PCF8583T/5,518-CUT TAPE\"\" - NXP SEMICONDUCTORS

1. General description

The PCF8583 is a clock and calendar chip, based on a 2048 bit static CMOS1 RAM

organized as 256 words by 8 bits. Addresses and data are transferred serially via the

two-line bidirectional I2C-b us. The built-in word address register is incremented

automatically after each written or read data byte. Ad dress pin A0 is used for

programming the hardware address, allowing the connection of two devices to the bus

without additional hardware.

The built-in 32.768 kHz oscillator circuit and the first 8 bytes of the RAM are used for the

clock, calendar, and counter functions. The next 8 bytes can be programmed as alarm

registers or used as free RAM space. The remaining 240 bytes are free RAM locations.

2. Features and benefits

I2C-bus interface operating supply voltage: 2.5 V to 6 V

Clock operating supply voltage 1.0 V to 6.0 V at 0 °Cto+70°C

240 ×8-bit low-voltage RAM

Data retention voltage: 1.0 V to 6.0 V

Operating current (at fSCL = 0 Hz): max 50 μA

Clock function with four year calendar

Universal timer with alarm and overflow indication

24 hour or 12 hour format

32.768 kHz or 50 Hz time base

Serial input and output bus (I2C-bus)

Automatic word address incrementing

Programmable alarm, timer, and interrupt function

Slave addresses: A1h or A3h for reading, A0h or A2h for writing

PCF8583

Clock and calendar with 240 x 8-bit RAM

Rev. 06 — 6 October 2010 Product data sheet

1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 14.

Product data sheet Rev. 06 — 6 October 2010 2 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

3. Ordering information

4. Marking

5. Block diagram

Table 1. Ordering information

Type number Package

Name Description Version

PCF8583P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

PCF8583T SO8 plastic small outline package; 8 leads;

body width 7.5 mm SOT176-1

PCF8583BS HVQFN20 plastic thermal enhanced very thin quad flat package;

no leads; 20 terminals; body 5 × 5 × 0.85 mm SOT662-1

Table 2. Marking codes

Type number Marking code

PCF8583P PCF8583P

PCF8583T 8583T

PCF8583BS 8583S

Fig 1. Block diagram of PCF8583

013aaa36

PCF8583

OSCI

OSCO

INT

VDD

VSS

SCL

SDA

OSCILLATOR

POWER-ON

RESET

I2C-BUS

INTERFACE

DIVIDER

CONTROL

LOGIC

ADDRESS

00h

01h

02h

03h

04h

05h

06h

07h

FFh

control/status

hundredth second

seconds

minutes

hours

year/date

weekdays/months

timer

alarm or RAM

RAM

(240 x 8 bit)

08h

0Fh

alarm control

Product data sheet Rev. 06 — 6 October 2010 3 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

6. Pinning information

6.1 Pinning

Top view. For mechanical details, see Figure 24.

Fig 2. Pin co nfi gura tio n for DIP8 (PCF85 83P )

Top view. For mechanical details, see Figure 25.

Fig 3. Pin configuration for SO8 (PCF8583T)

For mechanical details, see Figure 26.

Fig 4. Pin configuration for HVQFN20 (PCF8583BS)

PCF8583P

OSCI VDD

OSCO INT

A0 SCL

VSS SDA

013aaa366

PCF8583T

OSCI VDD

OSCO INT

A0 SCL

VSS SDA

013aaa367

013aaa36

PCF8583BS

Transparent top view

n.c.

VSS

SDA

OSCO SCL

OSCI INT

n.c. VDD

n.c.

5 11

4 12

3 13

2 14

1 15

terminal 1

index area

Product data sheet Rev. 06 — 6 October 2010 4 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

6.2 Pin description

[1] The die paddle (exposed pad) is connected to VSS and should be electrically isolated.

Table 3. Pin description

Symbol Pin Type Description

DIP8

(PCF8583P) SO8

(PCF8583T) HVQFN20

(PCF8583BS)

OSCI 1 1 2 input oscillator input, 50 Hz or event-pu l s e

input

OSCO 2 2 3 output oscillator output

A0 3 3 4 input address input

VSS 445

[1] supply ground supply voltage

SDA 5 5 12 input/output serial data line

SCL 6 6 13 input serial clock line

INT 7 7 14 output open-drain interrupt output (active LOW)

VDD 8 8 15 supply supply voltage

n.c. - - 1, 6 to 11, 16 to

20 - not connected; do not connect and do not

use as feed through

Product data sheet Rev. 06 — 6 October 2010 5 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7. Functional description

The PCF8583 contains a 256 by 8 bit RAM with an 8 bit auto-increment address register,

an on-chip 32.768 kHz oscillator circuit, a frequency divider, a serial two-line bidirectional

I2C-bus interface , an d a Pow e r-On Reset (POR) circuit.

