LM2841XQMK/NOPB - NATIONAL SEMICONDUCTOR

LM2840,LM2841,LM2842

LM2840/LM2841/LM2842/ LM2840Q/LM2841Q/LM2842Q 100/300/600 mA Input

Step-Down DC/DC Regulator in Thin SOT-23

Literature Number: SNVS540F

LM2840/LM2841/LM2842/

LM2840Q/LM2841Q/

LM2842Q

August 23, 2011

100/300/600 mA Input Step-Down DC/DC Regulator in Thin

SOT-23

General Description

The LM2840, LM2841 and LM2842 are PWM DC/DC buck

(step-down) regulators. With a wide input range from

4.5V-42V, they are suitable for a wide range of applications

such as power conditioning from unregulated sources. They

feature a low RDSON (0.9Ω typical) internal switch for maxi-

mum efficiency (85% typical). Operating frequency is fixed at

550 kHz (X version) and 1.25 MHz (Y version) allowing the

use of small external components while still being able to have

low output voltage ripple. Soft-start can be implemented using

the shutdown pin with an external RC circuit allowing the user

to tailor the soft-start time to a specific application.

The LM2840 is optimized for up to 100 mA, the LM2841 for

300 mA and the LM2842 is optimized for up to 600 mA load

currents. They all have a 0.765V nominal feedback voltage.

Additional features include: thermal shutdown, VIN under-volt-

age lockout, and gate drive under-voltage lockout. The

LM2840, LM2841 and LM2842 are available in a low profile

TSOT-6L package.

Features

■LM2840Q, LM2841Q and LM2842Q are Automotive

Grade products that are AEC-Q100 grade 1 qualified (-40°

C to +125°C operating junction temperature)

■Input voltage range of 4.5V to 42V

■Output current options of 100 mA, 300 mA and 600 mA

■Feedback pin voltage of 0.765V

■550 kHz (X) or 1.25 MHz (Y) switching frequency

■Low shutdown IQ, 16 µA typical

■Short circuit protected

■Internally compensated

■Soft-start circuitry

■Small overall solution size (TSOT-6L package)

Applications

■Battery powered equipment

■Industrial distributed power applications

■Portable media players

■Portable hand held instruments

Typical Application Circuit

30036702

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q 100 / 300 / 600 mA Input Step-Down DC/

DC Regulator in Thin SOT-23

Connection Diagram

Top View

30036704

TSOT 6 Lead

NS Package Number MK06A

Ordering Information

Order Number Spec. Package

Type

NSC

Package

Drawing

Top Mark Supplied As Feature

LM2840XMK-ADJL

NOPB TSOT-6 MK06A

SE8B 1000 Units, Tape and Reel

LM2840XMKX-ADJL 3000 Units, Tape and Reel

LM2840YMK-ADJL SF1B 1000 Units, Tape and Reel

LM2840YMKX-ADJL 3000 Units, Tape and Reel

LM2841XMK-ADJL STFB 1000 Units, Tape and Reel

LM2841XMKX-ADJL 3000 Units, Tape and Reel

LM2841YMK-ADJL STTB 1000 Units, Tape and Reel

LM2841YMKX-ADJL 3000 Units, Tape and Reel

LM2842XMK-ADJL STVB 1000 Units, Tape and Reel

LM2842XMKX-ADJL 3000 Units, Tape and Reel

LM2842YMK-ADJL STXB 1000 Units, Tape and Reel

LM2842YMKX-ADJL 3000 Units, Tape and Reel

LM2840XQMK SE9B 1000 Units, Tape and Reel

AEC-Q100 Grade 1

qualified. Automotive

Grade Production

Flow*

LM2840XQMKX 3000 Units, Tape and Reel

LM2840YQMK SF2B 1000 Units, Tape and Reel

LM2840YQMKX 3000 Units, Tape and Reel

LM2841XQMK SB1B 1000 Units, Tape and Reel

LM2841XQMKX 3000 Units, Tape and Reel

LM2841YQMK SB2B 1000 Units, Tape and Reel

LM2841YQMKX 3000 Units, Tape and Reel

LM2842XQMK SB3B 1000 Units, Tape and Reel

LM2842XQMKX 3000 Units, Tape and Reel

LM2842YQMK SB4B 1000 Units, Tape and Reel

LM2842YQMKX 3000 Units, Tape and Reel

*Automotive Grade (Q) product incorporates enhanced manufacturing and support processes for the automotive market, including defect detection methodologies.

