SN74HC74DBLE - Texas Instruments

SN54HC74, SN74HC74

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS

WITH CLEAR AND PRESET

SCLS094D – DECEMBER 1982 – REVISED JULY 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

Wide Operating Voltage Range of 2 V to 6 V

Outputs Can Drive Up To 10 LSTTL Loads

Low Power Consumption, 40-µA Max ICC

Typical tpd = 15 ns

±4-mA Output Drive at 5 V

Low Input Current of 1 µA Max

description/ordering information

The ’HC74 devices contain two independent

D-type positive-edge-triggered flip-flops. A low

level at the preset (PRE) or clear (CLR) inputs sets

or resets the outputs, regardless of the levels of

the other inputs. When PRE and CLR are inactive

(high), data at the data (D) input meeting the setup

time requirements are transferred to the outputs

on the positive-going edge of the clock (CLK)

pulse. Clock triggering occurs at a voltage level

and is not directly related to the rise time of CLK.

Following the hold-time interval, data at the

D input can be changed without affecting the

levels at the outputs.

ORDERING INFORMATION

TAPACKAGE†ORDERABLE

PART NUMBER TOP-SIDE

MARKING

PDIP – N T ube of 25 SN74HC74N SN74HC74N

T ube of 50 SN74HC74D

SOIC – D Reel of 2500 SN74HC74DR HC74

Reel of 250 SN74HC74DT

–40°C to 85°CSOP – NS Reel of 2000 SN74HC74NSR HC74

SSOP – DB Reel of 2000 SN74HC74DBR HC74

T ube of 90 SN74HC74PW

TSSOP – PW Reel of 2000 SN74HC74PWR HC74

Reel of 250 SN74HC74PWT

CDIP – J T ube of 25 SNJ54HC74J SNJ54HC74J

–55°C to 125°CCFP – W T ube of 150 SNJ54HC74W SNJ54HC74W

LCCC – FK T ube of 55 SNJ54HC74FK SNJ54HC74FK

†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

1CLR

1CLK

1PRE

GND

VCC

2CLR

2CLK

2PRE

SN54HC74 ...J OR W PACKAGE

SN74HC74 . . . D, DB, N, NS, OR PW PACKAGE

(TOP VIEW)

3212019

910111213

2CLK

2PRE

1CLK

1PRE

1CLR

2Q V

2CLR

GND

SN54HC74 . . . FK PACKAGE

(TOP VIEW)

NC – No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

SN54HC74, SN74HC74

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS

WITH CLEAR AND PRESET

SCLS094D – DECEMBER 1982 – REVISED JULY 2003

2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

FUNCTION TABLE

INPUTS OUTPUTS

PRE CLR CLK D Q Q

L H X X H L

HLXXLH

LLXXH

†H†

H H ↑HHL

H H ↑LLH

H H L X Q0Q0

†This configuration is nonstable; that is, it does not

persist when PRE or CLR returns to its inactive

(high) level.

logic diagram (positive logic)

PRE

CLK

CLR

TG TG TG

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡

Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

SN54HC74, SN74HC74

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS

WITH CLEAR AND PRESET

SCLS094D – DECEMBER 1982 – REVISED JULY 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

recommended operating conditions (see Note 3)