The first 16 bytes of the RAM (memory addresses 00h to 0Fh) are designed as

addressable 8 bit parallel special function registers. The first register (memory

address 00h) is used as a control and status register. The memory addresses 01h to 07h

are used as counters for the clock function. The memory addresses 08h to 0Fh may be

programmed as alar m registers or used as free RAM locations, when the alarm is

disabled.

7.1 Counter function modes

When the control and status register is programmed, a 32.768 kHz clock mode, a 50 Hz

clock mode or an event-counter mode ca n be selected.

In the clock modes the hundredths of a second, seconds, minutes, hours, date, month

(four year calen d ar ) and we ekday are store d in a Bina ry Coded Decimal (BCD) format.

The timer register stores up to 99 days. The event counter mode is used to count pulses

applied to the oscillator input (OSCO left open-circuit). The event counter stores up to 6

digits of data.

When one of the counters is read (memory locations 01h to 07h), the contents of all

counters are strobed into capture latches at the beginning of a read cycle. Therefore,

faulty reading of the counter during a carry condition is prevented.

When a counter is written, other counters are not affected.

7.2 Alarm function modes

By setting the alarm enable bit of the control and status register the alarm contro l register

(address 08h) is activated.

By setting the alarm control register, a dated alarm, a daily alarm, a weekday alarm, or a

timer alarm may be programmed. In the clock modes, the timer register (address 07h)

may be programmed to count hundredths of a second, seconds, minutes, hours, or days.

Days are counted wh en an ala rm is not pro gr am m ed.

Whenever an alarm even t o ccu rs the alarm flag of the co ntrol and status r egister is set. A

timer alarm event will set the alarm flag and an overflow condition of the timer will set the

timer flag. The open- drain inter rupt output is switched o n (active LOW) when the a larm or

timer flag is set (enabled). The flags remain set until directly reset by a write operation.

When the alarm is disabled (bit 2 of control and status register set logic 0) the alarm

registers at addresses 08h to 0Fh may be used as free RAM.

Product data sheet Rev. 06 — 6 October 2010 6 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.3 Control and status register

The control and status register is defined as the memory location 00h with free access for

reading and writin g via th e I 2C-bus. All functions and options are controlled by the

contents of the control and status register (see Figure 5).

Fig 5. Control and status register

timer flag:

alarm flag:

alarm enable bit:

mask flag:

function mode:

hold last count flag:

logic 0:

logic 1:

stop counting flag:

logic 0:

logic 1:

76543210

MSB LSB

013aaa370

memory location 00h

reset state: 0000 0000

alarm disabled: flags toggle

alarm control register to disabled

(memory locations 08h to 0Fh

are free RAM space)

logic 1: enable alarm control register

(memory location 08h is the

alarm control register)

logic 0: read locations 05h to 06h

unmasked

logic 1: read date and month count

directly

50 % duty factor

seconds flag if alarm enable bit

is logic 0

50 % duty factor

minutes flag if alarm enable bit

is logic 0

logic 0:

clock mode 32.768 kHz

clock mode 50 Hz

event-counter mode

test modes

store and hold last count in

capture latches

count

count pulses

stop counting, reset divider

Product data sheet Rev. 06 — 6 October 2010 7 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.4 Counter registers

The format for 24 hour or 12 hour clock modes can be selected by setting the most

significant bit of the hours counter register. The format of the hours counter is shown in

Figure 6.

The year and date are stored in memory location 05h (see Figure 7). The weekdays and

months are in memory location 06h (see Figure 8).

When reading these memory locations the year and weekdays are masked out when the

mask flag of the control and status register is set. This allows the user to read the date

and month count directly. In the event-counter m ode, events are stored in BCD format. D5

is the most significant an d D0 the lea st significant digit. The divider is by-passed.

Fig 6. Format of the hours counter

Fig 7. Format of the year and date counter

Fig 8. Format of the weekdays and month counter

76543210

MSB LSB

013aaa371

memory location 04h (hours counter)

reset state: 0000 0000

unit place

ten's place (0 to 2 binary)

AM/PM flag:

logic 0: AM

logic 1: PM

format:

logic 0: 24 hour format, AM/PM flag remains unchanged

logic 1: 12 h format, AM/PM flag will be updated

hours in BCD format:

7 65 432 10

MSB LSB

013aaa372

unit place

ten's place (0 to 3 binary)

year (0 to 3 binary, read as logic 0

if the mask flag is set)

memory location 05h (year/date)

reset state: 0000 0001

days in BCD format:

76 543 210

MSB LSB

013aaa373

memory location 06h (weekdays/months)

reset state: 0000 0001

unit place

ten's place

weekdays (0 to 6 binary, read as logic 0

if the mask flag is set)

months in BCD format:

Product data sheet Rev. 06 — 6 October 2010 8 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

In the different modes the counter registers are programmed and arranged as shown in

Figure 9. Counter cycles are listed in Table 4.

