1. Product profile
1.1 General description
Planar Maximum Ef ficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small and flat SMD plastic
packages.
1.2 Features
Forward current: ≤1.5 A
Reverse voltage: ≤20 V
Very low forward voltage
Small and flat lead SMD plastic packages
1.3 Applications
Low voltage rectification
High efficiency DC-to-DC conve rs ion
Switch mode power supply
Inverse polarity protection
Low and medium power general applications
1.4 Quick reference data
[1] Pulse test: tp≤300 μs; δ≤0.02.
PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 03 — 15 January 2010 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
PMEG2015EH SOD123F - single diode
PMEG2015EJ SOD323F SC-90 single diode
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current Tsp ≤55 °C --1.5A
VRreverse voltage - - 20 V
VFforward voltage IF=1.5A [1] - 560 660 mV
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 2 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
Table 3. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode
001aab540
12
sym00
1
12
Table 4. Ordering information
Type number Package
Name Description Version
PMEG2015EH - plastic surface mounted package; 2 leads SOD123F
PMEG2015EJ SC-90 plastic surface mounted package; 2 leads SOD323F
Table 5. Marking codes
Type number Marking code
PMEG2015EH AD
PMEG2015EJ EL
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 20 V
IFforward current Tsp ≤55 °C-1.5A
IFRM repetitive peak forward current tp≤1 ms; δ≤0.25 - 5.5 A
IFSM non-repetitive peak forward
current square wave;
tp=8ms [1] -9A
Ptot total power dissipation Tamb ≤25 °C
PMEG2015EH [1] - 375 mW
[2] - 830 mW
PMEG2015EJ [1] - 360 mW
[2] - 830 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 3 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
7. Characteristics
[1] Pulse test: tp≤300 μs; δ≤0.02.
Tstg storage temperature −65 +150 °C
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) ther mal resistance from
junction to ambient in free air
PMEG2015EH [1][2] --330K/W
[2][3] --150K/W
PMEG2015EJ [1][2] --350K/W
[2][3] --150K/W
Rth(j-sp) ther mal resistance from
junction to solder point
PMEG2015EH - - 60 K/W
PMEG2015EJ - - 55 K/W
Table 8. Characteristics
Tamb =25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF=10mA [1] - 240 270 mV
IF= 100 mA [1] - 300 350 mV
IF= 500 mA [1] - 400 460 mV
IF=1A [1] - 480 550 mV
IF=1.5A [1] - 560 660 mV
IRreverse current VR=5V - 5 10 μA
VR=8V - 7 20 μA
VR=10V - 8 30 μA
VR=15V - 10 50 μA
VR=20V - 15 70 μA
Cddiode capacitance VR=1V; f=1MHz - 4050pF
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 4 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 3. Diod e capacitance as a function of reverse voltage; typical values
006aaa402
10
10−1
1
103
102
104
IF
(mA)
10−2
VF (V)
0 0.60.40.2 0.50.30.1
(1) (2) (3) (4) (5)
006aaa403
I
R
(μA)
1
10
−2
10
−1
10
4
10
3
10
2
10
10
5
10
−3
V
R
(V)
02010 155
(1)
(2)
(3)
(4)
(5)
VR (V)
02015510
006aaa404
40
20
60
80
Cd
(pF)
0
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 5 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Fig 4. Pac kage outline SOD123F Fig 5. Package outline SOD323F (SC-90)
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 9. Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
PMEG2015EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135
PMEG2015EJ SOD323F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 6 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 7 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Cha nge notice Supersedes
PMEG2015EH_EJ_3 20100115 Product data sheet - PMEG2015EH_EJ_2
Modifications: •This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PMEG2015EH_EJ_2 20050407 Product data sheet - PMEG2015EJ_1
PMEG2015EJ_1 20050302 Product data sheet - -
PMEG2015EH_EJ_3 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 15 January 2010 8 of 9
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre va il.
12.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give an y represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descripti ons, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permane nt
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability .
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercia l sale, as published
at http://www.nxp.com/profile/terms, including those pert aining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 January 2010
Document identifier: PMEG2015EH_EJ_3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information . . . . . . . . . . . . . . . . . . . . . 5
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
