DS12885QN - Maxim Integrated Products, Inc.

General Description

The DS12885, DS12887, and DS12C887 real-time

clocks (RTCs) are designed to be direct replacements

for the DS1285 and DS1287. The devices provide a

real-time clock/calendar, one time-of-day alarm, three

maskable interrupts with a common interrupt output, a

programmable square wave, and 114 bytes of battery-

backed static RAM (113 bytes in the DS12C887 and

DS12C887A). The DS12887 integrates a quartz crystal

and lithium energy source into a 24-pin encapsulated

DIP package. The DS12C887 adds a century byte at

address 32h. For all devices, the date at the end of the

month is automatically adjusted for months with fewer

than 31 days, including correction for leap years. The

devices also operate in either 24-hour or

12-hour format with an AM/PM indicator. A precision

temperature-compensated circuit monitors the status of

VCC. If a primary power failure is detected, the device

automatically switches to a backup supply. A lithium

coin-cell battery can be connected to the VBAT input

pin on the DS12885 to maintain time and date operation

when primary power is absent. The device is accessed

through a multiplexed byte-wide interface, which sup-

ports both Intel and Motorola modes.

Applications

Embedded Systems

Utility Meters

Security Systems

Network Hubs, Bridges, and Routers

Features

♦Drop-In Replacement for IBM AT Computer

Clock/Calendar

♦RTC Counts Seconds, Minutes, Hours, Day, Date,

Month, and Year with Leap Year Compensation

Through 2099

♦Binary or BCD Time Representation

♦12-Hour or 24-Hour Clock with AM and PM in

12-Hour Mode

♦Daylight Saving Time Option

♦Selectable Intel or Motorola Bus Timing

♦Interfaced with Software as 128 RAM Locations

♦14 Bytes of Clock and Control Registers

♦114 Bytes of General-Purpose, Battery-Backed

RAM (113 Bytes in the DS12C887 and

DS12C887A)

♦RAM Clear Function (DS12885, DS12887A, and

DS12C887A)

♦Interrupt Output with Three Independently

Maskable Interrupt Flags

♦Time-of-Day Alarm Once Per Second to Once

Per Day

♦Periodic Rates from 122μs to 500ms

♦End-of-Clock Update Cycle Flag

♦Programmable Square-Wave Output

♦Automatic Power-Fail Detect and Switch Circuitry

♦Optional 28-Pin PLCC Surface Mount Package or

32-Pin TQFP (DS12885)

♦Optional Encapsulated DIP (EDIP) Package with

Integrated Crystal and Battery (DS12887,

DS12887A, DS12C887, DS12C887A)

♦Optional Industrial Temperature Range Available

♦Underwriters Laboratory (UL) Recognized

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

______________________________________________

Maxim Integrated Products

DS12885

DS83C520

R/W

GND

X2X1

VCC

CRYSTAL

VBAT

AD(0–7) SQW

RESET

IRQ

RCLR

MOT

Typical Operating Circuit

Rev 3; 2/07

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,

or visit Maxim’s website at www.maxim-ic.com.

Pin Configurations and Ordering Information appear at end of data sheet.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

2 _____________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V

Operating Temperature Range ...................................................

Commercial (noncondensing) .............................0°C to +70°C

Operating Temperature Range ...................................................

Industrial (noncondensing)...............................-40°C to +85°C

Storage Temperature Range .............................-55°C to +125°C

Soldering Temperature .......................................See IPC/JEDEC

J-STD-020 Specification (Note 1)

Soldering Temperature (leads, 10s) ................................+260°C

DC ELECTRICAL CHARACTERISTICS

(VCC = +4.5V to +5.5V, TA= over the operating range, unless otherwise noted.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Supply Voltage VCC (Note 3) 4.5 5.5 V

VBAT Input Voltage VBAT (Note 3) 2.5 4.0 V

Input Logic 1 VIH (Note 3) 2.2 VCC +

0.3 V

Input Logic 0 VIL (Note 3) -0.3 +0.8 V

VCC Power-Supply Current ICC1 (Note 4) 15 mA

VCC Standby Current ICCS (Note 5) mA

Input Leakage IIL -1.0 +1.0 µA

I/O Leakage IOL (Note 6) -1.0 +1.0 µA

Input Current IMOT (Note 7) -1.0 +500 µA

Output at 2.4V IOH (Note 3) -1.0 mA

Output at 0.4V IOL (Note 3) 4.0 mA

Power-Fail Voltage VPF (Note 3) 4.0 4.25 4.5 V

VRT Trip Point VRTTRIP 1.3 V

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

_____________________________________________________________________ 3

DC ELECTRICAL CHARACTERISTICS

(VCC = 0V, VBAT = 3.0V, TA= over the operating range, unless otherwise noted.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

VBAT Current (OSC On);

TA = +25°C, VBACKUP = 3.0V IBAT (Note 8) 500 nA

VBAT Current (Oscillator Off) IBATDR (Note 8) 100 nA

AC ELECTRICAL CHARACTERISTICS

(VCC = 4.5V to 5.5V, TA= over the operating range.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Cycle Time tCYC 385 DC ns

