TCR2EF18,LM(CT\"\"\"\" - TOSHIBA

TCR2EF series, TCR2EE series

2019-06-20

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Toshiba Electronic Devices & Storage Corporation

TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic

TCR2EF series

TCR2EE series

200 mA CMOS Low Dropout Regulator with Fast Load Transient Response

The TCR2EF and TCR2EE series are CMOS single output voltage

regulators with an on/off control input, featuring low dropout voltage, low

output noise voltage and fast load transient response.

These voltage regulators are available in fixed output voltages between 1.0

V and 5.0 V and capable of driving up to 200 mA. They feature overcurrent

protection, an Auto-discharge function.

The TCR2EF and TCR2EE series has a low dropout voltage of 180 mV

(2.5 V output, IOUT = 150 mA) with low output noise voltage of 35 μVrms (2.5

V output) and a load transient response of only ⊿VOUT = ±60 mV (IOUT =

1 mA⇔150 mA, COUT = 1.0 μF).

Thus, the TCR2EF and TCR2EE series are suitable for sensitive power

supply such as Analog and RF applications.

Features

• Low dropout voltage

VDO = 150 mV (typ.) at 3.0 V output, IOUT = 150 mA

VDO = 180 mV (typ.) at 2.5 V output, IOUT = 150 mA

VDO = 230 mV (typ.) at 1.8 V output, IOUT = 150 mA

VDO = 380 mV (typ.) at 1.2 V output, IOUT = 150 mA

VDO = 510 mV (typ.) at 1.0 V output, IOUT = 150 mA

• Low output noise voltage (VNO = 35 μVrms (typ.) at 2.5 V output, IOUT = 10 mA, 10 Hz < f < 100 kHz)

• Fast load transient response (⊿VOUT = ±60 mV (typ.) at IOUT = 1 mA ⇔ 150 mA, COUT =1.0 μF)

• Low quiescent bias current (IB = 35 μA (typ.) at IOUT = 0 mA)

• High ripple rejection ratio (73 dB (typ.) at 2.5 V output, IOUT = 10 mA, f = 1 kHz)

• Wide range output voltage line up (VOUT = 1.0 to 5.0 V)

• High VOUT accuracy ±1.0 % (1.8 V ≤ VOUT)

• Overcurrent protection

• Auto-discharge

• Pull down connection between CONTROL and GND

• Ceramic capacitors can be used (CIN = 0.1 μF, COUT = 1.0 μF)

• Small package ESV (SOT-553) (1.6 mm x 1.6 mm x 0.55 mm)

General package SMV (SOT-25) (2.8 mm x 2.9 mm x 1.1 mm)

SMV

ESV

Weight :

SMV (SOT

-25)(SC-74A) : 16 mg ( typ.)

ESV (SOT-553) : 3.0 mg ( typ.)

Start of commercial production

2012-

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Toshiba Electronic Devices & Storage Corporation

Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Input voltage V

IN

6.0 V

Control voltage VCT -0.3 to 6.0 V

Output voltage VOUT -0.3 to VIN + 0.3 V

Power dissipation PD

SMV

200 (Note 1)

mW

580 (Note 2)

ESV

150 (Note 1)

320 (Note 3)

Junction temperature Tj 150 °C

Storage temperature range Tstg −55 to 150 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant

change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating

conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the

operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report

and estimated failure rate, etc).

Note 1: Unit Rating

Note 2: Rating at mounting on a board

(FR4 board dimension: 25.4 mm × 25.4 mm × 1.6 mm)

Note 3: Rating at mounting on a board

(FR4 board dimension: 30 mm × 30 mm × 0.8 mm)

Operating Ranges

Note 4: IOUT = 1 mA.

Please refer to Dropout voltage (Page 5) and use it within Absolute Maximum Ratings Junction temperature and

Operation Temperature Ranges.

Note 5: Do not operate at or near the maximum ratings of operating ranges for extended periods of time. Exposure to such

conditions may adversely impact product reliability and results in failures not covered by warranty.