Fig 9. Register arrangement

control/status

hundredth of a second

1/10 s

seconds

minutes

hours

year/date

weekdays/months

timer

10 s

10 min

10 h

10 day

10 month

10 day

1/100 s

1 s

1 min

1 h

1 day

1 month

1 day

alarm control

hundredth of a second alarm

1/10 s 1/100 s

alarm seconds

alarm minutes

alarm hours

alarm month

alarm timer

alarm date

control/status

free

timer

alarm control

alarm alarm

free

alarm timer

free RAM free RAM

00h

01h

02h

03h

04h

05h

06h

07h

08h

09h

0Ah

0Bh

0Ch

0Dh

0Eh

0Fh

CLOCK MODES EVENT COUNTER

013aaa369

Product data sheet Rev. 06 — 6 October 2010 9 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.5 Alarm control register

When the alarm enable bit of the co ntrol an d status register is set (add re ss 00 h, bit 2) the

alarm control register (addr ess 08h) is activated. All alarm, timer, and interrupt output

functions are controlled by the contents of the alarm control register (see Figure 10).

Table 4. Cycle length of the time counters, clock modes

Unit Counting cycle Carry to next unit Contents of month

calendar

hundredths of a second 00 to 99 99 to 00 -

seconds 00 to 59 59 to 00 -

minutes 00 to 59 59 to 00 -

hours (24) 00 to 23 23 to 00 -

hours (12) 12 am - -

01 am to 11 am - -

12 pm - -

01 pm to 11 pm 11 pm to 12 am -

date 01 to 31 31 to 01 1, 3, 5, 7, 8, 10, and 12

01 to 30 30 to 01 4, 6, 9, and 11

01 to 29 29 to 01 2, year = 0

01 to 28 28 to 01 2, year = 1, 2, and 3

months 01 to 12 12 to 01 -

year 0 to 3 - -

weekdays 0 to 6 6 to 0 -

timer 00 to 99 no carry -

Product data sheet Rev. 06 — 6 October 2010 10 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.6 Alarm registers

All alarm registers are allocated with a constant address offset of 08h to the

corresponding counter registers (see Figure 9).

An alarm signal is generated when th e content s of the alar m registers match bit-by-bit th e

contents of the involved counte r re g is te rs. The y ear an d week da y bits are igno re d in a

dated alarm. A daily alarm ignores the month and date bits. When a weekday alarm is

selected, the contents of the alarm weekday and month register selects the weekdays on

which an alarm is activated (see Figure 11).

Remark: In the 12 hour mode, bits 6 and 7 of the alarm hours register must be the same

as the hours counter.

Fig 10. Alarm control registers, clock mode

memory location 08h

reset state: 0000 0000

timer function:

timer interrupt enable:

clock alarm function:

timer alarm enable:

alarm interrupt enable:

7 654 321 0

MSB LSB

013aaa374

000

001

010

011

100

101

110

111

no timer

hundredths of a second

seconds

minutes

hours

days

not used

test mode, all counters

in parallel (factory use only)

timer flag, no interrupt

timer flag, interrupt

no clock alarm

daily alarm

weekday alarm

dated alarm

no timer alarm

timer alarm

(only valid when alarm enable in

the control and status register is set)

alarm flag, no interrupt

alarm flag, interrupt

Product data sheet Rev. 06 — 6 October 2010 11 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.7 Timer

The timer (location 07h) is enabled by setting the control and status register to

XX0X X1XX. The timer counts up from 0 (or a programmed value) to 99. On overflow, the

timer resets to 0. The timer flag (LSB of control and status register) is set on overflow of

the timer. This flag must be reset by software. The inverted value of this flag can be

transferred to the external interrupt by setting bit 3 of the alarm control register.

Additionally, a timer alarm can be programmed by setting the timer alarm enable (bit 6 of

the alarm control register). When th e value of the timer equals a pre-pr ogrammed value in

the alarm timer register (location 0Fh), the a larm flag is set (bit 1 of the control and status

by enabling the alarm interrupt (bit 6 of the alarm control register).

Resolution of the timer is programmed via the 3 LSBs of the alarm control register (see

Figure 12).

