C0805C330GDGAC9028 - KEMET Electronics Corporation

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

Metric

Code

EIA Size

Code L - Length W - Width B - Bandwidth Band

Separation

2012 0805 2.0 (0.079)

± 0.2 (0.008)

1.2 (0.049)

± 0.2 (0.008)

0.5 (0.02

±0.25 (0.010) 0.75 (0.030)

3216 1206 3.2 (0.126)

± 0.2 (0.008)

1.6 (0.063)

± 0.2 (0.008)

0.5 (0.02)

± 0.25 (0.010) N/A

3225 1210 3.2 (0.126)

± 0.2 (0.008)

2.5 (0.098)

± 0.2 (0.008)

0.5 (0.02)

± 0.25 (0.010) N/A

4520 1808 4.5 (0.177)

± 0.3 (0.012)

2.0 (0.079

± 0.2 (0.008)

0.6 (0.024)

± 0.35 (0.014) N/A

4532 1812 4.5 (0.177)

± 0.3 (0.012)

3.2 (0.126)

± 0.3 (0.012)

0.6 (0.024)

± 0.35 (0.014) N/A

4564 1825 4.5 (0.177)

± 0.3 (0.012)

6.4 (0.250)

± 0.4 (0.016)

0.6 (0.024)

± 0.35 (0.014) N/A

5650 2220 5.6 (0.224)

± 0.4 (0.016)

5.0 (0.197)

± 0.4 (0.016)

0.6 (0.024)

± 0.35 (0.014) N/A

5664 2225 5.6 (0.224)

± 0.4 (0.016)

6.4 (0.250)

± 0.4 (0.016)

0.6 (0.024)

± 0.35 (0.014) N/A

Outline Drawing

KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They

offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin

(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering

applications. An insulating coating may be required to prevent surface arcing. These components are RoHS

compliant.

Applications Markets

• Switch Mode Power Supply • Power Supply

• Input Filter • High Voltage Power Supply

• Resonators • DC-DC Converter

• Tank Circuit • LCD Fluorescent Backlight Ballast

• Snubber Circuit • HID Lighting

• Output Filter • Telecommunications Equipment

• High Voltage Coupling • Industrial Equipment/Control

• High Voltage DC Blocking • Medical Equipment/Control

• Lighting Ballast • Computer (LAN/WAN Interface)

• Voltage Multiplier Circuits • Analog and Digital Modems

• Coupling Capacitor/CUK • Automotive

APPLICATIONS MARKETS

OUTLINE DRAWING

TABLE 1 - DIMENSIONS - MILLIMETERS (in.)

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

ELECTRODES

Ceramic Surface Mount

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.

Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

Ceramic Surface Mount

C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

Series

Max

Thickness

(in)

