PTVS6V5P1UP,115 - NXP Semiconductors

1. Product profile

1.1 General description

600 W unidirectional T ransient Voltage Suppr essor (TVS) in a SOD128 small and flat lead

Surface-Mounted Device (SMD) plastic package, designed for tra nsient overvoltage

protection.

1.2 Features and benefits

1.3 Applications

Power supply protection

Automotive application

Industrial application

Power management

1.4 Quick reference data

[1] In accordance with IEC 61643-321 (10/1000 μs current waveform).

PTVSxP1UP series

600 W Transient Voltage Suppressor

Rev. 2 — 6 January 2011 Product data sheet

Rated peak puls e po we r: PPPM = 600 W Very low package height: 1 mm

Reverse standoff voltage range:

VRWM =3.3Vto64V

Small plastic package suitable for

surface-mounted design

Reverse current: IRM =0.001μAAEC-Q101 qualified

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

PPPM rated peak pulse power [1] --600W

VRWM reverse standoff voltage 3.3 - 64 V

Product data sheet Rev. 2 — 6 January 2011 2 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

[1] The series consists of 35 types with reverse standoff voltages from 3.3 V to 64 V.

4. Marking

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode 12

sym035

Table 3. Ordering i nformation

Type number[1] Package

Name Description Version

PTVSxP1UP series - plastic surface-mounted package; 2 leads SOD128

Table 4. Marking codes

Type number Marking code Type number Marking code

PTVS3V3P1UP AJ PTVS20VP1UP B3

PTVS5V0P1UP AK PTVS22VP1UP B4

PTVS6V0P1UP AL PTVS24VP1UP B5

PTVS6V5P1UP AM PTVS26VP1UP B6

PTVS7V0P1UP AN PTVS28VP1UP B7

PTVS7V5P1UP AP PTVS30VP1UP B8

PTVS8V0P1UP AQ PTVS33VP1UP B9

PTVS8V5P1UP AR PTVS36VP1UP BA

PTVS9V0P1UP AS PTVS40VP1UP BB

PTVS10VP1UP AT PTVS43VP1UP BC

PTVS11VP1UP AU PTVS45VP1UP BD

PTVS12VP1UP AV PTVS48VP1UP BE

PTVS13VP1UP AW PTVS51VP1UP BF

PTVS14VP1UP AX PTVS54VP1UP BG

PTVS15VP1UP AY PTVS58VP1UP BH

PTVS16VP1UP AZ PTVS60VP1UP BJ

PTVS17VP1UP B1 PTVS64VP1UP BK

PTVS18VP1UP B2 - -

Product data sheet Rev. 2 — 6 January 2011 3 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

5. Limiting values

[1] In accordance with IEC 61643-321 (10/1000 μs current waveform).

[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses.

[2] Soldering point of cathode tab.

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[4] Soldering point of cathode tab.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power [1] -600W

IPPM rated peak pulse current [1] -see

Table 9

and 10

IFSM Non-repetitive peak

forward current single half-sine

wave; tp=8.3ms -100A

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. ESD maximum ratings

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Max Unit

Per diode

VESD electrostatic discharge voltage IEC 61000-4-2

(contact discharge) [1][2] -30kV

Table 7. ESD standards compliance

Standard Conditions

Per diode

IEC 61000-4-2; level 4 (ESD) > 1 5 kV (air); > 8 kV (contact)

MIL-STD-883; class 3 (human body model) > 4 kV

Table 8. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --200K/W

[2] --120K/W

[3] --60K/W

Rth(j-sp) thermal resistance from

junction to solder point [4] --12K/W

Product data sheet Rev. 2 — 6 January 2011 4 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

7. Characteristics

Table 9. Characteristics per type; PTVS3V3P1UP to PTVS7V0P1UP

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=10mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

PTVS3V3P1UP 3.3 5.20 5.60 6.00 5 600 8.0 75.0

PTVS5V0P1UP 5.0 6.40 6.70 7.00 5 400 9.2 65.2

PTVS6V0P1UP 6.0 6.67 7.02 7.37 5 400 10.3 58.3

PTVS6V5P1UP 6.5 7.22 7.60 7.98 5 250 11.2 53.6

PTVS7V0P1UP 7.0 7.78 8.20 8.60 3 100 12.0 50.0

Table 10. Characteristics per type; PTVS7V5P1UP to PTVS64VP1UP

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=1mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

