SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DMeets or Exceeds TIA/EIA-232-F and ITU
Recommendation V.28
DOperates From a Single 5-V Power Supply
With 1.0-mF Charge-Pump Capacitors
DOperates Up To 120 kbit/s
DTwo Drivers and Two Receivers
D±30-V Input Levels
DLow Supply Current ...8 mA Typical
DESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
DUpgrade With Improved ESD (15-kV HBM)
and 0.1-mF Charge-Pump Capacitors is
Available With the MAX202
DApplications
− TIA/EIA-232-F, Battery-Powered Systems,
Terminals, Modems, and Computers
description/ordering information
The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F
voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.
These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs.
Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and
voltage-generator functions are available as cells in the Texas Instruments LinASIC library.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (N) Tube of 25 MAX232N MAX232N
SOIC (D)
Tube of 40 MAX232D
MAX232
0°C to 70°C
SOIC (D) Reel of 2500 MAX232DR MAX232
0°C to 70°C
SOIC (DW)
Tube of 40 MAX232DW
MAX232
SOIC (DW) Reel of 2000 MAX232DWR MAX232
SOP (NS) Reel of 2000 MAX232NSR MAX232
PDIP (N) Tube of 25 MAX232IN MAX232IN
SOIC (D)
Tube of 40 MAX232ID
MAX232I
−40°C to 85°CSOIC (D) Reel of 2500 MAX232IDR MAX232I
−40 C to 85 C
SOIC (DW)
Tube of 40 MAX232IDW
MAX232I
SOIC (DW)
Reel of 2000 MAX232IDWR
MAX232I
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinASIC is a trademark of Texas Instruments.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
VS+
C1−
C2+
C2−
VS−
T2OUT
R2IN
VCC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
MAX232 . . . D, DW, N, OR NS PACKAGE
MAX232I . . . D, DW, OR N PACKAGE
(TOP VIEW)
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Function Tables
EACH DRIVER
INPUT
TIN OUTPUT
TOUT
L H
H L
H = high level, L = low
level
EACH RECEIVER
INPUT
RIN OUTPUT
ROUT
L H
H L
H = high level, L = low
level
logic diagram (positive logic)
T1IN T1OUT
R1INR1OUT
T2IN T2OUT
R2INR2OUT
11
10
12
9
14
7
13
8
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Input supply voltage range, VCC (see Note 1) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive output supply voltage range, VS+ V
CC − 0.3 V to 15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative output supply voltage range, VS− −0.3 V to −15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver ±30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO: T1OUT, T2OUT VS− − 0.3 V to VS+ + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
R1OUT, R2OUT −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Short-circuit duration: T1OUT, T2OUT Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 57°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage (T1IN,T2IN) 2 V
VIL Low-level input voltage (T1IN, T2IN) 0.8 V
R1IN, R2IN Receiver input voltage ±30 V
TA
Operating free-air temperature
MAX232 0 70
°C
T
A
Operating free-air temperature
MAX232I −40 85 °
C
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYP‡MAX UNIT
ICC Supply current VCC = 5.5 V,
TA = 25°CAll outputs open, 8 10 mA
‡All typical values are at VCC = 5 V and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ±0.5 V.
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature range (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage T1OUT, T2OUT RL = 3 kΩ to GND 5 7 V
VOL Low-level output voltage‡T1OUT, T2OUT RL = 3 kΩ to GND −7 −5 V
roOutput resistance T1OUT, T2OUT VS+ = VS− = 0, VO = ±2 V 300 Ω
IOS§Short-circuit output current T1OUT, T2OUT VCC = 5.5 V, VO = 0 ±10 mA
IIS Short-circuit input current T1IN, T2IN VI = 0 200 µA
†All typical values are at VCC = 5 V, TA = 25°C.
‡The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
§Not more than one output should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ±0.5 V.
switching characteristics, VCC = 5 V, TA = 25°C (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Driver slew rate RL = 3 kΩ to 7 kΩ,
See Figure 2 30 V/µs
SR(t) Driver transition region slew rate See Figure 3 3 V/µs
Data rate One TOUT switching 120 kbit/s
NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ±0.5 V.