0.050

0.065

0.101

0.080

0.067

Cap Code/

Voltage

500

1000

500

1000

1500

2000

500

1000

1500

2000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

1.0-2.4 C,D 109-249

2.7-5.1 C,D K,M 279-519

5.6-9.1 C,D J,K,M 569-919

10 C,D J,K,M 100

11 C,D J,K,M 110

12 C,D J,K,M 120

13 C,D J,K,M 130

15 C,D G,J,K,M 150

16 C,D G,J,K,M 160

18 C,D G,J,K,M 180

20 C,D G,J,K,M 200

22 C,D G,J,K,M 220

24 C,D G,J,K,M 240

27 D,F,G,J,K,M 270

30 D,F,G,J,K,M 300

33 D,F,G,J,K,M 330

36 D,F,G,J,K,M 360

39 D,F,G,J,K,M 390

43 D,F,G,J,K,M 430

47 D,F,G,J,K,M 470

51 D,F,G,J,K,M 510

56 F,G,J,K,M 560

62 F,G,J,K,M 620

68 F,G,J,K,M 680

75 F,G,J,K,M 750

82 F,G,J,K,M 820

91 F,G,J,K,M 910

100 F,G,J,K,M 101

110 F,G,J,K,M 111

120 F,G,J,K,M 121

130 F,G,J,K,M 131

150 F,G,J,K,M 151

160 F,G,J,K,M 161

180 F,G,J,K,M 181

200 F,G,J,K,M 201

220 F,G,J,K,M 221

240 F,G,J,K,M 241

270 F,G,J,K,M 271

300 F,G,J,K,M 301

330 F,G,J,K,M 331

360 F,G,J,K,M 361

390 F,G,J,K,M 391

430 F,G,J,K,M 431

470 F,G,J,K,M 471

510 F,G,J,K,M 511

560 F,G,J,K,M 561

620 F,G,J,K,M 621

680 F,G,J,K,M 681

750 F,G,J,K,M 751

820 F,G,J,K,M 821

910 F,G,J,K,M 911

1000 F,G,J,K,M 102

1100 F,G,J,K,M 112

1200 F,G,J,K,M 122

1300 F,G,J,K,M 132

1500 F,G,J,K,M 152

1600 F,G,J,K,M 162

1800 F,G,J,K,M 182

2000 F,G,J,K,M 202

2200 F,G,J,K,M 222

2400 F,G,J,K,M 242

2700 F,G,J,K,M 272

3000 F,G,J,K,M 302

3300 F,G,J,K,M 332

3600 F,G,J,K,M 362

3900 F,G,J,K,M 392

4300 F,G,J,K,M 432

4700 F,G,J,K,M 472

5100 F,G,J,K,M 512

5600 F,G,J,K,M 562

6200 F,G,J,K,M 622

6800 F,G,J,K,M 682

7500 F,G,J,K,M 752

8200 F,G,J,K,M 822

9100 F,G,J,K,M 912

10,000 F,G,J,K,M 103

2225

Cap

Capacitance

Tolerance

1825 222018120805 1206 1210 1808

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

Note: Actual thickness dimensions may be less than stated maximum.

Check the KEMET website, www.kemet.com, for additional values and chip sizes available.

X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)

EIA Metric

0805 2012 0.055 1.27 8 2,500 10,000

1206 3216 0.065 1.65 8 2,000 8,000

1210 3225 0.101 2.57 8 2,000 8,000

1808 4520 0.080 2.03 12 1,000 4,000

1812/1813 4532 0.067 1.70 12 1,000 4,000

1825 4564 0.067 1.70 12 1,000 4,000

2220 5650 0.067 1.70 12 1,000 4,000

2225 5664 0.067 1.70 12 1,000 4,000

Qty per Reel

7" Plastic

Qty per Reel

13" Plastic

KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)

THICKNESS AND REELING QUANTITIES

Chip size Max.

Thickness (in)

Max.

Thickness (mm)

Tape Width

(mm)

Series

Max

Thickness

(in)

0.050

0.065

0.080

0.067

Cap Code/

Voltage

500

1000

500

1000

1500

2000

500

1000

1500

2000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

500

1000

1500

2000

2500

3000

10 J,K,M 100

11 J,K,M 110

12 J,K,M 120

13 J,K,M 130

15 J,K,M 150

16 J,K,M 160

18 J,K,M 180

20 J,K,M 200

22 J,K,M 220

24 J,K,M 240

27 J,K,M 270

30 J,K,M 300

33 J,K,M 330

36 J,K,M 360

39 J,K,M 390

43 J,K,M 430

47 J,K,M 470

51 J,K,M 510

56 J,K,M 560

62 J,K,M 620

68 J,K,M 680

75 J,K,M 750

82 J,K,M 820

91 J,K,M 910

100 J,K,M 101

110 J,K,M 111

120 J,K,M 121

130 J,K,M 131

150 J,K,M 151

180 J,K,M 181

220 J,K,M 221

270 J,K,M 271

330 J,K,M 331

390 J,K,M 391

470 J,K,M 471

560 J,K,M 561

680 J,K,M 681

820 J,K,M 821

1000 J,K,M 102

1200 J,K,M 122

1500 J,K,M 152

1800 J,K,M 182

2000 J,K,M 202

2200 J,K,M 222

2700 J,K,M 272

3300 J,K,M 332

3900 J,K,M 392

4700 J,K,M 472

5600 J,K,M 562

6800 J,K,M 682

8200 J,K,M 822

10,000 J,K,M 103

12,000 J,K,M 123

15,000 J,K,M 153

18,000 J,K,M 183

22,000 J,K,M 223

27,000 J,K,M 273

33,000 J,K,M 333

39,000 J,K,M 393

47,000 J,K,M 473

56,000 J,K,M 563

62,000 J,K,M 623

68,000 J,K,M 683

82,000 J,K,M 823

100,000 J,K,M 104

120,000 J,K,M 124

150,000 J,K,M 154

180,000 J,K,M 184

220,000 J,K,M 224

2225

Cap

Capacitance

Tolerance

1825 222018120805 1206 1210 1808

Ceramic Surface Mount

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP / HIGH VOLTAGE

C 0805 C 102 K C R A C

Style

C - Ceramic

Chip Size

0805; 1206; 1210; 1808;

1812; 1825; 2220; 2225

Specification

C - Standard

Capacitance Code, pF

First two digits represent significant figures.

