(R) Direct RambusTM RIMMTM Module Specification Version 1.0 Copyright 2000 Rambus Inc. All rights reserved. Rambus, RDRAM, and the Rambus Logo are registered trademarks of Rambus Inc. Direct Rambus, RIMM, SORIMM, and Direct RDRAM are trademarks of Rambus Inc. Rambus Inc. assumes no responsibility or liability for any use of the information contained herein. RAMBUS SHALL HAVE NO LIABILITY, DIRECT, INDIRECT, OR OTHERWISE, ARISING OUT OF THIS DIRECT RAMBUS RIMM MODULE SPECIFICATION OR THE USE THEREOF. Direct RDRAMs are manufactured and sold by Rambus RDRAM licensees. Rambus DRAM licensees provide data sheets specific to their RDRAM products. For a list of Rambus licensees who are providing Direct RDRAMs, refer to our website: http:// www.rambus.com. (R) Data contained in this document is preliminary and subject to change without notice. Rambus Inc. assumes no responsibility for any errors that may appear in this document. Rambus Inc. makes no warranties, express or implied, of functionality or suitability for any purpose. THIS DIRECT RAMBUS RIMM MODULE SPECIFICATION IS PROVIDED "AS IS" WITH NO WARRANTIES WHATSOEVER, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF MERCHANTABILITY, OR FITNESS FOR ANY PARTICULAR PURPOSE. No license is granted by implication, estoppel or otherwise under any patent or other intellectual property rights of Rambus Inc. Rambus Inc. 2465 Latham Street Mountain View, California USA 94040 Telephone: 650-944-8000 Fax: 650-944-8080 http://www.rambus.com Direct RambusTM RIMMTM Module Specification 1.0 Table of Contents Chapter 1 1.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.1.1 Chapter 2 2.1 2.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 RIMM Configurations Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1.1 Temperature and Humidity Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.1.2 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2.1 Dimensions and Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2.2 Module Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2.3 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2.4 Plating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2.5 Contact Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2.6 Keying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 Reliability Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 RIMM Module Validation Requirement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.5 Module Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.5.1 Signal Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.6 RIMM Module Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 RIMM Layout Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 2.7.1 Routing Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.7.2 Placement Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.8.1 2.9 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.9.1 Fixtures & Probes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.9.2 Impedance Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.9.3 Propagation Delay Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.9.4 Delta Propagation Delay Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.9.5 Attenuation Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.9.6 Crosstalk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.9.7 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.10 RDRAM Component Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.11 SPD Component Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Direct RambusTM RIMMTM Module Specification 1.0 Page i Page ii Direct RambusTM RIMMTM Module Specification 1.0 List of Figures Figure 2-1: RIMM Module Mechanical Drawing 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 2-2: RIMM Module Mechanical Drawing 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2-3: Module Keying . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2-4: RIMM Module Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 2-5: Trace Length Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 2-6: 1.375" RIMM Module Mechanical Drawing with Heatspeader and Component Placement Restrictions 12 Figure 2-7: 1.25" RIMM Module Mechanical Drawing with Heatspeader and Component Placement Restrictions . 