Characteristics Symbol Rating Unit

Input voltage VIN 1.5 to 5.5 V (Note 4) V

Control voltage VCT 0 to 5.5 V

Output voltage VOUT 1.0 to 5.0 V

Output current IOUT DC 200 (Note 5)

mA

Operation Temperature Topr -40 to 85 °C

Output Capacitance COUT

≥

1.0 μF ―

Input Capacitance CIN

≥

0.1 μF ―

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Pin Assignment (top view)

SMV(SOT-25)(SC-74A) ESV(SOT-553)

VOUT

CONTROL

GND

NC

VIN

1

3

2

4

5

VOUT

CONTROL GND

NC

VIN

1

3

2

4

5

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List of Products Number, Output voltage and Marking

Product No. VOUT (V)

(typ.) Marking

Product No. VOUT (V)

(typ.) Marking

SMV(SOT-25) ESV(SOT-553) SMV(SOT-25) ESV(SOT-553)

TCR2EF10 TCR2EE10 1.0 1N0 TCR2EF28 TCR2EE28 2.8 2N8

TCR2EF105 TCR2EE105 1.05 1NA TCR2EF285 TCR2EE285 2.85 2ND

TCR2EF11 TCR2EE11 1.1 1N1 TCR2EF29 TCR2EE29 2.9 2N9

TCR2EF115 TCR2EE115 1.15 1NB - TCR2EE295 2.95 2NE

TCR2EF12 TCR2EE12 1.2 1N2 TCR2EF30 TCR2EE30 3.0 3N0

TCR2EF125 TCR2EE125 1.25 1NC - TCR2EE305 3.05 3NA

TCR2EF13 TCR2EE13 1.3 1N3 TCR2EF31 TCR2EE31 3.1 3N1

TCR2EF135 TCR2EE135 1.35 1ND TCR2EF32 TCR2EE32 3.2 3N2

TCR2EF14 TCR2EE14 1.4 1N4 TCR2EF33 TCR2EE33 3.3 3N3

- TCR2EE145 1.45 1NE - TCR2EE335 3.35 3ND

TCR2EF15 TCR2EE15 1.5 1N5 - TCR2EE34 3.4 3N4

- TCR2EE17 1.7 1N7 - TCR2EE35 3.5 3N5

TCR2EF18 TCR2EE18 1.8 1N8 TCR2EF36 TCR2EE36 3.6 3N6

- TCR2EE185 1.85 1NF - TCR2EE39 3.9 3N9

TCR2EF19 TCR2EE19 1.9 1N9 TCR2EF40 TCR2EE40 4.0 4N0

TCR2EF20 TCR2EE20 2.0 2N0 TCR2EF41 TCR2EE41 4.1 4N1

- TCR2EE24 2.4 2N4 - TCR2EE42 4.2 4N2

TCR2EF25 TCR2EE25 2.5 2N5 TCR2EF45 TCR2EE45 4.5 4N5

TCR2EF27 TCR2EE27 2.7 2N7 - TCR2EE48 4.8 4N8

- TCR2EE275 2.75 2NF TCR2EF50 TCR2EE50 5.0 5N0

Please ask your local retailer about the devices with other output voltages.

Marking (top view)

Example: T

CR2EF33 (3.3 V output) Example: TCR2EE33 (3.3 V output)

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Electrical Characteristics

(Unless otherwise specified,

VIN = VOUT + 1 V, IOUT = 50 mA, CIN = 0.1 μF, COUT = 1.0 μF, Tj = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Output voltage accuracy VOUT IOUT = 50 mA (Note 6)

VOUT < 1.8 V -18 ― +18 mV

1.8 V ≤ VOUT -1.0 ― +1.0 %

Input voltage VIN IOUT = 1 mA 1.5 ― 5.5 V

Line regulation Reg･line VOUT + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 1 mA ― 1 15 mV

Load regulation Reg･load 1 mA ≤ IOUT ≤ 150 mA ― 15 30 mV

Quiescent current IB IOUT = 0 mA ― 35 60 μA

Stand-by current IB (OFF) VCT = 0 V ― 0.1 1.0 μA

Dropout voltage VDO IOUT = 150 mA (Note 7) ― 180 230 mV

Temperature coefficient TCVO −40°C ≤ Topr ≤ 85°C ― 100 ― ppm/°C

Output noise voltage VNO VIN = VOUT + 1 V, IOUT = 10 mA,

10 Hz ≤ f ≤ 100 kHz (Note 7) ― 35 ― μVrms

Ripple rejection ratio R.R. VIN = VOUT + 1 V, IOUT = 10 mA,

f = 1 kHz, VRipple = 500 mVp-p (Note 7) ― 73 ― dB

Load transient response ⊿VOUT IOUT = 1 mA⇔150 mA, COUT = 1.0 μF ― ±60 ― mV

Control voltage (ON) VCT (ON) ― 1.0 ― 5.5 V

Control voltage (OFF) VCT (OFF) ― 0 ― 0.4 V

Note 6: Stable state with fixed IOUT condition

Note 7: The 2.5 V output product

Note 8: All characterisitcs of over 4.5 V output products are measured at VIN = VOUT + 0.5 V conditions.