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature range (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage R1OUT, R2OUT IOH = −1 mA 3.5 V
VOL Low-level output voltage‡R1OUT, R2OUT IOL = 3.2 mA 0.4 V
VIT+ Receiver positive-going input
threshold voltage R1IN, R2IN VCC = 5 V, TA = 25°C 1.7 2.4 V
VIT− Receiver negative-going input
threshold voltage R1IN, R2IN VCC = 5 V, TA = 25°C 0.8 1.2 V
Vhys Input hysteresis voltage R1IN, R2IN VCC = 5 V 0.2 0.5 1 V
riReceiver input resistance R1IN, R2IN VCC = 5, TA = 25°C 3 5 7 kΩ
†All typical values are at VCC = 5 V, TA = 25°C.
‡The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ±0.5 V.
switching characteristics, VCC = 5 V, TA = 25°C (see Note 4 and Figure 1)
PARAMETER TYP UNIT
tPLH(R) Receiver propagation delay time, low- to high-level output 500 ns
tPHL(R) Receiver propagation delay time, high- to low-level output 500 ns
NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ±0.5 V.
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
≤10 ns
VCC
R1IN
or
R2IN
R1OUT
or
R2OUT
RL = 1.3 kΩ
See Note C
CL = 50 pF
(see Note B)
TEST CIRCUIT
≤10 ns
Input
Output
tPHL tPLH
1.5 V VOL
VOH
0 V
3 V
10% 90%
50%
500 ns
WAVEFORMS
1.5 V
90%
50% 10%
NOTES: A. The pulse generator has the following characteristics: Z O = 50 Ω, duty cycle ≤ 50%.
B. CL includes probe and jig capacitance.
C. All diodes are 1N3064 or equivalent.
Pulse
Generator
(see Note A)
Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
T1IN or T2IN T1OUT or T2OUT
CL = 10 pF
(see Note B)
TEST CIRCUIT
≤10 ns≤10 ns
Input
Output
tPHL tPLH
VOL
VOH
0 V
3 V
10%
90%
50%
5 µs
WAVEFORMS
90%
50% 10%
RL
90%
10%
90%
10%
tTLH
tTHL
SR +
0.8 (VOH –V
OL)
tTLH or 0.8 (VOL –V
OH)
tTHL
NOTES: A. The pulse generator has the following characteristics: Z O = 50 Ω, duty cycle ≤ 50%.
B. CL includes probe and jig capacitance.
Pulse
Generator
(see Note A) EIA-232 Output
Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-µs Input)
EIA-232 Output
−3 V 3 V
−3 V
3 V
3 kΩ
10%
1.5 V
90%
WAVEFORMS
20 µs
1.5 V
90%
10%
VOH
VOL
tTLH
tTHL
≤10 ns ≤10 ns
TEST CIRCUIT
CL = 2.5 nF
Pulse
Generator
(see Note A)
Input
Output
SR +6V
tTHL or tTLH
NOTE A: The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-µs Input)
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
1 µF
1 µFVS+
VS−
2
6
14
7
13
8
C1+
C1−
C2+
C2−
1
3
4
5
11
10
12
9
GND
15
0 V
VCC
16
5 V
EIA-232 Output
EIA-232 Output
EIA-232 Input
EIA-232 Input
1 µF
8.5 V
−8.5 V
1 µF
From CMOS or TTL
To CMOS or TTL
CBYPASS = 1 µF
C1
C2
C3†
C4
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown. In addition to the 1-µF capacitors shown, the MAX202 can operate with 0.1-µF capacitors.
+
+
−
Figure 4. Typical Operating Circuit
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX232D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ID ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232IN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX232INE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MAX232N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MAX232NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MAX232NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232NSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
MAX232DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232DWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
MAX232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX232DR SOIC D 16 2500 367.0 367.0 38.0
MAX232DR SOIC D 16 2500 333.2 345.9 28.6
MAX232DWR SOIC DW 16 2000 366.0 364.0 50.0
MAX232DWRG4 SOIC DW 16 2000 367.0 367.0 38.0
MAX232IDR SOIC D 16 2500 333.2 345.9 28.6
MAX232IDWR SOIC DW 16 2000 366.0 364.0 50.0
MAX232NSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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