■定格・特性曲線
■APPROX.NETWEIGHT:0.06g
FIG.1
FIG.4
FIG.2
AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE
平 均 順 電 流 − 周 囲 温 度 定 格
EC8FS6
Glass-Epoxy Substrate Mounted(Soldering Land=2 2mm)
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (
°
C)
周 囲 温 度 （℃）
0
0.2
0.4
0.6
0.8
1.0
1.2
AVERAGE FORWARD CURRENT (A)
平
均
順
電
流
（Ａ）
HALF SINE WAVE
D.C.
RECT 180
°
RECT 120
°
RECT 60
°
0
°
180
°
通流角
CONDUCTION ANGLE
θ
FIG.3
Volts FRED
■
OUTLINEDRAWING(mm)
51
EC8FS6
FORWARD CURRENT VS. VOLTAGE
順 電 圧 特 性
EC8FS6
0 0.5 1.0 1.5 2.0 2.5 3.0
INSTANTANEOUS FORWARD VOLTAGE (V)
瞬 時 順 電 圧 （Ｖ）
0.1
0.2
0.5
1
2
5
10
INSTANTANEOUS FORWARD CURRENT (A)
瞬
時
順
電
流
（Ａ）
Tj=25°C
Tj=150°C
AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE
平 均 順 電 流 − 周 囲 温 度 定 格
EC8FS6
Alumina Substrate Mounted(Soldering Land=2 2mm)
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (∞C)
周 囲 温 度 （℃）
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
AVERAGE FORWARD CURRENT (A)
平
均
順
電
流
（Ａ）
HALF SINE WAVE
D.C.
RECT 180
°
RECT 120
°
RECT 60
°
0
°
180
°
通流角
CONDUCTION ANGLE
θ
AVERAGE FORWARD POWER DISSIPATION
平 均 順 電 力 損 失 特 性
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
AVERAGE FORWARD CURRENT (A)
平 均 順 電 流 （Ａ）
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
AVERAGE FORWARD POWER DISSIPATION (W)
平
均
順
電
力
損
失
（Ｗ）
EC8FS6
HALF SINE WAVE
D.C.
RECT 180°
RECT 120°
RECT 60°
0
°
180
°
通流角
CONDUCTION ANGLE
θ
SURGE CURRENT RATINGS
サ ー ジ 順 電 流 定 格
EC8FS6
f=50Hz,Half Sine Wave,Non-repetitive,No Load
0.02 0.05 0.1 0.2 0.5 1 2
TIME (s)
時 間 （ｓ）
0
4
8
12
16
20
SURGE FORWARD CURRENT (A)
サ
｜
ジ
順
電
流
（Ａ）
0.02s
IFSM
FIG.5
0.8A Avg. 600
■最大定格 Maximum Ratings
■電気的・熱的特性 Electrical/ThermalCharacteristics
Item Symbol Conditions Unit
くり返しピーク逆電圧
RepetitivePeakReverseVoltage VRRM 600 V
平均整流電流
AverageRectifiedForwardCurrent
IO50Hz、正弦半波通電抵抗負荷
50HzHalfSineWaveResistiveLoad
A
A
実効順電流
R.M.S.ForwardCurrent IF(RMS) 1.256 A
サージ順電流
SurgeForwardCurrent IFSM 20 50Hz正弦半波，１サイクル，非くり返し
50HzHalfSineWave,1cycle,Non-repetitive A
保存温度範囲
StorageTemperatureRange Tstg −40〜＋150 ℃
動作接合温度範囲
OperatingJunctionTemperatureRange
Tjw −40〜＋150 ℃
Ta＝25℃＊1 0.65
Ta＝35℃＊2 0.8
Item Conditions
ピーク逆電流
PeakReverseCurrent Tj＝25℃,VRM＝VRRM
熱抵抗
ThermalResistance
接合部･周囲間
JunctiontoAmbient
GlassEpoxySubstrateMounted＊1
Min. Typ. Max.
− − 20
− − 157
Symbol
IRM
Rth(j-a)
逆回復時間
ReverseRecoveryTime trr IFM＝1A,-di/dt＝50A/μs,Tj＝25℃ −−80
Unit
μA
ns
℃/W
AluminaSubstrateMounted＊2 − − 108 ℃/W
＊1:プリント基板実装/Glass-EpoxySubstratemounted(SolderingLands=2× 2mm,BothSides)
＊2:アルミナ基板実装/AluminaSubstratemounted(SolderingLands=2× 2mm,BothSides)
ピーク順電圧
PeakForwardVoltage VFM Tj＝25℃,IFM＝0.8A − − 1.32 V
Ta＝25℃ IF＝IR＝10mA 0.4 μs