Dropout voltage (IOUT = 150 mA, CIN = 0.1 μF, COUT = 1.0 μF, Tj = 25°C)

Output voltages Symbol Min Typ. Max Unit

1.0 V, 1.05 V

VDO

― 510 770

mV

1.1 V, 1.15 V ― 440 670

1.2 V, 1.25 V ― 380 570

1.3 V ― 350 470

1.4 V ― 310 420

1.5 V ≤ VOUT < 1.8 V ― 290 390

1.8 V ≤ VOUT < 2.5 V ― 230 310

2.5 V ≤ VOUT < 3.0 V ― 180 230

3.0 V ≤ VOUT ≤ 5.0 V ― 150 200

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Application Note

1. Examples of Application Circuit

SMV ESV

The figures above show the examples of configuration for using a Low dropout regulator. Insert a capacitor at VOUT and

VIN pins for stable input/output operation. (Ceramic capacitors can be used).

2. Power Dissipation

Both unit and board mounted power dissipation ratings for TCR2EF series and TCR2EE series are available in the Absolute

Maximum Ratings table.

Power dissipation is measured on the board shown below.

Test Board for Thermal Resistance

CONTROL pin

connection Operation

HIGH ON

LOW OFF

OPEN OFF

SMV ESV

Ambient temperature Ta (

℃

)

PD – Ta (ESV)

Power dissipation P

D

(mW)

−40

0

0 40 120 80

100

200

300

400

①

②

①Board dimension 30 mm x 30 mm,

x 0.8 mm Copper area 20 mm2,

mounted on FR4 Board

②Unit Rating

*Board material: FR4 board

Board dimension: 30 mm × 30 mm × 0.8 mm

Copper area: 20 mm2

*Board material:

FR4 board

Board dimension: 25.4 mm × 25.4 mm × 1.6 mm

Copper area: 645 mm2

V

OUT

GND

VIN

1.0 μF

0.1

μF

CONTROL

NC

VOUT

GND

VIN

1.0 μF

0.1 μF

CONTROL

NC

Ambient temperature Ta (℃)

PD – Ta (SMV)

Power dissipation PD (mW)

−40 0

0

40 120

80

200

400

600

800

①Board dimension 25.4 mm x 25.4 mm, x

1.6 mm Copper area 645 mm2,

mounted on FR4 Board

②Unit Rating

②

①

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Attention in Use

● Output Capacitors

Ceramic capacitors can be used for these devices. However, because of the type of the capacitors, there might be unexpected

thermal features. Please consider application condition for selecting capacitors. And Toshiba recommends the ESR of ceramic

capacitor be under 10 Ω.

● Mounting

The long distance between IC and output capacitor might affect phase compensation by impedance in wire and inductor. For

stable power supply, output capacitor need to mount near IC as much as possible. Also VIN and GND pattern need to be

large and make the wire impedance small as possible.

● Permissible Loss

Please have enough design patterns for expected maximum permissible loss. And under consideration of ambient

temperature, input voltage, and output current etc., we recommend proper dissipation ratings for maximum permissible loss;

in general maximum dissipation rating is 70 to 80 percent.

● Overcurrent Protection

Overcurrent protection is designed in these products, but this does not assure for the suppression of uprising device operation.

If output pins and GND pins are shorted out, these products might break down.

In use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above

mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum ratings in any

condition. Furthermore, Toshiba recommends inserting failsafe system into the design.