Fig 11. Selection of alarm weekdays

76543210

MSB LSB

013aaa375

memory location 0Eh (alarm_weekday/month)

weekday 0 enabled when set

weekday 1 enabled when set

weekday 2 enabled when set

weekday 3 enabled when set

weekday 4 enabled when set

weekday 5 enabled when set

weekday 6 enabled when set

not used

Product data sheet Rev. 06 — 6 October 2010 12 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

7.8 Event counter mode

Event counter m ode is selected by bit s 4 and 5 which are logic 10 in the control and st atus

oscillator input (OSCO left open-circuit).

The event counter stor es up to 6 digit s of dat a, which a re stor ed a s 6 hexadecimal valu es

located in the registers 1h, 2h, and 3h. Therefore, up to 1 million events may be recorded.

An event counter alarm occurs when the event counter registers match the value

programmed in the re gisters 9 h, Ah, a nd Bh, an d the even t alar m is ena bled ( bits 4 and 5

which are logic 01 in the alarm contr ol register). In this event, the alarm flag (bit 1 of the

control and status register) is set. The inverted value of this flag can be transferred to the

interrupt pin (pin 7) by setting the alarm interrupt enable in the alarm control register. In

(1) If the alarm enable bit of the control and status register is reset (logic 0), a 1 Hz signal is observed on the interrupt pin INT.

Fig 12. Alarm and timer interrupt logic diagram

INT

7 654 321 0 76543210

timer overflow

interrupt

alarm

interrupt

TIMERALARM

CLOCK/CALENDAR

MUX

timer

control

timer

alarm overflow

alarm

control

clock

alarm

counter

control

mode

select

oscillator

CONTROL/STATUS

ALARM CONTROL

013aaa377

Product data sheet Rev. 06 — 6 October 2010 13 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

this mode, the timer (location 07h) increments once for every one, one hundred, ten

thousand, or 1 million events, depending on the value programmed in bits 0, 1 and 2 of

the alarm control register. In all other events, the timer functions are as in the clock mode.

7.9 Interrupt output

The conditions for activating the output INT (active LOW) are determined by appropriate

programming of the alarm control register. These conditions are clock alarm, timer alarm,

timer overflow, and event counter alarm. An interrupt occurs when the alar m flag or the

timer flag is set, and th e co rre sp o ndi ng inte rr up t is enabled. In all events, the interrupt is

cleared only by software resetting of the flag which initiated the interrupt.

In the clock mode, if the alarm enable is not activated (alarm enable bit of the control and

status register is logic 0), the interrupt output toggles at 1 Hz with a 50 % duty cycle (may

be used for calibration). This is the de fault power-on st a te of the device. The OFF vo lt age

of the interrupt output may exceed the supply voltage, up to a maximum of 6.0 V. A logic

diagram of the interrupt output is shown in Figure 12.

7.10 Oscillator and divider

A 32.768 kHz quartz cryst al has to be connected to OSCI and OSCO. A trimmer cap acitor

between OSCI and VDD is used for tuning the oscillator (see Section 11.1). A 100 Hz clock

signal is derived from the quartz oscillator for the clock counters.

Fig 13. Alarm control register, event counter mode

memory location 08h

reset state: 0000 0000

timer function:

clock alarm function:

timer alarm enable:

alarm interrupt enable:

7 654 321 0

MSB LSB

013aaa376

000

001

010

011

100

101

110

111

no timer

units

100

10 000

1 000 000

not allowed

test mode, all counters

in parallel

timer interrupt enable:

timer flag, no interrupt

timer flag, interrupt

no event alarm

event alarm

not allowed

no timer alarm

timer alarm

alarm flag, no interrupt

alarm flag, interrupt

Product data sheet Rev. 06 — 6 October 2010 14 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

In the 50 Hz clock mode or event-counter mode the oscillator is disabled and the oscillator

input is switched to a high-impedance state. This allows the user to feed the 50 Hz

reference fr eq ue n cy or an ext er nal hig h spe e d ev en t si gnal into the input OSCI.

7.11 Initialization

When power-on occurs the I2C-bus interface, the control and status register and all clock

counters are reset. The device starts tim e-keepin g in the 32 .7 68 kHz clock mode with the

24 hour format on the first of January at 0.00.00:00. A 1 Hz square wave with 50 % duty

cycle appears at the interrupt output pin (start s HIGH).

The stop counting flag of the control and status register must be set before loading the

actual time into the counters. Loading of illegal states leads to a temporary clock

malfunction.

Product data sheet Rev. 06 — 6 October 2010 15 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

8. Characteristics of the I2C-bus

8.1 Characteristics

The I2C-bus is for bidirectional, two-line communication between different ICs or modules.