Third digit specifies number of zeros. 100 pF = 101.

(Use “9” for 1.0 through 9.9 pF)

(Use “8” for 0.1 through .99 pF)

Capacitance Tolerance

C = ±0.25pF* J = ±5%

D = ±0.5pF* K = ±10%

F = ±1%* M = ±20%

G = ±2%*

* Contact KEMET Sales for availability.

Voltage

C = 500V G = 2000V

D = 1000V Z = 2500V

F = 1500V H = 3000V

Temperature Characteristic

Designated by Capacitance

Change over Temperature Range

G – (C0G) (±30ppm/C) (-55°C +125°C)

R – X7R (±15%) (-55°C +125°C)

End Metallization

C = Standard

Failure Rate Level

A = Not Applicable

Capacitor Ordering Information

Property Specification

Capacitance

C0G: 1 pF to 0.010 µF

X7R: 10 pf to 0.22 µF

25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)

Cap Tolerance C0G: C*, D*, F*, G*, J, K, M * Contact KEMET Sales for availability.

X7R: J, K, M

DF C0G: 0.1% Max

X7R: 2.5% Max

Voltage Ratings 500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V

Operating Temperature Range From -55C to +125C

25ºC IR @ 500V 100 GΩor 1000 MΩ-µF, whichever is less

125ºC IR @ 500V 10 GΩor 100 MΩ-µF, whichever is less

-55ºC TCC

+125ºC TCC

X7R: + 15%

C0G: + 30 ppm / ºC

Dielectric Strength 150% of Rated Voltage for Rated Voltage <1000 V

120% of Rated Voltage for Rated Voltage >=1000V

Ripple Current Consult KEMET Sales Representative

Electrical Parameters

Marking

These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.

Packaging

KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk

Soldering Process

The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and

larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of

pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of

Recommended Solder Pad Dimensions

the termination.

bag as outlined on page 83. Please consult factory for waffle packaging options.

Details on the marking format is located on page 97.

mm in. mm in. mm in. mm in.

0805 3.30 0.130 0.70 0.028 1.60 0.063 1.30 0.051

1206 4.50 0.177 1.50 0.059 2.00 0.079 1.50 0.059

1210 4.50 0.177 1.50 0.059 2.90 0.114 1.50 0.059

1808 5.90 0.232 2.30 0.091 2.40 0.094 1.80 0.071

1812 5.90 0.232 2.30 0.091 3.70 0.146 1.80 0.071

1825 5.90 0.232 2.30 0.091 6.90 0.272 1.80 0.071

2220 7.00 0.276 3.30 0.130 5.50 0.217 1.85 0.073

2225 7.00 0.276 3.30 0.130 6.80 0.268 1.85 0.073

L (Pad Length)

Chip Size T (Total Length) S (Separation W (Pad Width)

From -55ºC to +125ºC

CAPACITOR ORDERING INFORMATION

ELECTRICAL PARAMETERS

MARKING

PACKAGING

SOLDERING PROCESS

RECOMMENDED SOLDER PAD DIMENSIONS

Style

Chip Size

Specification

Capacitance Code, pF

Capacitance Tolerance Voltage

Temperature Characteristic

Failure Rate Level

End Metallization

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

KEMET offers Multilayer Ceramic Chip Capacitors

packaged in 8mm and 12mm plastic tape on 7" and

13" reels in accordance with EIA standard 481-1:

Taping of surface mount components for automatic

handling. This packaging system is compatible with all

tape

fed

automatic

pick

and

place

systems. See page 78

for details on reeling quantities for commercial chips

and page 87 for MIL-PRF-55681 chips.

CERAMIC CHIP CAPACITORS

Packaging Information

Tape & Reel Packaging

8mm ±.30

(.315 ±.012")

12mm ±.30

(.472 ±.012")

178mm (7.00")

330mm (13.00")

Anti-Static Reel

Embossed Carrier*

0402 and 0603 case sizes

available on punched paper only.

Embossment

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

Chip Orientation

in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

* Punched paper carrier used for 0402 and 0603 case size.

handling. This packaging system is compatible with all

tape

fed

automatic

pick

and

place

systems. See page 81

for details on reeling quantities for commercial chips

and page 90 for MIL-PRF-55681 chips.