Reliability qualification is compliant with the requirements and temperature grades defined in the AEC-Q100 standard. Automotive grade products are identified

with the letter Q. For more information go to http://www.national.com/automotive.

www.national.com 2

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Pin Descriptions

Pin Name Function

1 CB SW FET gate bias voltage. Connect CBOOT cap between CB and SW.

2 GND Ground connection.

3 FB Feedback pin: Set feedback voltage divider ratio with VOUT = VFB (1+(R1/R2)). Resistors should

be in the 100-10K range to avoid input bias errors.

4 SHDN Logic level shutdown input. Pull to GND to disable the device and pull high to enable the device.

If this function is not used tie to VIN or leave open.

5 VIN Power input voltage pin: 4.5V to 42V normal operating range.

6 SW Power FET output: Connect to inductor, diode, and CBOOT cap.

3 www.national.com

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN -0.3V to +45V

SHDN -0.3V to (VIN+0.3V)

SHDN=VIN at 45V max

SW Voltage -0.3V to +45V

CB Voltage above SW Voltage 7V

FB Voltage -0.3V to +5V

Maximum Junction

Temperature

150°C

Power Dissipation(Note 2) Internally Limited

Lead Temperature 300°C

Vapor Phase (60 sec.) 215°C

Infrared (15 sec.) 220°C

ESD Susceptibility

(Note 3)

Human Body Model 2 kV

Operating Conditions

Operating Junction

Temperature Range (Note 4) −40°C to +125°C

Storage Temperature −65°C to +150°C

Input Voltage VIN 4.5V to 42V

SW Voltage Up to 42V

Electrical Characteristics

Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature

Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical

values represent the most likely parametric norm at TJ = +25°C, and are provided for reference purposes only. Unless otherwise

stated the following conditions apply: VIN = 12V.

Symbol Parameter Conditions Min (Note 4)Typ (Note 5)Max (Note 4)Units

IQQuiescent current SHDN = 0V 16 40 µA

Device On, Not Switching 1.30 1.75 mA

Device On, No Load 1.35 1.85

RDSON Switch ON resistance (Note 6) 0.9 1.6 Ω

ILSW Switch leakage current VIN = 42V 0.0 0.5 µA

ICL Switch current limit LM2840 (Note 7) 525 900 mA

LM2841 (Note 7) 525 900 mA

LM2842 (Note 7) 1.15 1.7 A

IFB Feedback pin bias current LM2840/41/42 (Note 8) 0.1 1.0 µA

VFB FB Pin reference voltage 0.747 0.765 0.782 V

tON(min) Minimum ON time (Note 10) 100 150 ns

tOFF(min) Minimum OFF time X option 110 370 ns

Y option 104 200 ns

fSW

Switching frequency

LM2840/41/42X, VFB = 0.5V 325 550 750 kHz

LM2840/41/42X, VFB = 0V 140

LM2840/41/42Y, VFB = 0.5V 0.95 1.25 1.50 MHz

LM2840/41/42Y, VFB = 0V 0.35

DMAX Maximum duty cycle LM2840/41/42X 88 94 %

LM2840/41/42Y 81 87

VUVP Undervoltage lockout

thresholds

On threshold 4.4 3.7 V

Off threshold 3.5 3.25

VSHDN Shutdown threshold Device on 2.3 1.0 V

Device off 0.9 0.3

ISHDN Shutdown pin input bias current VSHDN = 2.3V (Note 8) 0.05 1.5 µA

VSHDN = 0V 0.02 1.5

THERMAL SPECIFICATIONS

RθJA Junction-to-Ambient Thermal

Resistance, TSOT-6L Package

(Note 9) 121 °C/W

RθJC Junction-to-Case Thermal

Resistance, TSOT-6L Package

94 °C/W

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended

to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance,

θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/

θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=175°C (typ.) and disengages at TJ= 155°C (typ).