The two lines are a Serial DAt a line (SDA) and a Serial Clock Line (SCL). Both lines mu st

be connected to a positive supply via a pull-up re sistor . Dat a transfe r is initiated only when

the bus is not busy.

8.1.1 Bit transfer

One data bit is transferred during each clock pulse (see Figure 14). The data on the SDA

line must remain stable during the HIGH period of the clock pulse as changes in the data

line at this time are interpreted as a control signal.

8.1.2 Start and stop conditions

Both data and clock lines remain HIGH when the bus is not busy.

A HIGH-to-LOW transition of the dat a line while the clock is HIGH is defined as the START

condition - S.

A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP

condition - P (see Figure 15).

8.1.3 System configuration

A device generating a message is a transmitter; a device receiving a message is the

receiver (see Figure 16). The device that controls the message is the master; and the

devices which are controlled by the master are the slaves.

Fig 14. Bit transfer

mbc62

data line

stable;

data valid

change

of data

allowed

SDA

SCL

Fig 15. D e finition of start and stop c ond itions

mbc62

SDA

SCL

STOP condition

SDA

SCL

START condition

Product data sheet Rev. 06 — 6 October 2010 16 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

8.1.4 Acknowledge

The number of data bytes transf er re d be tween the START and STOP conditions from

transmitter to receiver is unlimited. Each byte of eight bits is followe d by an acknowledge

cycle.

•A slave receiver, which is addressed, must generate an acknowledge after the

reception of each byte.

•Also a master receiver must gener ate an acknowle dge after the reception of each

byte that has been clocked out of the slave transmitter.

•The device that acknowledges must pull-down the SDA line during the ac knowledge

clock pulse, so that the SDA line is stable LOW during the HIGH period of the

acknowledge related clock pulse (set-up and hold times must be taken into

consideration).

•A master receiver must signal an end of data to the transmitter by not generating an

acknowledge on the last byte that has been clocked out of the slave. In this event, the

transmitter must leave the data line HIGH to enable the master to generate a STOP

condition.

Acknowledgement on the I2C-bus is illustrated in Figure 17.

Fig 16. Sy stem co nfi gura tio n

mba60

MASTER

TRANSMITTER

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER

RECEIVER

SDA

SCL

Fig 17. Acknowledgement on the I2C-bus

mbc60

START

condition

9821

clock pulse for

acknowledgement

not acknowledge

acknowledge

data output

by transmitter

data output

by receiver

SCL from

master

Product data sheet Rev. 06 — 6 October 2010 17 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

8.2 I2C-bus protocol

8.2.1 Addressing

Before any data is transmitted on the I2C-bu s, th e de vice which must respond is

addressed first. The addressing is always carried out with the first byte transmitted after

the start procedure .

The clock and calendar act s as a slave receiver or slave tr ansmitter. The clock signal SCL

is only an input signal but the data signal SDA is a bidirectional line.

The clock and calendar slave address is shown in Table 5. Bit A0 corresponds to

hardware address pin A0. Connecting this pin to VDD or VSS allows the device to have on e

of two different addresses.

8.2.2 Clock and calendar READ or WRITE cycles

The I2C-bus configu ration for the dif ferent PCF 8583 READ and WRITE cycles is shown in

Figure 18, Figure 19 and Figure 20.

Table 5. I2C slave address byte

Slave address

Bit 7 6 5 4 3 2 1 0

MSB LSB

101000A0R/W

Fig 18. Master transmits to slave receiver (WRITE mode)

S0ASLAVE ADDRESS REGISTER ADDRESS A ADATA P

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

R/W

auto increment

memory register address

013aaa34

n bytes

Product data sheet Rev. 06 — 6 October 2010 18 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

(1) At this moment master transmitter becomes master receiver and PCF8583 slave receiver becomes slave transmitter.

Fig 19. Master reads after setting word address (write word ad dress; READ data)

S0A

SLAVE ADDRESS REGISTER ADDRESS A A

R/W

DATA

013aaa041

auto increment

memory register address

last byte

R/W

n bytes

(1)

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

acknowledgement

from slave

no acknowledgement

from master

auto increment

memory register address

SLAVE ADDRESS

DATA

Fig 20. Master reads slave immediately after first byte (READ mode)

S1A

SLAVE ADDRESS DATA A1DATA

acknowledgement

from slave

acknowledgement

from master

no acknowledgement

from master

R/W

auto increment

013aaa347

auto increment

n bytes last byte

Product data sheet Rev. 06 — 6 October 2010 19 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

9. Limiting values

[1] Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.

[2] Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”.

