TJA1050T/CM,118 - NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2002 May 16 2003 Oct 22

INTEGRATED CIRCUITS

TJA1050

High speed CAN transceiver

2003 Oct 22 2

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

FEATURES

•Fully compatible with the

“ISO 11898”

standard

•High speed (up to 1 Mbaud)

•Very low ElectroMagnetic Emission (EME)

•Differential receiver with wide common-mode range for

high ElectroMagnetic Immunity (EMI)

•An unpowered node does not disturb the bus lines

•Transmit Data (TXD) dominant time-out function

•Silent mode in which the transmitter is disabled

•Bus pins protected against transients in an automotive

environment

•Input levels compatible with 3.3 V and 5 V devices

•Thermally protected

•Short-circuit proof to battery and to ground

•At least 110 nodes can be connected.

GENERAL DESCRIPTION

The TJA1050 is the interface between the Controller Area

Network (CAN) protocol controller and the physical bus.

The device provides differential transmit capability to the

bus and differential receive capability to the CAN

controller.

The TJA1050 is the third Philips high-speed CAN

transceiver after the PCA82C250 and the PCA82C251.

The most important differences are:

•Much lower electromagnetic emission due to optimal

matching of the output signals CANH and CANL

•Improved behaviour in case of an unpowered node

•No standby mode.

This makes the TJA1050 eminently suitable for use in

nodes that are in a power-down situation in partially

powered networks.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage 4.75 5.25 V

VCANH DC voltage at pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V

VCANL DC voltage at pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V

Vi(dif)(bus) differential bus input voltage dominant 1.5 3 V

tPD(TXD-RXD) propagation delay TXD to RXD VS= 0 V; see Fig.7 −250 ns

Tvj virtual junction temperature −40 +150 °C

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TJA1050T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TJA1050U −bare die; die dimensions 1700 ×1280 ×380 µm−

2003 Oct 22 3

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

BLOCK DIAGRAM

handbook, full pagewidth

30 µA

200

µA

MGS374

TXD

DOMINANT

TIME-OUT

TIMER

RECEIVER

REFERENCE

VOLTAGE

DRIVER

TEMPERATURE

PROTECTION

VCC

VCC CANH

CANL

GND

Vref

RXD

TXD

TJA1050

kΩ

0.5VCC

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input; reads in data

from the CAN controller to the bus

line drivers

GND 2 ground

VCC 3 supply voltage

RXD 4 receive data output; reads out

data from the bus lines to the

CAN controller

Vref 5 reference voltage output

CANL 6 LOW-level CAN bus line

CANH 7 HIGH-level CAN bus line

S 8 select input for high-speed mode

or silent mode

handbook, halfpage

MGS375

TJA1050T

CANHGND

CANL

Vref

RXD

VCC

TXD

Fig.2 Pin configuration.

2003 Oct 22 4

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

FUNCTIONAL DESCRIPTION

The TJA1050 is the interface between the CAN protocol

controller and the physical bus. It is primarily intended for

high-speed automotive applications using baud rates from

60 kbaud up to 1 Mbaud. It provides differential transmit

capability to the bus and differential receiver capability to

the CAN protocol controller. It is fully compatible to the

“ISO 11898”

standard.

A current-limiting circuit protects the transmitter output

stage from damage caused by accidental short-circuit to

either positive or negative supply voltage, although power

dissipation increases during this fault condition.

A thermal protection circuit protects the IC from damage

by switching off the transmitter if the junction temperature

exceeds a value of approximately 165 °C. Because the

transmitter dissipates most of the power, the power

dissipation and temperature of the IC is reduced. All other

IC functions continue to operate. The transmitter off-state

resets when pin TXD goes HIGH. The thermal protection

circuit is particularly needed when a bus line short-circuits.

The pins CANH and CANL are protected from automotive

electrical transients (according to

“ISO 7637”

; see Fig.4).

Control pin S allows two operating modes to be selected:

high-speed mode or silent mode.

Thehigh-speedmodeisthenormaloperating mode and is

selected by connecting pin S to ground. It is the default

mode if pin S is not connected. However, to ensure EMI

performance in applications using only the high-speed

mode, it is recommended that pin S is connected to

ground.

In the silent mode, the transmitter is disabled. All other

IC functions continue to operate. The silent mode is

selected by connecting pin S to VCC and can be used to

prevent network communication from being blocked, due

to a CAN controller which is out of control.

A ‘TXD dominant time-out’ timer circuit prevents the bus

linesbeingdriventoapermanent dominant state(blocking

all network communication) if pin TXD is forced

permanently LOW by a hardware and/or software

application failure. The timer is triggered by a negative

edge on pin TXD. If the duration of the LOW-level on

pin TXDexceeds theinternal timervalue, thetransmitteris

disabled, driving the bus into a recessive state. The timer

is reset by a positive edge on pin TXD.

