LM837
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SNOSBZ6C –MAY 1999–REVISED MARCH 2013
LM837 Low Noise Quad Operational Amplifier
Check for Samples: LM837
1FEATURES DESCRIPTION
The LM837 is a quad operational amplifier designed
2• High Slew Rate 10 V/μs (typ); 8 V/μs (min) for low noise, high speed and wide bandwidth
• Wide Gain Bandwidth Product 25 MHz (typ); 15 performance. It has a new type of output stage which
MHz (min) can drive a 600Ωload, making it ideal for almost all
• Power Bandwidth 200 kHz (typ) digital audio, graphic equalizer, preamplifiers, and
professional audio applications. Its high performance
• High Output Current ±40 mA characteristics also make it suitable for
• Excellent Output Drive Performance >600Ωinstrumentation applications where low noise is the
• Low Input Noise Voltage 4.5 nV/√Hz key consideration.
• Low Total Harmonic Distortion 0.0015% The LM837 is internally compensated for unity gain
• Low Offset Voltage 0.3 mV operation. It is pin compatible with most other
standard quad op amps and can therefore be used to
upgrade existing systems with little or no change.
Schematic and Connection Diagrams
Figure 1. PDIP Package
Top View
See Package Number
D0014A or NFF0014A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM837
SNOSBZ6C –MAY 1999–REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Supply Voltage, VCC/VEE ±18V
Differential Input Voltage, VID(3) ±30V
Common Mode Input Voltage, VIC(3) ±15V
Power Dissipation, PD(4) 1.2W (N)
830 mW (M)
Operating Temperature Range, TOPR −40°C to +85°C
Storage Temperature Range, TSTG −60°C to +150°C
Soldering Information
PDIP Package
Soldering (10 seconds) 260°C
SOIC Package
Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
ESD rating to be determined.
See http://www.ti.com for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Unless otherwise specified the absolute maximum input voltage is equal to the power supply voltage.
(4) For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance, junction to ambient, as follows: LM837N, 90°C/W; LM837M, 150°C/W.
DC ELECTRICAL CHARACTERISTICS
TA= 25°C, VS= ±15V
Symbol Parameter Condition Min Typ Max Units
VOS Input Offset Voltage RS= 50Ω0.3 5 mV
IOS Input Offset Current 10 200 nA
IBInput Bias Current 500 1000 nA
AVLarge Signal Voltage Gain RL= 2 kΩ, VOUT = ±10V 90 110 dB
VOM Output Voltage Swing RL= 2 kΩ±12 ±13.5 V
RL= 600Ω±10 ±12.5 V
VCM Common Mode Input Voltage ±12 ±14.0 V
CMRR Common Mode Rejection Ratio VIN = ±12V 80 100 dB
PSRR Power Supply Rejection Ratio VS= 15 ∼5, −15 ∼−5 80 100 dB
ISPower Supply Current RL=∞, Four Amps 10 15 mA
AC ELECTRICAL CHARACTERISTICS
TA= 25°C, VS= ±15V
Symbol Parameter Condition Min Typ Max Units
SR Slew Rate RL= 600Ω8 10 V/μs
GBW Gain Bandwidth Product f = 100 kHz, RL= 600Ω15 25 MHz
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DESIGN ELECTRICAL CHARACTERISTICS
TA= 25°C, VS=±15V (1)
Symbol Parameter Condition Min Typ Max Units
PBW Power Bandwidth VO= 25 VP-P, RL= 600Ω,200 kHz
THD < 1%
en1 Equivalent Input Noise Voltage JIS A, RS= 100Ω0.5 μV
en2 Equivalent Input Noise Voltage f = 1 kHz 4.5 nV/ √Hz
inEquivalent Input Noise Current f = 1 kHz 0.7 pA/ √Hz
THD Total Harmonic Distortion AV= 1, VOUT = 3 Vrms, 0.0015 %
f = 20 ∼20 kHz, RL= 600Ω
fUZero Cross Frequency Open Loop 12 MHz
φmPhase Margin Open Loop 45 deg
Input-Referred Crosstalk f = 20 ∼20 kHz −120 dB
ΔVOS/ΔAverage TC of Input Offset Voltage 2μV/°C
T
(1) The following parameters are not tested or ensured.
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SNOSBZ6C –MAY 1999–REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Maximum Power Dissipation vs Normalized Input Bias Current
Ambient Temperature vs Supply Voltage
Figure 2. Figure 3.
Normalized Input Bias Current Supply Current vs
vs Ambient Temperature Supply Voltage
Figure 4. Figure 5.
Supply Current vs
Ambient Temperature Positive Current Limit
Figure 6. Figure 7.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Maximum Output Voltage
Negative Current Limit vs Supply Voltage
Figure 8. Figure 9.
Maximum Output Voltage Maximum Output Voltage
vs Supply Voltage vs Ambient Temperature
Figure 10. Figure 11.
Maximum Output Voltage
vs Ambient Temperature Power Bandwidth
Figure 12. Figure 13.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Normalized Slew Rate & Gain Bandwidth
vs Normalized Slew Rate & Gain Bandwidth (f = 100 kHz)
Supply Voltage (f = 100 kHz) vs Ambient Temperature
Figure 14. Figure 15.
Voltage Gain Voltage Gain
vs vs
Supply Voltage Ambient Temperature
Figure 16. Figure 17.
CMRR
Power Supply Rejection vs
vs Frequency Frequency
Figure 18. Figure 19.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Open Loop Gain &
Phase
vs Total Harmonic Distortion
Frequency vs Frequency
Figure 20. Figure 21.
Equivalent Input Noise Voltage Equivalent Input Noise Current
vs vs
Frequency Frequency
Figure 22. Figure 23.
Small Signal, Non-Inverting Current Limit
TA= 25°C, AV= 1, RL= 600Ω, VS= ±15V TA= 25°C, VS= ±15V, RL= 100Ω, AV= 1
Figure 24. Figure 25.
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SNOSBZ6C –MAY 1999–REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Large Signal Non-Inverting Large Signal Inverting
TA= 25°C, RL= 600Ω, VS= ±15V TA= 25°C, RL= 600Ω, VS= ±15V
Figure 26. Figure 27.
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SNOSBZ6C –MAY 1999–REVISED MARCH 2013
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REVISION HISTORY
Changes from Revision B (March 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 5
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PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM837MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM837M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM837MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM837MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 2
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