IPI90R800C3
CoolMOS™ Power Transistor
Features
• Lowest figure-of-merit RON x Qg
• Extreme dv/dt rated
• High peak current capability
• Qualified according to JEDEC1) for target applications
• Pb-free lead plating; RoHS compliant
• Ultra low gate charge
CoolMOS™ 900V is designed for:
• Quasi Resonant Flyback / Forward topologies
• PC Silverbox and consumer applications
• Industrial SMPS
Maximum ratings, at TJ=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current IDTC=25 °C A
TC=100 °C
Pulsed drain current2) ID,pulse TC=25 °C
Avalanche energy, single pulse EAS ID=1.4 A, VDD=50 V 157 mJ
Avalanche energy, repetitive tAR
2),3) EAR ID=1.4 A, VDD=50 V
Avalanche current, repetitive tAR
2),3) IAR A
MOSFET dv/dt ruggedness dv/dtVDS=0...400 V V/ns
Gate source voltage VGS static V
AC (f>1 Hz)
Power dissipation Ptot TC=25 °C W
Operating and storage temperature TJ, Tstg °C
±30
104
-55 ... 150
0.46
1.4
50
±20
Value
6.9
4.4
15
VDS @ TJ=25°C 900 V
RDS(on),max @ TJ= 25°C 0.8 Ω
Qg,typ 42 nC
Product Summary
Type Package Marking
IPI90R800C3 PG-TO262 9R800C
PG-TO262
Rev. 1.0 page 1 2008-07-30
IPI90R800C3
Maximum ratings, at TJ=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous diode forward current ISA
Diode pulse current2) IS,pulse 15
Reverse diode dv/dt4) dv/dt4 V/ns
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case RthJC - - 1.2 K/W
RthJA leaded - - 62
Soldering temperature,
wavesoldering only allowed at leads Tsold
1.6 mm (0.063 in.)
from case for 10 s - - 260 °C
Electrical characteristics, at TJ=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS VGS=0 V, ID=250 µA 900 - - V
Gate threshold voltage VGS(th) VDS=VGS, ID=0.46 mA 2.5 3 3.5
Zero gate voltage drain current IDSS
VDS=900 V, VGS=0 V,
Tj=25 °C --1µA
VDS=900 V, VGS=0 V,
Tj=150 °C -10-
Gate-source leakage current IGSS VGS=20 V, VDS=0 V - - 100 nA
Drain-source on-state resistance RDS(on)
VGS=10 V, ID=4.1 A,
Tj=25 °C - 0.62 0.8 Ω
VGS=10 V, ID=4.1 A,
Tj=150 °C - 1.7 -
Gate resistance RGf=1 MHz, open drain - 1.3 - Ω
Value
TC=25 °C
4.1
Values
Thermal resistance, junction -
ambient
Rev. 1.0 page 2 2008-07-30
IPI90R800C3
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance Ciss - 1100 - pF
Output capacitance Coss -52-
Effective output capacitance, energy
related 5) Co(er) -34-
Effective output capacitance, time
related 6) Co(tr) - 130 -
Turn-on delay time td(on) -70-ns
Rise time tr-20-
Turn-off delay time td(off) - 400 -
Fall time tf-32-
Gate Charge Characteristics
Gate to source charge Qgs -5-nC
Gate to drain charge Qgd -18-
Gate charge total Qg- 42 tbd
Gate plateau voltage Vplateau - 4.6 - V
Reverse Diode
Diode forward voltage VSD
VGS=0 V, IF=4.1 A,
TJ=25 °C - 0.8 1.2 V
Reverse recovery time trr - 360 - ns
Reverse recovery charge Qrr - 5.3 - µC
Peak reverse recovery current Irrm -24-A
5) Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 50% VDSS.
6) Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 50% VDSS.
4) ISD≤ID, di/dt≤ 200 A/µs, VDClink=400V, Vpeak<V(BR)DSS, TJ<TJ,max, identical low side and high side switch
VR=400 V, IF=IS,
diF/dt=100 A/µs
2) Pulse width tp limited by TJ,max
3) Repetitive avalanche causes additional power losses that can be calculated as PAV=EAR*f.