Note 3: Human Body Model, applicable std. JESD22-A114-C.

Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%

production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used

to calculate Average Outgoing Quality Level (AOQL).

Note 5: Typical numbers are at 25°C and represent the most likely norm.

Note 6: Includes the bond wires, RDSON from VIN pin to SW pin.

Note 7: Current limit at 0% duty cycle. May be lower at higher duty cycle or input voltages below 6V.

Note 8: Bias currents flow into pin.

Note 9: All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards.

Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient

temperature, and air flow.

Note 10: Minimum On Time guaranteed by design and simulation.

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Typical Performance Characteristics

Efficiency vs. Load Current

(LM2842X, VOUT = 3.3V)

30036718

Efficiency vs. Load Current

(LM2841X, VOUT = 3.3V)

30036719

Efficiency vs. Load Current

(LM2840X, VOUT = 8V)

30036720

Switching Frequency vs. Temperature

(X version)

30036766

Input UVLO Voltage vs. Temperature

30036767

Switch Current Limit vs. SHDN Pin Voltage

(Soft-start Implementation, LM2840/41)

30036768

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Switch Current Limit vs. SHDN Pin Voltage

(Soft-start Implementation, LM2842)

30036721

SHDN Pin Current vs. SHDN Pin Voltage

30036769

Switching Node and Output Voltage Waveforms

30036770

VIN = 12V, VOUT = 3.3V, IOUT = 200 mA

Top trace: VOUT, 10 mV/div, AC Coupled

Bottom trace: SW, 5V/div, DC Coupled

T = 1 µs/div

Load Transient Waveforms

30036771

VIN = 12V, VOUT = 3.3V, IOUT = 300 mA to 200 mA to 300 mA

Top trace: VOUT, 20 mV/div, AC Coupled

Bottom trace: IOUT, 100 mA/div, DC Coupled

T = 200 µs/div

Start-up Waveform

30036772

VIN = 12V, VOUT = 3.3V, IOUT = 50 mA

Top trace: VOUT, 1V/div, DC Coupled

Bottom trace: SHDN, 2V/div, DC Coupled

T = 40 µs/div

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Block Diagram

30036703

Operation

PROTECTION

The LM2840/1/2 has dedicated protection circuitry running

during normal operation to protect the IC. The thermal shut-

down circuitry turns off the power device when the die tem-

perature reaches excessive levels. The UVLO comparator

protects the power device during supply power startup and

shutdown to prevent operation at voltages less than the min-

imum input voltage. A gate drive (CB) under-voltage lockout

is included to guarantee that there is enough gate drive volt-

age to drive the MOSFET before the device tries to start

switching. The LM2840/1/2 also features a shutdown mode

decreasing the supply current to approximately 16 µA.

CONTINUOUS CONDUCTION MODE

The LM2840/1/2 contains a current-mode, PWM buck regu-

lator. A buck regulator steps the input voltage down to a lower

output voltage. In continuous conduction mode (when the in-

ductor current never reaches zero at steady state), the buck

regulator operates in two cycles. The power switch is con-

nected between VIN and SW. In the first cycle of operation the

transistor is closed and the diode is reverse biased. Energy

is collected in the inductor and the load current is supplied by

COUT and the rising current through the inductor. During the

second cycle the transistor is open and the diode is forward

biased due to the fact that the inductor current cannot instan-

taneously change direction. The energy stored in the inductor

is transferred to the load and output capacitor. The ratio of

these two cycles determines the output voltage. The output

voltage is defined approximately as: D=VOUT/VIN and D’ = (1-

D) where D is the duty cycle of the switch. D and D' will be

required for design calculations.

