INTEGRATED CIRCUITS DIVISION
CPC1008N
Single-Pole, Normally Open
4-Pin SOP OptoMOS® Relay
www.ixysic.com
DS-CPC1008N-R11 1
Part # Description
CPC1008N 4-Pin SOP (100/tube)
CPC1008NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 100 VP
Load Current 150 mArms / mADC
On-Resistance (max) 8
Applications
Features
Description
Ordering Information
Pin Configuration
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
• Reed Relay Replacement
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Halogen-Free
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
CPC1008N is a miniature, low-voltage, low
on-resistance, single-pole, normally open (1-Form-A)
solid state relay in a 4-Pin SOP package. It uses
IXYS Integrated Circuits Division’s patented, optically
coupled, OptoMOS architecture to provide 1500Vrms
of input/output isolation.
Using IXYS Integrated Circuits Division’s state of the
art double-molded vertical construction packaging,
the CPC1008N is one of the world’s smallest relays.
It is ideal for replacing larger, less-reliable reed and
electromechanical relays.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
Certificate B 13 12 82667 003
Switching Characteristics
of Normally Open Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
1
23
4
+ Control
– Control
Load
Load
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2R11
CPC1008N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1400 mW
Isolation Voltage, Input to Output (60 Seconds) 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L150 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=150mA RON - 4.8 8
Off-State Leakage Current VL=100VPILEAK --1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton -12 ms
Turn-Off toff - 0.17 1
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -6 - pF
Input Characteristics
Input Control Current to Activate 3IL=150mA IF- 0.45 2 mA
Input Control Current to Deactivate - IF0.2 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF
1 Load current derates linearly from 150mA @ 25oC to 120mA @ 85oC.
2 Measurement taken within 1 second of on time.
3 For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended.
Electrical Characteristics @ 25ºC
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CPC1008N
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R11
LED Forward Voltage (V)
1.250 1.255 1.260 1.265 1.270 1.275
Device Count (N)
0
5
10
15
20
25
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Turn-On Time (ms)
0.85 0.90 0.95 1.00 1.05 1.10 1.15
Device Count (N)
0
5
10
15
20
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
Turn-Off Time (ms)
0.166 0.168 0.170 0.172 0.174 0.176 0.178
Device Count (N)
0
5
10
15
20
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mA)
LED Current (mA)
0.38 0.40 0.42 0.45 0.47 0.50 0.53
Device Count (N)
0
5
10
15
20
Typical IF for Switch Operation
(N=50, IL=100mA)
On-Resistance (:)
4.4 4.6 4.8 5.0 5.2 5.4 5.6
Device Count (N)
0
5
10
15
20
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=150mA)
Blocking Voltage (VP)
106 109 112 115 118 121 124
Device Count (N)
0
5
10
15
20
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
Typical IF for Switch Operation
vs. Temperature
(IL=120mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Typical Turn-On Time
vs. Temperature
IF=10mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.0
0.2
0.4
0.6
0.8
1.0
Typical Turn-Off Time
vs. Temperature
IF=10mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
LED Current (mA)
0 1020304050
Turn-On Time (ms)
0.0
0.5
1.0
1.5
2.0
2.5
Typical Turn-On Time
vs. LED Forward Current
LED Current (mA)
0 1020304050
Turn-Off Time (ms)
0.00
0.05
0.10
0.15
0.20
0.25
Typical Turn-Off Time
vs. LED Forward Current
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
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4R11
CPC1008N
PERFORMANCE DATA*
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0
2
4
6
8
10
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=120mA)
Load Voltage (V)
-1.0 -0.5 0.0 0.5 1.0
Load Current (mA)
-200
-150
-100
-50
0
50
100
150
200
Typical Load Current
vs. Load Voltage
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
110
120
130
140
150
160
Maximum Load Current
vs. Temperature
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
108
110
112
114
116
118
120
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Typical Leakage vs. Temperature
(VL=100V)
Leakage (nA)
0
5
10
15
20
25
Load Voltage (V)
0 20406080100
Output Capacitnace (pF)
0
10
20
30
40
50
Output Capacitance
vs. Load Voltage
(IF=2mA, f=1MHz)
Time (s)
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
INTEGRATED CIRCUITS DIVISION
CPC1008N
www.ixysic.com 5
R11
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1008N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1008N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1008N-R11
©Copyright 2017, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/25/2017
For additional information please visit our website at: www.ixysic.com
6
CPC1008N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1008N
CPC1008NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
5.50
(0.217)
1.45
(0.057)
0.55
(0.022)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 TYP.
(0.015 TYP.)
Pin to package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(0-0.004)
0.481
(0.019)
0.203 Typ
(0.008 Typ)
Mouser Electronics
Authorized Distributor
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CPC1008N CPC1008NTR