SN54HC74 SN74HC74

UNIT

MIN NOM MAX MIN NOM MAX

UNIT

VCC Supply voltage 2 5 6 2 5 6 V

VCC = 2 V 1.5 1.5

VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V

VCC = 6 V 4.2 4.2

VCC = 2 V 0.5 0.5

VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V

VCC = 6 V 1.8 1.8

VIInput voltage 0 VCC 0 VCC V

VOOutput voltage 0 VCC 0 VCC V

VCC = 2 V 1000 1000

∆t/∆vInput transition rise/fall time VCC = 4.5 V 500 500 ns

VCC = 6 V 400 400

TAOperating free-air temperature –55 125 –40 85 °C

NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C SN54HC74 SN74HC74

UNIT

PARAMETER

TEST

CONDITIONS

CC MIN TYP MAX MIN MAX MIN MAX

UNIT

2 V 1.9 1.998 1.9 1.9

IOH = –20 µA4.5 V 4.4 4.499 4.4 4.4

VOH VI = VIH or VIL 6 V 5.9 5.999 5.9 5.9 V

IOH = –4 mA 4.5 V 3.98 4.3 3.7 3.84

IOH = –5.2 mA 6 V 5.48 5.8 5.2 5.34

2 V 0.002 0.1 0.1 0.1

IOL = 20 µA4.5 V 0.001 0.1 0.1 0.1

VOL VI = VIH or VIL 6 V 0.001 0.1 0.1 0.1 V

IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33

IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33

IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA

ICC VI = VCC or 0, IO = 0 6 V 4 80 40 µA

Ci2 V to 6 V 3 10 10 10 pF

SN54HC74, SN74HC74

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS

WITH CLEAR AND PRESET

SCLS094D – DECEMBER 1982 – REVISED JULY 2003

4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

timing requirements over recommended operating free-air temperature range (unless otherwise

noted)

VCC

TA = 25°C SN54HC74 SN74HC74

UNIT

CC MIN MAX MIN MAX MIN MAX

UNIT

2 V 6 4.2 5

fclock Clock frequency 4.5 V 31 21 25 MHz

6 V 0 36 0 25 0 29

2 V 100 150 125

PRE or CLR low 4.5 V 20 30 25

Pulse duration

6 V 17 25 21

Pulse

duration

2 V 80 120 100

CLK high or low 4.5 V 16 24 20

6 V 14 20 17

↑

2 V 100 150 125

↑

Data 4.5 V 20 30 25

Setu

time before CLK↑

6 V 17 25 21

Setup

time

before

CLK↑

2 V 25 40 30

PRE or CLR inactive 4.5 V 5 8 6

6 V 4 7 5

↑

2 V 0 0 0

thHold time, data after CLK

↑

4.5 V 0 0 0 ns

6 V 0 0 0

switching characteristics over recommended operating free-air temperature range, CL = 50 pF

(unless otherwise noted) (see Figure 1)

PARAMETER

FROM TO

VCC

TA = 25°C SN54HC74 SN74HC74

UNIT

PARAMETER

(INPUT) (OUTPUT)

CC MIN TYP MAX MIN MAX MIN MAX

UNIT

2 V 6 10 4.2 5

fmax 4.5 V 31 50 21 25 MHz

6 V 36 60 25 29

2 V 70 230 345 290

PRE or CLR Q or Q 4.5 V 20 46 69 58

6 V 15 39 59 49

pd 2 V 70 175 250 220

CLK Q or Q 4.5 V 20 35 50 44

6 V 15 30 42 37

2 V 28 75 110 95

ttQ or Q 4.5 V 8 15 22 19 ns

6 V 6 13 19 16

operating characteristics, TA = 25°C

PARAMETER TEST CONDITIONS TYP UNIT

Cpd Power dissipation capacitance per flip-flop No load 35 pF

SN54HC74, SN74HC74

DUAL D-TYPE POSITIVE-EDGE-TRIGGERED FLIP-FLOPS

WITH CLEAR AND PRESET

SCLS094D – DECEMBER 1982 – REVISED JULY 2003

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION

VOLTAGE WAVEFORMS

SETUP AND HOLD AND INPUT RISE AND FALL TIMES

VOLTAGE WAVEFORMS

PULSE DURATIONS

tsu

50%

50%50% 10%10% 90% 90%

VCC

0 V

trtf

Reference

Input

Data

Input

50%

High-Level

Pulse 50% VCC

0 V

50% 50%

VCC

0 V

Low-Level

Pulse

VOLTAGE WAVEFORMS

PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

50%

50%50% 10%10% 90% 90%

VCC

VOH

VOL

0 V

trtf

Input

In-Phase

Output

50%

tPLH tPHL

50% 50%

10% 10% 90%90% VOH

VOL

tPHL tPLH

Out-of-Phase

Output

Test

Point

From Output

Under Test

CL = 50 pF

(see Note A)

LOAD CIRCUIT

NOTES: A. CL includes probe and test-fixture capacitance.

B. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following

characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.

