SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 1 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
3.5x2.8mm SURFACE MOUNT LED LAMP
Part Number: AA3528QBS/D-AMT Blue
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4.The device has a single mounting surface. The device must be mounted according to the specifications.
Features
zIndustry standard PLCC-2 package.
zHigh reliability LED package.
zWide viewing angle.
zSingle color.
zSuitable for all SMT assembly and solder process.
zAvailable on tape and reel.
z Ideal for backlighting.
zPackage : 2000pcs / reel.
zMoisture sensitivity level : level 3.
zRoHS compliant.
Applications
zTraffic signaling.
zBacklighting (illuminated advertising , general lighting).
zInterior and exterior automotive lighting.
zSubstitution of micro incandescent lamps.
zReading lamps.
zSignal and symbol luminaire for orientation.
zMarker lights (e.g. Steps, exit ways, etc).
zDecorative and entertainment lighting.
zIndoor and outdoor commercial and residential
architectural lighting.
Description
The Blue source color devices are made with InGaN Light
Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 2 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
All design applications should refer to Kingbright application notes available at
http://www.KingbrightUSA.com/ApplicationNotes
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 3 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
Selection Guide
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards.
Part No. Dice Lens Type
Iv (mcd) [2]
@ 20mA
V
iewing
Angle [1]
Code. Min. Max. 2θ1/2
AA3528QBS/D-AMT Blue (InGaN) Water Clear 120°
M 80 120
N 120 200
P 200 300
Parameter Symbol
Value
Unit
Code. Min. Typ. Max.
Wavelength at peak emission IF=20mA λpeak 468 *460 nm
Dominant Wavelength IF=20mA λ dom [1]
1B 461 468
nm
2A 464 471
2B 467 473
3A 469 475
3B 471 477
Reverse Current (VR = 5V) IR 50 uA
Spectral bandwidth at 50%ΦREL MAX IF=20mA Δλ 25 nm
Forward Voltage IF=20mA VF [2] - 3.3 4.0 V
Temperature coefficient of λpeak
IF=20mA, -10 °C T100 °C TC λpeak 0.05 nm/°C
Temperature coefficient of λdom
IF=20mA, -10 °C T100 °C TC λdom 0.03 nm/°C
Temperature coefficient of VF
IF=20mA, -10 °C T100 °C TCV mV/°C
-2.5
Notes:
1.The dominant Wavelength (λ d) above is the setup value of the sorting machine. (Tolerance λ d : ±1nm. )
2. Forward Voltage: +/-0.1V.
* Wavelength value is traceable to the CIE127-2007 compliant national standards.
Notes:
1. Rth(j-a) Results from mounting on PC board FR4 (pad size16 mm2 per pad),
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Value Unit
Power dissipation PD 120 mW
Junction temperature TJ 110 °C
Operating Temperature Top -40 To +10 0 °C
Storage Temperature Ts tg -40 To +11 0 °C
DC Forward Current[1] IF 30 mA
Peak Forward Current [2] IFM 150 mA
Electrostatic Discharge Threshold (HBM) 250 V
Thermal Resistance (Junction/ambient) [1] Rth j-a 250 °C/W
Reverse Voltage VR 5 V
Electrical / Optical Characteristics at Ta=25°C
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 4 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
Blue AA3528QBS/D-AMT
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 5 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
AA3528QBS/D-AMT
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications
(Units : mm) Reel Dimension
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 6 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
PACKING & LABEL SPECIFICATIONS AA3528QBS/D-AMT
SPEC NO: DSAL3987 REV NO: V.2A DATE: SEP/01/2012 PAGE: 7 OF 7
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: C.H.HAN ERP: 1201006709
Failure Criteria
Items Symbols Conditions Failure Criteria
luminous Intensity lv IF = 20mA Testing Min. Value <Spec.Min.Value x 0.5
Forward Voltage VF IF = 20mA Testing Max. Value Spec.Max.Value x 1.2
Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value Spec.Max.Value x 2.5
High temp. storage test - - Occurrence of notable decoloration, deformation
and cracking
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
No. Test Item Standards Test Condition Test Times /
Cycles
Number of
Damaged
1 Continuous operating test - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22
2 High Temp. operating test EIAJED-
4701/100(101) Ta = 100°C IF = maximum rated current* 1,000 h 0 / 22
3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22
4 High temp. storage test EIAJED-
4701/100(201) Ta = maximum rated storage temperature 1,000 h 0 / 22
5 Low temp. storage test EIAJED-
4701/100(202) Ta = -40°C 1,000 h 0 / 22
6 High temp. & humidity storage test - Ta = 60°C, RH = 90% 500 h 0 / 22
7 High temp. & humidity operating test - Ta = 60°C, RH = 90%
IF = maximum rated current* 500 h 0 / 22
8 Soldering reliability test EIAJED-
4701/100(301)
Moisture soak : 30°C,70% RH, 72h
Preheat : 150~180°C(120s max.)
Soldering temp : 260°C(10s)
2 times 0 / 18
9 Thermal shock operating test - Ta = -40°C(15min) ~ 100°C(15min)
IF = derated current at 100°C 1,000 cycles 0 / 22
10 Thermal shock test - Ta = -40°C(15min) ~ maximum rated
storage temperature(15min) 1,000 cycles 0 / 22
11 Electric Static Discharge (ESD) EIAJED-
4701/100(304) C = 100pF , R2 = 1.5K V = 250V Once each
Polarity 0 / 22
12 Vibration test - a = 196m/s² , f = 100~2KHz ,
t = 48min for all xyz axes 4 times 0 / 22
* : Refer to forward current vs. derating curve diagram