INTEGRATED CIRCUITS DIVISION
Linear Optocoupler
www.ixysic.com
DS-LOC112-R07 1
LOC112
Part Number Description
LOC112 8-Pin DIP (50/Tube)
LOC112P 8-Pin Flatpack (50/Tube)
LOC112PTR 8-Pin Flatpack (1000/Reel)
LOC112S 8-Pin Surface Mount (50/tube)
LOC112STR 8-Pin Surface Mount (1000/Reel)
Applications
Features
Description
Ordering Information
Pin Configuration
The LOC112 Single Linear Optocoupler features an
infrared LED optically coupled with two photodiodes.
One feedback (input) photodiode is used to generate
a control signal that provides a servomechanism
to the LED drive current, thus compensating
for the LED's nonlinear time and temperature
characteristics. The other (output) photodiode
provides an output signal that is linear with respect
to the servo LED current. The product features
wide bandwidth, high input to output isolation and
excellent servo linearity.
Approvals
- LED
+ LED
C1
A1
N/C
N/C
C2
A2
1
2
3
4
8
7
6
5
K3 Sorted Bins
Bin D = 0.733 - 0.805
Bin E = 0.806 - 0.886
Bin F = 0.887 - 0.974
Bin G = 0.975 - 1.072
Parameter Rating Units
LED Operating Range 2-10 mA
K3, Transfer Gain 0.733-1.072 -
Isolation, Input to Output 3750 Vrms
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate # B 13 12 82667 003
• Modem Transformer Replacement With No
Insertion Loss
• Digital Telephone Isolation
• Power Supply Feedback Voltage/Current
• Medical Sensor Isolation
• Audio Signal Interfacing
• Isolation of Process Control Transducers
• 0.01% Servo Linearity
• THD -87dB Typical
• Wide Bandwidth (>200kHz)
• Couples Analog and Digital Signals
• High Gain Stability
• Low Input/Output Capacitance
• Low Power Consumption
• 8-Pin Flatpack or DIP Package
• Surface Mount and Tape & Reel Versions Available
• VDE Compatible
Each tube or reel will contain only devices of one K3-sorted value.
Devices will be individually marked with the letter of their K3 bin.
Devices of any available bin will be shipped.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R07
LOC112
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Reverse LED Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Input Power Dissipation1150 mW
Total Package Dissipation2500 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25ºC
Parameter Conditions Symbol Min Typ Max Units
Input Characteristics
LED Voltage Drop IF = 2 - 10mA VF0.9 1.2 1.4 V
Reverse LED Current VR = 5V IR--10A
Coupler/Detector Characteristics
Dark Current IF=0mA, VC1-A1=VC2-A2=15V ID- 1 25 nA
K1, Servo Gain (IC1/IF)
IF=2 - 10mA, VC1-A1=VC2-A2=15V
K1 0.004 0.007 0.030 -
K2, Forward Gain (IC2/IF)K2 0.004 0.007 0.030 -
K3, Transfer Gain (K2/K1=IC2/IC1) K3 0.733 - 1.072 -
K3, Transfer Gain Linearity (non-servoed) IF=2 - 10mA K3 - - 1 %
K3 Temperature Coefficient IF=2 - 10mA, VC1-A1=VC2-A2= 5V K3/T - 0.005 - % / ºC
Common-Mode Rejection Ratio V=20VP-P , RL=2k, f=100Hz CMRR - 130 - dB
Total Harmonic Distortion f0=350Hz, 0dBm THD -96 -87 -80 dB
Frequency Response 1Photoconductive Configuration f-3dB -200 - kHz
Photovoltaic Configuration 40
Input/Output Capacitance VIO=0V, f=1MHz CIO -3-pF
1 Refer to Application Note, AN-107, for LOC112 configurations.
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
INTEGRATED CIRCUITS DIVISION
LOC112
www.ixysic.com 3
R07
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5
LED Current (mA)
0
10
20
30
40
50
60
LED Forward Current
vs. LED Forward Voltage
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5
LED Current (mA)
0.01
0.1
1
10
100
LED Forward Current
vs. LED Forward Voltage
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=2mA
IF=1mA
IF=50mA
IF=20mA
IF=10mA
LED Current (mA)
024681012
Servo Gain
0.000
0.004
0.008
0.012
0.016
Servo Gain
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
LED Current (mA)
024681012
Servo-Photocurrent (PA)
0
20
40
60
80
100
120
140
Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
LED Current (mA)
024681012
Normalized Servo-Photocurrent
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Normalized Servo-Photocurrent
vs. LED Current & Temperature
0ºC
25ºC
50ºC
70ºC
85ºC
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R07
LOC112
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture
Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the
latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LOC112 / LOC112S MSL 1
LOC112P MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (TC) Dwell Time (tp) Max Refl ow Cycles
LOC112 250ºC
30 seconds
N/A
LOC112S 250ºC3
LOC112P 240ºC3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
LOC112
www.ixysic.com 5
R07
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LOC112
LOC112P
LOC112S
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
LOC112
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LOC112-R07
©Copyright 2016, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/1/2016
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
LOC112PTR Tape & Reel
LOC112STR Tape & Reel