Pulse Width, DS Low or R/W High PWEL 150 ns

Pulse Width, DS High or R/W Low PWEH 125 ns

Input Rise and Fall tR, tF30 ns

R/W Hold Time tRWH 10 ns

R/W Setup Time Before DS/E tRWS 50 ns

Chip-Select Setup Time Before

DS or R/WtCS 20 ns

Chip-Select Hold Time tCH 0ns

Read-Data Hold Time tDHR 10 80 ns

Write-Data Hold Time tDHW 0ns

Address Valid Time to AS Fall tASL 30 ns

Address Hold Time to AS Fall tAHL 10 ns

Delay Time DS/E to AS Rise tASD 20 ns

Pulse Width AS High PWASH 60 ns

Delay Time, AS to DS/E Rise tASED 40 ns

Output Data Delay Time from DS

or R/WtDDR 20 120 ns

Data Setup Time tDSW 100 ns

Reset Pulse Width tRWL 5µs

IRQ Release from DS tIRDS 2µs

IRQ Release from RESET tIRR 2µs

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

4 _____________________________________________________________________

PWASH

PWEL

tASED

tCYC

tRWS

tCS

tRWH

tCH

PWEH

tASD

AD0–AD7

READ

R/ W

AD0–AD7

WRITE

tDHW

tDHR

tDDR

tAHL

tASL

tDSW

Motorola Bus Read/Write Timing

Intel Bus Write Timing

PWASH

PWEL PWEH

tCS

tAHL

tASL tDSW tDHW

tCH

tASD

tCYC

R/W

AD0–AD7

WRITE

tASED

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

_____________________________________________________________________ 5

tCS

tAHL

tASL

tCYC

PWASH

PWEL PWEH

R/W

AD0–AD7

tASD

tASED

tDDR tDHR

tCH

Intel Bus Read Timing

tRWL

tIRR

tIRDS

RESET

IRQ

Release Delay Timing

OUTPUTS

INPUTS

HIGH-Z

DON'T CARE

VALID

RECOGNIZED RECOGNIZED

VALID

VCC

VPF(MAX)

VPF(MIN)

tRPU

tDR

Power-Up/Power-Down Timing

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

6 _____________________________________________________________________

POWER-UP/POWER-DOWN CHARACTERISTICS

(TA= -40°C to +85°C) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Recovery at Power-Up tRPU 20 200 ms

VCC Fall Time; VPF(MAX) to

VPF(MIN) tF300 µs

VCC Rise Time; VPF(MIN) to

VPF(MAX) tR0µs

CAPACITANCE

(TA= +25°C) (Note 9)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Capacitance on All Input Pins

Except X1 and X2 CIN 5pF

Capacitance on IRQ, SQW, and

DQ Pins CIO 7pF

DATA RETENTION

(TA= +25°C)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Expected Data Retention tDR 10 years

AC TEST CONDITIONS

PARAMETER TEST CONDITIONS

Input Pulse Levels 0 to 3.0V

Output Load Including Scope and Jig 50pF + 1TTL Gate

Input and Output Timing Measurement Reference Levels Input/Output: VIL maximum and VIH minimum

Input-Pulse Rise and Fall Times 5ns

WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data.

Note 1: RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature

exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-

washing techniques is acceptable, provided that ultrasonic vibrations are not used to prevent crystal damage.

Note 2: Limits at -40°C are guaranteed by design and not production tested.

Note 3: All voltages are referenced to ground.

Note 4: All outputs are open.

Note 5: Specified with CS = DS = R/W= RESET = VCC; MOT, AS, AD0–AD7 = 0; VBACKUP open.

Note 6: Applies to the AD0 to AD7 pins, the IRQ pin, and the SQW pin when each is in a high-impedance state.

Note 7: The MOT pin has an internal 20kΩpulldown.

Note 8: Measured with a 32.768kHz crystal attached to X1 and X2.

Note 9: Guaranteed by design. Not production tested.

Note 10: Measured with a 50pF capacitance load.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

_____________________________________________________________________

Typical Operating Characteristics

(VCC = +5.0V, TA= +25°C, unless otherwise noted.)

OSCILLATOR FREQUENCY

vs. VCC

DS12885 toc02

VCC (V)

FREQUENCY (Hz)

5.3

5.04.8

32768.10

32768.20

32768.30

32768.40

32768.50

32768.60

32768.70

32768.00

4.5 5.5

IBAT1 vs. VBAT

vs. TEMPERATURE

DS12885 toc01

VBAT (V)

IBAT (nA)

3.82.8 3.0 3.3 3.5

200

300

250

150

2.5 4.0

VCC = 0V +85°C

+25°C

0°C

-40°C

+70°C

+40°C

POWER

CONTROL

GND

OSC

BUS

INTERFACE

VCC

RESET

R/W

MOT

AD0–AD7

DIVIDE

BY 8

DIVIDE

BY 64

DIVIDE

BY 64

16:1 MUX

SQUARE-

WAVE

GENERATOR

REGISTERS A, B, C, D

CLOCK/CALENDAR AND

ALARM REGISTERS

USER RAM

114 BYTES

CLOCK/CALENDAR

UPDATE LOGIC

IRQ

SQW

IRQ

GENERATOR

BUFFERED CLOCK/

CALENDAR AND ALARM

REGISTERS

VBAT

RLCR

DS12885

Functional Diagram

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

8 _____________________________________________________________________

Pin Description

SO,

PDIP EDIP PLCC TQFP NAME FUNCTION

1 1 2 29 MOT

Motorola or Intel Bus Timing Selector. This pin selects one of two bus types. When

connected to VCC, Motorola bus timing is selected. When connected to GND or

left disconnected, Intel bus timing is selected. The pin has an internal pulldown

resistor.

2—3 30X1

3—4 31X2

Connections for Standard 32.768kHz Quartz Crystal. The internal oscillator

circuitry is designed for operation with a crystal having a 6pF specified load

capacitance (CL). Pin X1 is the input to the oscillator and can optionally be

connected to an external 32.768kHz oscillator. The output of the internal oscillator,

pin X2, is floated if an external oscillator is connected to pin X1.

4–11 4–11 5–10,

12, 14

1, 2, 3,

5, 7, 8,

9, 11

AD0–

AD7

Multiplexed, Bidirectional Address/Data Bus. The addresses are presented during

the first portion of the bus cycle and latched into the device by the falling edge of

AS. Write data is latched by the falling edge of DS (Motorola timing) or the rising

edge of R/W (Intel timing). In a read cycle, the device outputs data during the

latter portion of DS (DS and R/W high for Motorola timing, DS low and R/W high for

Intel timing). The read cycle is terminated and the bus returns to a high-

impedance state as DS transitions low in the case of Motorola timing or as DS

transitions high in the case of Intel timing.

12, 16 12 15, 20 12, 17 GND Ground

13 13 16 13 CS

Active-Low Chip-Select Input. The chip-select signal must be asserted low for a

bus cycle in the device to be accessed. CS must be kept in the active state during

DS and AS for Motorola timing and during DS and R/W for Intel timing. Bus cycles

that take place without asserting CS will latch addresses, but no access occurs.