DESIGN PROCEDURE

This section presents guidelines for selecting external com-

ponents.

SETTING THE OUTPUT VOLTAGE

The output voltage is set using the feedback pin and a resistor

divider connected to the output as shown on the front page

schematic. The feedback pin voltage is 0.762V, so the ratio

of the feedback resistors sets the output voltage according to

the following equation: VOUT=0.765V(1+(R1/R2)) Typically

R2 will be given as 100Ω-10 kΩ for a starting value. To solve

for R1 given R2 and VOUT use R1=R2((VOUT/0.765V)-1).

INPUT CAPACITOR

A low ESR ceramic capacitor (CIN) is needed between the

VIN pin and GND pin. This capacitor prevents large voltage

transients from appearing at the input. Use a 2.2 µF-10 µF

value with X5R or X7R dielectric. Depending on construction,

a ceramic capacitor’s value can decrease up to 50% of its

nominal value when rated voltage is applied. Consult with the

capacitor manufacturer's data sheet for information on ca-

pacitor derating over voltage and temperature.

INDUCTOR SELECTION

The most critical parameters for the inductor are the induc-

tance, peak current, and the DC resistance. The inductance

is related to the peak-to-peak inductor ripple current, the input

and the output voltages.

A higher value of ripple current reduces inductance, but in-

creases the conductance loss, core loss, and current stress

for the inductor and switch devices. It also requires a bigger

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

output capacitor for the same output voltage ripple require-

ment. A reasonable value is setting the ripple current to be

30% of the DC output current. Since the ripple current in-

creases with the input voltage, the maximum input voltage is

always used to determine the inductance. The DC resistance

of the inductor is a key parameter for the efficiency. Lower DC

resistance is available with a bigger winding area. A good

tradeoff between the efficiency and the core size is letting the

inductor copper loss equal 2% of the output power. See

AN-1197 for more information on selecting inductors. A good

starting point for most applications is a 10 µH to 22 µH with

1.1A or greater current rating for the LM2842 or a 0.7A or

greater current rating for the LM2840/41. Using such a rating

will enable the LM2840/1/2 to current limit without saturating

the inductor. This is preferable to the LM2840/1/2 going into

thermal shutdown mode and the possibility of damaging the

inductor if the output is shorted to ground or other longterm

overload.

OUTPUT CAPACITOR

The selection of COUT is driven by the maximum allowable

output voltage ripple. The output ripple in the constant fre-

quency, PWM mode is approximated by: VRIPPLE = IRIPPLE

(ESR+(1/(8fSWCOUT))) The ESR term usually plays the dom-

inant role in determining the voltage ripple. Low ESR ceramic

capacitors are recommended. Capacitors in the range of 22

µF-100 µF are a good starting point with an ESR of 0.1Ω or

less.

BOOTSTRAP CAPACITOR

A 0.15 µF ceramic capacitor or larger is recommended for the

bootstrap capacitor (CBOOT). For applications where the input

voltage is less than twice the output voltage a larger capacitor

is recommended, generally 0.15 µF to 1 µF to ensure plenty

of gate drive for the internal switches and a consistently low

RDSON.

SOFT-START COMPONENTS

The LM2840/1/2 has circuitry that is used in conjunction with

the SHDN pin to limit the inrush current on start-up of the DC/

DC switching regulator. The SHDN pin in conjunction with a

RC filter is used to tailor the soft-start for a specific application.