13 Figure 2-8: Measure Impedance and Propagation Delay by TDR . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 2-9: Signal Attenuation Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 2-10:Crosstalk Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Direct RambusTM RIMMTM Module Specification 1.0 Page iii Page iv Direct RambusTM RIMMTM Module Specification 1.0 List of Tables Table 2-1: RIMM Module Temperature, Humidity and Barometric Pressure Requirements . . . . . . . . . . . 3 Table 2-2: Keying Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 2-3: Device Signal Level Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2-4: Module Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 2-5: Routing Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 2-6: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 2-7: Design Characterization Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 2-8: AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 2-9: Adjusted DTPD specification: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 2-10: EEPROM Component Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 2-11: EEPROM Component Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Direct RambusTM RIMMTM Module Specification 1.0 Page v Page vi Direct RambusTM RIMMTM Module Specification 1.0 Chapter 1 1.1 Introduction Introduction This specification defines the electrical and mechanical requirements for 184 pin, 2.5 volt, 600 or 800 MHz, 16-bit and 18-bit, Direct RDRAM RIMM memory modules. A principal use of these RIMM modules is for main memory when installed on personal computer motherboards. These requirements support interchangeable modules of 1 to 16 RDRAM devices to be used in Rambus Channel. Direct Rambus Channel supports up to three RIMM modules. 1.1.1 RIMM Configurations Supported RIMM modules can support 1 to 16 Direct RDRAM devices per module. The basic design of the RIMM should not preclude the ability to design any capacity RIMM. However, there are several configuration that should be most popular: 1) Maximum capacity: 16 RDRAM RIMM modules are available for maximum capacity systems. 2) Typical module configurations: 4, 6, 8, and 16 using 64Mb/72Mb RDRAM devices (32MB, 48MB, 64MB, and 128MB) will most likely be the minimum memory size to be shipped with any PC as base memory. Direct RambusTM RIMMTM Module Specification 1.0 Page 1-1 Introduction Page 1-2 Direct RambusTM RIMMTM Module Specification 1.0 Chapter 2 2.1 Specifications Environmental The RIMM module must operate within a personal computer cabinet in an office or home environment. 2.1.1 Temperature and Humidity Limits The environmental parameters for both storage and operating conditions are listed in Table 2-1. Table 2-1: RIMM Module Temperature, Humidity and Barometric Pressure Requirements Environmental Condition Limit Ambient Operating Temperature (Ta) Application dependent, 0 C to +55 C typically Operating Humidity 10% to 90% relative humidity Storage Temperature -50 C to +100 C Storage Humidity 5% to 95% without condensation Barometric Pressure (operating & storage) 105K - 69K Pascal (up to 3000 meters) 2.1.2 Safety The RIMM module printed wiring board is to have a flammability rating of 94V-O. Markings should include UL tractability requirements per UL Recognized Component Directory. 2.2 Mechanical Design 2.2.1 Dimensions and Tolerances The module is a multi-layer PC board. PC board thickness is 1.27 0.10mm (0.050 0.004 in) measured at the contact pads. Maximum warpage is 1% (0.01 mm per mm). The board manufacturer must maintain 28 + 10% impedance for the loaded and unloaded sections of all RSL signal traces on the module. In addition, the board manufacturer should maintain the impedance of the two high speed CMOS signals (SCK and CMD) to 28 + 10% for the loaded sections and 28 + 15% for the unloaded sections. Direct RambusTM RIMMTM Module Specification 1.0 Page 2-3 Specifications 2.2.2 Module Drawing Figure 2-1 shows the RIMM module PCB outline. The maximum module height is 35.0 mm. Figure 2-1: Page 2-4 RIMM Module Mechanical Drawing 1 Direct RambusTM RIMMTM Module Specification 1.0 Figure 2-2: RIMM Module Mechanical Drawing 2 The contact region must be clear of solder mask. PCB designers should avoid placing additional vias in this region. 