KEMET

Grid

placement

courtyard Z

2.14

2.78

3.30

4.50

5.90

7.00

0.28

0.68

0.70

1.50

2.30

3.30

0.74

1.08

1.60

2.00

2.90

3.70

6.90

5.50

6.80

Y(ref)

0.93

1.05

1.30

1.50

1.80

1.85

C(ref)

1.21

1.73

2.00

3.00

4.10

5.15

3.18

3.70

4.90

0.68

0.70

1.50

0.80

1.10

1.40

2.00

Y(ref)

1.25

1.50

1.70

Smin

1.93

2.20

3.20

Wave SolderReflow Solder

Calculation Formula

Z = Lmin + 2Jt + Tt

G = Smax - 2Jh -Th

X = Wmin + 2Js + Ts

Tt, Th, Ts = Combined tolerances

0402

0603

0805

1206

1210

1812

1825

2220

2225

Dimension

Not Recommended

Grid

Placement

Courtyard

SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM

Packaging

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 Newton to 1.0 Newton (10g to 100g)

12 mm 0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165to 180from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 ±10 mm/minute.

3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration: Figure 1

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A0,B0,and K0shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)

Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size D0EP

0P2T Max T1Max

8 mm 1.5 1.75 ±0.10 4.0 ±0.10 2.0 ±0.05 0.600 0.100

and +0.10 -0.0

12 mm (0.059 (0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002) (0.024) (0.004)

+0.004, -0.0)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch B1Max. D1Min. F P1R Min. T2Max W A0B0K0

Note 1 Note 2 Note 3 Note 4

8 mm Single 4.4 1.0 3.5 ±0.05 4.0 ±0.10 25.0 2.5 8.0 ±0.30

(4 mm)

(0.173) (0.039) (0.138 ±0.002) (0.157 ±0.004) (0.984) (0.098) (.315 ±0.012)

12 mm Double 8.2 1.5 5.5 ±0.05 8.0 ±0.10 30.0 4.6 12.0 ±0.30

(8 mm) (0.323) (0.059) (0.217 ±0.002) (0.315 ±0.004) (1.181) (0.181) (0.472 ±0.012)

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

Embossed Carrier Tape Configuration (cont.)

Sketch D: Tape Camber (Top View)

Allowable camber to be 1 mm/250 mm.

250mm (9.843)

1mm (0.039) Max.

Table 2 – REEL DIMENSIONS (Metric will govern)

Figure 3: Reel Dimensions (Metric Dimensions will govern)

Tape Size A Max B* Min C D* Min N Min W1W2Max W3

8 mm 330.0 1.5 13.0 ± 0.20 20.2 50.0 8.4 14.4 7.9 Min

(12.992) (0.059) (0.512 ± 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311)

See (0.331 10.9 Max

Note 3 +0.059, -0.0) (0.429)

12 mm 330.0 1.5 13.0 ± 0.20 20.2 Table 1 12.4 18.4 11.9 Min

(12.992) (0.059) (0.512 ± 0.008) (0.795) +2.0, -0.0 (0.724) (0.469)

(0.488 15.4 Max

+0.078, -0.0) (0.606)

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Figure 2:

Tape Leader

& Trailer

Dimensions

(Metric

Dimensions

Will Govern)

400mm (15.75) Min.

20°

Packaging

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

20°

Maximum

component rotation.

Typical

component

center line

Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):

Table 1: 8 & 12mm Punched Tape

(Metric Dimensions Will Govern)

Variable Dimensions - Millimeters (Inches)

Note:

1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the

body and/or the body dimensions of the component. The clearance between the ends of the terminals or

body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)

minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component

within the cavity of not more than 20 degrees (see sketches A and B).

2. Tape with components shall pass around radius "R" without damage.

3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.

8mm

and

12mm

1.5

+0.10, -0.0

(.059

+0.004, -0.0)

1.75 ±0.10

(.069 ±0.004)

4.0 ± 0.10

(.157 ± 0.004)

2.0 ± 0.05

(.079 ± 0.002)

0.10

(.004)

Max.

0.75

(.030)

Min.

0.75

(.030)

Min.

25 (.984)

See Note 2

Table 1

Tape

Size D0P0

EP2T1G1G2R Min.