When VCC is below VPF volts, the device inhibits access by internally disabling the

CS input. This action protects the RTC data and the RAM data during power

outages.

14 14 17 14 AS

Address Strobe Input. A positive-going address-strobe pulse serves to

demultiplex the bus. The falling edge of AS causes the address to be latched

within the device. The next rising edge that occurs on the AS bus clears the

address regardless of whether CS is asserted. An address strobe must

immediately precede each write or read access. If a write or read is performed

with CS deasserted, another address strobe must be performed prior to a read or

write access with CS asserted.

15 15 19 16 R/W

Read/Write Input. The R/W pin has two modes of operation. When the MOT pin is

connected to VCC for Motorola timing, R/W is at a level that indicates whether the

current cycle is a read or write. A read cycle is indicated with a high level on R/W

while DS is high. A write cycle is indicated when R/W is low during DS. When the

MOT pin is connected to GND for Intel timing, the R/W signal is an active-low

signal. In this mode, the R/W pin operates in a similar fashion as the write-enable

signal (WE) on generic RAMs. Data are latched on the rising edge of the signal.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Pin Description (continued)

SO,

PDIP EDIP PLCC TQFP NAME FUNCTION

2, 3,

16, 20,

21, 22

1, 11,

13, 18,

4, 6, 10,

15, 20,

23, 25,

27, 32

N.C. No Connection. This pin should remain unconnected. Pin 21 is RCLR for the

DS12887A/DS12C887A. On the EDIP, these pins are missing by design.

17 17 21 18 DS

D ata S tr ob e or Read Inp ut. The D S p i n has tw o m od es of op er ati on d ep end i ng on

the l evel of the M O T p i n. W hen the M O T p i n i s connected to V

C C

, M otor ol a b us

ti m i ng i s sel ected . In thi s m od e, D S i s a p osi ti ve p ul se d ur i ng the l atter p or ti on of the

b us cycl e and i s cal l ed d ata str ob e. D ur i ng r ead cycl es, D S si g ni fi es the ti m e that the

device i s to d r i ve the b i d i r ecti onal b us. In w r i te cycl es, the tr ai l i ng ed g e of D S causes

the device to l atch the w r i tten d ata. W hen the M O T p i n i s connected to GN D , Intel

us ti m i ng i s sel ected . D S i d enti fi es the ti m e p er i od w hen the device d r i ves the b us

w i th r ead d ata. In thi s m od e, the D S p i n op er ates i n a si m i l ar fashi on as the outp ut-

enab l e ( O E ) si g nal on a g ener i c RAM .

18 18 22 19 RESET

Active-Low Reset Input. The RESET pin has no effect on the clock, calendar, or

RAM. On power-up, the RESET pin can be held low for a time to allow the power

supply to stabilize. The amount of time that RESET is held low is dependent on the

application. However, if RESET is used on power-up, the time RESET is low should

exceed 200ms to ensure that the internal timer that controls the device on power-

up has timed out. When RESET is low and VCC is above VPF, the following occurs:

A. Periodic interrupt-enable (PIE) bit is cleared to 0.

B. Alarm interrupt-enable (AIE) bit is cleared to 0.

C. Update-ended interrupt-enable (UIE) bit is cleared to 0.

D. Periodic-interrupt flag (PF) bit is cleared to 0.

E. Alarm-interrupt flag (AF) bit is cleared to 0.

F. Update-ended interrupt flag (UF) bit is cleared to 0.

G. Interrupt-request status flag (IRQF) bit is cleared to 0.

H. IRQ pin is in the high-impedance state.

I. The device is not accessible until RESET is returned high.

J. Square-wave output-enable (SQWE) bit is cleared to 0.

In a typical application, RESET can be connected to VCC. This connection allows

the device to go in and out of power fail without affecting any of the control

registers.

Real-Time Clock

_____________________________________________________________________ 9

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

10 ____________________________________________________________________

Pin Description (continued)

SO,

PDIP EDIP PLCC TQFP NAME FUNCTION

19 19 23 21 IRQ

Active-Low Interrupt Request Output. The IRQ pin is an active-low output of the

device that can be used as an interrupt input to a processor. The IRQ output

remains low as long as the status bit causing the interrupt is present and the

corresponding interrupt-enable bit is set. The processor program normally

reads the C register to clear the IRQ pin. The RESET pin also clears pending

interrupts. When no interrupt conditions are present, the IRQ level is in the high-

impedance state. Multiple interrupting devices can be connected to an IRQ

bus, provided that they are all open drain. The IRQ pin is an open-drain output

and requires an external pullup resistor to VCC.

20 — 24 22 VBAT

Connection for a Primary Battery. (DS12885 Only.) Battery voltage must be held

between the minimum and maximum limits for proper operation. If a backup

supply is not supplied, VBAT must be grounded. Connect the battery directly to

the VBAT pin. Diodes in series between the VBAT pin and the battery may

prevent proper operation. UL recognized to ensure against reverse charging

when used with a lithium battery.

(DS12887A/

DS12C887A)

25 24 RCLR

Active-Low RAM Clear. The RCLR pin is used to clear (set to logic 1) all the

general-purpose RAM, but does not affect the RAM associated with the RTC. To

clear the RAM, RCLR must be forced to an input logic 0 during battery-backup

mode when VCC is not applied. The RCLR function is designed to be used

through a human interface (shorting to ground manually or by a switch) and not

to be driven with external buffers. This pin is internally pulled up. Do not use an

external pullup resistor on this pin.

23 23 27 26 SQW

Square-Wave Output. The SQW pin can output a signal from one of 13 taps

provided by the 15 internal divider stages of the RTC. The frequency of the

SQW pin can be changed by programming Register A, as shown in Table 1.

The SQW signal can be turned on and off using the SQWE bit in Register B. The

SQW signal is not available when VCC is less than VPF.

24 24 28 28 VCC

DC Power Pin for Primary Power Supply. When VCC is applied within normal

limits, the device is fully accessible and data can be written and read. When

VCC is below VPF reads and writes are inhibited.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 11

Detailed Description

The DS12885 family of RTCs provide 14 bytes of real-

time clock/calendar, alarm, and control/status registers

and 114 bytes (113 bytes for DS12C887 and

DS12C887A) of nonvolatile, battery-backed static RAM.