2.2.3 Weight Weight = 45 grams, maximum. Center of gravity specifications: a maximum of 35 mm from the bottom edge of the RIMM module. 2.2.4 Plating Contact pad thicknesses are 0.75 microns (30 micro-inches) gold over a minimum of 2 microns (80 micro-inches) nickel. 2.2.5 Contact Requirement Leading edge of contact pads specified as the keep out zone must be free of burrs and external tie bars (see Figure 2-2). The tie bar must be offset from the center line. 2.2.6 Keying The RIMM module will be keyed for insertion orientation, safety, and configuration. To allow for future expansions, there are three possible keying options in the RIMM module designs. The left key which is indicated as DATUM A is fixed, but the center key can be moved 1.0 mm or 2.0 mm to the right. The default is option A as shown in Figure . Direct RambusTM RIMMTM Module Specification 1.0 Page 2-5 Specifications Option A (default): DATUM A 11.50 mm Option B: DATUM A Option C: 12.50 mm DATUM A 13.50 mm Figure 2-3: Module Keying The following table describes a few possible options: Table 2-2: Option 2.3 Keying Options Connector Key Module Key Module Description 1 A A VDD=2.5V 2 B B TBD 3 C C TBD Reliability Requirement TBD. 2.4 RIMM Module Validation Requirement See RIMM Module Validation Specification. Page 2-6 Direct RambusTM RIMMTM Module Specification 1.0 2.5 Module Pinout 2.5.1 Signal Types Table 2-3 summarizes the types of signals used in the RIMM module. In the table, RSL stands for Rambus Signaling Levels. Table 2-3: Device Signal Level Summary Pin Type Levels IO Polarity Clock RSL I Active low Data RSL IO Active low Request RSL I Active low Serial CMOS I, IOa Active high Power Gnd, VDD, VREF, VCMOS Power DC voltages a. SCK and CMD are input only. SIN and SOUT are input/output. For simplicity, the following definitions are used: ClockFromMaster (CFM), ClockToMaster (CTM) and their complements, CFMN and CTMN, are described as Clock. Bi-directional DQA[8:0] and DQB[8:0] data signals are collectively referred to as Data. DQ is a synonym for Data. Uni-directional ROW[2:0] and COL[4:0] request signals are simply referred to as Request. RQ is a synonym for Request. CMOS SCK, CMD, and SIN and SOUT control signals are collectively called Serial. The RIMM module pinout has the prefixes (Lxxx or Rxxx) for all signals to distinguish the locations of the signals relative to pin A1. Signals with Lxxx prefix (left side of the module) is closer to pin A1, and signals with Rxxx prefix (right side of the module) is closer to pin A92. Direct RambusTM RIMMTM Module Specification 1.0 Page 2-7 Specifications Table 2-4: Pin A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46 Page 2-8 Pin Name Gnd LDQA8 Gnd LDQA6 Gnd LDQA4 Gnd LDQA2 Gnd LDQA0 Gnd LCTMN Gnd LCTM Gnd RSRV2 (NC) Gnd LROW1 Gnd LCOL4 Gnd LCOL2 Gnd LCOL0 Gnd LDQB1 Gnd LDQB3 Gnd LDQB5 Gnd LDQB7 Gnd LSCK Vcmos SOUT Vcmos RSRV3 (NC) Gnd RSRV5 (NC) Vdd Vdd RSRV9-(NC) RSRV11-(NC) RSRV13-(NC) RSRV15-(NC) Pin B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 Module Pinout Pin Name Gnd LDQA7 Gnd LDQA5 Gnd LDQA3 Gnd LDQA1 Gnd LCFM Gnd LCFMN Gnd RSRV1 (NC) Gnd LROW2 Gnd LROW0 Gnd LCOL3 Gnd LCOL1 Gnd LDQB0 Gnd LDQB2 Gnd LDQB4 Gnd LDQB6 Gnd LDQB8 Gnd LCMD Vcmos SIN Vcmos RSRV4 (NC) Gnd RSRV6 (NC) Vdd Vdd RSRV10-(NC) RSRV12-(NC) RSRV14-(NC) RSRV16-(NC) Pin A47 A48 A49 A50 A51 A52 A53 A54 A55 A56 A57 A58 A59 A60 A61 A62 A63 A64 A65 A66 A67 A68 A69 A70 A71 A72 A73 A74 A75 A76 A77 A78 A79 A80 A81 A82 A83 A84 A85 A86 A87 A88 A89 A90 A91 A92 Pin Name RSRV17-(NC) RSRV19-(NC) RSRV21-(NC) RSRV23-(NC) Vref Gnd SCL Vdd SDA SVdd SWP Vdd RSCK Gnd RDQB7 Gnd RDQB5 Gnd RDQB3 Gnd RDQB1 Gnd RCOL0 Gnd RCOL2 Gnd RCOL4 Gnd RROW1 Gnd RSRV7 (NC) Gnd RCTM Gnd RCTMN Gnd RDQA0 Gnd RDQA2 Gnd RDQA4 Gnd RDQA6 Gnd RDQA8 Gnd Pin B47 B48 B49 B50 B51 B52 B53 B54 B55 B56 B57 B58 B59 B60 B61 B62 B63 B64 B65 B66 B67 B68 B69 B70 B71 B72 B73 B74 B75 B76 B77 B78 B79 B80 B81 B82 B83 B84 B85 B86 B87 B88 B89 B90 B91 B92 Pin Name RSR18V-(NC) RSRV20-(NC) RSRV22-(NC) RSRV24-(NC) Vref Gnd SA0 Vdd SA1 SVdd SA2 Vdd RCMD Gnd RDQB8 Gnd RDQB6 Gnd RDQB4 Gnd RDQB2 Gnd RDQB0 Gnd RCOL1 Gnd RCOL3 Gnd RROW0 Gnd RROW2 Gnd