DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT uPC741 GENERAL PURPOSE OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The uPC741 is a general purpose operational ampli- Internal frequency compensation fier having internal frequency compensating circuits. Short circuit protection It is intended for a wide range of analog applications. Offset voltage null capability High common mode voltage range and no latch up tendencies make this amplifier ideal for use as a voltage follower. CONNECTION DIAGRAM EQUIVALENT CIRCUIT (Top View) HPC741C / uPC741G2 OFFSET LY NuLt Lt [ac HK [3 | [6 | OUT : OFFSET v- [4] SI NULL 50kQ OFFSET NULL i ORDERING INFORMATION PART NUMBER PACKAGE QUALITY GRADE uPC741C 8 PIN PLASTIC DIP (300 mil) Standard uPC741G2 8 PIN PLASTIC SOP (225 mil) Standard Please refer to Quality grade on NEC Semiconductor Devices (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1972A (O.D. No. IC-6304C) Date Published March 1993 M Printed in JapanNEC UPC741 ABSOLUTE MAXIMUM RATINGS (Ta = 25 C) PARAMETER SYMBOL uPC741 UNIT Voltage between V* and V- (Note 1) Viv -0.3 to +36 Vv Differential Input Voltage Vip +30 Vv Input Voltage (Note 2) vi V- -0.3 to V* +0.3 Vv Output Voltage (Note 3) Vo V- -0.3 to V* +0.3 Vv Power Dissipation C Package ee Pr 350 mW G2 Package __ (Note 5) 440 mW Output Short Circuit Duration (Note 6) Indefinite sec Voltage between Offset-Null and V* +0.5 Vv Operating Temperature Range Topt -20 to +80 c Storage Temperature Range Tstg 55 to +125 c Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV /C when ambient temperature is higher than 55 C. Note 5. Thermal derating factor is -4.4 mV / C when ambient temperature is higher than 25 C. Note 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT Supply Voltage (Split) vi +75 + 16 Vv Supply Voltage (V7 = GND) vt +15 + 32 Vv Output Current lo 2 +5 mA OFFSET VOLTAGE NULL CIRCUITNEC uPC741 ELECTRICAL CHARACTERISTICS (Ta = 25 C, V+ = +15 V) CHARACTERISTIC SYMBOL | MIN. TYP. MAX. UNIT CONDITIONS Input Offset Voltage Vio +1.0 +6.0 mV Rs < 10 kQ Average Vio Temperature Drift ANViI0/ AT +3 +30 uvPrC Rs 10 kQ Input Offset Current (Note 7) lio +20 +200 nA Input Bias Current (Note 7) IB 80 500 nA Large Signal Voltage Gain Av 25000 200000 Ri 2 2 kQ, Vo = +10 V Offset Voltage Adjustable Range +15 mV VRi = 10 kQ Supply Current Icc 1.5 2.8 mA lo=0A Power Consumption Pa 45 85 mW lo=z0A Common Mode Rejection Ratio CMR 70 90 dB Rs < 10 kQ Supply Voltage Rejection Ratio SVR 30 150 LuV Rs = 10 kQ 12 1D RL> 10 kQ Output Voltage Swing Vom Vv +10 " RLZ2kQ Common Mode Input Voltage Range Viem y 3 V Output Short Circuit Current lo short 5 20 mA Ri = 0 Note 7. Input bias currents flow into IC. Because each currents are base current of NPN-transistor on input stage.NEC uPC741 TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 C, TYP.) POWER DISSIPATION OPEN LOOP FREQUENCY RESPONSE 600 120 Vicai5v = = ca 110 T oO ; 500 1 100 5 s 90 2 oO 400 o 80 2 Da D & 70 Q 300 S 60 Z g 50 a 200 z 40 & 30 100 | 20 a < 10 0 0 20 40 60 80 100 1 10 100 1k 10k 100k 1M Ta ~ Ambient Temperature C f Frequency Hz LARGE