A time-of-day alarm, three maskable interrupts with a

common interrupt output, and a programmable square-

wave output are available. The devices also operate in

either 24-hour or 12-hour format with an AM/PM indica-

tor. A precision temperature-compensated circuit moni-

tors the status of VCC. If a primary power-supply failure

is detected, the devices automatically switch to a back-

up supply. The backup supply input supports a primary

battery, such as lithium coin cell. The devices are

accessed through a multiplexed address/data bus that

supports Intel and Motorola modes.

Oscillator Circuit

The DS12885 uses an external 32.768kHz crystal. The

oscillator circuit does not require any external resistors

or capacitors to operate. Table 1 specifies several crys-

tal parameters for the external crystal. Figure 1 shows a

functional schematic of the oscillator circuit. An enable

bit in the control register controls the oscillator.

Oscillator startup times are highly dependent upon

crystal characteristics, PC board leakage, and layout.

High ESR and excessive capacitive loads are the major

contributors to long startup times. A circuit using a

crystal with the recommended characteristics and

proper layout usually starts within one second.

An external 32.768kHz oscillator can also drive the

DS12885. In this configuration, the X1 pin is connected

to the external oscillator signal and the X2 pin is floated.

COUNTDOWN

CHAIN

X1 X2

CRYSTAL

CL1C

L2RTC REGISTERS

DS12885

Figure 1. Oscillator Circuit Showing Internal Bias Network

PARAMETER SYMBOL MIN TYP MAX UNITS

Nominal

Frequency fO32.768 kHz

Series

Resistance ESR 50 kΩ

Load

Capacitance CL6pF

Table 1. Crystal Specifications*

The crystal, traces, and crystal input pins should be isolated

from RF generating signals. Refer to

Application Note 58:

Crystal Considerations for Dallas Real-Time Clocks

for

additional specifications.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

12 ____________________________________________________________________

Clock Accuracy

The accuracy of the clock is dependent upon the accu-

racy of the crystal and the accuracy of the match

between the capacitive load of the oscillator circuit and

the capacitive load for which the crystal was trimmed.

Additional error is added by crystal frequency drift

caused by temperature shifts. External circuit noise cou-

pled into the oscillator circuit can result in the clock run-

ning fast. Figure 2 shows a typical PC board layout for

isolation of the crystal and oscillator from noise. Refer to

Application Note 58: Crystal Considerations with Dallas

Real-Time Clocks

for more detailed information.

Clock Accuracy for DS12887, DS12887A,

DS12C887, DS12C887A Only

The encapsulated DIP modules are trimmed at the fac-

tory to an accuracy of ±1 minute per month at +25°C.

Power-Down/Power-Up

Considerations

The real-time clock continues to operate, and the RAM,

time, calendar, and alarm memory locations remain

nonvolatile regardless of the VCC input level. VBAT must

remain within the minimum and maximum limits when

VCC is not applied. When VCC is applied and exceeds

VPF (power-fail trip point), the device becomes accessi-

ble after tREC—if the oscillator is running and the oscil-

lator countdown chain is not in reset (Register A). This

time allows the system to stablize after power is

applied. If the oscillator is not enabled, the oscillator-

enable bit is enabled on power-up, and the device

becomes immediately accessible.

Time, Calendar, and Alarm

Locations

The time and calendar information is obtained by read-

ing the appropriate register bytes. The time, calendar,

and alarm are set or initialized by writing the appropri-

ate register bytes. Invalid time or date entries result in

undefined operation. The contents of the 10 time, cal-

endar, and alarm bytes can be either binary or binary-

coded decimal (BCD) format.

The day-of-week register increments at midnight, incre-

menting from 1 through 7. The day-of-week register is

used by the daylight saving function, so the value 1 is

defined as Sunday. The date at the end of the month is

automatically adjusted for months with fewer than 31

days, including correction for leap years.

Before writing the internal time, calendar, and alarm reg-

isters, the SET bit in Register B should be written to logic

1 to prevent updates from occurring while access is

being attempted. In addition to writing the 10 time, calen-

dar, and alarm registers in a selected format (binary or

BCD), the data mode bit (DM) of Register B must be set

to the appropriate logic level. All 10 time, calendar, and

alarm bytes must use the same data mode. The SET bit

in Register B should be cleared after the data mode bit

has been written to allow the RTC to update the time and

calendar bytes. Once initialized, the RTC makes all

updates in the selected mode. The data mode cannot be

changed without reinitializing the 10 data bytes. Tables

2A and 2B show the BCD and binary formats of the time,

calendar, and alarm locations.

The 24-12 bit cannot be changed without reinitializing the

hour locations. When the 12-hour format is selected, the

higher-order bit of the hours byte represents PM when it

is logic 1. The time, calendar, and alarm bytes are always

accessible because they are double-buffered. Once per

second the seven bytes are advanced by one second

and checked for an alarm condition.

If a read of the time and calendar data occurs during

an update, a problem exists where seconds, minutes,

hours, etc., may not correlate. The probability of read-

ing incorrect time and calendar data is low. Several

methods of avoiding any possible incorrect time and

calendar reads are covered later in this text.

LOCAL GROUND PLANE (TOP LAYER)

CRYSTAL

GND

NOTE: AVOID ROUTING SIGNAL LINES

IN THE CROSSHATCHED AREA

(UPPER LEFT QUADRANT) OF

THE PACKAGE UNLESS THERE IS

A GROUND PLANE BETWEEN THE

SIGNAL LINE AND THE DEVICE PACKAGE.

Figure 2. Layout Example

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 13

The three alarm bytes can be used in two ways. First,

when the alarm time is written in the appropriate hours,

minutes, and seconds alarm locations, the alarm inter-

rupt is initiated at the specified time each day, if the

alarm-enable bit is high. In this mode, the “0” bits in the

alarm registers and the corresponding time registers

must always be written to 0 (Table 2A and 2B). Writing

the 0 bits in the alarm and/or time registers to 1 can

result in undefined operation.