[3] Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).

[4] According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be

stored at a temperature of +8 °C to +45 °C and a humidity of 25 % to 75 %. For long term storage products

deviant conditions are described in that document.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage −0.8 +7.0 V

IDD supply current - 50 mA

ISS ground supply current - 50 mA

VIinput voltage −0.8 VDD + 0.8 V

IIinput current - 10 mA

IOoutput current - 10 mA

Ptot total power dissipation - 300 mW

Pooutput power - 50 mW

VESD electrostatic discharge

voltage HBM [1] -±3000 V

MM [2] -±200 V

Ilu latch-up current [3] - 100 mA

Tstg storage temperature [4] −65 +150 °C

Tamb ambient temperature operating device −40 +85 °C

Product data sheet Rev. 06 — 6 October 2010 20 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

10. Characteristics

10.1 Static characteristics

[1] Typical values measured at Tamb = 25 °C.

[2] When the device is powered on, VDD must exceed 1.5 V until the stable operation of the oscillator is established.

[3] Event counter mode: supply current dependant upon input frequency.

[4] See Figure 21.

[5] The I2C-bus logic is disabled if VDD < Ven.

[6] When the voltages are above or below the supply voltages VDD or VSS, an input current will flow; this current must not exceed ±0.5 mA.

[7] Tested on a sample basis.

Table 7. Static chara cteristics

VDD = 2.5 V to 6.0 V; VSS = 0 V; Tamb =

−

C to +85

C unless otherwise specified.

Symbol Parameter Conditions Min Typ[1] Max Unit

VDD supply voltage operating mode

I2C-bus active 2.5 - 6.0 V

I2C-bus inactive 1.0 - 6.0 V

quartz oscillator

Tamb = 0 °C to +70 °C[2] 1.0 - 6.0 V

IDD supply current operating mode

fSCL = 100 kHz clock mode [3] - - 200 μA

clock mode; fSCL = 0 Hz

VDD = 5.0 V [4] -1050μA

VDD = 1.0 V [4] -210μA

data retention;

fOSCI = 0 Hz; VDD = 1.0 V

Tamb = −40 °C to +85 °C --5μA

Tamb = −25 °C to +70 °C --2μA

Ven enable voltage I2C-bus enable level [5] 1.5 1.9 2.3 V

Pin SDA

VIL LOW-level input voltage [6] −0.8 - 0.3VDD V

VIH HIGH-level input voltage [6] 0.7VDD -V

DD + 0.8 V

IOL LOW-level output current 3.0 - - mA

ILI input leakage current −1- +1μA

CIinput capacitance [7] --7pF

Pins A0 and OSCI

ILI input leakage current VI = VDD or VSS −250 - +250 nA

Pin INT

IOL LOW-level output current VOL = 0.4 V 3 - - mA

ILI input leakage current VI = VDD or VSS −1- +1μA

Pin SCL

ILI input leakage current VI = VDD or VSS −1- +1μA

CIinput capacitance [7] --7pF

Product data sheet Rev. 06 — 6 October 2010 21 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

fSCL = 32 kHz; Tamb = 25 °C

Fig 21. Ty pical sup ply current in clock mode as a function of supply voltage

VDD (V)

0642

001aam492

IDD

(μA)

Product data sheet Rev. 06 — 6 October 2010 22 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

10.2 Dynamic characteristics

[1] Event counter mode only.

[2] All timing values are valid within the operating supply voltage, ambient temperature range, reference to VIL and VIH and with an input

voltage swing of VSS to VDD.

Table 8. Dynamic characteristics

VDD = 2.5 V to 6.0 V; VSS = 0 V; Tamb =

−

C to +85

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Oscillator

COSCO capacitance on pin OSCO - 40 - pF

Δfosc/fosc relative oscillator frequency

variation for ΔVDD = 100 mV ; Tamb =25°C;

VDD = 1.5 V -0.2-ppm

fclk(ext) external clock freque ncy on pin OSCI [1] --1MHz

Quartz crystal parameters (f = 32.768 kHz)

RSseries resistance - - 40 kΩ

CLparallel load capacitance - 10 - pF

Ctrim trimmer capacitance 5 - 25 pF

I2C-bus timing (see Figure 21)[2]

fSCL SCL clock frequency - - 100 kHz

tSP pulse width of spikes that

must be suppressed by the

input filter

--100ns

tBUF bus free time between a

STOP and START condition 4.7 - - μs

tSU;STA se t-up time for a repeated

START condition 4.7 - - μs

tHD;STA hold time (repeated) START

condition 4.0 - - μs

tLOW LOW period of the SCL clock 4.7 - - μs

tHIGH HIGH period of the SCL clock 4.0 - - μs

trrise time of both SDA and

SCL signals --1.0μs

tffall time of both SDA and SCL

signals --0.3μs

tSU;DAT data set-up time 250 - - ns

tHD;DAT data hold time 0 - - ns

tVD;DAT data valid time - - 3.4 μs

tSU;STO set-up time for STOP

condition 4.0 - - μs

Product data sheet Rev. 06 — 6 October 2010 23 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

