Conductive Polymer Hybrid Aluminum Electrolytic Capacitors
(3) In case of use in 2 times reflow, 2nd reflow must be done when the capacitor’s temperature return back
(4) In our recommended reflow condition , the case discoloration and the case swelling might be slightly
generated. But please acknowledge that these two phenomena do not influence the reliability of the product.
(5) The crack on top marking might be occurred by reflow heat stress.
But please acknowledge that it does not influence the reliability of the product.
(6) VPS (Vapor Phase Soldering) reflow can cause significant characteristics change and/ or mounting failure
due to deformation by acute temperature rise.
VPS is acceptable provided that the process does not exceed recommended reflow profile and
temperature rise is less than 3 ℃ / sec. Please contact Panasonic for detailed conditions.
(7) The vibration-proof capacitors of size ø6.3 has support terminals extending from the bottom side to the lead edge.
Then, make sure to find appropriate soldering conditions to form fillet on the support terminals if required for
appearance inspection. However, even if sufficient solder fillets are not observed, the reliability of vibration-proof
will not be lowered because the support terminals on the bottom side enhance the solder joint to PCB.
2.4 Flow soldering (for radial type)
(1) Radial lead type capacitors cannot apply to reflow soldering.
(2) Do not immerse the capacitor body into the solder bath as excessive internal pressure could result.
(3) Apply proper soldering conditions (temperature, time, etc.). Do not exceed the specified limits.
(4) Do not allow other parts or components to touch the capacitor during soldering.
(5) When mounting the radial type being touched to PCB, be sure to check the appearance of solder under the
sealing rubber, which does not have an airflow structure.
(1) Observe temperature and time soldering specifications or do not exceed temperature of 350 °C for
(2) If a soldered capacitor must be removed and reinserted, avoid excessive stress on the capacitor leads.
(3) Avoid physical contacts between the tip of the soldering iron and capacitors to prevent or capacitor failure.
(4) When bending lead wires of radial type capacitors to match the hole pitch on PCB, avoid applying excessive
stress to the capacitor body.
2.6 Capacitor handling after soldering
(1) Avoid moving the capacitor after soldering to prevent excessive stress on the lead wires where they enter
the seal. The capacitor may break from element portion due to a torque at outer rim, causing a large stress
(2) Do not use the capacitor as a handle when moving the circuit board assembly. The total weight of the
board would apply to element portion through terminals, and the capacitor may break.
(3) Avoid striking the capacitor after assembly to prevent failure due to excessive shock. The capacitor may
break due to excessive shock or load above specified range.
2.7 Circuit board cleaning
(1) Circuit boards can be immersed or ultrasonically cleaned using suitable cleaning solvents for up to
5 minutes and up to 60 °C maximum temperatures. The boards should be thoroughly rinsed and dried.
The use of ozone depleting cleaning agents is not recommended for the purpose of protecting our
Pine Alpha ST-100S, Aqua Cleaner 210SEP, Clean-thru 750H / 750L / 710M, Sunelec B-12,
Sunelec B-12, Cold Cleaner P3-375, Techno Cleaner 219, DK Be-clear CW-5790,
Telpene Cleaner EC-7R, Technocare FRW-17 / FRW-1 / FRV-1
(2) Avoid using the following solvent groups unless specifically allowed in the specification ;
(a) Halogenated based solvents
: may permeate the seal and cause internal corrosion.
Especially, 1-1-1 trichloroethane must not be used on any aluminum electrolytic capacitors.
(b) Alkaline based solvents : may dissolve and react to the aluminum case.
(c) Petroleum based solvents
: may deteriorate the sealing rubber
(d) Xylene : may deteriorate the sealing rubber
: may erase the markings on the capacitor top
(3) A thorough drying after cleaning is required to remove residual cleaning solvents that may be trapped
between the capacitor and the circuit board. Avoid drying temperatures, which exceed the upper category
temperature of the capacitor.
(4) Monitor the contamination levels of cleaning solvents during use in terms of electrical conductivity, pH, specific
gravity, and water content. Inside the capacitor may corrode with high density of chlorine. Control the flux
density in the cleaning agent to be less than 2 mass%.
(5) Depending on the cleaning method, the marking on a capacitor may be erased or blurred.
※ Please consult us if you are not certain about acceptable cleaning solvents or cleaning methods.