SIGNAL FREQUENCY RESPONSE OUTPUT VOLTAGE SWING Vi =+15V Vom Output Voltage Swing Vop Vom Output Voltage Swing Vp-p 1k 10k 100k 1M 100 1k 10k 100k f Frequency Hz Ri Load Resistance Q OUTPUT VOLTAGE SWING POWER CONSUMPTION Rv22kQ = = I <= 100 D \ 3 Ss Q oO ic a= 2 8 50 a) he s $ 5 a ! I 2 s a 0 +10 +20 0 +10 +20 V* Supply Voltage V V* Supply Voltage VNEC uPC741 icc Supply Current - mA lo short - Output Short Circuit Current - mA Ip Input Bias Current - nA SUPPLY CURRENT -20 150 100 50 -20 +10 +20 V* Supply Voltage V OUTPUT SHORT CIRCUIT CURRENT VF=+15V 0 20 40 60 Ta ~ Ambient Temperature - C INPUT BIAS CURRENT VF=tl5V 0 20 40 60 Ta - Ambient Temperature C 80 80 Pg - Power Consumption mW Icc - Supply Current - mA lio - Input Offset Current - nA -20 100 50 -20 -20 SUPPLY CURRENT V*=+15V 0 20 40 60 80 Ta - Ambient Temperature C POWER CONSUMPTION Vi=+15V 0 20 40 60 80 Ta - Ambient Temperature C INPUT OFFSET CURRENT Vr =+15V 0 20 40 60 80 Ta - Ambient Temperature CNEC uPC741 8PIN PLASTIC DIP (300 mil) 8 5 1S) 1 ~\ - Ls OL LU UW 1 4 A K P > + ! go {x | | F | t T rT Hl | CB M O~15 D [LN @] P8C-100-300B,C NOTES ITEM MILLIMETERS INCHES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at A 10.16 MAX. 0.400 MAX. maximum material condition. B 1.27 MAX. 0.050 MAX. Cc 2.54 (T.P.) 0.100 (T.P.) 2) Item K to center of leads when formed y0.004 parallel D 0.50*' 0.020 -0'005 F 1.4 MIN. 0.055 MIN. G 3,9 493 0.126 #.012 H 0.51 MIN. 0.020 MIN. | 4.31 MAX. 0.170 MAX. J 5.08 MAX. 0.200 MAX. K 7.62 (T.P.} 0.300 (T.P.) L 6.4 0.252 M 0.25 76:38 0.010 78:863 N 0.25 0.01 P 0.9 MIN. 0.035 MIN.NEC uPC741 8 PIN PLASTIC SOP (225 mil) AAA detail of lead end HEE A 1 4 A H | | J | Geict ht J | L uu L B f7| N bd [elu | S8GM-50-225B-2 NOTE ITEM| MILLIMETERS INCHES Each lead centerline is located within 0.12 mm (0.005 inch} of its true position (T.P.) at A 5.37 MAX, 0.212 MAX. maximum material condition. B 0.78 MAX. 0.031 MAX. Cc 1.27 (T.P.) 0.050 (T.P.)} D 0.4078:02 0.016 %3-004 E 0.1+0.1 0.004+0.004 F 1.8 MAX. 0.071MAX. G 1.49 0.059 H 6.5+0.3 0.2560.012 | 4.4 0.173 J 1.1 0.043 K 0.157948 0.00678:894 L 0.60.2 0.02479:009 M 0.12 0.005 N 0.15 0.006NEC UPC741 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207). [ uPC741G2 ] Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Peak packages surface temperature: 230 C or below, Reflow time: 30 seconds or below (210 C or higher), IR30-00-1 Number of reflow process: 1, Exposure limit*: None VPS Peak packages surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), VP15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or below, WS 15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method Terminal temperature: 300 C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for Partial heating method. TYPES OF THROUGH HOLE DEVICE [ uPC741C ] Soldering . wg: Recommended method Soldering conditions condition symbol Wave soldering Solder temperature: 260 C or below, Fiow time: 10 seconds or belowNEC uPC741 [MEMO]NEC uPC741 [MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic control systems, Antidisaster systems, Anticrime systems, etc. M4 92.6