The second use condition is to insert a “don’t care”

state in one or more of the three alarm bytes. The don’t-

care code is any hexadecimal value from C0 to FF. The

two most significant bits of each byte set the don’t-care

condition when at logic 1. An alarm is generated each

hour when the don’t-care bits are set in the hours byte.

Similarly, an alarm is generated every minute with

don’t-care codes in the hours and minute alarm bytes.

The don’t-care codes in all three alarm bytes create an

interrupt every second.

All 128 bytes can be directly written or read, except for

the following:

1) Registers C and D are read-only.

2) Bit 7 of register A is read-only.

3) The MSB of the seconds byte is read-only.

Table 2A. Time, Calendar, and Alarm Data Modes—BCD Mode (DM = 0)

ADDRESS BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 FUNCTION RANGE

00H 0 10 Seconds Seconds Seconds 00–59

01H 0 10 Seconds Seconds Seconds Alarm 00–59

02H 0 10 Minutes Minutes Minutes 00–59

03H 0 10 Minutes Minutes Minutes Alarm 00–59

AM/PM 0 10 Hours

04H 0010 Hours Hours Hours 1–12 +AM/PM

00–23

AM/PM 0 10 Hours

05H 0010 Hours Hours Hours Alarm 1–12 +AM/PM

00–23

06H 0 0 0 0 0 Day Day 01–07

07H 0 0 10 Date Date Date 01–31

08H 0 0 0 10 Months Month Month 01–12

09H 10 Years Year Year 00–99

0AH UIP DV2 DV1 DV0 RS3 RS2 RS1 RS0 Control —

0BH SET PIE AIE UIE SQWE DM 24/12 DSE Control —

0CH IRQF PF AF UF 0 0 0 0 Control —

0DH VRT 0 0 0 0 0 0 0 Control —

0EH-31H X X X X X X X X RAM —

32H 10 Century Century Century* 00–99

33H-7FH X X X X X X X X RAM —

X = Read/Write Bit.

DS12C887, DS12C887A only. General-purpose RAM on DS12885, DS12887, and DS12887A.

Note: Unless otherwise specified, the state of the registers is not defined when power is first applied. Except for the seconds regis-

ter, 0 bits in the time and date registers can be written to 1, but may be modified when the clock updates. 0 bits should always be

written to 0 except for alarm mask bits.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

14 ____________________________________________________________________

Table 2B. Time, Calendar, and Alarm Data Modes—Binary Mode (DM = 1)

ADDRESS BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 FUNCTION RANGE

00H 0 0 Seconds Seconds 00–3B

01H 0 0 Seconds Seconds Alarm 00–3B

02H 0 0 Minutes Minutes 00–3B

03H 0 0 Minutes Minutes Alarm 00–3B

AM/PM 0 Hours

04H

Hours

Hours 01–0C +AM/PM

00–17

AM/PM 0 Hours

05H

Hours

Hours Alarm 01–0C +AM/PM

00–17

06H 0 0 0 0 0 Day Day 01–07

07H 0 0 0 Date Date 01–1F

08H 0 0 0 0 Month Month 01–0C

09H 0 Year Year 00–63

0AH UIP DV2 DV1 DV0 RS3 RS2 RS1 RS0 Control —

0BH SET PIE AIE UIE SQWE DM 24/12 DSE Control —

0CH IRQF PF AF UF 0 0 0 0 Control —

0DH VRT 0 0 0 0 0 0 0 Control —

0EH-31H X X X X X X X X RAM —

32H N/A N/A Century* —

33H-7FH X X X X X X X X RAM —

X = Read/Write Bit.

DS12C887, DS12C887A only. General-purpose RAM on DS12885, DS12887, and DS12887A.

Note: Unless otherwise specified, the state of the registers is not defined when power is first applied. Except for the seconds regis-

ter, 0 bits in the time and date registers can be written to 1, but may be modified when the clock updates. 0 bits should always be

written to 0 except for alarm mask bits.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 15

Bit 7: Update-In-Progress (UIP). This bit is a status

flag that can be monitored. When the UIP bit is a 1, the

update transfer occurs soon. When UIP is a 0, the

update transfer does not occur for at least 244µs. The

time, calendar, and alarm information in RAM is fully

available for access when the UIP bit is 0. The UIP bit is

read-only and is not affected by RESET. Writing the

SET bit in Register B to a 1 inhibits any update transfer

and clears the UIP status bit.

Bits 6, 5, and 4: DV2, DV1, DV0. These three bits are

used to turn the oscillator on or off and to reset the

countdown chain. A pattern of 010 is the only combina-

tion of bits that turn the oscillator on and allow the RTC

to keep time. A pattern of 11x enables the oscillator but

holds the countdown chain in reset. The next update

occurs at 500ms after a pattern of 010 is written to DV0,

DV1, and DV2.

Bits 3 to 0: Rate Selector (RS3, RS2, RS1, RS0).

These four rate-selection bits select one of the 13 taps

on the 15-stage divider or disable the divider output.

The tap selected can be used to generate an output

square wave (SQW pin) and/or a periodic interrupt. The

user can do one of the following:

1) Enable the interrupt with the PIE bit;

2) Enable the SQW output pin with the SQWE bit;

3) Enable both at the same time and the same rate;

4) Enable neither.

Table 3 lists the periodic interrupt rates and the square-

wave frequencies that can be chosen with the RS bits.

These four read/write bits are not affected by RESET.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

UIP DV2 DV1 DV0 RS3 RS2 RS1 RS0

Control Register A

Control Registers

The real-time clocks have four control registers that are

accessible at all times, even during the update cycle.

MSB LSB

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

16 ____________________________________________________________________

Bit 7: SET. When the SET bit is 0, the update transfer

functions normally by advancing the counts once per

second. When the SET bit is written to 1, any update

transfer is inhibited, and the program can initialize the

time and calendar bytes without an update occurring in

the midst of initializing. Read cycles can be executed in

a similar manner. SET is a read/write bit and is not

affected by RESET or internal functions of the device.

