www.osram-os.com Produktdatenblatt | Version 1.1 LA E67F dual binning LA E67F dual binning Power TOPLED (R) PowerTOPLED, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles. Applications ----Signalling Features: d e ----Package: white PLCC-4 package, colorless clear resin ----Chip technology: Thinfilm ----Typ. Radiation: 120 (Lambertian emitter) ----Color: dom = 617 nm ( amber) ----Corrosion Robustness Class: 3B r t l e s a e ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) N 1 Version 1.2 | 2018-09-20 o LA E67F dual binning Ordering Information Type Luminous Intensity 1) IF = 4 mA Iv LA E67F-R2T1-1-1+BBCB-24-1 N 2 Version 1.2 | 2018-09-20 140 ... 355 mcd o r t l e s a e Luminous Intensity 1) IF = 50 mA Iv Ordering Code 2240 ... 4500 mcd Q65111A6057 d e LA E67F dual binning Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 C 100 C Storage Temperature Tstg min. max. -40 C 100 C Junction Temperature Tj max. 125 C Forward current TS = 25 C IF max. 70 mA Surge Current t 10 s; D = 0.005 ; TS = 25 C IFS max. 100 mA Reverse voltage 2) TS = 25 C VR max. 12 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD N 3 Version 1.2 | 2018-09-20 o r t l e s a e d e Values 2 kV LA E67F dual binning Characteristics IF = 50 mA; TS = 25 C Parameter Symbol Peak Wavelength 3) peak typ. 624 nm Dominant Wavelength 3) IF = 50 mA dom min. typ. max. 612 nm 617 nm 624 nm Spectral Bandwidth at 50% Irel,max typ. 18 nm Viewing angle at 50 % IV 2 typ. 120 Forward Voltage 4) IF = 50 mA VF min. typ. max. 1.90 V 2.15 V 2.50 V Reverse current 2) VR = 12 V IR typ. max. 0.01 A 10 A Temperature Coefficient of Peak Wavelength -10C T 100C TCpeak typ. RthJS real typ. max. 110 K / W 130 K / W RthJS elec. typ. max. 83 K / W 98 K / W Real thermal resistance junction/solderpoint 5) s a e Electrical thermal resistance junction/solderpoint with efficiency e = 25 % N 4 Version 1.2 | 2018-09-20 o r t l e 5) d e Values 0.14 nm / K LA E67F dual binning Brightness Groups Group Luminous Intensity 1) IF = 4 mA min. Iv Luminous Intensity. 1) IF = 4 mA max. Iv Luminous Flux 6) IF = 4 mA typ. V R2 140 mcd 180 mcd 480 mlm S1 180 mcd 224 mcd 610 mlm S2 224 mcd 280 mcd 760 mlm T1 280 mcd 355 mcd 950 mlm Brightness Groups Group Luminous Intensity 1) IF = 50 mA min. Iv Luminous Intensity. 1) IF = 50 mA max. Iv Luminous Flux 6) IF = 50 mA typ. V BB 2240 mcd 2800 mcd 7560 mlm CA 2800 mcd 3550 mcd 9530 mlm CB 3550 mcd 4500 mcd 12080 mlm Forward Voltage Groups Group 3X r t l e Forward Voltage 4) IF = 4 mA min. VF N o s a e d e Forward Voltage 4) IF = 4 mA max. VF 1.65 V 1.71 V 1.71 V 1.77 V 4X 1.77 V 1.83 V 4Y 1.83 V 1.89 V 5X 1.89 V 1.95 V 3Y Forward Voltage Groups Group Forward Voltage 4) IF = 50 mA min. VF Forward Voltage 4) IF = 50 mA max. VF 3A 1.90 V 2.05 V 3B 2.05 V 2.20 V 5 Version 1.2 | 2018-09-20 LA E67F dual binning Forward Voltage Groups Group Forward Voltage 4) IF = 50 mA min. VF Forward Voltage 4) IF = 50 mA max. VF 4A 2.20 V 2.35 V 4B 2.35 V 2.50 V Wavelength Groups Group 1 Dominant Wavelength 3) IF = 4 mA min. dom Dominant Wavelength 3) IF = 4 mA max. dom 611 nm 624 nm Wavelength Groups Group Dominant Wavelength 3) IF = 50 mA min. dom 2 612 nm 3 616 nm 4 620 nm N 6 Version 1.2 | 2018-09-20 o r t l e s a e d e Dominant Wavelength 3) IF = 50 mA max. dom 616 nm 620 nm 624 nm LA E67F dual binning Relative