RSRV8 (NC) Gnd RCFMN Gnd RCFM Gnd RDQA1 Gnd RDQA3 Gnd RDQA5 Gnd RDQA7 Gnd Direct RambusTM RIMMTM Module Specification 1.0 2.6 RIMM Module Block Diagram (The number of devices per module can be from one to sixteen) Left Paddle Right Paddle LDQA[8:0] RDQA[8:0] LDQB[8:0] RDQB[8:0] LROW[2:0] RROW[2:0] LCOL[4:0] RCOL[4:0] LCTM/N D0 D1 D2 D15 RCTM/N LCFM/N RCFM/N LSCK RSCK LCMD S I O 0 Vref S I O 1 S I O 0 S I O 1 S I O 0 S I O 1 S I O 0 S I O 1 RCMD Vcmos SIN SOUT Vdd Vref Vcmos Gnd Gnd Gnd Recommended bypass: Two 0.1F per device (X7R or Z5U; 0603) Recommended bypass: One 0.1F per two devices One at the connector pin (X7R or Z5U; 0603) Recommended bypass: One 0.1F per two devices (X7R or Z5U; 0603) SVdd (2.5V-3.3V) SVdd Serial PD SCL SDA Gnd SA[2:0] SWP Recommended bypass: One 0.1F (X7R or Z5U; 0603) 47K (Optional) Figure 2-4: RIMM Module Block Diagram Direct RambusTM RIMMTM Module Specification 1.0 Page 2-9 Specifications 2.7 RIMM Layout Restrictions 2.7.1 Routing Restrictions Besides meeting the total delay specified in Table 2-8, the following length restrictions must be met. Lright Last Device Lleft First Device Pin A1 Length Figure 2-5: Trace Length Definition Table 2-5: Routing Restrictions From To Length (mm) Lleft Edge of connector finger The via of the first RDRAM device 60 (max for 4 device module) 35 (max for 6 device module) 41 (max for 8 device module) 35 (max for 12 device module) 35 (max for 16 device module) Lright The via of the last RDRAM device Edge of connector finger 60 (max for 4 device module) 35 (max for 6 device module) 41 (max for 8 device module) 35 (max for 12 device module) 35 (max for 16 device module) The LLEFT and LRIGHT restrictions do not apply to the Continuity RIMM module, provided the signals should have a maximum length as specified by the TPD specification. Page 2-10 Direct RambusTM RIMMTM Module Specification 1.0 2.7.2 Placement Restrictions If the RIMM module is to be used with a heatspreader, the following (Figure 2-6 and Figure 2-7) are the dimensions and locations of the mounting holes. In order to fit the heatspreaders currently recommended by Rambus, the RDRAM devices, SPD, capacitors and resistor must be placed in the designated areas as shown in Figure 2-6 and Figure 2-7. Figure 2-6 is for 1.375" tall module, and Figure 2-7 is for 1.25" tall module. Direct RambusTM RIMMTM Module Specification 1.0 Page 2-11 Specifications Figure 2-6: Page 2-12 1.375" RIMM Module Mechanical Drawing with Heatspeader and Component Placement Restrictions Direct RambusTM RIMMTM Module Specification 1.0 Figure 2-7: 1.25" RIMM Module Mechanical Drawing with Heatspeader and Component Placement Restrictions Direct RambusTM RIMMTM Module Specification 1.0 Page 2-13 Specifications 2.8 DC Electrical Specifications 2.8.1 Absolute Maximum Ratings Table 2-6: Absolute Maximum Ratings Symbol 2.9 Parameter Min Max Unit VI,ABS Voltage applied to any RSL or CMOS pin with respect to Gnd -0.3 VDD + 0.3 V VDD,ABS VDDA,ABS Voltage on Vdd and VddA with respect to Gnd and GndA -0.5 VDD + 1.0 V AC Electrical Specifications Design verification by virtue of detailed characterizations is necessary at the prototype phase to guarantee, by design, compliance with the RIMM module design requirements. These tests are required at the beginning of the production cycle. These tests should be performed as often as needed in the production cycle to make sure the RIMM module still meets the specifications. It is important to differentiate characterization tests from production tests. The characterization tests are described in this section and specified in Table 2-8. Table 2-7: SYMBOL Design Characterization Parameters DESCRIPTION MEASUREMENT METHOD Z module impedance TDR, tester, or VNA tPD () RSL propagation delay TDT, tester, or VNA tPD () variation of prop. delay (clock to any other RSL), related to timing TDT, tester, or VNA V attenuation (rail-to-rail or fo attenuation) function generator/scope, TDT, tester, or VNA VXF VXB forward and backward crosstalk function generator/scope, TDT, tester, or VNA The following sub-sections describe how to measure some of the electrical parameters of RIMM modules. All the parameters discussed here can be measured in either time domain or