Bit 6: Periodic Interrupt Enable (PIE). The PIE bit is a

read/write bit that allows the periodic interrupt flag (PF) bit

in Register C to drive the IRQ pin low. When the PIE bit is

set to 1, periodic interrupts are generated by driving the

IRQ pin low at a rate specified by the RS3–RS0 bits of

being driven by a periodic interrupt, but the PF bit is still

set at the periodic rate. PIE is not modified by any internal

device functions, but is cleared to 0 on RESET.

Bit 5: Alarm Interrupt Enable (AIE). This bit is a

read/write bit that, when set to 1, permits the alarm flag

(AF) bit in Register C to assert IRQ. An alarm interrupt

occurs for each second that the three time bytes equal

the three alarm bytes, including a don’t-care alarm

code of binary 11XXXXXX. The AF bit does not initiate

the IRQ signal when the AIE bit is set to 0. The internal

functions of the device do not affect the AIE bit, but is

cleared to 0 on RESET.

Bit 4: Update-Ended Interrupt Enable (UIE). This bit is

a read/write bit that enables the update-end flag (UF)

bit in Register C to assert IRQ. The RESET pin going

low or the SET bit going high clears the UIE bit.

The internal functions of the device do not affect the

UIE bit, but is cleared to 0 on RESET.

Bit 3: Square-Wave Enable (SQWE). When this bit is

set to 1, a square-wave signal at the frequency set by

the rate-selection bits RS3–RS0 is driven out on the SQW

pin. When the SQWE bit is set to 0, the SQW pin is held

low. SQWE is a read/write bit and is cleared by RESET.

SQWE is low if disabled, and is high impedance when

VCC is below VPF. SQWE is cleared to 0 on RESET.

Bit 2: Data Mode (DM). This bit indicates whether time

and calendar information is in binary or BCD format.

The DM bit is set by the program to the appropriate for-

mat and can be read as required. This bit is not modi-

fied by internal functions or RESET. A 1 in DM signifies

binary data, while a 0 in DM specifies BCD data.

Bit 1: 24/12. The 24/12 control bit establishes the for-

mat of the hours byte. A 1 indicates the 24-hour mode

and a 0 indicates the 12-hour mode. This bit is

read/write and is not affected by internal functions or

RESET.

Bit 0: Daylight Saving Enable (DSE). This bit is a

read/write bit that enables two daylight saving adjust-

ments when DSE is set to 1. On the first Sunday in

April, the time increments from 1:59:59 AM to 3:00:00

AM. On the last Sunday in October when the time first

reaches 1:59:59 AM, it changes to 1:00:00 AM. When

DSE is enabled, the internal logic test for the first/last

Sunday condition at midnight. If the DSE bit is not set

when the test occurs, the daylight saving function does

not operate correctly. These adjustments do not occur

when the DSE bit is 0. This bit is not affected by internal

functions or RESET.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

SET PIE AIE UIE SQWE DM 24/12 DSE

Control Register B

MSB LSB

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 17

Bit 7: Interrupt Request Flag (IRQF). This bit is set to

1 when any of the following are true:

PF = PIE = 1

AF = AIE = 1

UF = UIE = 1

Any time the IRQF bit is 1, the IRQ pin is driven low.

This bit can be cleared by reading Register C or with a

RESET.

Bit 6: Periodic Interrupt Flag (PF). This bit is read-

only and is set to 1 when an edge is detected on the

selected tap of the divider chain. The RS3 through RS0

bits establish the periodic rate. PF is set to 1 indepen-

dent of the state of the PIE bit. When both PF and PIE

are 1s, the IRQ signal is active and sets the IRQF bit.

This bit can be cleared by reading Register C or with a

RESET.

Bit 5: Alarm Interrupt Flag (AF). A 1 in the AF bit indi-

cates that the current time has matched the alarm time.

If the AIE bit is also 1, the IRQ pin goes low and a 1

appears in the IRQF bit. This bit can be cleared by

reading Register C or with a RESET.

Bit 5: Update-Ended Interrupt Flag (UF). This bit is

set after each update cycle. When the UIE bit is set to

1, the 1 in UF causes the IRQF bit to be a 1, which

asserts the IRQ pin. This bit can be cleared by reading

Bits 3 to 0: Unused. These bits are unused in Register

C. These bits always read 0 and cannot be written.

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

IRQF PF AF UF 0 0 0 0

Control Register C

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

VRT0000000

Control Register D

Bit 7: Valid RAM and Time (VRT). This bit indicates

the condition of the battery connected to the VBAT pin.

This bit is not writeable and should always be 1 when

read. If a 0 is ever present, an exhausted internal lithi-

um energy source is indicated and both the contents of

the RTC data and RAM data are questionable. This bit

is unaffected by RESET.

Bits 6 to 0: Unused. The remaining bits of Register D

are not usable. They cannot be written and they always

MSB LSB

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

18 ____________________________________________________________________

Century Register

(DS12C887/DS12C887A Only)

The century register at location 32h is a BCD register

designed to automatically load the BCD value 20 as the

year register changes from 99 to 00. The MSB of this

remains at the value written by the user.

Nonvolatile RAM (NV RAM)

The general-purpose NV RAM bytes are not dedicated

to any special function within the device. They can be

used by the processor program as battery-backed

memory and are fully available during the update cycle.

Interrupts

The RTC family includes three separate, fully automatic

sources of interrupt for a processor. The alarm interrupt

can be programmed to occur at rates from once per

second to once per day. The periodic interrupt can be

selected for rates from 500ms to 122µs. The update-

ended interrupt can be used to indicate to the program

that an update cycle is complete. Each of these inde-

pendent interrupt conditions is described in greater

detail in other sections of this text.

The processor program can select which interrupts, if

any, are to be used. Three bits in Register B enable the

interrupts. Writing a logic 1 to an interrupt-enable bit

permits that interrupt to be initiated when the event

occurs. A 0 in an interrupt-enable bit prohibits the IRQ

pin from being asserted from that interrupt condition. If

an interrupt flag is already set when an interrupt is

enabled, IRQ is immediately set at an active level,

although the interrupt initiating the event may have

occurred earlier. As a result, there are cases where the

program should clear such earlier initiated interrupts

before first enabling new interrupts.