Table 1 Function table of the CAN transceiver; X = don’t care

VCC TXD S CANH CANL BUS STATE RXD

4.75 V to 5.25 V LOW LOW (or

ﬂoating) HIGH LOW dominant LOW

4.75 V to 5.25 V X HIGH 0.5VCC 0.5VCC recessive HIGH

4.75 V to 5.25 V HIGH (or

ﬂoating) X 0.5VCC 0.5VCC recessive HIGH

<2 V (not powered) X X 0 V < VCANH <V

CC 0V<V

CANL <V

CC recessive X

2V<V

CC < 4.75 V >2 V X 0 V < VCANH <V

CC 0V<V

CANL <V

CC recessive X

2003 Oct 22 5

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND (pin 2).

Positive currents ﬂow into the IC.

Notes

1. The waveforms of the applied transients shall be in accordance with

“ISO 7637 part 1”

, test pulses 1, 2, 3a and 3b

(see Fig.4).

2. Human body model: C = 100 pF and R = 1.5 kΩ.

3. Machine model: C = 200 pF, R = 10 Ω and L = 0.75 µH.

4. In accordance with

“IEC 60747-1”

. An alternative definition of Tvj is: Tvj =T

amb +P×R

th(vj-a), where Rth(vj-a) is a fixed

value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P)

and ambient temperature (Tamb).

THERMAL CHARACTERISTICS

According to IEC 60747-1.

QUALITY SPECIFICATION

Quality specification

“SNW-FQ-611 part D”

is applicable.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage −0.3 +6 V

VCANH DC voltage at pin CANH 0 < VCC < 5.25 V;

no time limit −27 +40 V

VCANL DC voltage at pin CANL 0 < VCC < 5.25 V;

no time limit −27 +40 V

VTXD DC voltage at pin TXD −0.3 VCC + 0.3 V

VRXD DC voltage at pin RXD −0.3 VCC + 0.3 V

Vref DC voltage at pin Vref −0.3 VCC + 0.3 V

VSDC voltage at pin S −0.3 VCC + 0.3 V

Vtrt(CANH) transient voltage at pin CANH note 1 −200 +200 V

Vtrt(CANL) transient voltage at pin CANL note 1 −200 +200 V

Vesd electrostatic discharge voltage at all pins note 2 −4000 +4000 V

note 3 −200 +200 V

Tstg storage temperature −55 +150 °C

Tvj virtual junction temperature note 4 −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(vj-a) thermal resistance from junction to

ambient in SO8 package in free air 145 K/W

Rth(vj-s) thermal resistance from junction to

substrate of bare die in free air 50 K/W

2003 Oct 22 6

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

CHARACTERISTICS

VCC = 4.75 V to 5.25 V; Tvj =−40 °C to +150 °C; RL=60Ω unless speciﬁed otherwise; all voltages are referenced to

GND (pin 2); positive currents ﬂow into the IC; see notes 1 and 2.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin VCC)

ICC supply current dominant; VTXD =0V255075mA

recessive; VTXD =V

CC 2.5 5 10 mA

Transmitter data input (pin TXD)

VIH HIGH-level input voltage output recessive 2.0 −VCC + 0.3 V

VIL LOW-level input voltage output dominant −0.3 −+0.8 V

IIH HIGH-level input current VTXD =V

CC −50 +5µA

IL LOW-level input current VTXD =0V −100 −200 −300 µA

Ciinput capacitance not tested −510pF

Mode select input (pin S)

VIH HIGH-level input voltage silent mode 2.0 −VCC + 0.3 V

VIL LOW-level input voltage high-speed mode −0.3 −+0.8 V

IIH HIGH-level input current VS= 2 V 20 30 50 µA

IIL LOW-level input current VS=0.8V 153045µA

Receiver data output (pin RXD)

IOH HIGH-level output current VRXD = 0.7VCC −2−6−15 mA

IOL LOW-level output current VRXD = 0.45 V 2 8.5 20 mA

Reference voltage output (pin Vref)

Vref reference output voltage −50 µA<I

Vref < +50 µA 0.45VCC 0.5VCC 0.55VCC V

Bus lines (pins CANH and CANL)

Vo(reces)(CANH) recessive bus voltage at

pin CANH VTXD =V

CC; no load 2.0 2.5 3.0 V

Vo(reces)(CANL) recessive bus voltage at

pin CANL VTXD =V

CC; no load 2.0 2.5 3.0 V

Io(reces)(CANH) recessive output current at

pin CANH −27V<V

CANH < +32 V;

0V<V

CC < 5.25 V −2.0 −+2.5 mA

Io(reces)(CANL) recessive output current at

pin CANL −27V<V

CANL < +32 V;