8mm

1/2

Pitch

2.0 ± 0.10

(.079 ±.004)

See Require-

ments

Section 3.3 (d)

3.5 ± 0.05

(.138 ± .002)

8.0 ± 0.3

(.315 ± 0.012)

See Note 1

Table 1

1.1mm (.043)

Max. for Paper

Base Tape and

1.6mm (.063)

Max. for Non-

Paper Base

Compositions.

See Note 3.

Tape

Size P1W

FA0B0T

8mm 4.0 ± 0.10

(0.157 ± .004)

12mm 4.0 ± 0.10

(0.157 ± .004)

12mm

Double

Pitch

8.0 ± 0.10

(0.315 ± .004)

12.0 ± 0.3

(.472 ± .012)

5.5 ± 0.05

(.217 ± .002)

Table 1: 8 & 12mm Punched Tape

(Metric Dimensions Will Govern)

Constant Dimensions - Millimeters (Inches)

Sketch B:

Max. Component

Rotation - Front

Cross Sectional View

Sketch C:

Component Rotation - Top View

Center lines

of cavity

10 pitches cumulative

tolerance on tape

±0.2 (±0.008)

Top

Tape

Cover

User Direction of Feed

Max. Cavity Size

See Note 1

Table 1

Bottom

Tape

Cover

(Min.)

Sketch A:

Bending Radius

See Note 2

Table 1

CERAMIC CHIP CAPACITORS

Packaging Information

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

CERAMIC CHIP CAPACITORS

Packaging Information

CAPACITOR MARKING TABLE

(Marking Optional - Not Available

for 0402 Size or Y5V Dielectric)

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1000

1100

1200

1300

1500

1600

1800

2000

2200

2400

2700

3000

3300

3600

3900

4300

4700

5100

5600

6200

6800

7500

8200

9100

2500

3500

4000

4500

5000

6000

7000

8000

9000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000

110,000

120,000

130,000

150,000

160,000

180,000

200,000

220,000

240,000

270,000

300,000

330,000

360,000

390,000

430,000

470,000

510,000

560,000

620,000

680,000

750,000

820,000

910,000

250,000

350,000

400,000

450,000

500,000

600,000

700,000

800,000

900,000

Alpha

Character

Numeral

901 2 3 4 5

Capacitance (pF) For Various Numeral Identifiers

1,000,000

1,100,000

1,200,000

1,300,000

1,500,000

1,600,000

1,800,000

2,000,000

2,200,000

2,400,000

2,700,000

3,000,000

3,300,000

3,600,000

3,900,000

4,300,000

4,700,000

5,100,000

5,600,000

6,200,000

6,800,000

7,500,000

8,200,000

9,100,000

2,500,000

3,500,000

4,000,000

4,500,000

5,000,000

6,000,000

7,000,000

8,000,000

9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

Laser marking is available as an extra-cost option for

most KEMET ceramic chips. Such marking is two

sided, and includes a K to identify KEMET, followed by

two characters (per EIA-198 - see table below) to

identify the capacitance value. Note that marking is

not available for size 0402 nor for any Y5V chip. In

addition, the 0603 marking option is limited to the K

only.

Example shown is 1,000 pF capacitor.

KA3

Table 2 – Capacitance Values Available

In Bulk Cassette Packaging

0402

0603

0805

All

C0G

X7R

Y5V

All

109

221

104

All

181

331

102

392

103

273

104

224

Case

Size Dielectric Voltage

Min.

Cap

Value

Max.

Cap

Value

All

200

100

200

100

Terminations: KEMET nickel barrier layer with a tin overplate.

0.3

0.7

0.75

EIA

Size

Code

Length

Width

Thickness

Bandwidth

Minimum

Separation

Metric

Size

Code

Number of

Pcs/Cassette

50,000

15,000

10,000

0402

0603

0805

1.0 ± 0.05

1.6 ± 0.07

2.0 ± 0.10

0.5 ± 0.05

0.8 ± 0.07

1.25 ± 0.10

0.5 ± .05

0.8 ± .07

0.6 ± .10

0.2 to 0.4

0.2 to 0.5

0.5 to 0.75

1005

1608

2012

Table 1 – Capacitor Dimensions for Bulk

Cassette Packaging – Millimeters

Unit: mm

* Reference

110 ± 0.7

31.5 ±0

0.2

36 ±0

0.2

19.0*

5.0*

10*

53.3*

6.8 ± 0.1

8.8 ± 0.1

12.0 ± 0.1

3.0 ±0

0.2

2.0 ±0.1

1.5 ±0

0.1

Bulk Cassette Packaging (Ceramic Chips only)

(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)

Packaging