C. For clock inputs, fmax is measured when the input duty cycle is 50%.

D. The outputs are measured one at a time with one input transition per measurement.

E. tPLH and tPHL are the same as tpd.

Figure 1. Load Circuit and Voltage Waveforms

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’sstandard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support thiswarranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarilyperformed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

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PACKAGING INFORMATION

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

5962-8405601VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

5962-8405601VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

84056012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

8405601CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

8405601DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

JM38510/65302B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

JM38510/65302BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

JM38510/65302BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

SN54HC74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

SN74HC74ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI

SN74HC74D ACTIVE SOIC D 14 50 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI

SN74HC74DBR ACTIVE SSOP DB 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DE4 ACTIVE SOIC D 14 50 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DG4 ACTIVE SOIC D 14 50 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DR ACTIVE SOIC D 14 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DT ACTIVE SOIC D 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DTE4 ACTIVE SOIC D 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74DTG4 ACTIVE SOIC D 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74N ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74HC74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI

SN74HC74NE4 ACTIVE PDIP N 14 25 Pb-Free

(RoHS) CU NIPDAU N / A for Pkg Type

SN74HC74NSR ACTIVE SO NS 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PW ACTIVE TSSOP PW 14 90 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

Addendum-Page 1

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

no Sb/Br)

SN74HC74PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI

SN74HC74PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWT ACTIVE TSSOP PW 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SN74HC74PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

SNJ54HC74FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

SNJ54HC74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

SNJ54HC74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN54HC74, SN54HC74-SP, SN74HC74 :

•Automotive: SN74HC74-Q1

PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

Addendum-Page 2

•Enhanced Product: SN74HC74-EP

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

PACKAGE OPTION ADDENDUM

www.ti.com 15-Oct-2009

Addendum-Page 3

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm) W

(mm) Pin1

Quadrant

SN74HC74DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1

SN74HC74DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

SN74HC74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

SN74HC74PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jul-2009

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

SN74HC74DBR SSOP DB 14 2000 346.0 346.0 33.0

SN74HC74DR SOIC D 14 2500 346.0 346.0 33.0

SN74HC74DR SOIC D 14 2500 333.2 345.9 28.6

SN74HC74NSR SO NS 14 2000 346.0 346.0 33.0

SN74HC74PWR TSSOP PW 14 2000 346.0 346.0 29.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Jul-2009

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

4040065 /E 12/01

28 PINS SHOWN

Gage Plane

8,20

7,40

0,55

0,95

0,25

12,90

12,30

10,50

8,50

Seating Plane

9,907,90

10,50

9,90

0,38

5,60

5,00

0,22

2016

6,50

0,05 MIN

5,905,90

DIM

A MAX

A MIN

PINS **

2,00 MAX

6,90

7,50

0,65 M

0,15

0°–ā8°

0,10

0,09

0,25

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

MECHANICAL DATA

MLCC006B – OCTOBER 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

4040140/D 10/96

28 TERMINAL SHOWN

0.358

(9,09)

MAX

(11,63)

0.560

(14,22)

0.560

0.458

0.858

(21,8)

1.063

(27,0)

(14,22)

NO. OF

MINMAX

0.358

0.660

0.761

0.458

0.342

(8,69)

MIN

(11,23)

(16,26)

0.640

0.739

0.442

(9,09)

(11,63)

(16,76)

0.962

1.165

(23,83)

0.938

(28,99)

1.141

(24,43)

(29,59)

(19,32)(18,78)

0.020 (0,51)

TERMINALS

0.080 (2,03)

0.064 (1,63)

(7,80)

0.307

(10,31)

0.406

(12,58)

0.495

(12,58)

0.495

(21,6)

0.850

(26,6)

1.047

0.045 (1,14)

0.035 (0,89)

0.010 (0,25)

1314151618 17

432

0.020 (0,51)

0.010 (0,25)

12826 27

B SQ

A SQ 22

0.055 (1,40)

0.045 (1,14)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M

0,10

0,25

0,50

0,75

0,15 NOM

Gage Plane

9,80

9,60

7,90

7,70

2016

6,60

6,40

4040064/F 01/97

0,30

6,60

6,20

80,19

4,30

4,50

0,15

1,20 MAX

5,10

4,90

3,10

2,90

A MAX

A MIN

DIM PINS **

0,05

4,90

5,10

Seating Plane

0°–8°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

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