Fig 22. I 2C-bus timing diagram; rise and fall times refer to VIL and VIH

PROTOCOL

SCL

SDA

mbd82

BIT 0

LSB

(R/W)

START

CONDITION

(S)

BIT 7

MSB

(A7)

BIT 6

(A6)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

SU;STA

HD;STA

SU;DAT

HD;DAT

VD;DAT

SU;STO

LOW

HIGH

1 / f

SCL

BUF

Product data sheet Rev. 06 — 6 October 2010 24 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

11. Application information

11.1 Quartz frequency adjustment

11.1.1 Method 1: Fixed OSCI capacitor

By evaluating the average capacitance necessary for the application layout, a fixed

capacitor can be used. The frequency is measured using the 1 Hz signal available after

power-on at the interrupt output (pin 7). The frequency tolerance depends on the quartz

crystal tolerance, the capacitor tolerance and the device-to-device tolerance. Average

deviations of ±5 minutes per year are possible.

11.1.2 Method 2: OSCI trimmer

Using the alarm function (via the I2C-bus) a signal faster than the 1 Hz is generate d at the

interrupt output for fast setting of a trimmer.

Procedure:

•Power the device on

•Initialize the device (alarm functions).

Routine:

•Set clock to time t and set alarm to time t + Δt

•at time t + Δt (interrupt) repeat routine.

11.1.3 Method 3: Direct measurement

Direct measurement of oscillator output (allowing for test probe capacitance).

Product data sheet Rev. 06 — 6 October 2010 25 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

Fig 23. A pp lication example

013aaa37

SCL

SDA

VSS

OSCI

OSCO

CLOCK/CALENDAR

PCF8583

SDA

SCL

MASTER

TRANSMITTER/

RECEIVER

VDD

SDA SCL

R: pull-up resistor

R = tr

SCL

SDA

OSCI

OSCO

PCF8583

VDD

VSS

EVENT COUNTER

VDD

(I2C-bus)

Product data sheet Rev. 06 — 6 October 2010 26 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

12. Package outline

Fig 24. Package outline SOT97-1 (DIP8) of PCF858 3P

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05 0.2542.54 7.62 8.25

7.80

10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12 0.010.1 0.3 0.32

0.31

0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

Product data sheet Rev. 06 — 6 October 2010 27 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

Fig 25. Package outline SOT176-1 (SO8) of PCF8583T

UNIT A

max. A1A2A3bpcD

(1) E(1) Z(1)

ELL

pQywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

7.65

7.45

7.6

7.4 1.27 10.65

10.00

1.1

1.0

2.0

1.8 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.45

SOT176-1 97-05-22

03-02-19

detail X

vMA

(A )

0.25

0.1 0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.30

0.29

0.30

0.29 0.05

1.45

0.057

0.25

0.01

0.419

0.394

0.043

0.039

0.079

0.071

0.01 0.004

0.043

0.018

0.01

0 5 10 mm

scale

pin 1 index

O8: plastic small outline package; 8 leads; body width 7.5 mm SOT176

-1

Product data sheet Rev. 06 — 6 October 2010 28 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

Fig 26. Package outline SOT662-1 (HVQFN20) of PCF8583BS

0.651

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 5.1

4.9

3.25

2.95

5.1

4.9

3.25

2.95

2.6

0.38

0.23

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT662-1 MO-220- - - - - -

0.75

0.50

0.1

0.05

0 2.5 5 mm

scale

SOT662

-1

VQFN20: plastic thermal enhanced very thin quad flat package; no leads;

0 terminals; body 5 x 5 x 0.85 mm

A(1)

max.

A1c

detail X

y1C

610

20 16

terminal 1

index area

terminal 1

index area

01-08-08

02-10-22

E(1)

D(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

Product data sheet Rev. 06 — 6 October 2010 29 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

13. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

13.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

13.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

13.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 06 — 6 October 2010 30 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

13.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 27) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting th e process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low en ough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 9 and 10

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 27.