PTVS7V5P1UP 7.5 8.33 8.77 9.21 0.2 50 12.9 46.5

PTVS8V0P1UP 8.0 8.89 9.36 9.83 0.03 25 13.6 44.1

PTVS8V5P1UP 8.5 9.44 9.92 10.40 0.01 10 14.4 41.7

PTVS9V0P1UP 9.0 10.00 10.55 11.10 0.005 5 15.4 39.0

PTVS10VP1UP 10 11.10 11.70 12.30 0.005 2.5 17.0 35.3

PTVS11VP1UP 11 12.20 12.85 13.50 0.005 2.5 18.2 33.0

PTVS12VP1UP 12 13.30 14.00 14.70 0.005 2.5 19.9 30.2

PTVS13VP1UP 13 14.40 15.15 15.90 0.001 0.1 21.5 27.9

PTVS14VP1UP 14 15.60 16.40 17.20 0.001 0.1 23.2 25.9

PTVS15VP1UP 15 16.70 17.60 18.50 0.001 0.1 24.4 24.6

PTVS16VP1UP 16 17.80 18.75 19.70 0.001 0.1 26.0 23.1

PTVS17VP1UP 17 18.90 19.90 20.90 0.001 0.1 27.6 21.7

PTVS18VP1UP 18 20.00 21.00 22.10 0.001 0.1 29.2 20.5

PTVS20VP1UP 20 22.20 23.35 24.50 0.001 0.1 32.4 18.5

PTVS22VP1UP 22 24.40 25.60 26.90 0.001 0.1 35.5 16.9

PTVS24VP1UP 24 26.70 28.10 29.50 0.001 0.1 38.9 15.4

PTVS26VP1UP 26 28.90 30.40 31.90 0.001 0.1 42.1 14.3

PTVS28VP1UP 28 31.10 32.80 34.40 0.001 0.1 45.4 13.2

PTVS30VP1UP 30 33.30 35.10 36.80 0.001 0.1 48.4 12.4

PTVS33VP1UP 33 36.70 38.70 40.60 0.001 0.1 53.3 11.3

PTVS36VP1UP 36 40.00 42.10 44.20 0.001 0.1 58.1 10.3

PTVS40VP1UP 40 44.40 46.80 49.10 0.001 0.1 64.5 9.3

Product data sheet Rev. 2 — 6 January 2011 5 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

PTVS43VP1UP 43 47.80 50.30 52.80 0.001 0.1 69.4 8.6

PTVS45VP1UP 45 50.00 52.65 55.30 0.001 0.1 72.7 8.3

PTVS48VP1UP 48 53.30 56.10 58.90 0.001 0.1 77.4 7.8

PTVS51VP1UP 51 56.70 59.70 62.70 0.001 0.1 82.4 7.3

PTVS54VP1UP 54 60.00 63.15 66.30 0.001 0.1 87.1 6.9

PTVS58VP1UP 58 64.40 67.80 71.20 0.001 0.1 93.6 6.4

PTVS60VP1UP 60 66.70 70.20 73.70 0.001 0.1 96.8 6.2

PTVS64VP1UP 64 71.10 74.85 78.60 0.001 0.1 103.0 5.8

Table 10. Characteristics per type; PTVS7V5P1UP to PTVS64VP1UP …continued

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=1mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

Product data sheet Rev. 2 — 6 January 2011 6 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

Fig 1. 10/1000 μs pulse waveform according to

IEC 61643-321 Fig 2. Relative variation of rated peak pulse power as

a function of junction temperature; typical

values

Tamb =25°CT

amb =25°C; f = 1 MHz

(1) PTVS5V0P1UP

(2) PTVS12VP1UP

(3) PTVS24VP1UP

(4) PTVS64VP1UP

Fig 3. Rat ed pe ak pu lse powe r as a func tion of p ulse

duration; typical values Fig 4. Diode capacitance as a function of reverse

voltage; typical values

tp (ms)

0 4.03.01.0 2.0

006aab319

100

150

IPP

(%)

50 % IPP; 1000 μs

100 % IPP; 10 μs

(°C)

0 20015050 100

006aab321

0.4

0.8

1.2

PPM

PPM(25°C)

006aac172

104

103

105

PPPM

(W)

102

tp (μs)

10−1104

103

110

006aac173

103

102

104

(pF)

VR (V)

110

(1)

(2)

(3)

(4)

Product data sheet Rev. 2 — 6 January 2011 7 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

9. Package outline

Fig 5. V-I characteristics for a unidirectional TVS protection di ode

006aab32

−V

RWM

−I

P-N

−+

−I

PPM

Fig 6. Package outline SOD128

07-09-12Dimensions in mm

1.1

0.9

0.22

0.10

0.6

0.3

5.0

4.4

4.0

3.6

1.9

1.6

2.7

2.3

Product data sheet Rev. 2 — 6 January 2011 8 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

[2] The series consists of 35 types with reverse standoff voltages from 3.3 V to 64 V.

11. Soldering

Table 11. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number[2] Package Description Packing quantity

3000

PTVSxP1UP series SOD128 4 mm pitch, 12 mm tape and reel -115

Reflow soldering is the only recommended soldering method.

Fig 7. Reflow soldering footprint SOD128

solder lands

solder resist

occupied area

solder paste

2.53.4 2.1

(2×)

1.9

(2×)

4.4

4.2

6.2

1.2

(2×)

1.4

(2×)sod128_

Dimensions in mm

Product data sheet Rev. 2 — 6 January 2011 9 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

12. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PTVSXP1UP_SER v.2 20110106 Product data sheet - PTVSXP1UP_SER v.1

Modifications: •Table 6 “ESD maximum ratings”: added.

•Section 13 “Legal information”: updated.

PTVSXP1UP_SER v.1 20100527 Product data sheet - -

Product data sheet Rev. 2 — 6 January 2011 10 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information se e the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

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profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

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contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings onl y and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms an d conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

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other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 6 January 2011 11 of 12

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PTVSxP1UP series

600 W Transient Voltage Suppressor

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 January 2011

Document identifier: PTVSXP1UP_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Te st information. . . . . . . . . . . . . . . . . . . . . . . . . 7

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 8

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12