0V<V

CC < 5.25 V −2.0 −+2.5 mA

Vo(dom)(CANH) dominant output voltage at

pin CANH VTXD = 0 V 3.0 3.6 4.25 V

Vo(dom)(CANL) dominant output voltage at

pin CANL VTXD = 0 V 0.5 1.4 1.75 V

Vi(dif)(bus) differential bus input voltage

(VCANH −VCANL)VTXD = 0 V; dominant;

42.5 Ω<R

L<60Ω1.5 2.25 3.0 V

VTXD =V

CC; recessive;

no load −50 0 +50 mV

2003 Oct 22 7

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

Notes

1. All parameters are guaranteed over the virtual junction temperature range by design,but only 100 % tested at 125 °C

ambient temperature for dies on wafer level and in addition to this 100 % tested at 25 °C ambient temperature for

cased products, unless speciﬁed otherwise.

2. For bare die, all parameters are only guaranteed if the backside of the bare die is connected to ground.

Io(sc)(CANH) short-circuitoutput current at

pin CANH VCANH =0V;V

TXD =0V −45 −70 −95 mA

Io(sc)(CANL) short-circuitoutput current at

pin CANL VCANL =36V;

TXD =0V 45 70 100 mA

Vi(dif)(th) differentialreceiverthreshold

voltage −12V<V

CANL < +12 V;

−12V<V

CANH < +12 V;

see Fig.5

0.5 0.7 0.9 V

Vi(dif)(hys) differential receiver input

voltage hysteresis −12V<V

CANL < +12 V;

−12V<V

CANH < +12 V;

see Fig.5

50 70 100 mV

Ri(cm)(CANH) common mode input

resistance at pin CANH 15 25 35 kΩ

Ri(cm)(CANL) common mode input

resistance at pin CANL 15 25 35 kΩ

Ri(cm)(m) matching between

pin CANH and pin CANL

common mode input

resistance

VCANH =V

CANL −3 0 +3 %

Ri(dif) differential input resistance 25 50 75 kΩ

Ci(CANH) input capacitance at

pin CANH VTXD =V

CC; not tested −7.5 20 pF

Ci(CANL) input capacitance at

pin CANL VTXD =V

CC; not tested −7.5 20 pF

Ci(dif) differential input capacitance VTXD =V

CC; not tested −3.75 10 pF

ILI(CANH) input leakage current at

pin CANH VCC =0V; V

CANH = 5 V 100 170 250 µA

ILI(CANL) input leakage current at

pin CANL VCC =0V; V

CANL = 5 V 100 170 250 µA

Thermal shutdown

Tj(sd) shutdown junction

temperature 155 165 180 °C

Timing characteristics (see Figs.6 and 7)

td(TXD-BUSon) delay TXD to bus active VS= 0 V 25 55 110 ns

td(TXD-BUSoff) delay TXD to bus inactive VS= 0 V 25 60 95 ns

td(BUSon-RXD) delay bus active to RXD VS= 0 V 20 50 110 ns

td(BUSoff-RXD) delay bus inactive to RXD VS= 0 V 45 95 155 ns

tdom(TXD) TXD dominant time for

time-out VTXD = 0 V 250 450 750 µs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2003 Oct 22 8

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

APPLICATION AND TEST INFORMATION

handbook, full pagewidth

MGS380

VCC

Vref

RXD

TJA1050

60 Ω

CANH

CAN

BUS LINE

CANL

SJA1000

CAN

CONTROLLER

MICRO-

CONTROLLER

GND S

TXD

RX0

TX0 13

100

47 nF

+5 V

Fig.3 Application information.

handbook, full pagewidth

MGS379

VCC

Vref

RXD

TJA1050

1 nF

TRANSIENT

GENERATOR

1 nF

CANH

CANL

GND S

15 pF

TXD 13

100

+5 V

Fig.4 Test circuit for automotive transients.

The waveforms of the applied transients shall be in accordance with

“ISO 7637 part 1”

, test pulses 1, 2, 3a and 3b.

2003 Oct 22 9

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

handbook, full pagewidth

MGS378

VRXD

HIGH

LOW

hysteresis

0.5 0.9 Vi(dif)(bus) (V)

Fig.5 Hysteresis of the receiver.

handbook, halfpage

MGS376

VCC

Vref

RXD

TJA1050 RL

60 Ω CL

100 pF

CANH

CANL

GND S

15 pF

TXD 13

100

+5 V

Fig.6 Test circuit for timing characteristics.

2003 Oct 22 10

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

handbook, full pagewidth

MGS377

td(TXD-BUSon)

tPD(TXD-RXD)tPD(TXD-RXD)

0.3VCC 0.7VCC

0.9 V

0.5 V

HIGH

LOW

CANH

TXD

RXD

CANL

Vi(dif)(bus)(1)

HIGH

recessive

(BUS off)

dominant

(BUS on)

LOW

td(TXD-BUSoff)

td(BUSon-RXD) td(BUSoff-RXD)

Fig.7 Timing diagram for AC characteristics.