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 10. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 06 — 6 October 2010 31 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

For further informa tion on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

MSL: Moisture Sensitivity Level

Fig 27. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 06 — 6 October 2010 32 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

14. Abbreviations

Table 11. Abbreviations

Acronym Description

AM Ante Meridiem

BCD Binary Coded Decimal

CDM Charged-Device Model

CMOS Complementary Metal-Oxide Semiconductor

ESD ElectroStatic Discharge

HBM Human Body Model

I2C Inter-Integrated Circuit bus

IC Integrated Circuit

LSB Least Significant Bit

MM Machine Model

MSB Most Significant Bit

MSL Moisture Sensitivity Level

MUX Multiplexer

PCB Printed-Circuit Board

PM Post Meridiem

POR Power-On Reset

PPM Parts Per Million

RF Radio Frequency

RAM Random Access Memory

SCL Serial Clock Line

SDA Serial DAta line

SMD Surface-Mount Device

Product data sheet Rev. 06 — 6 October 2010 33 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

15. References

[1] AN10365 — Surface mount reflow soldering description

[2] IEC 60134 — Rating syst ems for electronic tubes and valves and analogous

semiconductor devices

[3] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[4] IPC/JEDEC J-STD-020 — Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices

[5] JESD22-A114 — Elec trostatic Discharge (ESD) Sensitiv ity Testing Human Body

Model (HBM)

[6] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[7] JESD78 — IC Latch-Up Test

[8] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[9] NX3-00092 — NXP store and transport requirements

[10] SNV-FA-01-02 — Marking Formats Integrated Circuits

[11] UM10204 — I2C-bus specification and user manual

Product data sheet Rev. 06 — 6 October 2010 34 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

16. Revision history

Table 12. Revision history

Document ID Relea se date Data sheet status Change notice Supersedes

PCF8583 v.6 20101006 Product data sheet - PCF8583_5

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate .

•Add HVQFN20 package

PCF8583_5 19970715 Product Specification - PCF8583_4

PCF8583_4 19970328 Product Specification - PCF8583_CNV_3

PCF8583_CNV_3 19961003 Produ ct Specification - PCF8583_2

Product data sheet Rev. 06 — 6 October 2010 35 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, th e

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

17.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregat e and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specif ication.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 06 — 6 October 2010 36 of 37

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

17.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

I2C-bus — logo is a trademark of NXP B.V.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PCF8583

Clock and calendar with 240 x 8-bit RAM

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 6 October 2010

Document identifier: PCF8583

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Functional description . . . . . . . . . . . . . . . . . . . 5

7.1 Counter function modes . . . . . . . . . . . . . . . . . . 5

7.2 Alarm function modes. . . . . . . . . . . . . . . . . . . . 5

7.3 Control and status register . . . . . . . . . . . . . . . . 6

7.4 Counter registers . . . . . . . . . . . . . . . . . . . . . . . 7

7.5 Alarm control register . . . . . . . . . . . . . . . . . . . . 9

7.6 Alarm registers . . . . . . . . . . . . . . . . . . . . . . . . 10

7.7 Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

7.8 Event counter mode . . . . . . . . . . . . . . . . . . . . 12

7.9 Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 13

7.10 Oscillator and divider . . . . . . . . . . . . . . . . . . . 13

7.11 Initialization. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8 Characteristics of the I2C-bus . . . . . . . . . . . . 15

8.1 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15

8.1.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.1.2 Start and stop conditions . . . . . . . . . . . . . . . . 15

8.1.3 System configuration . . . . . . . . . . . . . . . . . . . 15

8.1.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.2 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 17

8.2.1 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

8.2.2 Clock and calendar READ or WRITE cycles . 17

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 19

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 20

10.1 Static characteristics. . . . . . . . . . . . . . . . . . . . 20

10.2 Dynamic characteristics . . . . . . . . . . . . . . . . . 22

11 Application information. . . . . . . . . . . . . . . . . . 24

11.1 Quartz frequency adjustment . . . . . . . . . . . . . 24

11.1.1 Method 1: Fixed OSCI capacitor. . . . . . . . . . . 24

11 .1.2 Method 2: OSCI trimmer. . . . . . . . . . . . . . . . . 24

11.1.3 Method 3: Direct measurement . . . . . . . . . . . 24

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26

13 Soldering of SMD packages . . . . . . . . . . . . . . 29

13.1 Introduction to soldering . . . . . . . . . . . . . . . . . 29

13.2 Wave and reflow soldering . . . . . . . . . . . . . . . 29

13.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 29

13.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 30

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 32

15 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

16 Revision history . . . . . . . . . . . . . . . . . . . . . . . 34

17 Legal information . . . . . . . . . . . . . . . . . . . . . . 35

17.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 35

17.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 35

17.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36

18 Contact information . . . . . . . . . . . . . . . . . . . . 36

19 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37