1) J-STD20 and JESD22
Values
VGS=0 V, VDS=100 V,
f=1 MHz
VDD=400 V,
VGS=10 V, ID=4.1 A,
RG=50 Ω
VDD=400 V, ID=4.1 A,
VGS=0 to 10 V
VGS=0 V, VDS=0 V
to 500 V
Rev. 1.0 page 3 2008-07-30
IPI90R800C3
1 Power dissipation 2 Safe operating area
Ptot=f(TC)ID=f(VDS); TC=25 °C; D=0
parameter: tp
3 Max. transient thermal impedance 4 Typ. output characteristics
ZthJC=f(tP)ID=f(VDS); TJ=25 °C
parameter: D=t p/Tparameter: VGS
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
TC [°C]
Ptot [W]
1 µs
10 µs
100 µs
1 ms
10 ms
DC
102
101
100
10-1
1 10 100 1000
VDS [V]
ID [A]
single pulse
0.01
0.02
0.05
0.1
0.2
0.5
10-1
10-2
10-3
10-4
10-5
101
100
10-1
10-2
tp [s]
ZthJC [K/W]
4 V
4.5 V
5 V
5.5 V
6 V
8 V
10 V
20 V
0
5
10
15
20
0 5 10 15 20 25
VDS [V]
ID [A]
limited by on-state
resistance
Rev. 1.0 page 4 2008-07-30
IPI90R800C3
5 Typ. output characteristics 6 Typ. drain-source on-state resistance
ID=f(VDS); TJ=150 °C RDS(on)=f(ID); TJ=150 °C
parameter: VGS parameter: VGS
7 Drain-source on-state resistance 8 Typ. transfer characteristics
RDS(on)=f(TJ); ID=4.1 A; VGS=10 V ID=f(VGS); VDS=20V
parameter: TJ
typ
98 %
0
0.5
1
1.5
2
2.5
-60 -20 20 60 100 140 180
TJ [°C]
RDS(on) [Ω]
25 °C
150 °C
0
5
10
15
20
0246810
VGS [V]
ID [A]
4 V
4.5 V
5 V
6 V
8 V
10 V
20 V
0
2
4
6
8
10
0 5 10 15 20 25
VDS [V]
ID [A]
4 V
4.5 V
4.8 V
5 V
10 V
0
2
4
6
8
10
02468101214
ID [A]
RDS(on) [Ω]
Rev. 1.0 page 5 2008-07-30
IPI90R800C3
9 Typ. gate charge 10 Forward characteristics of reverse diode
VGS=f(Qgate); ID=4.1 A pulsed IF=f(VSD)
parameter: VDD parameter: TJ
11 Avalanche energy 12 Drain-source breakdown voltage
EAS=f(TJ); ID=1.4 A; VDD=50 V VBR(DSS)=f(TJ); ID=0.25 mA
25 °C
150 °C
25 °C, 98%
150 °C, 98%
102
101
100
10-1
0 0.5 1 1.5 2
VSD [V]
IF [A]
400 V 720 V
0
2
4
6
8
10
0 1020304050
Qgate [nC]
VGS [V]
800
850
900
950
1000
1050
-60 -20 20 60 100 140 180
TJ [°C]
VBR(DSS) [V]
0
20
40
60
80
100
120
140
160
25 50 75 100 125 150
TJ [°C]
EAS [mJ]
Rev. 1.0 page 6 2008-07-30
IPI90R800C3
13 Typ. capacitances 14 Typ. Coss stored energy
C=f(VDS); VGS=0 V; f=1 MHz Eoss=f(V DS)
0
1
2
3
4
5
6
0 100 200 300 400 500 600
VDS [V]
Eoss [µJ]
Ciss
Coss
Crss
1
10
100
1000
10000
0 100 200 300 400 500 600
VDS [V]
C [pF]
Rev. 1.0 page 7 2008-07-30
IPI90R800C3
Definition of diode switching characteristics
Rev. 1.0 page 8 2008-07-30
IPI90R800C3
PG-TO262 Outlines
Dimensions in mm/inches
Rev. 1.0 page 9 2008-07-30
IPI90R800C3
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 1.0 page 10 2008-07-30
