Ver. 201306
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For High
HighHigh
High Current
CurrentCurrent
Current
RECOMMENDED LAND PATTERN
CIC10 Series (1608/ EIA 0603)
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIC10P080 0.80±0.15 8 0.03 3000
CIC10P220 0.80±0.15 22 0.025 3000
CIC10P300 0.80±0.15 30 0.025 3000
CIC10P330 0.80±0.15 33 0.025 3000
CIC10P600 0.80±0.15 60 0.05 2500
CIC10P800 0.80±0.15 80 0.05 2000
CIC10P101 0.80±0.15 100 0.05 2000
CIC10P121 0.80±0.15 120 0.05 2000
CIC10P151 0.80±0.15 150 0.09 1500
CIC10P181 0.80±0.15 180 0.09 1500
CIC10P221 0.80±0.15 220 0.10 1400
CIC10P301 0.80±0.15 300 0.12 1200
CIC10P331 0.80±0.15 330 0.14 1200
CIC10P471 0.80±0.15 470 0.15 1200
CIC10P601 0.80±0.15 600 0.15 1200
CIC10J080 0.80±0.15 8 0.02 3000
CIC10J300 0.80±0.15 30 0.03 3000
CIC10J470 0.80±0.15 47 0.05 2000
CIC10J600 0.80±0.15 60 0.05 2000
CIC10J800 0.80±0.15 80 0.10 2000
CIC10J121 0.80±0.15 120 0.10 2000
CIC10J151 0.80±0.15 150 0.15 1500
CIC10J221 0.80±0.15 220 0.15 1500
CIC10J301 0.80±0.15 300 0.15 800
CIC10J471 0.80±0.15 470 0.15 800
CIC10J601 0.80±0.15 600 0.15 750
Noise Suppression in power line
CIC series is used for high current. (~ 3A)
0.6~0.8mm
0.6~0.8mm 0.6~0.8mm
0.6~0.8mm
Ver. 201306
CHARACTERISTIC DATA
Ver. 201306
CHARACTERISTIC DATA
Ver. 201306
CI C 10 P 080 N C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) For High current(C:~3A)
(3) Dimension (4) Material Code
(5) Nominal impedance (080:8Ω, 221:220Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question regarding the
data sheets, please contact our sales personnel or application engineers.
