5F212E4DXXXFP Figure 3.1 Memory Map of R8C/2E Group Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 15 of 39 R8C/2E Group, R8C/2F Group 3.2 3. Memory R8C/2F Group Figure 3.2 is a Memory Map of R8C/2F Group. The R8C/2F group has 1 Mbyte of address space from addresses 00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address 0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh. The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting address of each interrupt routine. The internal ROM (data flash) is allocated addresses 02400h to 02BFFh. The internal RAM area is allocated higher addresses, beginning with address 00400h. For example, a 1-Kbyte internal RAM is allocated addresses 00400h to 007FFh. The internal RAM is used not only for storing data but also for calling subroutines and as stacks when interrupt requests are acknowledged. Special function registers (SFRs) are allocated addresses 00000h to 002FFh. The peripheral function control registers are allocated here. All addresses within the SFR, which have nothing allocated are reserved for future use and cannot be accessed by users. 00000h 002FFh SFR (Refer to 4. Special Function Registers (SFRs)) 00400h Internal RAM 0XXXXh 02400h 0FFDCh Internal ROM (data flash)(1) Undefined instruction Overflow BRK instruction Address match Single step 02BFFh Watchdog timer/oscillation stop detection/voltage monitor 2 0YYYYh (Reserved) (Reserved) Reset Internal ROM (program ROM) 0FFFFh 0FFFFh FFFFFh NOTES: 1. Data flash block A (1 Kbyte) and B (1 Kbyte) are shown. 2. The blank regions are reserved. Do not access locations in these regions. Internal ROM Part Number R5F212F2NFP, R5F212F2DFP, Internal RAM Size Address 0YYYYh Size Address 0XXXXh 8 Kbytes 0E000h 512 bytes 005FFh 16 Kbytes 0C000h 1 Kbyte 007FFh R5F212F2NXXXFP, R5F212F2DXXXFP R5F212F4NFP, R5F212F4DFP, R5F212F4NXXXFP, R5F212F4DXXXFP Figure 3.2 Memory Map of R8C/2F Group Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 16 of 39 R8C/2E Group, R8C/2F Group 4. 4. Special Function Registers (SFRs) Special Function Registers (SFRs) An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.7 list the special function registers. Table 4.1 Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h 0007h 0008h 0009h 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h 0013h 0014h 0015h 0016h 0017h 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh 001Fh 0020h 0021h 0022h 0023h 0024h 0025h 0026h 0027h 0028h 0029h 002Ah 002Bh 002Ch SFR Information (1)(1) Register Symbol After reset Processor Mode Register 0 Processor Mode Register 1 System Clock Control Register 0 System Clock Control Register 1 PM0 PM1 CM0 CM1 00h 00h 01101000b 00100000b Protect Register PRCR 00h Oscillation Stop Detection Register Watchdog Timer Reset Register Watchdog Timer Start Register Watchdog Timer Control Register Address Match Interrupt Register 0 OCD WDTR WDTS WDC RMAD0 Address Match Interrupt Enable Register Address Match Interrupt Register 1 AIER RMAD1 00000100b XXh XXh 00X11111b 00h 00h 00h 00h 00h 00h 00h Count Source Protection Mode Register CSPR 00h 10000000b(4) High-Speed On-Chip Oscillator Control Register 0 High-Speed On-Chip Oscillator Control Register 1 High-Speed On-Chip Oscillator Control Register 2 FRA0 FRA1 FRA2 00h When shipping 00h High-Speed On-Chip Oscillator Control Register 7 FRA7 When Shipping 0030h VCA1 00001000b 0031h Voltage Detection Register 1 (2) VCA2 00100000b 0032h Voltage Detection Register 2 (2) 0033h 0034h 0035h VW1C 00001000b 0036h Voltage Monitor 1 Circuit Control Register(3) VW2C 00h 0037h Voltage Monitor 2 Circuit Control Register(3) 0038h 0039h 003Ah 003Bh 003Ch 003Dh 003Eh 003Fh X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. Software reset, watchdog timer reset, and voltage monitor 1 reset or voltage monitor 2 reset do not affect this register. 3. Software reset, watchdog timer reset, and voltage monitor 1 reset or voltage monitor 2 reset do not affect b2 and b3. 4. The CSPROINI bit in the OFS register is set to 0. