SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175, SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54174, SN54175, SN74174, SN74175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54LS174, SN54LS175, SN74LS174, SN74LS175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SN54S174, SN54S175, SN74S174, SN74S175 HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR SDLS068A - DECEMBER 1972 - REVISED OCTOBER 2001 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/01702BEA OBSOLETE CDIP J 16 TBD Call TI Call TI JM38510/01702BFA OBSOLETE CFP W 16 TBD Call TI Call TI JM38510/07105BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07105BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/07106BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30106B2A ACTIVE LCCC FK 20 1 TBD JM38510/30106BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type JM38510/30106BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30107B2A ACTIVE LCCC FK 20 1 TBD JM38510/30107BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type JM38510/30107BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30107SEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30107SFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54175J OBSOLETE CDIP J 16 TBD Call TI SN54LS174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54LS175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74174N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74175N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74175N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS174D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174J OBSOLETE CDIP J 16 SN74LS174N ACTIVE PDIP N 16 Call TI TBD Call TI Call TI 25 Pb-Free (RoHS) CU NIPDAU TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type N / A for Pkg Type SN74LS174N3 OBSOLETE PDIP N 16 SN74LS174NE4 ACTIVE PDIP N 16 SN74LS174NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS174NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS175D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS175J OBSOLETE CDIP J 16 SN74LS175N ACTIVE PDIP N 16 SN74LS175N3 OBSOLETE PDIP N 16 SN74LS175NE4 ACTIVE PDIP N 16 SN74LS175NSR ACTIVE SO NS 16 SN74LS175NSRE4 ACTIVE SO NS SN74LS175NSRG4 ACTIVE SO Lead/Ball Finish MSL Peak Temp (3) TBD Call TI Pb-Free (RoHS) CU NIPDAU TBD Call TI Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S174J OBSOLETE CDIP J 16 SN74S174N ACTIVE PDIP N 16 25 25 25 Call TI N / A for Pkg Type Call TI TBD Call TI Call TI TBD Call TI Call TI SN74S174N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S174NE4 ACTIVE PDIP N 16 25 TBD Call TI Call TI SN74S175D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S175DR OBSOLETE SOIC D 16 TBD Call TI SN74S175N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU SN74S175N3 OBSOLETE PDIP N 16 SN74S175NE4 ACTIVE PDIP N 16 Call TI N / A for Pkg Type Call TI N / A for Pkg Type SNJ54175J OBSOLETE CDIP J 16 TBD Call TI Call TI SNJ54175W OBSOLETE CFP W 16 TBD Call TI Call TI SNJ54LS174FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS174J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS174W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54LS175FK ACTIVE LCCC FK 20 1 TBD SNJ54LS175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS175W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type Addendum-Page 2 POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SNJ54S174FK ACTIVE LCCC FK 20 1 TBD SNJ54S174J ACTIVE CDIP J 16 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type A42 N / A for Pkg Type SNJ54S174W ACTIVE CFP W 16 1 TBD SNJ54S175FK ACTIVE LCCC FK 20 1 TBD SNJ54S175J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S175W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS174DR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS174NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LS175DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS175NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS174DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS174NSR SO NS 16 2000 346.0 346.0 33.0 SN74LS175DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS175NSR SO NS 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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