When an interrupt event occurs, the relating flag bit is

set to logic 1 in Register C. These flag bits are set inde-

pendent of the state of the corresponding enable bit in

without enabling the corresponding enable bits. The

interrupt flag bit is a status bit that software can interro-

gate as necessary. When a flag is set, an indication is

given to software that an interrupt event has occurred

since the flag bit was last read; however, care should

be taken when using the flag bits as they are cleared

each time Register C is read. Double latching is includ-

ed with Register C so that bits that are set remain sta-

ble throughout the read cycle. All bits that are set (high)

are cleared when read, and new interrupts that are

pending during the read cycle are held until after the

cycle is completed. One, two, or three bits can be set

when reading Register C. Each used flag bit should be

examined when Register C is read to ensure that no

interrupts are lost.

The second flag bit method is used with fully enabled

interrupts. When an interrupt flag bit is set and the cor-

responding interrupt-enable bit is also set, the IRQ pin is

asserted low. IRQ is asserted as long as at least one of

the three interrupt sources has its flag and enable bits

set. The IRQF bit in Register C is a 1 whenever the IRQ

pin is driven low. Determination that the RTC initiated an

interrupt is accomplished by reading Register C. A logic

1 in bit 7 (IRQF bit) indicates that one or more interrupts

have been initiated by the device. The act of reading

Oscillator Control Bits

When the DS12887, DS12887A, DS12C887, and

DS12C887A are shipped from the factory, the internal

oscillator is turned off. This prevents the lithium energy

cell from being used until the device is installed in a

system.

A pattern of 010 in bits 4 to 6 of Register A turns the

oscillator on and enables the countdown chain. A pat-

tern of 11x (DV2 = 1, DV1 = 1, DV0 = X) turns the oscil-

lator on, but holds the countdown chain of the oscillator

in reset. All other combinations of bits 4 to 6 keep the

oscillator off.

Square-Wave Output Selection

Thirteen of the 15 divider taps are made available to a 1-

of-16 multiplexer, as shown in the functional diagram.

The square-wave and periodic-interrupt generators

share the output of the multiplexer. The RS0–RS3 bits in

plexer (see Table 1). Once the frequency is selected, the

output of the SQW pin can be turned on and off under

program control with the square-wave enable bit, SQWE.

Periodic Interrupt Selection

The periodic interrupt causes the IRQ pin to go to an

active state from once every 500ms to once every 122µs.

This function is separate from the alarm interrupt, which

can be output from once per second to once per day.

The periodic interrupt rate is selected using the same

(Table 1). Changing the Register A bits affects the

square-wave frequency and the periodic-interrupt out-

put. However, each function has a separate enable bit in

put. Similarly, the PIE bit in Register B enables the peri-

odic interrupt. The periodic interrupt can be used with

software counters to measure inputs, create output inter-

vals, or await the next needed software function.

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 19

Update Cycle

The device executes an update cycle once per second

regardless of the SET bit in Register B. When the SET

bit in Register B is set to 1, the user copy of the double-

buffered time, calendar, and alarm bytes is frozen and

does not update as the time increments. However, the

time countdown chain continues to update the internal

copy of the buffer. This feature allows time to maintain

accuracy independent of reading or writing the time,

calendar, and alarm buffers, and also guarantees that

time and calendar information is consistent. The update

cycle also compares each alarm byte with the corre-

sponding time byte and issues an alarm if a match or if

a don’t-care code is present in all three positions.

There are three methods that can handle RTC access

that avoid any possibility of accessing inconsistent time

and calendar data. The first method uses the update-

ended interrupt. If enabled, an interrupt occurs after

every update cycle that indicates over 999ms is avail-

able to read valid time and date information. If this

interrupt is used, the IRQF bit in Register C should be

cleared before leaving the interrupt routine.

A second method uses the update-in-progress bit (UIP)

in Register A to determine if the update cycle is in

progress. The UIP bit pulses once per second. After

the UIP bit goes high, the update transfer occurs 244µs

later. If a low is read on the UIP bit, the user has at least

244µs before the time/calendar data is changed.

Therefore, the user should avoid interrupt service rou-

tines that would cause the time needed to read valid

time/calendar data to exceed 244µs.

The third method uses a periodic interrupt to determine if

an update cycle is in progress. The UIP bit in Register A

is set high between the setting of the PF bit in Register C

(Figure 3). Periodic interrupts that occur at a rate greater

than tBUC allow valid time and date information to be

reached at each occurrence of the periodic interrupt.

The reads should be complete within one (tPI/2 + tBUC)

to ensure that data is not read during the update cycle.

Handling, PC Board Layout,

and Assembly

The EDIP module can be successfully processed

through conventional wave-soldering techniques so long

as temperature exposure to the lithium energy source

does not exceed +85°C. Post-solder cleaning with water-

washing techniques is acceptable, provided that ultra-

sonic vibration is not used. Such cleaning can damage

the crystal.

SELECT BITS

RS3 RS2 RS1 RS0

tPI PERIODIC

INTERRUPT

RATE

SQW OUTPUT

FREQUENCY

0 0 0 0 None None

0 0 0 1 3.90625ms 256Hz

0 0 1 0 7.8125ms 128Hz

0 0 1 1 122.070µs 8.192kHz

0 1 0 0 244.141µs 4.096kHz

0 1 0 1 488.281µs 2.048kHz

0 1 1 0 976.5625µs 1.024kHz

0 1 1 1 1.953125ms 512Hz

1 0 0 0 3.90625ms 256Hz

1 0 0 1 7.8125ms 128Hz

1 0 1 0 15.625ms 64Hz

1 0 1 1 31.25ms 32Hz

1 1 0 0 62.5ms 16Hz

1 1 0 1 125ms 8Hz

1 1 1 0 250ms 4Hz

1 1 1 1 500ms 2Hz

Table 3. Periodic Interrupt Rate and

Square-Wave Output Frequency

UIP

tBUC = DELAY TIME BEFORE UPDATE

CYCLE = 244μs

1 SECOND

tPI

tP1/2 tP1/2

tBUC

Figure 3. UIP and Periodic Interrupt Timing

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

20 ____________________________________________________________________

VCC

SQW

N.C.