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 17 of 39 R8C/2E Group, R8C/2F Group Table 4.2 4. Special Function Registers (SFRs) SFR Information (2)(1) Address Register 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h Timer RC Interrupt Control Register 0048h 0049h 004Ah Timer RE Interrupt Control Register 004Bh 004Ch 004Dh Key Input Interrupt Control Register 004Eh A/D Conversion Interrupt Control Register 004Fh 0050h 0051h UART0 Transmit Interrupt Control Register 0052h UART0 Receive Interrupt Control Register 0053h 0054h 0055h 0056h Timer RA Interrupt Control Register 0057h 0058h Timer RB Interrupt Control Register 0059h INT1 Interrupt Control Register 005Ah INT3 Interrupt Control Register 005Bh Comparator 0 Interrupt Control Register 005Ch Comparator 1 Interrupt Control Register 005Dh INT0 Interrupt Control Register 005Eh 005Fh 0060h 0061h 0062h 0063h 0064h 0065h 0066h 0067h 0068h 0069h 006Ah 006Bh 006Ch 006Dh 006Eh 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 18 of 39 Symbol After reset TRCIC XXXXX000b TREIC XXXXX000b KUPIC ADIC XXXXX000b XXXXX000b S0TIC S0RIC XXXXX000b XXXXX000b TRAIC XXXXX000b TRBIC INT1IC INT3IC CM0IC CM1IC INT0IC XXXXX000b XX00X000b XX00X000b XXXXX000b XXXXX000b XX00X000b R8C/2E Group, R8C/2F Group Table 4.3 4. Special Function Registers (SFRs) SFR Information (3)(1) Address Register 0080h 0081h 0082h 0083h 0084h 0085h 0086h 0087h 0088h 0089h 008Ah 008Bh 008Ch 008Dh 008Eh 008Fh 0090h 0091h 0092h 0093h 0094h 0095h 0096h 0097h 0098h 0099h 009Ah 009Bh 009Ch 009Dh 009Eh 009Fh 00A0h UART0 Transmit/Receive Mode Register 00A1h UART0 Bit Rate Register 00A2h UART0 Transmit Buffer Register 00A3h 00A4h UART0 Transmit/Receive Control Register 0 00A5h UART0 Transmit/Receive Control Register 1 00A6h UART0 Receive Buffer Register 00A7h 00A8h 00A9h 00AAh 00ABh 00ACh 00ADh 00AEh 00AFh 00B0h 00B1h 00B2h 00B3h 00B4h 00B5h 00B6h 00B7h 00B8h 00B9h 00BAh 00BBh 00BCh 00BDh 00BEh 00BFh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 19 of 39 Symbol U0MR U0BRG U0TB U0C0 U0C1 U0RB After reset 00h XXh XXh XXh 00001000b 00000010b XXh XXh R8C/2E Group, R8C/2F Group Table 4.4 4. Special Function Registers (SFRs) SFR Information (4)(1) Address Register 00C0h A/D Register 00C1h 00C2h 00C3h 00C4h 00C5h 00C6h 00C7h 00C8h 00C9h 00CAh 00CBh 00CCh 00CDh 00CEh 00CFh 00D0h 00D1h 00D2h 00D3h 00D4h A/D Control Register 2 00D5h 00D6h A/D Control Register 0 00D7h A/D Control Register 1 00D8h D/A Register 0 00D9h 00DAh D/A Register 1 00DBh 00DCh D/A Control Register 00DDh 00DEh 00DFh 00E0h Port P0 Register 00E1h Port P1 Register 00E2h Port P0 Direction Register 00E3h Port P1 Direction Register 00E4h 00E5h Port P3 Register 00E6h 00E7h Port P3 Direction Register 00E8h Port P4 Register 00E9h Port P5 Register 00EAh Port P4 Direction Register 00EBh Port P5 Direction Register 00ECh 00EDh 00EEh 00EFh 00F0h 00F1h 00F2h 00F3h 00F4h 00F5h 00F6h Pin Select Register 2 00F7h Pin Select Register 3 00F8h Port Mode Register 00F9h External Input Enable Register 00FAh INT Input Filter Select Register 00FBh Key Input Enable Register 00FCh Pull-Up Control Register 0 00FDh Pull-Up Control Register 1 00FEh Port P1 Drive Capacity Control Register 00FFh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 20 of 39 Symbol After reset AD XXh XXh ADCON2 00h ADCON0 ADCON1 DA0 00h 00h 00h DA1 00h DACON 00h P0 P1 PD0 PD1 00h 00h 00h 00h P3 00h PD3 P4 P5 PD4 PD5 00h 00h 00h 00h 00h PINSR2 PINSR3 PMR INTEN INTF KIEN PUR0 PUR1 P1DRR 00h 00h 00h 00h 00h 00h 00h 00h 00h R8C/2E Group, R8C/2F Group Table 4.5 4. Special Function Registers (SFRs) SFR Information (5)(1) Address Register 0100h Timer RA Control Register 0101h Timer RA I/O Control Register 0102h Timer RA Mode Register 0103h Timer RA Prescaler Register 0104h Timer RA Register 0105h 0106h LIN Control Register 0107h LIN Status Register 0108h Timer RB Control Register 0109h Timer RB One-Shot Control Register 010Ah Timer RB I/O Control Register 010Bh Timer RB Mode Register 010Ch Timer RB Prescaler Register 010Dh Timer RB Secondary Register 010Eh Timer RB Primary Register 010Fh 0110h 0111h 0112h 0113h 0114h 0115h 0116h 0117h 0118h Timer RE Counter Data Register 0119h Timer RE Compare Data Register 011Ah 011Bh 011Ch Timer RE Control Register 1 011Dh Timer RE Control Register 2 011Eh Timer RE Clock Source Select Register 011Fh 0120h Timer RC Mode Register 0121h Timer RC Control Register 1 0122h Timer RC Interrupt Enable Register 0123h Timer RC Status Register 0124h Timer RC I/O Control Register 0 0125h Timer RC I/O Control Register 1 0126h Timer RC Counter 0127h 0128h Timer RC General Register A 0129h 012Ah Timer RC General Register B 012Bh 012Ch Timer RC General Register C 012Dh 012Eh Timer RC General Register D 012Fh 0130h Timer RC Control Register 2 0131h Timer RC Digital Filter Function Select Register 0132h Timer RC Output Master Enable Register 0133h 0134h 0135h 0136h 0137h 0138h 0139h 013Ah 013Bh 013Ch 013Dh 013Eh 013Fh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 