Spectral Emission 6) Irel = f (); IF = 50 mA; TS = 25 C I LA E67F dual binning 1,0 : V : amber 0,8 0,6 0,4 0,2 0,0 350 400 450 Radiation Characteristics 6) Irel = f (); TS = 25 C N o -30 -40 -50 r t -20 500 l e -10 550 s a e 600 650 700 750 800 / d e LA E67F dual binning / 0 10 20 30 40 50 60 70 80 90 1,0 0,8 0,6 -60 -70 -80 -90 -100 7 Version 1.2 | 2018-09-20 0,4 0,2 0,0 I LA E67F dual binning Forward current Relative Luminous Intensity 6), 7) IF = f(VF); TS = 25 C 6), 7) Iv/Iv(IF group) = f(IF); TS = 25 C LA E67F dual binning LA E67F dual binning IV IF / mA IV(IF group) 50 40 : IF= 50mA : IF= 4mA 10 30 5 20 1 10 0,5 5 4 0,1 3 0,05 2 2,3 VF / V N 8 Version 1.2 | 2018-09-20 o r t l e s a e d e 70 2,2 30 40 50 2,1 20 2,0 10 1,9 3 4 5 1,8 2 0,01 1 1 1,7 IF / mA LA E67F dual binning Forward Voltage Relative Luminous Intensity 6) VF = VF - VF(25 C) = f(Tj); IF = 50 mA VF / V Iv/Iv(25 C) = f(Tj); IF = 50 mA LA E67F dual binning 0,3 6) Iv LA E67F dual binning 1,6 Iv(25C) 1,4 0,2 1,2 0,1 1,0 0,8 0,0 0,6 -0,1 0,4 -0,2 0,2 -0,3 -40 -20 0 20 40 60 80 100 120 Tj / C Dominant Wavelength 6) dom = f(Tj); IF = 50 mA r t LA E67F dual binning / nm 660 N 640 o l e 620 600 580 560 -40 -20 0 20 40 60 80 100 120 T / C 9 Version 1.2 | 2018-09-20 s a e d e 0,0 -40 -20 0 20 40 60 80 100 120 Tj / C LA E67F dual binning Max. Permissible Forward Current IF = f(T) OHL01413 80 mA IF 70 60 TA TS 50 40 30 20 A temp. ambient S temp. solder point 10 0 20 0 40 60 80 C 100 T s a e d e Permissible Pulse Handling Capability Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 25 C IF = f(tp); D: Duty cycle; TA = 85 C D= IF A N 0.10 0.08 o 0.005 0.01 0.02 0.05 D= 0.06 tP D= T OHL02045 0.12 D= IF A 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 0.10 0.08 0.06 0.1 0.2 0.5 1 0.04 0.02 r t OHL02046 0.12 l e 0.04 tP 0.02 IF T 0 10-5 10-4 10-3 10-2 10-1 100 101 s 102 tp 10 Version 1.2 | 2018-09-20 tP D= T tP IF T 0 10-5 10-4 10-3 10-2 10-1 100 101 s 102 tp LA E67F dual binning Dimensional Drawing 8) 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.9 (0.035) 0.7 (0.028) A C 0.5 (0.020) Package marking 1.1 (0.043) A 3.7 (0.146) 3.3 (0.130) 41 A 0.1 (0.004) (typ.) 3.4 (0.134) 3.0 (0.118) 0.6 (0.024) 2.1 (0.083) (2.4) (0.095) 0.8 (0.031) 1.7 (0.067) 0.18 (0.007) 0.12 (0.005) s a e d e 0.6 (0.024) 0.4 (0.016) A A A C GPLY6084 Approximate Weight: 30.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43) N 11 Version 1.2 | 2018-09-20 o r t l e LA E67F dual binning Recommended Solder Pad 8) Flache darf bei Verwendung von TOPLED(R) elektrisch nicht beschaltet werden. For TOPLED(R) assembly do not use this area for electrical contact Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation 3.3 (0.130) 3.3 (0.130) Anode 2.3 (0.091) 11.1 (0.437) 1.5 (0.059) 1.1 (0.043) 3.7 (0.146) 0.8 (0.031) 0.7 (0.028) Kathode/ Cathode Flache darf bei Verwendung von TOPLED(R) elektrisch nicht beschaltet werden. Cu Flache / <_ 16 mm 2 per pad Cu-area For TOPLED(R) assembly do not use this area for electrical contact Lotstoplack Solder resist d e OHLPY440 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. N 12 Version 1.2 | 2018-09-20 o r t l e s a e LA E67F dual binning Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 Profile Feature Ramp-up rate to preheat 25 C to 150 C Liquidus temperature s a e Symbol *) r t l e tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP 150 N o d e 200 250 s 300 t Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum 60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 C 10 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.2 | 2018-09-20 C 480 s K/s s LA E67F dual binning 8) 2.9 (0.114) 4 (0.157) N 14 Version 1.2 | 2018-09-20 o r t l e s a e d e Cathode/Collector Marking 8 (0.315) 2 (0.079) 1.75 (0.069) 4 (0.157) 3.5 (0.138) 1.5 (0.059) 3.6 (0.142) Taping OHAY0667 LA E67F dual binning Tape and Reel 9) Reel dimensions [mm] A W Nmin 180 mm 8 + 0.3 / - 0.1 330 mm 8 + 0.3 / - 0.1 N 15 Version 1.2 | 2018-09-20 o r t s a e W1 60 l e 60 d e W2 max Pieces per PU 8.4 + 2 14.4 2000 8.4 + 2 14.4 8000 LA E67F dual binning Barcode-Product-Label (BPL) s a e Dry Packing Process and Materials l e d e 8) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co C 72 si nd H ou 5 te 48 C su es e H co 24 6 da e y 40 be oc tim C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d < M RA OS N o r t Barcode label Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.2 | 2018-09-20 LA E67F dual binning Transportation Packing and Materials 8) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Dimensions of transportation box in mm Width Length s a e 200 5 mm 195 5 mm 352 5 mm 352 5 mm N 17 Version 1.2 | 2018-09-20 M Y DE -1 +Q -1 R 18 P RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec C sin nd O 5 C su es Ais baRE co IC y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label o r t l e d e OHA02044 Height 30 5 mm 33 5 mm LA E67F dual binning Type Designation System Wavelength (dom typ.) A: 617 nm S: 633 nm T: 528 nm Y: 587 nm O: 606 nm CP/P: 560 nm R: 625 nm B: 470 nm L: Emission Color amber super red true green yellow orange pure green red blue Color coordinates according CIE 1931/Emission color: W: white UW: ultra white CW: warm white CB: color on demand blue CR: crystal pink Package Type E: PowerTOPLED Light emitting diode L A s a e E l e d e 6 Lead / Package Properties 6: folded leads T: folded leads, improved corrosion stability (Au-LF), w/o TiO2 jetting N o r t Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion (resin encapsulation) S: Silicone (with or without diffuser) 3: lens 30 ... 70 5: lens 40 .. 80 Chip Technology: 5: HOP 2000 B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire) 18 Version 1.2 | 2018-09-20 7 6 LA E67F dual binning Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes N 19 Version 1.2 | 2018-09-20 o r t l e s a e d e LA E67F dual binning Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. d e Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. s a e In case Buyer - or Customer supplied by Buyer- considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. N 20 Version 1.2 | 2018-09-20 o r t l e LA E67F dual binning Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of 8 % and an expanded uncertainty of 11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of 0.5 nm and an expanded uncertainty of 1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of 0.05 V and an expanded uncertainty of 0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. N 21 Version 1.2 | 2018-09-20 o r t l e s a e d e LA E67F dual binning N o r t l e s a e Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 22 Version 1.2 | 2018-09-20 d e