CREAT BY ART
Silicon zener diodes
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
BZD17C11P Sub-SMA 3K / 7" REEL RV
Maxi mum Ratings and Electrical Characteristics
Rating at 25 ambient temperature unless otherwise specified.
Symbol Unit
V
F
Volts
R
θJA
/W
R
θJL
/W
T
J
, T
STG
Version:H13
Thermal Resistance Junction to Lead 30
Note 1: Mounted on Cu-Pad size 5mm x 5mm (40um thick)
Note 2: T
J
=25 Prior to Surge
Ordering Information (example)
Part No. Package Packing Packing
code
Packing code
(Green)
Power Dissipation at T
L
=80
T
A
=25 (Note 1) Ptot 2.3
0.8 Watts
Packaging method: refer to package code
Terminals: Pure tin plated, lead free
Weight: 0.01 gram
Forward Voltage @ I
F
=0.2A
RVG
Features
Mechanical Data
High temperature soldering guaranteed:
260 / 10 seconds
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Value
-65 to +175
1.2
Non-Repetitive Peak Pulse Power Dissipation
100us square pulse (Note 2) P
ZSM
BZD17C SERIES
Sub SMA
0.8 Watts Voltage Regulator Diodes
Case: Sub SMA Plastic
300 Watts
Thermal Resistance Junction to Ambient Air (Note 1) 180
Marking code: as table
Type Number
Operating and Storage Temperature Range
Version:H13
RATINGS AND CHARACTERISTIC CURVES (BZD17C SERIES)
0
0.5
1
1.5
2
2.5
3
0 25 50 75 100 125 150 175
POWER DISSIPATION(W)
AMBIENT TEMPERATURE(oC)
FIG.3 POWER DISSIPATION vs
AMBIENT TEMPERATURE
SEPOINT TEMPERATURE
AMBIENT TEMPERATURE
10
100
1000
10000
0.0 0.5 1.0 1.5 2.0 2.5 3.0
TYP. JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE
FIG. 2 TYP. DIODE CAPACITANCE vs
REVERSE VOLTAGE
C12P
C27P
C200P
0.1
1
10
0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 1 TYPICAL FORWARD CHARACTERISTICS
TYP. VF MAX. VF
Test
Current
I
ZT
I
R
V
R
mA uA V
Min. Max typ Max. Min. Max Max.
BZD17C11P J2 10.4 11.6 4 7 0.05 0.10 50 4.0 8.2
BZD17C12P J3 11.4 12.7 4 7 0.05 0.10 50 3.0 9.1
BZD17C13P J4 12.4 14.1 5 10 0.05 0.10 50 2.0 10
BZD17C15P J5 13.8 15.6 5 10 0.05 0.10 25 1.0 11
BZD17C16P J6 15.3 17.1 6 15 0.06 0.11 25 1.0 12
BZD17C18P J7 16.8 19.1 6 15 0.06 0.11 25 1.0 13
BZD17C24P K0 22.8 25.6 7 15 0.06 0.11 25 1.0 18
BZD17C27P K1 25.1 28.9 7 15 0.06 0.11 25 1.0 20
BZD17C33P K3 31 35 8 15 0.06 0.11 25 1.0 24
BZD17C36P K4 34 38 21 40 0.06 0.11 10 1.0 27
BZD17C39P K5 37 41 21 40 0.06 0.11 10 1.0 30
BZD17C43P K6 40 46 24 45 0.07 0.12 10 1.0 33
BZD17C47P K7 44 50 24 45 0.07 0.12 10 1.0 36
BZD17C51P K8 48 54 25 60 0.07 0.12 10 1.0 39
BZD17C62P L0 58 66 25 80 0.08 0.13 10 1.0 47
BZD17C68P L1 64 72 25 80 0.08 0.13 10 1.0 51
BZD17C75P L2 70 79 30 100 0.08 0.13 10 1.0 56
BZD17C100P L5 94 106 60 200 0.09 0.13 4 1.0 75
BZD17C120P L7 114 127 150 300 0.09 0.13 4 1.0 91
BZD17C180P M1 168 191 280 450 0.09 0.13 4 1.0 130
BZD17C200P M2 188 212 350 750 0.09 0.13 4 1.0 150
BZD17C220P M3 208 233 430 900 0.09 0.13 4 1.0 160
Notes: 1. Pulse test: tp 5ms.
Version:H13
Reverse Current@
Reverse Voltage
ALPH
Z
@ I
Z
Temperature
Coefficient
%/
ELECTRICAL CHARACTERISTICS (TA=25 unless otherwise noted)
Device
Device
Marking
Code
Working Voltage
(Note 1)
V
Z
@ I
ZT
V
Differential
Resistance
r
dif @ I
Z
Sub-SMA 8mm RU
Sub-SMA 8mm RV
Sub-SMA 8mm RT
Sub-SMA 8mm MT
Sub-SMA 8mm RQ
Sub-SMA 8mm MQ
Sub-SMA 12mm R3
Sub-SMA 12mm RF
Sub-SMA 12mm R2
Sub-SMA 12mm M2
Sub-SMA 12mm RH
Sub-SMA 12mm MH
Tape & Reel specification
AB C DNGT
±2.0 ±0.4 +0.5;-0.2 min ±1.0 +0.8;-0 max
8mm 8.2 10.6
12mm 12.2 14.6
AB C DNGT
max ±0.5 ±0.5 min ±0.5 +2.0;-0 max
8mm 8.5 14.5
12mm 12.4 18.4 Unit (mm)
20.2 75
Reel Size Tape Size
13" 330 2 13
7" 178 1.9 13 21 62
10K / 13" Plastic REEL MHG
Note: "x" is Device Code from "11" thru "220".
Reel Size Tape Size
7.5K / 13" REEL R2G
7.5K / 13" Plastic REEL M2G
10K / 13" REEL RHG
RQG
10K / 13" Plastic REEL MQG
1.8K / 7" REEL R3G
3K / 7" REEL RFG
BZD17CxxP
(Note)
1.8K / 7" REEL RUG
3K / 7" REEL RVG
7.5K / 13" REEL RTG
7.5K / 13" Plastic REEL MTG
10K / 13" REEL
Ordering information
Part No. Package Packing Tape Size Packing
code
Packing code
(Green)
Symbol
A
B
C
D
E
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/NL = Specific Device Code
G = Green Compound
YW = Date Code
4.3
Package Outline Dimensions
DIM. Unit(mm) Unit(inch)
Marking Diagram
Suggested PAD Layout
Unit(mm)
1.4
1.2
3.1
1.9