21 of 39 Symbol TRACR TRAIOC TRAMR TRAPRE TRA 00h 00h 00h FFh FFh LINCR LINST TRBCR TRBOCR TRBIOC TRBMR TRBPRE TRBSC TRBPR 00h 00h 00h 00h 00h 00h FFh FFh FFh TRESEC TREMIN 00h 00h TRECR1 TRECR2 TRECSR 00h 00h 00001000b TRCMR TRCCR1 TRCIER TRCSR TRCIOR0 TRCIOR1 TRC 01001000b 00h 01110000b 01110000b 10001000b 10001000b 00h 00h FFh FFh FFh FFh FFh FFh FFh FFh 00011111b 00h 01111111b TRCGRA TRCGRB TRCGRC TRCGRD TRCCR2 TRCDF TRCOER After reset R8C/2E Group, R8C/2F Group Table 4.6 4. Special Function Registers (SFRs) SFR Information (6)(1) Address Register 0140h 0141h 0142h 0143h 0144h 0145h 0146h 0147h 0148h 0149h 014Ah 014Bh 014Ch 014Dh 014Eh 014Fh 0150h 0151h 0152h 0153h 0154h 0155h 0156h 0157h 0158h 0159h 015Ah 015Bh 015Ch 015Dh 015Eh 015Fh 0160h 0161h 0162h 0163h 0164h 0165h 0166h 0167h 0168h 0169h 016Ah 016Bh 016Ch 016Dh 016Eh 016Fh 0170h 0171h 0172h 0173h 0174h Comparator 0 Control Register 0175h Comparator 1 Control Register 0176h 0177h Comparator Mode Register 0178h 0179h 017Ah 017Bh 017Ch 017Dh 017Eh 017Fh X: Undefined NOTE: 1. The blank regions are reserved. Do not access locations in these regions. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 22 of 39 Symbol After reset ACCR0 ACCR1 00001000b 00001000b ACMR 00h R8C/2E Group, R8C/2F Group Table 4.7 Address 0180h 0181h 0182h 0183h 0184h 0185h 0186h 0187h 0188h 0189h 018Ah 018Bh 018Ch 018Dh 018Eh 018Fh 0190h 0191h 0192h 0193h 0194h 0195h 0196h 0197h 0198h 0199h 019Ah 019Bh 019Ch 019Dh 019Eh 019Fh 01A0h 01A1h 01A2h 01A3h 01A4h 01A5h 01A6h 01A7h 01A8h 01A9h 01AAh 01ABh 01ACh 01ADh 01AEh 01AFh 01B0h 01B1h 01B2h 01B3h 01B4h 01B5h 01B6h 01B7h 01B8h 01B9h 01BAh 01BBh 01BCh 01BDh 01BEh 01BFh 4. Special Function Registers (SFRs) SFR Information (7)(1) Register Symbol After reset Flash Memory Control Register 4 FMR4 01000000b Flash Memory Control Register1 FMR1 1000000Xb Flash Memory Control Register 0 FMR0 00000001b OFS (Note 2) FFFFh Option Function Select Register X: Undefined NOTES: 1. The blank regions are reserved. Do not access locations in these regions. 2. The OFS register cannot be changed by a program. Use a flash programmer to write to it. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 23 of 39 R8C/2E Group, R8C/2F Group 5. 5. Electrical Characteristics Electrical Characteristics Table 5.1 Absolute Maximum Ratings Symbol Parameter Rated Value Unit -0.3 to 6.5 V Input voltage -0.3 to VCC + 0.3 V VO Output voltage -0.3 to VCC + 0.3 V Pd Power dissipation 500 mW Topr Operating ambient temperature -20 to 85 (N version) / -40 to 85 (D version) C Tstg Storage temperature -65 to 150 C VCC/AVCC Supply voltage VI Table 5.2 Condition Topr = 25C Recommended Operating Conditions Symbol Parameter Conditions Standard Min. Typ. Max. Unit VCC/AVCC Supply voltage 2.7 - 5.5 V VSS/AVSS Supply voltage - 0 - V VIH Input "H" voltage 0.8 VCC - VCC V VIL Input "L" voltage 0 - 0.2 VCC V IOH(sum) Peak sum output "H" current Sum of all pins IOH(peak) - - -160 mA IOH(sum) Average sum output "H" current Sum of all pins IOH(avg) - - -80 mA IOH(peak) Peak output "H" current Except P1_0 to P1_7 - - -10 mA P1_0 to P1_7 - - -20 mA IOH(avg) Average output "H" current Except P1_0 to P1_7 - - -5 mA P1_0 to P1_7 - - -10 mA IOL(sum) Peak sum output "L" currents Sum of all pins IOL(peak) - - 160 mA IOL(sum) Average sum Sum of all pins IOL(avg) output "L" currents - - 80 mA IOL(peak) Peak output "L" currents Except P1_0 to P1_7 - - 10 mA P1_0 to P1_7 - - 20 mA IOL(avg) Average output "L" current Except P1_0 to P1_7 - - 5 mA - - 10 mA f(XIN) XIN clock input oscillation frequency 3.0 V VCC 5.5 V 0 - 20 MHz 2.7 V VCC < 3.0 V 0 - 10 MHz - System clock OCD2 = 0 XlN clock selected 3.0 V VCC 5.5 V 0 - 20 MHz 2.7 V VCC < 3.0 V 0 - 10 MHz OCD2 = 1 On-chip oscillator clock selected FRA01 = 0 Low-speed on-chip oscillator clock selected - 125 - kHz FRA01 = 1 High-speed on-chip oscillator clock selected 3.0 V VCC 5.5 V - - 20 MHz FRA01 = 1 High-speed on-chip oscillator clock selected 2.7 V VCC 5.5 V - - 10 MHz P1_0 to P1_7 NOTES: 1. VCC = 2.7 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. The average output current indicates the average value of current measured during 100 ms. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 24 of 39 R8C/2E Group, R8C/2F Group 5. Electrical Characteristics P0 P1 30pF P3 P4 P5 Figure 5.1 Table 5.3 Ports P0, P1, and P3 to P5 Timing Measurement Circuit A/D Converter Characteristics Symbol Parameter - Resolution - Absolute accuracy Conditions Standard Min. Typ. Max. Unit Vref = AVCC - - 10 Bits 10-bit mode AD = 10 MHz, Vref = AVCC = 5.0 V - - 3 LSB 8-bit mode AD = 10 MHz, Vref = AVCC = 5.0 V - - 2 LSB 10-bit mode AD = 10 MHz, Vref = AVCC = 3.3 V - - 5 LSB 8-bit mode AD = 10 MHz, Vref = AVCC = 3.3 V - - 2 LSB Rladder Resistor ladder Vref = AVCC 10 - 40 k tconv Conversion time 10-bit mode AD = 10 MHz, Vref = AVCC = 5.0 V 3.3 - - s AD = 10 MHz, Vref = AVCC = 5.0 V 2.8 - - s 2.7 - AVCC V 0 - AVCC V 8-bit mode Vref Reference voltage VIA Analog input - A/D operating clock frequency voltage(2) Without sample and hold Vref = AVCC = 2.7 to 5.5 V 0.25 - 10 MHz With sample and hold Vref = AVCC = 2.7 to 5.5 V 1 - 10 MHz NOTES: 1. AVCC = 2.7 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in 8-bit mode. Table 5.4 D/A Converter Characteristics Symbol Parameter Conditions Standard Min. Typ. Max. Unit - Resolution - - 8 - Absolute accuracy - - 1.0 % tsu Setup time - - 3 s RO Output resistor 4 10 20 k IVref Reference power input current - - 1.5 mA (NOTE 2) Bit NOTES: 1. AVCC = 2.7 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. This applies when one D/A converter is used and the value of the DAi register (i = 0 or 1) for the unused D/A converter is 00h. The resistor ladder of the A/D converter is not included. Also, even if the VCUT bit in the ADCON1 register is set to 0 (VREF not connected), IVref flows into the D/A converters. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 25 of 39 R8C/2E Group, R8C/2F Group Table 5.5 5. Electrical Characteristics Comparator Characteristics(1) Symbol Parameter Conditions Standard Min. Typ. Max. Unit 0 - VCC-1.2 V -0.3 - VCC+0.3 V Input offset voltage - - 100 mV Response time - - 200 ns Vcref Comparator reference voltage Vcin Comparator input voltage Vofs Tcrsp NOTE: 1. VCC = 2.7 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. Table 5.6 Flash Memory (Program ROM) Electrical Characteristics Symbol - Parameter Program/erase endurance(2) Conditions Standard Unit Min. Typ. Max. R8C/2E Group 100(3) - - times R8C/2F Group 1,000(3) - - times s - Byte program time - 50 400 - Block erase time - 0.4 9 s td(SR-SUS) Time delay from suspend request until suspend - - 97+CPU clock x 6 cycles s - Interval from erase start/restart until following suspend request 650 - - s - Interval from program start/restart until following suspend request 0 - - ns - Time from suspend until program/erase restart - - 3+CPU clock x 4 cycles s - Program, erase voltage 2.7 - 5.5 V - Read voltage 2.7 - 5.5 V - Program, erase temperature 0 - 60 C - Data hold time(7) 20 - - year Ambient temperature = 55C NOTES: 1. VCC = 2.7 to 5.5 V at Topr = 0 to 60C, unless otherwise specified. 2. Definition of programming/erasure endurance The programming and erasure endurance is defined on a per-block basis. If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024 1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance still stands at one. However, the same address must not be programmed more than once per erase operation (overwriting prohibited). 3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the number of erase operations to a certain number. 5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative. 7. The data hold time includes time that the power supply is off or the clock is not supplied. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 26 of 39 R8C/2E Group, R8C/2F Group Table 5.7 5. Electrical Characteristics Flash Memory (Data flash Block A, Block B) Electrical Characteristics(4) Symbol Parameter Conditions Standard Min. Typ. Max. Unit 10,000(3) - - times Byte program time (program/erase endurance 1,000 times) - 50 400 s - Byte program time (program/erase endurance > 1,000 times) - 65 - s - Block erase time (program/erase endurance 1,000 times) - 0.2 9 s - Block erase time (program/erase endurance > 1,000 times) - 0.3 - s td(SR-SUS) Time delay from suspend request until suspend - - 97+CPU clock x 6 cycles s - Interval from erase start/restart until following suspend request 650 - - s - Interval from program start/restart until following suspend request 0 - - ns - Time from suspend until program/erase restart - - 3+CPU clock x 4 cycles s - Program, erase voltage 2.7 - 5.5 V - Read voltage 2.7 - 5.5 V - Program, erase temperature -20(8) - 85 C - Data hold time(9) 20 - - year - Program/erase endurance(2) - Ambient temperature = 55 C NOTES: 1. VCC = 2.7 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. Definition of programming/erasure endurance The programming and erasure endurance is defined on a per-block basis. If the programming and erasure endurance is n (n = 100 or 10,000), each block can be erased n times. For example, if 1,024 1-byte writes are performed to block A, a 1 Kbyte block, and then the block is erased, the programming/erasure endurance still stands at one. However, the same address must not be programmed more than once per erase operation (overwriting prohibited). 