frequency domain as shown in Table 2-7. The time domain measurements can be done with TDR, signal generator, and scope. The frequency domain measurements can be done with a vector network analyzer. The details on frequency domain measurement will be included in a future revision of this document. Page 2-14 Direct RambusTM RIMMTM Module Specification 1.0 2.9.1 Fixtures & Probes To perform the measurements, probes with both signal and ground contacts are required. The spacing between the probe tips should match the spacing of the contact pads on the module. A high impedance probe is also required for time domain measurement. No special fixture is required. 2.9.2 Impedance Measurement The module impedance can be measured by TDR. The experimental setup is shown in Figure 2-8. Notice that the module needs to be properly biased with VDD and VREF. The bias T is required only if the TDR cannot tolerate the DC voltage VREF. A TDR with adjustable risetime is preferred, and the risetime should be set to the minimum RSL signal risetime. Alternatively, a low pass filter with adequate bandwidth can be used to change the risetime. Such filtering can be implemented by a hardware filter or software post processing. VDD + - RIMM Module GND S bias T G probe TDR + - Figure 2-8: 2.9.3 VREF Measurements: tPD and ZL Measure Impedance and Propagation Delay by TDR Propagation Delay Measurement The propagation delay is measured by the same setup as in impedance measurement. The TDR also measures the roundtrip delay of the module. On a TDR with adjustable risetime, the fastest risetime available should be used. The delay of the critical signals of the module can be characterized by the Vector Network Analyzer, TDT (Time Domain Transmission) instrument or by the pulse generator and an Oscilloscope. A 400MHz signal must be provided with the pulse generator. The data should be taken from the mid-point of the rising or falling edges. 2.9.4 Delta Propagation Delay Measurement To measure the variance of propagation delay, the same setup for propagation delay measurement is repeated for all RSL lines and the high-speed CMOS signals. The maximum propagation delay variance is defined as the maximum difference between any Direct RambusTM RIMMTM Module Specification 1.0 Page 2-15 Specifications RSL signals (including clock signals) and the average of all clock signals (CFM, CFMN, CTM, and CTMN). 2.9.5 Attenuation Measurement The frequency dependent signal attenuation can be measured in time domain with a signal generator and a scope. A sinusoidal signal at the system clock frequency is applied to an RSL line, and the signal amplitudes at both ends of the module are measured with a high impedance probe. Notice that the RSL line should be terminated to its characteristic impedance. VDD + - RIMM Module GND SG V2 V1 bias T coax cable V/VIN = (V1-V2)/V1 + - Figure 2-9: 2.9.6 VREF attenuation = -20 log10 (V2/V1) Signal Attenuation Measurement Crosstalk To measure the crosstalk in time domain, both ends of the quiet victim line must be terminated with its characteristic impedance, as well as the far end of the active signal line. The experimental setup is illustrated in Figure . Signal amplitudes at both ends of the victim line are measured. In addition, the amplitude, VIN, and rise time, tR, of the input signal are required to compute the backward, Kb, and forward, Kf, crosstalk coefficients. Page 2-16 Direct RambusTM RIMMTM Module Specification 1.0 VDD + - GND RIMM Module Active Victim VIN, tR Pulse Generator VXF VXB bias T coaxial cable Kb = VXB/VIN + - VREF Kf = VXF/VIN * tR/L L: total signal length Figure 2-10: Crosstalk Measurement 2.9.7 AC Characteristics The following AC parameters are for all module sizes unless it is specified. The 800MHz numbers below apply for the 800MHz speed grade modules when run at 800MHz. The 800MHz numbers below also apply for the 711MHz speed grade modules when run at 711MHz. The 600MHz numbers below apply for the 600MHz speed grade modules when run at 600MHz. Table 2-8: Symbol TPD AC Characteristics Parameter Average RSL clock delay a Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) Direct RambusTM RIMMTM Module Specification 1.0 Min - Typ - Max 1.015 TBD 1.25 1.40 1.60 1.76 