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Representative Typical Characteristics(Note)

1) Output voltage vs. Input voltage

2) Output voltage vs. Output current

Output voltage V

OUT (V)

Output current I

OUT

(mA)

Input voltage VIN (V)

Output voltage V

OUT

(V)

Input voltage VIN (V)

Output voltage V

OUT (V)

Output current IOUT (mA)

Input voltage VIN (V) Input voltage VIN (V)

VIN = 2.2 V,

CIN = 0.1 μF, COUT = 1 μF

VIN = 2.8 V,

CIN = 0.1 μF, COUT = 1 μF

VOUT = 1.2 V VOUT = 1.8 V

VOUT = 1.2 V

VOUT = 1.8 V

VOUT = 2.5 V

CIN = 0.1 μF, COUT = 1 μF

I

OUT

= 1mA

I

OUT

= 150mA

I

OUT

= 50mA

CIN = 0.1 μF, COUT = 1 μF

VOUT = 3.0 V

CIN = 0.1 μF, COUT = 1 μF

I

OUT

= 1mA

I

OUT

= 150mA

I

OUT

= 50mA

I

OUT

= 1mA

I

OUT

= 150mA

I

OUT

= 50mA

I

OUT

= 1mA

I

OUT

= 150mA

I

OUT

= 50mA

Output voltage V

OUT

(V)

Output voltage V

OUT

(V)

Output voltage V

OUT (V)

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3) Output voltage vs. Ambient temperature

Output voltage V

OUT (V)

Output current I

OUT

(mA)

VIN = 3.5 V,

CIN = 0.1 μF, COUT = 1 μF

VIN = 4.0 V,

CIN = 0.1 μF, COUT = 1 μF

Output voltage V

OUT (V)

Output current IOUT (mA)

VOUT = 2.5 V

VOUT = 3.0 V

VOUT = 1.2 V

VOUT = 1.8 V

VOUT = 2.5 V

VOUT = 3.0 V

VIN = 2.2 V,

CIN = 0.1 μF, COUT = 1 μF

IOUT = 50 mA

VIN = 2.8 V,

CIN = 0.1 μF, COUT = 1 μF

IOUT = 50 mA

VIN = 3.5 V,

CIN = 0.1 μF, COUT = 1 μF

IOUT = 50 mA

VIN = 4.0 V,

CIN = 0.1 μF, COUT = 1 μF

IOUT = 50 mA

Output voltage V

OUT (V)

Ambient temperature T

a

(°C)

Output voltage V

OUT (V)

Ambient temperature Ta (°C)

Output voltage V

OUT (V)

Output voltage V

OUT (V)

Ambient temperature Ta (°C)

Ambient temperature T

a

(°C)

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4) Dropout voltage vs. Output current

5) Quiescent current vs. Input voltage

CIN = 0.1 μF, COUT = 1 μF CIN = 0.1 μF, COUT = 1 μF

VOUT = 1.2 V

VOUT = 1.8 V

Dropout voltage V

DO

(mV)

Output current IOUT (mA)

Quiescent current I

B

(μA)

VOUT = 1.2 V

VOUT = 1.8 V

Input voltage VIN (V)

Quiescent current I

B

(μA)

Input voltage VIN (V)

VOUT = 2.5 V

VOUT = 3.0 V

Dropout voltage V

DO

(mV)

Output current IOUT (mA)

Dropout voltage V

DO

(mV)

Output current IOUT (mA)

Dropout voltage V

DO

(mV)

Output current IOUT (mA)

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

CIN = 0.1 μF, COUT = 1 μF CIN = 0.1 μF, COUT = 1 μF

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6) Quiescent current vs. Ambient temperature

VOUT = 1.2 V

VOUT = 1.8 V

VOUT = 2.5 V

VOUT = 3.0 V

VIN = 2.2 V

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

VIN = 2.8 V

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

VIN = 3.5 V

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

VIN = 4.0 V

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

Quiescent current I

B (μA)

Quiescent current I

B (μA)

Quiescent current I

B (μA)

Quiescent current I

B (μA)

Ambient temperature T

a

(°C)

Ambient temperature T

a

(°C)

Ambient temperature Ta (°C)

Ambient temperature T

a

(°C)

V

OUT

= 2.5 V

V

OUT

= 3.0 V

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

CIN = 0.1 μF, COUT = 1 μF

IOUT = 0 mA

Input voltage VIN (V) Input voltage VIN (V)

Quiescent current I

B

(μA)

Quiescent current I

B (μA)

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7) Output voltage vs. Output current