3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed). 4. Standard of block A and block B when program and erase endurance exceeds 1,000 times. Byte program time to 1,000 times is the same as that in program ROM. 5. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example, when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups before erasing them all in one operation. It is also advisable to retain data on the erase count of each block and limit the number of erase operations to a certain number. 6. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase command at least three times until the erase error does not occur. 7. Customers desiring program/erase failure rate information should contact their Renesas technical support representative. 8. -40C for D version. 9. The data hold time includes time that the power supply is off or the clock is not supplied. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 27 of 39 R8C/2E Group, R8C/2F Group 5. Electrical Characteristics Suspend request (maskable interrupt request) FMR46 Clock-dependent time Fixed time Access restart td(SR-SUS) Figure 5.2 Table 5.8 Time delay until Suspend Voltage Detection 1 Circuit Electrical Characteristics Symbol Parameter Condition Vdet1 Voltage detection level(4) - Voltage monitor 1 interrupt request generation time(2) - Voltage detection circuit self power consumption td(E-A) Waiting time until voltage detection circuit operation starts(3) Vccmin MCU operating voltage minimum value VCA26 = 1, VCC = 5.0 V Standard Unit Min. Typ. Max. 2.7 2.85 3.00 V - 40 - s - 0.6 - A - - 100 s 2.7 - - V NOTES: 1. The measurement condition is VCC = 2.7 V to 5.5 V and Topr = -20 to 85C (N version) / -40 to 85C (D version). 2. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1. 3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2 register to 0. 4. This parameter shows the voltage detection level when the power supply drops. The voltage detection level when the power supply rises is higher than the voltage detection level when the power supply drops by approximately 0.1 V. Table 5.9 Voltage Detection 2 Circuit Electrical Characteristics Symbol Vdet2 Parameter Condition Voltage detection level - Voltage monitor 2 interrupt request generation - Voltage detection circuit self power consumption td(E-A) Waiting time until voltage detection circuit operation starts(3) time(2) VCA27 = 1, VCC = 5.0 V Standard Min. Typ. Max. 3.3 3.6 3.9 Unit V - 40 - s - 0.6 - A - - 100 s NOTES: 1. The measurement condition is VCC = 2.7 V to 5.5 V and Topr = -20 to 85C (N version) / -40 to 85C (D version). 2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2. 3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2 register to 0. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 28 of 39 R8C/2E Group, R8C/2F Group Table 5.10 5. Electrical Characteristics Power-on Reset Circuit, Voltage Monitor 0 Reset Electrical Characteristics Symbol Parameter Condition Standard Min. Typ. Max. Unit Vpor1 Power-on reset valid voltage(3) - - 0.1 V Vpor2 Power-on reset valid voltage 0 - 2.6 V trth External power VCC rise gradient(2) 20 - - mV/msec NOTES: 1. The measurement condition is Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. This condition (external power VCC rise gradient) does not apply if VCC 1.0 V. 3. tw(por1) indicates the duration the external power VCC must be held below the effective voltage (Vpor1) to enable a power on reset. When turning on the power for the first time, maintain tw(por1) for 30 s or more if -20C Topr 85C, maintain tw(por1) for 3,000 s or more if -40C Topr < -20C. max. 2.6 V max. 2.6 V 2.2 V trth trth External Power VCC Vpor2 Vpor1 Sampling time(1, 2) tw(por1) Internal reset signal ("L" valid) 1 x 32 fOCO-S NOTES: 1. Ensure that the voltage is 2.2 V or above during the sampling time. 2. The sampling time is fOCO-S divided by 1 x 4 cycles. Figure 5.3 Reset Circuit Electrical Characteristics Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 29 of 39 1 x 32 fOCO-S R8C/2E