(1) Vi(dif)(bus) =V

CANH −VCANL.

handbook, full pagewidth

MGT229

6.2 kΩ

Ω30

Ω

10 nF

47 nF

CANH

CANL

test PCB GND

TX TJA1050 ACTIVE PROBE

SPECTRUM-

ANALYZER

Fig.8 Basic test set-up (with split termination) for electromagnetic emission measurement (see Figs 9 and 10).

2003 Oct 22 11

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

handbook, full pagewidth

00203010

MGT231

40 f (MHz)

(dBµV)

Fig.9 Typical electromagnetic emission up to 50 MHz (peak amplitude measurement).

Data rate of 500 kbits/s.

handbook, full pagewidth

00462

MGT233

8f (MHz)

(dBµV)

Fig.10 Typical electromagnetic emission up to 10 MHz (peak amplitude measurement and envelope on peak

amplitudes).

Data rate of 500 kbits/s.

2003 Oct 22 12

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

handbook, full pagewidth

MGT230

30 Ω

Ω

4.7 nF

CANH

CANL

test PCB GND

TX TJA1050 RF VOLTMETER

AND POWER

AMPLIFIER

RF SIGNAL

GENERATOR

RX TJA1050

Fig.11 Basic test set-up for electromagnetic immunity measurement (see Fig.12).

handbook, full pagewidth

VRF(rms)

(V)

103

MGT232

102

101 f (MHz)

10−1

max RF voltage reached with no errors

Fig.12 Typical electromagnetic immunity.

Data rate of 500 kbits/s.

2003 Oct 22 13

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

BONDING PAD LOCATIONS

Note

1. All x/y coordinates represent the position of the centre

ofeach pad (in µm) with respect tothelefthand bottom

corner of the top aluminium layer (see Fig.13).

SYMBOL PAD COORDINATES(1)

TXD 1 103 103

GND 2 740 85

VCC 3 886.5 111

RXD 4 1371.5 111

Vref 5 1394 1094

CANL 6 998 1115

CANH 7 538.5 1115

S 8 103 1097

Fig.13 Bonding pad locations.

handbook, halfpage

MGS381

TJA1050U

765

123 4

test pad

The backside of the bare die must be connected to ground.

2003 Oct 22 14

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

2003 Oct 22 15

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

SOLDERING

Introduction to soldering surface mount packages

Thistext givesa verybrief insightto acomplex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certainsurfacemountICs,but itis notsuitable forfinepitch

SMDs. In these situations reflow soldering is

recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardbyscreen printing, stencilling or

pressure-syringe dispensing before package placement.

Driven by legislation and environmental forces the

worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

•below 220 °C (SnPb process) or below 245 °C (Pb-free

process)

– for all BGA and SSOP-T packages

– for packages with a thickness ≥2.5 mm

– for packages with a thickness < 2.5 mm and a

volume ≥350 mm3 so called thick/large packages.

•below 235 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

Wave soldering

Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs) orprinted-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackageswithleadson foursides, thefootprint must

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2003 Oct 22 16

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. Formore detailed informationon the BGApackagesrefer to the

“(LF)BGAApplication Note

”(AN01026); order acopy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C±10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Hot bar or manual soldering is suitable for PMFP packages.

REVISION HISTORY

PACKAGE(1) SOLDERING METHOD

WAVE REFLOW(2)

BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable

PLCC(5), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(5)(6) suitable

SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable

PMFP(8) not suitable not suitable

REV DATE CPCN DESCRIPTION

4 20031013 −Product speciﬁcation (9397 750 12157)

Modiﬁcation:

•Added recommendation to connect unused pin S to ground

•Added Chapter REVISION HISTORY

3 20020516 −Product speciﬁcation (9397 750 09778)

2003 Oct 22 17

Philips Semiconductors Product speciﬁcation

High speed CAN transceiver TJA1050

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL DATA SHEET

STATUS(1) PRODUCT

STATUS(2)(3) DEFINITION

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

atthese orat anyotherconditions abovethose given inthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarrantythatsuch applicationswillbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands R16/04/pp18 Date of release: 2003 Oct 22 Document order number: 9397 750 12157

Mouser Electronics

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NXP:

TJA1050T/N1,518 TJA1050T/N1,112 TJA1050T/N1,118 TJA1050T/H/V,112 TJA1050T/H/V,118 TJA1050T/V,112

TJA1050T/V,118 TJA1050T/N1M,112 TJA1050T/N1M,118 TJA1050T/VM,112 TJA1050T/VM,118 TJA1050T/CM,118