Document Number: MPXA6115A
Rev 7.1, 05/2012
Freescale Semiconductor
Data Sheet: Technical Data
© 2007-2012 Freescale Semiconductor, Inc. All rights reserved.
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXxx6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-
chip integration make the pressure sensor a logical and economical choice
for the system designer.
The MPXxx6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor . This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to appli ed pressure.
Features
• Resistant to High Humidity and Common Automotive Media
• Improved Accuracy at High Temperature
• Available in Small and Super Small Outline Packages
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Device Name Package
Option Case No. # of Ports Pressure Type Device
Marking
None Single Dual Gauge Differential Absolute
Small Outline Package (MPXA6115A Series)
MPXA6115A6U Rails 482 • • MPXA6115A
MPXA6115A6T1 Tape and Reel 482 • • MPXA6115A
MPXA6115AC6U Rails 482A • • MPXA6115A
MPXA6115AC6T1 Tape and Reel 482A • • MPXA6115A
MPXA6115AC7U Rails 482C • • MPXA6115A
Small Outline Package (Media Resistant Gel) (MPXAZ6115A Series)
MPXAZ6115A6U Rails 482 • • MPXAZ6115A
MPXAZ6115AC6U Rails 482A • • MPXAZ6115A
MPXAZ6115AC6T1 Tape and Reel 482A • • MPXAZ6115A
MPXAZ6115AP Trays 1369 • • MPXAZ6115A
MPXAZ6115APT1 Tape and Reel 1369 • • MPXAZ6115A
Super Small Outline Package (MPXH6115A Series)
MPXH6115A6U Rails 1317 • • MPXH6115A
MPXH6115A6T1 Tape and Reel 1317 • • MPXH6115A
MPXH6115AC6U Rails 1317A • • MPXH6115A
MPXH6115AC6T1 Tape and Reel 1317A • • MPXH6115A
MPXA6115A
Series
MPXH6115A
MPXHZ6115A
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.8 V Output
MPXAZ6115A
Application Examples
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
• Weather Station and Weather
Reporting Device Barometers
MPXA6115A
Sensors
2Freescale Semiconductor
Small Outline Package (Media Resistant Gel) (MPXHZ6115A Series)
MPXHZ6115A6U Rails 1317 • • MPXHZ6115A
MPXHZ6115A6T1 Tape and Reel 1317 • • MPXHZ6115A
MPXHZ6115AC6U Rails 1317A • • MPXHZ6115A
MPXHZ6115AC6T1 Tape and Reel 1317A • • MPXHZ6115A
ORDERING INFORMATION
SMALL OUTLINE PACKAGES
SUPER SMALL OUTLINE PACKAGES
MPXA6115A6U/T1
MPXAZ6115A6U
CASE 482
MPXA6115AC6U/T1
MPXAZ6115AC6U/T1
CASE 482A
MPXH6115A6U/T1
MPXHZ6115A6U/T1
CASE 1317
MPXH6115AC6U/T1
MPXHZ6115AC6U/T1
CASE 1317A
MPXA6115AC7U
CASE 482C MPXAZ6115AP/T1
CASE 1369
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Operating Characteristics
Maximum Rat ings
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure Range POP 15 — 115 kPa
Supply Voltage(1) VS4.75 5.0 5.25 Vdc
Supply Current Io—6.010mAdc
Minimum Pressure Offset(2)(0 to 85°C)
@ VS = 5.0 Volts Voff 0.133 0.200 0.268 Vdc
Full Scale Output(3)(0 to 85°C)
@ VS = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc
Full Scale Span(4)(0 to 85°C)
@ VS = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc
Accuracy(5)(0 to 85°C) ———±1.5 %VFSS
Sensitivity V/P — 45.0 — mV/kPa
Response Time(6) tR—1.0—ms
Warm-Up Time(7) ——20—ms
Offset Stability(8) ——±0.25 — %VFSS
1.Device is ratiometric within this specified excitation range.
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25°C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 2. Maximum Ratings(1)
Rating Symbol Value Units
Maximum Pressure (P1 > P2) Pmax 400 kPa
Storage Temperature Tstg -40° to +125°°C
Operating Temperature TA-40° to +125°°C
Output Source Current @ Full Scale Output(2) Io+0.5mAdc
Output Sink Current @ Minimum Pressure Offset(2) Io--0.5mAdc
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2.Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
MPXA6115A
Sensors
4Freescale Semiconductor
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully Integrated Pressure Sensor Schematic
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor outp ut signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXxx6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability . Contact the factory for information regarding media
compatibility in your application.
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Sensing
Element VOUT
VS
Gain Stage #2
GND
and Ground
Reference
Shift
Circuitry
Thin Film
Temperature
Compensation
and
Gain Stage #1
3
2
4
Wire Bond
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Sealed Vacuum Refere nce
Fluorosilicone
Gel Die Coat
Lead
Frame
Absolute Element
P1 Die
VS Pin 2
+5.0 V
GND Pin 3
Vout Pin 4
MPXxx6115A to ADC
100 nF
51 K
47 pF
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Freescale Semiconductor, Inc. 5
Figure 4. Output vs. Absolute Pressure
Output (Volts)
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuu m) in kPa
MAX
MIN
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
2.5
2.0
1.5
1.0
0.5
0
110
Transfer Fun ction:
Vout = Vs* (.009*P-.095) ± Error
VS = 5.0 Vdc
TEMP = 0 to 85ºC
115
120
TYP
Transfer Function (MPXxx6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Temperature Error Band MPXxxA6115A SERIES
Break Points
Temp Multiplier
- 40 3
0 to 85 1
125 1.75
Temperature in Cº
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 20 Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
40 60 80 100 120
Pressure Error (Max)
MPXA6115A
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MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the tot al
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482)
Figure 6. SSOP Footprint (Case 1317 and 1317A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP
2.54
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35 inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
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PACKAGE DIMENSIONS
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0˚ 7˚ 0˚ 7˚
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D
8 PL
G
4
5
81
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
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PACKAGE DIMENSIONS
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.660.0340.026 0.864
G0.100 BSC 2.54 BSC
J0.009 0.011 0.23 0.28
K0.100 0.120 2.54 3.05
M0 15 0 15
N0.444 0.448 11.28 11.38
S0.540 0.560 13.72 14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
PIN 1
K
SEATING
PLANE
–T–
S
G
4
5
81
–A–
–B–
C
N
V
W
M
J
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
IDENTIFIER
D8 PL
S
B
M
0.25 (0.010) A S
T
DETAIL X
DETAIL X
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Freescale Semiconductor, Inc. 9
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 1 OF 2
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PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
PAGE 2 OF 2
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PACKAGE DIMENSIONS
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
PAGE 1 OF 3
MPXA6115A
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PACKAGE DIMENSIONS
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
PAGE 2 OF 3
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PACKAGE DIMENSIONS
CASE 1317-04
ISSUE H
SUPER SMALL OUTLINE PACKAGE
PAGE 3 OF 3
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PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
PAGE 1 OF 2
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PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
PAGE 2 OF 2
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Table 3. Revision History
Revision
number Revision
date Description of changes
7.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H,
MPXA6115A
Rev. 7.1
05/2012
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