Group, R8C/2F Group Table 5.11 High-speed On-Chip Oscillator Circuit Electrical Characteristics Symbol fOCO40M 5. Electrical Characteristics Parameter High-speed on-chip oscillator frequency temperature * supply voltage dependence High-speed on-chip oscillator frequency when correction value in FRA7 register is written to FRA1 register - Value in FRA1 register after reset - Oscillation frequency adjustment unit of highspeed on-chip oscillator - Oscillation stability time - Self power consumption at oscillation Condition Standard Unit Min. Typ. Max. VCC = 4.75 V to 5.25 V 0C Topr 60C(2) 39.2 40 40.8 MHz VCC = 3.0 V to 5.5 V -20C Topr 85C(2) 38.8 40 41.2 MHz VCC = 3.0 V to 5.5 V -40C Topr 85C(2) 38.4 40 41.6 MHz VCC = 2.7 V to 5.5 V -20C Topr 85C(2) 38 40 42 MHz VCC = 2.7 V to 5.5 V -40C Topr 85C(2) 37.6 40 42.4 MHz VCC = 5.0 V 10% -20C Topr 85C(2) 38.8 40 40.8 MHz VCC = 5.0 V 10% -40C Topr 85C(2) 38.4 40 40.8 MHz - 36.864 - MHz -3% - 3% % VCC = 5.0 V, Topr = 25C VCC = 2.7 V to 5.5 V -20C Topr 85C 08h - F7h - Adjust FRA1 register (value after reset) to -1 - +0.3 - MHz - 10 100 s VCC = 5.0 V, Topr = 25C - 400 - A NOTES: 1. VCC = 2.7 to 5.5 V, Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. 2. These standard values show when the FRA1 register value after reset is assumed. Table 5.12 Low-speed On-Chip Oscillator Circuit Electrical Characteristics Symbol Parameter Condition Standard Min. Typ. Max. Unit fOCO-S Low-speed on-chip oscillator frequency 30 125 250 - Oscillation stability time - 10 100 s - Self power consumption at oscillation - 15 - A VCC = 5.0 V, Topr = 25C kHz NOTE: 1. VCC = 2.7 to 5.5 V, Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified. Table 5.13 Power Supply Circuit Timing Characteristics Symbol Parameter Condition Standard Min. Typ. Max. Unit td(P-R) Time for internal power supply stabilization during power-on(2) 1 - 2000 s td(R-S) STOP exit time(3) - - 150 s NOTES: 1. The measurement condition is VCC = 2.7 to 5.5 V and Topr = 25C. 2. Waiting time until the internal power supply generation circuit stabilizes during power-on. 3. Time until system clock supply starts after the interrupt is acknowledged to exit stop mode. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 30 of 39 R8C/2E Group, R8C/2F Group Table 5.14 Electrical Characteristics (1) [VCC = 5 V] Symbol VOH 5. Electrical Characteristics Parameter Output "H" voltage Except P1_0 to P1_7, XOUT P1_0 to P1_7 Condition Output "L" voltage Except P1_0 to P1_7, XOUT VCC - 2.0 - VCC V VCC - 0.5 - VCC V Drive capacity HIGH IOH = -10 mA VCC - 2.0 - VCC V IOH = -5 mA VCC - 2.0 - VCC V Drive capacity HIGH IOH = -1 mA VCC - 2.0 - VCC V VCC - 2.0 - VCC V - - 2.0 V IOH = -500 A IOL = 5 mA IOL = 200 A - - 0.45 V - - 2.0 V IOL = 5 mA - - 2.0 V Drive capacity HIGH IOL = 1 mA - - 2.0 V - - 2.0 V INT0, INT1, INT3, KI0, KI1, KI2, KI3, TRAIO, RXD0, CLK0 0.1 0.5 - V RESET 0.1 1.0 - V A Drive capacity LOW XOUT Drive capacity LOW Hysteresis Unit Drive capacity HIGH IOL = 10 mA P1_0 to P1_7 VT+-VT- Max. IOH = -5 mA Drive capacity LOW VOL Typ. IOH = -200 A Drive capacity LOW XOUT Standard Min. IOL = 500 A IIH Input "H" current VI = 5 V, VCC = 5 V - - 5.0 IIL Input "L" current VI = 0 V, VCC = 5 V - - -5.0 A VI = 0 V, VCC = 5 V 30 50 167 k - 1.0 - M 1.8 - - V RPULLUP Pull-up resistance RfXIN Feedback resistance VRAM RAM hold voltage XIN During stop mode NOTE: 1. VCC = 4.2 to 5.5 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), f(XIN) = 20 MHz, unless otherwise specified. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 31 of 39 R8C/2E Group, R8C/2F Group Table 5.15 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (2) [Vcc = 5 V] (Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified.) Parameter Condition Unit Typ. Max. XIN = 20 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division - 10 17 mA XIN = 16 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division - 9 15 mA XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division - 6 - mA XIN = 20 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 5 - mA XIN = 16 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 4 - mA XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 2.5 - mA XIN clock off High-speed on-chip oscillator on fOCO = 20 MHz Low-speed on-chip oscillator on = 125 kHz No division - 10 15 mA XIN clock off High-speed on-chip oscillator on fOCO = 20 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 4 - mA XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz No division - 5.5 10 mA XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 2.5 - mA Low-speed on-chip oscillator mode XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8, FMR47 = 1 - 130 300 A Wait mode XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock operation VCA27 = VCA26 = 0 VCA20 = 1 - 25 75 A XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock off VCA27 = VCA26 = 0 VCA20 = 1 - 23 60 A XIN clock off, Topr = 25C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = 0 - 0.8 3.0 A XIN clock off, Topr = 85C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = 0 - 1.2 - A Power supply High-speed clock mode current (VCC = 3.3 to 5.5 V) Single-chip mode, output pins are open, other pins are VSS High-speed on-chip oscillator mode Stop mode Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Standard Min. Page 32 of 39 R8C/2E Group, R8C/2F Group 5. Electrical Characteristics Timing Requirements (Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25C) [VCC = 5 V] Table 5.16 XIN Input Symbol Standard Parameter Min. Max. Unit tc(XIN) XIN input cycle time 50 - ns tWH(XIN) XIN input "H" width 25 - ns tWL(XIN) XIN input "L" width 25 - ns VCC = 5 V tC(XIN) tWH(XIN) XIN input tWL(XIN) Figure 5.4 Table 5.17 XIN Input Timing Diagram when VCC = 5 V TRAIO Input Symbol Standard Parameter Min. Max. Unit tc(TRAIO) TRAIO input cycle time 100 - ns tWH(TRAIO) TRAIO input "H" width 40 - ns tWL(TRAIO) TRAIO input "L" width 40 - ns tC(TRAIO) tWH(TRAIO) TRAIO input tWL(TRAIO) Figure 5.5 TRAIO Input Timing Diagram when VCC = 5 V Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 33 of 39 VCC = 5 V R8C/2E Group, R8C/2F Group Table 5.18 5. Electrical Characteristics Serial Interface Symbol Standard Parameter Min. Max. Unit tc(CK) CLK0 input cycle time 200 - ns tW(CKH) CLK0 input "H" width 100 - ns tW(CKL) CLK0 input "L" width 100 - ns td(C-Q) TXD0 output delay time - 50 ns th(C-Q) TXD0 hold time 0 - ns tsu(D-C) RXD0 input setup time 50 - ns th(C-D) RXD0 input hold time 90 - ns VCC = 5 V tC(CK) tW(CKH) CLK0 tW(CKL) th(C-Q) TXD0 td(C-Q) tsu(D-C) th(C-D) RXD0 Figure 5.6 Table 5.19 Serial Interface Timing Diagram when VCC = 5 V External Interrupt INTi (i = 0, 1, 3) Input Symbol Standard Parameter Min. Max. Unit tW(INH) INTi input "H" width 250(1) - ns tW(INL) INTi input "L" width 250(2) - ns NOTES: 1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock frequency x 3) or the minimum value of standard, whichever is greater. 2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock frequency x 3) or the minimum value of standard, whichever is greater. VCC = 5 V tW(INL) INTi input tW(INH) i = 0, 1, 3 Figure 5.7 External Interrupt INTi Input Timing Diagram when VCC = 5 V Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 34 of 39 R8C/2E Group, R8C/2F Group Table 5.20 Electrical Characteristics (3) [VCC = 3 V] Symbol VOH 5. Electrical Characteristics Parameter Output "H" voltage Output "L" voltage Hysteresis Unit Typ. Max. VCC - 0.5 - VCC V IOH = -1 mA P1_0 to P1_7 Drive capacity HIGH IOH = -2 mA VCC - 0.5 - VCC V Drive capacity LOW IOH = -1 mA VCC - 0.5 - VCC V Drive capacity HIGH IOH = -0.1 mA VCC - 0.5 - VCC V Drive capacity LOW IOH = -50 A VCC - 0.5 - VCC V - - 0.5 V Except P1_0 to P1_7, XOUT IOL = 1 mA P1_0 to P1_7 Drive capacity HIGH IOL = 2 mA - - 0.5 V Drive capacity LOW IOL = 1 mA - - 0.5 V Drive capacity HIGH IOL = 0.1 mA - - 0.5 V Drive capacity LOW IOL = 50 A - - 0.5 V INT0, INT1, INT3, KI0, KI1, KI2, KI3, TRAIO, RXD0, CLK0 0.1 0.3 - V RESET 0.1 0.4 - V A XOUT VT+-VT- Standard Min. Except P1_0 to P1_7, XOUT XOUT VOL Condition IIH Input "H" current VI = 3 V, VCC = 3 V - - 4.0 IIL Input "L" current VI = 0 V, VCC = 3 V - - -4.0 A VI = 0 V, VCC = 3 V 66 160 500 k - 3.0 - M During stop mode 1.8 - - V RPULLUP Pull-up resistance RfXIN Feedback resistance VRAM RAM hold voltage XIN NOTE: 1. VCC =2.7 to 3.3 V at Topr = -20 to 85C (N version) / -40 to 85C (D version), f(XIN) = 10 MHz, unless otherwise specified. Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 35 of 39 R8C/2E Group, R8C/2F Group Table 5.21 Symbol ICC 5. Electrical Characteristics Electrical Characteristics (4) [Vcc = 3 V] (Topr = -20 to 85C (N version) / -40 to 85C (D version), unless otherwise specified.) Parameter Condition Unit Typ. Max. XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz No division - 6 - mA XIN = 10 MHz (square wave) High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 2 - mA High-speed on-chip oscillator mode XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz No division - 5 9 mA XIN clock off High-speed on-chip oscillator on fOCO = 10 MHz Low-speed on-chip oscillator on = 125 kHz Divide-by-8 - 2 - mA Low-speed on-chip oscillator mode XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz Divide-by-8, FMR47 = 1 - 130 300 A Wait mode XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock operation VCA27 = VCA26 = 0 VCA20 = 1 - 25 70 A XIN clock off High-speed on-chip oscillator off Low-speed on-chip oscillator on = 125 kHz While a WAIT instruction is executed Peripheral clock off VCA27 = VCA26 = 0 VCA20 = 1 - 23 55 A XIN clock off, Topr = 25C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = 0 - 0.7 3.0 A XIN clock off, Topr = 85C High-speed on-chip oscillator off Low-speed on-chip oscillator off CM10 = 1 Peripheral clock off VCA27 = VCA26 = 0 - 1.1 - A Power supply current High-speed (VCC = 2.7 to 3.3 V) clock mode Single-chip mode, output pins are open, other pins are VSS Stop mode Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Standard Min. Page 36 of 39 R8C/2E Group, R8C/2F Group 5. Electrical Characteristics Timing requirements (Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25C) [VCC = 3 V] Table 5.22 XIN Input Symbol Standard Parameter Min. Max. Unit tc(XIN) XIN input cycle time 100 - ns tWH(XIN) XIN input "H" width 40 - ns tWL(XIN) XIN input "L" width 40 - ns VCC = 3 V tC(XIN) tWH(XIN) XIN input tWL(XIN) Figure 5.8 XIN Input Timing Diagram when VCC = 3 V Table 5.23 TRAIO Input Symbol Standard Parameter Min. Max. Unit tc(TRAIO) TRAIO input cycle time 300 - ns tWH(TRAIO) TRAIO input "H" width 120 - ns tWL(TRAIO) TRAIO input "L" width 120 - ns tC(TRAIO) tWH(TRAIO) TRAIO input tWL(TRAIO) Figure 5.9 TRAIO Input Timing Diagram when VCC = 3 V Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 37 of 39 VCC = 3 V R8C/2E Group, R8C/2F Group Table 5.24 5. Electrical Characteristics Serial Interface Symbol Standard Parameter Min. Max. Unit tc(CK) CLK0 input cycle time 300 - ns tW(CKH) CLK0 input "H" width 150 - ns tW(CKL) CLK0 Input "L" width 150 - ns td(C-Q) TXD0 output delay time - 80 ns th(C-Q) TXD0 hold time 0 - ns tsu(D-C) RXD0 input setup time 70 - ns th(C-D) RXD0 input hold time 90 - ns VCC = 3 V tC(CK) tW(CKH) CLK0 tW(CKL) th(C-Q) TXD0 td(C-Q) tsu(D-C) th(C-D) RXD0 Figure 5.10 Table 5.25 Serial Interface Timing Diagram when VCC = 3 V External Interrupt INTi (i = 0, 1, 3) Input Symbol tW(INH) tW(INL) Standard Parameter Unit Min. Max. INTi input "H" width 380(1) - ns INTi input "L" width 380(2) - ns NOTES: 1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock frequency x 3) or the minimum value of standard, whichever is greater. 2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock frequency x 3) or the minimum value of standard, whichever is greater. VCC = 3 V tW(INL) INTi input tW(INH) i = 0, 1, 3 Figure 5.11 External Interrupt INTi Input Timing Diagram when VCC = 3 V Rev.1.00 Dec 14, 2007 REJ03B0222-0100 Page 38 of 39 R8C/2E Group, R8C/2F Group Package Dimensions Package Dimensions Diagrams showing the latest package dimensions and mounting information are available in the "Packages" section of the Renesas Technology website. JEITA Package Code P-LQFP32-7x7-0.80 RENESAS Code PLQP0032GB-A Previous Code 32P6U-A MASS[Typ.] 0.2g HD *1 D 24 17 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 16 25 bp c c1 HE *2 E b1 Reference Dimension in Millimeters Symbol 32 9 1 ZE Terminal cross section 8 ZD c A A1 F A2 Index mark L D E A2 HD HE A A1 bp b1 c c1 L1 y e Rev.1.00 Dec 14, 2007 REJ03B0222-0100 *3 Detail F bp Page 39 of 39 x e x y ZD ZE L L1 Min Nom Max 6.9 7.0 7.1 6.9 7.0 7.1 1.4 8.8 9.0 9.2 8.8 9.0 9.2 1.7 0.1 0.2 0 0.32 0.37 0.42 0.35 0.09 0.145 0.20 0.125 0 8 0.8 0.20 0.10 0.7 0.7 0.3 0.5 0.7 1.0 REVISION HISTORY REVISION HISTORY Rev. Date 0.10 Aug 01, 2007 1.00 Dec 14, 2007 R8C/2E Group, R8C/2F Group Datasheet R8C/2E Group, R8C/2F Group Datasheet Description Page - Summary First Edition issued All pages "Under development" deleted 2, 4 Table 1.1, Table 1.3: "Interrupts" revised 6, 7 Table 1.5, Table 1.6: "(D)" deleted 15, 16 Figure 3.1, Figure 3.2: "Expanded area" deleted 17 Table 4.1: "002Ch" added 24 Table 5.2: IOH(sum), NOTE2 revised 30 Table 5.11: Symbol "fOCO40M"; Parameter added All trademarks and registered trademarks are the property of their respective owners. A-1 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. 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