8) Ripple rejection ratio vs. Frequency

V

IN

= 2.2 V ,V

ripple

= 500 mV

p−p

CIN = none, COUT = 1 μF

IOUT = 10 mA, Ta = 25°C

V

IN

= 4.0 V, V

ripple

= 500 mV

p−p

CIN = none, COUT = 1 μF

IOUT = 10 mA, Ta = 25°C

VOUT = 1.2 V

VOUT = 3.0 V

VOUT = 1.2 V

VOUT = 1.8 V

VOUT = 2.5 V

VOUT = 3.0 V

Pulse width = 1 ms

V

IN

= 5.5V

Output voltage V

OUT (V)

Output current IOUT (mA)

Output voltage V

OUT

(V)

Output current I

OUT

(mA)

Output voltage V

OUT

(V)

Output current IOUT (mA)

Output voltage V

OUT (V)

Output current IOUT (mA)

Ripple rejection ratio (dB)

Frequency f (Hz)

Ripple rejection

ratio (dB)

Frequency f (Hz)

V

IN

= 2.2V

V

IN

= 5.5V

VIN = 2.8V

VIN = 5.5V VIN = 5.5V

VIN = 3.5V VIN = 4.0V

Pulse width = 1 ms

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9) Control Transient Response

Control voltage

VCT (V)

Output voltage

VOUT (V)

V

IN

= 2.2 V,

CIN = 0.1 μF, COUT = 1 μF

I

OUT

= 1mA

VOUT = 1.2 V

V

OUT

= 1.8 V

VOUT = 2.5 V

VOUT = 3.0 V

0

1.0

2.0

0

1.0

2.0

0

1.0

2.0

0

1.0

2.0

0

1.0

2.0

0

1.0

2.0

V

IN

= 2.8 V,

CIN = 0.1 μF, COUT = 1 μF

0

1.0

2.0

0

1.0

2.0

V

IN

= 3.5 V,

CIN = 0.1 μF, COUT = 1 μF

V

IN

= 4.0 V,

CIN = 0.1 μF, COUT = 1 μF

3.0

Time t (25 μs/div)

I

OUT

= 50mA

I

OUT

= 150mA

I

OUT

= 1mA

IOUT = 50

mA

I

OUT

= 150mA

I

OUT

= 1mA

I

OUT

= 50mA

IOUT = 150

mA

I

OUT

= 1mA

I

OUT

= 50mA

I

OUT = 150

mA

Control voltage

VCT (V)

Output voltage

VOUT (V)

Control voltage

VCT (V)

Output voltage

VOUT (V)

Control voltage

VCT (V)

Output voltage

VOUT (V)

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10) Control Transient Response

(Note) The above characteristics curves are presented for reference only and not guaranteed by production

test, unless otherwise noted.

V

IN

= 2.2 V,

CIN = 0.1 μF, COUT = 1 μF

V

IN

= 2.8 V,

CIN = 0.1 μF, COUT = 1 μF

V

IN

= 3.5 V,

CIN = 0.1 μF, COUT = 1 μF

0

200

400

1.2

1.3

1.1

0

200

400

2.5

2.6

2.4

0

200

400

1.8

1.9

1.7

0

200

400

3.0

3.1

2.9

V

IN

= 4.0 V,

CIN = 0.1 μF, COUT = 1 μF

Output current

IOUT (mA)

Output voltage

⊿VOUT (V)

Time t (25 μs/div)

V

OUT

= 1.2 V

(IOUT = 1 mA

⇔

150 mA)

V

OUT

= 1.8 V

(IOUT = 1 mA

⇔

150 mA)

V

OUT

= 2.5 V

(IOUT = 1 mA

⇔

150 mA)

V

OUT

= 3.0 V

(IOUT = 1 mA

⇔

150 mA)

Time t (25 μs/div)

Output current

IOUT (mA)

Output voltage

⊿VOUT (V)

Output current

IOUT (mA)

Output voltage

⊿VOUT (V)

Output current

IOUT (mA)

Output voltage

⊿VOUT (V)

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Package Dimensions

SMV (SOT-25)(SC-74A) Unit: mm

Weight : 16 mg (typ.)

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Package Dimensions

ESV (SOT-553) Unit: mm

Weight: 3.0 mg (typ.)

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RESTRICTIONS ON PRODUCT USE

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Hardware, software and systems described in this document are collectively referred to as “Product”.

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

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written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for

complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to

property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the

Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information,

including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and

conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product

will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited

to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the

applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any

other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,

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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR

PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2)

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INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE,

ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for

the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass

destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations

including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export

and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and

regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please

use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including

without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT

OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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