RCLRAD0

MOT

TOP VIEW

VBAT

IRQ

RESET

DSAD4

AD3

AD2

AD1

GND

R/W

CSGND

AD7

AD6

AD5

SO, PDIP

PLCC

DS12885

DS12885S

DS12885Q

VCC

SQW

N.C.

(RCLR)

AD0

N.C.

MOT

N.C.

IRQ

RESET

DSAD4

AD3

AD2

AD1

N.C.

R/W

( ) FOR THE DS12887A/DS12C887A.

NOTE: THE DS12887A AND DS12C887A CANNOT BE STORED OR SHIPPED IN CONDUCTIVE MATERIAL

THAT WILL GIVE A CONTINUITY PATH BETWEEN THE RAM CLEAR PIN AND GROUND.

GND

AD7

AD6

AD5

EDIP

DS12887

DS12887A

DS12C887

DS12C887A

1N.C.

VCC

SQW

N.C.

MOT

GND

N.C.

AD7

N.C.

AD6

AD0

AD1

AD2

AD3

AD4

AD5

N.C.

RCLR

VBAT

IRQ

RESET

GND

R/W

Pin Configurations

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

____________________________________________________________________ 21

PACKAGE THETA-JA (°C/W) THETA-JC (°C/W)

PDIP 75 30

SO 105 22

PLCC 95 25

Thermal Information

Chip Information

TRANSISTOR COUNT: 17,000

PROCESS: CMOS

SUBSTRATE CONNECTED TO GROUND

TQFP

TOP VIEW

32 28

293031 25

MOT

VCC

N.C.

SQW

N.C.

10 13 15

14 1611 12

AD6

AD7

N.C.

GND

N.C.

R/W

23 N.C.

24 RCLR

VBAT

IRQ

N.C.

RESET

GND

8AD5

AD4

N.C.

AD3

N.C.

AD2

AD1

1AD0

DS12885T

Pin Configurations (continued) Ordering Information

PART TEMP RANGE

PIN-

PACKAGE

TOP

MARK*

DS12885 0°C to +70°C 24 PDIP DS12885

DS12885+ 0°C to +70°C 24 PDIP DS12885

DS12885N -40°C to +85°C 24 PDIP DS12885

DS12885N+ -40°C to +85°C 24 PDIP DS12885

DS12885Q 0°C to +70°C 28 PLCC DS12885Q

DS12885Q+ 0°C to +70°C 28 PLCC DS12885Q

DS12885QN -40°C to +85°C 28 PLCC DS12885Q

DS12885QN+ -40°C to +85°C 28 PLCC DS12885Q

DS12885Q/T&R 0°C to +70°C 28 PLCC DS12885Q

DS12885Q+T&R 0°C to +70°C 28 PLCC DS12885Q

DS12885QN/T&R -40°C to +85°C 28 PLCC DS12885Q

DS12885QN+T&R -40°C to +85°C 28 PLCC DS12885Q

DS12885S 0°C to +70°C 24 SO

(300 mils) DS12885S

DS12885S+ 0°C to +70°C 24 SO

(300 mils) DS12885S

DS12885SN -40°C to +85°C

24 SO

(300 mils) DS12885S

DS12885SN+ -40°C to +85°C

24 SO

(300 mils) DS12885S

DS12885S/T&R 0°C to +70°C 24 SO

(300 mils) DS12885S

DS12885S+T&R 0°C to +70°C 24 SO

(300 mils) DS12885S

DS12885T 0°C to +70°C 32 TQFP DS12885

DS12885T+ 0°C to +70°C 32 TQFP DS12885

DS12885TN -40°C to +85°C 32 TQFP DS12885

DS12885TN+ -40°C to +85°C 32 TQFP DS12885

DS12885T/T&R 0°C to +70°C 32 TQFP DS12885

DS12887 0°C to +70°C 24 EDIP DS12887

DS12887+ 0°C to +70°C 24 EDIP DS12887

DS12887A 0°C to +70°C 24 EDIP DS12887A

DS12887A+ 0°C to +70°C 24 EDIP DS12887A

DS12C887 0°C to +70°C 24 EDIP DS12C887

DS12C887+ 0°C to +70°C 24 EDIP DS12C887

DS12C887A 0°C to +70°C 24 EDIP DS12C887A

DS12C887A+ 0°C to +70°C 24 EDIP DS12C887A

Denotes a lead(Pb)-free/RoHS-compliant device.

T&R = Tape and reel.

*A “+” anywhere on the top mark indicates a lead-free device,

and an “N” indicates an industrial temperature range device.

Package Information

For the latest package outline information and land patterns, go

to www.maxim-ic.com/packages.

PACKAGE TYPE PACKAGE CODE DOCUMENT NO.

24 SO W24+8 21-0042

24 PDIP P24+4 21-0044

24 EDIP MDP24+1 21-0241

28 PLCC Q28+2 21-0049

32 TQFP C32+3 21-0292

DS12885/DS12887/DS12887A/DS12C887/DS12C887A

Real-Time Clock

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

is a registered trademark of Dallas Semiconductor Corporation.

Quijano

Revision History

Rev 0; 6/05: Initial release of combined data sheet.

Rev 1; 4/06: Corrected

Intel Bus Write Timing

diagram (page 4),

Intel Bus Read Timing

IRQ Release Delay

Timing

, and

Power-Up/Down Timing

diagrams (page 5), and

Functional Diagram

(page 7). Added

Handling

PC Board Layout

, and

Assembly

section (page 20).

Rev 2; 5/06: Corrected

Intel Bus Write Timing

diagram (page 4); added PLCC pin description information

(pages 8, 9, and 10); changed pin 16 from N.C. to GND for the SO, PDIP packages (pages 8, 9,

and 20).

Rev 3; 2/07: Corrected

Intel Bus Write Timing

diagram (page 4); updated Ordering Information (page 20);

added Package Information table (page 20); removed package drawings (pages 22 to 27).