2.10 TBD 1.25 1.40 1.56 1.76 2.06 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Page 2-17 Specifications Symbol TPD Page 2-18 Parameter Propagation delay variation of RSL signals with respect to TPD a,b Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) Min -0.010 TBD -0.021 -0.021 -0.021 -0.021 -0.024 TBD -0.021 -0.021 -0.021 -0.021 -0.024 Typ Max Unit - 0.020 TBD 0.021 0.021 0.021 0.021 0.024 TBD 0.021 0.021 0.021 0.021 0.024 ns ns ns ns ns ns ns ns ns ns ns ns ns - TPD-CMOS Propagation delay variation of SCK and CMD signals with respect to an average clock delay a -0.100 - 0.100 ns ZL Loaded channel impedance (RSL,SCK, CMD signals) 25.2 28 30.8 ZUL-CMOS Unloaded channel impedance (SCK, CMD only) 23.8 28 32.2 V/VIN Attenuation limit Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) 8 TBD 8 9 10 18 21 TBD 12 14 16 20 25 % % % % % % % % % % % % % - - - - Direct RambusTM RIMMTM Module Specification 1.0 Symbol VXF/VIN VXB/VIN Parameter Min Typ Max Unit Forward crosstalk coefficient (input signal rise time = 300 ps; 20-80%) Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) 2 TBD 2 3 4 6 8 TBD 2 3 4 6 8 % % % % % % % % % % % % % Backward crosstalk coefficient (input signal rise time = 300 ps; 20-80%) Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) 1.25 TBD 1.5 1.8 2 2.3 2.5 TBD 1.5 1.8 2 2.3 2.5 % % % % % % % % % % % % % Direct RambusTM RIMMTM Module Specification 1.0 Page 2-19 Specifications Symbol RDC Parameter Min DC Resistance limit Continuity Module (0 Device) 600MHz (2 Device Module) 600MHz (4 Device Module) 600MHz (6 Device Module) 600MHz (8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (2 Device Module) 800MHz (4 Device Module) 800MHz (6 Device Module) 800MHz (8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) Typ - - - - Max 0.5 TBD 0.6 0.7 0.8 1.1 1.2 TBD 0.6 0.7 0.8 1.1 1.2 Unit a. TPD or Average clock delay is defined as the average delay from finger to finger of all RSL clock nets (CTM, CTMN, CFM, and CFMN). b. If the module meets the following specification, it passes. If the module does not meet these specifications, then the specifications can be adjusted by the next table. Note the equation is not applicable to the continuity module. Table 2-9: Adjusted TPD specification: Absolute Symbol TPD a. Where 2.10 Parameter Propagation delay variation of RSL signals with respect to TPD 600MHz (4,6,8 Device Module) 600MHz (12 Device Module) 600MHz (16 Device Module) 800MHz (4,6,8 Device Module) 800MHz (12 Device Module) 800MHz (16 Device Module) Adjusted Min/Max +/- [17 + (18*N*Z0)]a +/- [20 + (18*N*Z0)] +/- [24 + (18*N*Z0)] +/- [17 + (18*N*Z0)] +/- [20 + (18*N*Z0)] +/- [24 + (18*N*Z0)] Min/Max +/-0.030 +/-0.040 +/-0.050 +/-0.030 +/-0.040 +/-0.050 Unit ns ns ns ns ns ns N = Number of devices Z0 = delta Z0 % = (max Z0 - min Z0) / (min Z0) (max Z0 and min Z0 are obtained from the loaded (high impedance) impedance coupons of all RSL layers on the modules) RDRAM Component Specifications To guarantee functionality and compatibility, all devices on a RIMM module must meet their respective specifications. Page 2-20 Direct RambusTM RIMMTM Module Specification 1.0 2.11 SPD Component Specifications The SPD function is implemented using 2048 bit EEPROM component such as the National NM24C02L, Catalyst CAT24WC02, SGS Thompson 24C02 or other vendors' equivalent. It is required that the EEPROM device must meet the functional and electrical specifications listed below. Table 2-10: EEPROM Component Absolute Maximum Ratings Parameter Range All Input or Output Voltages with respect to Ground 4.6 V to -0.3 V Ambient Storage Temperature -50 oC to 100 oC Table 2-11: EEPROM Component Operating Conditions Parameter Range Ambient Operating Temperature 0 oC to 70 oC Positive Power Supply 2.2 V to 3.6 V These devices must also meet their respective component AC and DC specifications. Any violation of these specifications constitutes a violation of the RIMM Module Specification as well. Direct RambusTM RIMMTM Module Specification 1.0 Page 2-21 Specifications Page 2-22 Direct RambusTM RIMMTM Module Specification 1.0 RAMBUS INC. 2465 Latham Street Mountain View, California USA 94040 Telephone: 650-944-8000 Fax: 650-944-8080 http://www.rambus.com SL-0006-100