When a voltage applied to the SHDN pin is between 0V and

up to 2.3V it will cause the cycle by cycle current limit in the

power stage to be modulated for minimum current limit at 0V

up to the rated current limit at 2.3V. Thus controlling the output

rise time and inrush current at startup. The resistor value

should be selected so the current sourced into the SHDN pin

will be greater then the leakage current of the SHDN pin (1.5

µA ) when the voltage at SHDN is equal or greater then 2.3V.

SHUTDOWN OPERATION

The SHDN pin of the LM2840/1/2 is designed so that it may

be controlled using 2.3V or higher logic signals. If the shut-

down function is not to be used the SHDN pin may be tied to

VIN. The maximum voltage to the SHDN pin should not ex-

ceed 42V. If the use of a higher voltage is desired due to

system or other constraints it may be used, however a 100

kΩ or larger resistor is recommended between the applied

voltage and the SHDN pin to protect the device.

SCHOTTKY DIODE

The breakdown voltage rating of the diode (D1) is preferred

to be 25% higher than the maximum input voltage. The cur-

rent rating for the diode should be equal to the maximum

output current for best reliability in most applications. In cases

where the input voltage is much greater than the output volt-

age the average diode current is lower. In this case it is

possible to use a diode with a lower average current rating,

approximately (1-D)IOUT, however the peak current rating

should be higher than the maximum load current. A 0.5A to

1A rated diode is a good starting point.

LAYOUT CONSIDERATIONS

To reduce problems with conducted noise pick up, the ground

side of the feedback network should be connected directly to

the GND pin with its own connection. The feedback network,

resistors R1 and R2, should be kept close to the FB pin, and

away from the inductor to minimize coupling noise into the

feedback pin. The input bypass capacitor CIN must be placed

close to the VIN pin. This will reduce copper trace resistance

which effects input voltage ripple of the IC. The inductor L1

should be placed close to the SW pin to reduce magnetic and

electrostatic noise. The output capacitor, COUT should be

placed close to the junction of L1 and the diode D1. The L1,

D1, and COUT trace should be as short as possible to reduce

conducted and radiated noise and increase overall efficiency.

The ground connection for the diode, CIN, and COUT should

be as small as possible and tied to the system ground plane

in only one spot (preferably at the COUT ground point) to min-

imize conducted noise in the system ground plane. For more

detail on switching power supply layout considerations see

Application Note AN-1149: Layout Guidelines for Switching

Power Supplies.

9 www.national.com

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Application Information

30036705

FIGURE 1. Application Circuit, 3.3V Output @ 100 mA

Some Recommended Inductors (Others May Be Used)

Manufacturer Inductor Contact Information

Coilcraft LPS4018, DO1608C, DO3308, and LPO2506 series www.coilcraft.com

800-3222645

MuRata LQH55D and LQH66S series www.murata.com

Coiltronics MP2 and MP2A series www.cooperbussman.com

Some Recommended Input And Output Capacitors (Others May Be Used)

Manufacturer Capacitor Contact Information

Vishay Sprague 293D, 592D, and 595D series tantalum www.vishay.com

407-324-4140

Taiyo Yuden High capacitance MLCC ceramic www.t-yuden.com

408-573-4150

Cornell Dubilier ESRD seriec Polymer Aluminum Electrolytic

SPV and AFK series V-chip series www.cde.com

MuRata High capacitance MLCC ceramic www.murata.com

30036708

FIGURE 2. Application Circuit, 5V Output

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

30036709

FIGURE 3. Application Circuit, 12V Output

30036716

FIGURE 4. Application Circuit, 15V Output

30036717

FIGURE 5. Application Circuit, 0.8V Output

11 www.national.com

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Physical Dimensions inches (millimeters) unless otherwise noted

TSOT 6 Pin Package (MK)

For Ordering, Refer to Ordering Information Table

NS Package Number MK06A

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LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Notes

13 www.national.com

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q

Notes

LM2840/LM2841/LM2842/LM2840Q/LM2841Q/LM2842Q 100 / 300 / 600 mA Input Step-Down DC/

DC Regulator in Thin SOT-23

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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

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