CM1000DU-34NF
Mega Power Dual™ IGBTMOD
1000 Amperes/1700 Volts
2 02/10 Rev. 1
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Ratings Symbol CM1000DU-34NF Units
Junction Temperature Tj -40 to 150 °C
Storage Temperature Tstg -40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1700 Volts
Gate-Emitter Voltage (C-E SHORT) VGES ±20 Volts
Collector Current DC (TC' = 104°C)** IC 1000 Amperes
Peak Collector Current (Tj ≤ 150°C) ICM 2000* Amperes
Emitter Current (TC = 25°C)*** IE 1000 Amperes
Peak Emitter Current*** IEM 2000* Amperes
Maximum Collector Dissipation (Tj < 150°C) (TC = 25°C) PC 3900 Watts
Mounting Torque, M6 Mounting Screws – 40 in-lb
Mounting Torque, M6 Main Terminal Screw – 40 in-lb
Weight (Typical) – 1400 Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) Viso 3500 Volts
Static Electrical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 1 mA
Gate Leakage Current IGES V
GE = VGES, VCE = 0V – – 5 µA
Gate-Emitter Threshold Voltage VGE(th) I
C = 100mA, VCE = 10V 5.5 7.0 8.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) I
C = 1000A, VGE = 15V, Tj = 25°C – 2.2 2.8 Volts
(Without Lead Resistance) (Chip) IC = 1000A, VGE = 15V, Tj = 125°C – 2.45 – Volts
Module Lead Resistance R(lead) I
C = 1000A, Terminal-chip – 0.286 – mΩ
Total Gate Charge QG V
CC = 1000V, IC = 1000A, VGE = 15V – 6000 – nC
Emitter-Collector Voltage*** VEC I
E = 1000A, VGE = 0V – 2.3 3 Volts
Dynamic Electrical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies – – 220 nF
Output Capacitance Coes V
CE = 10V, VGE = 0V – – 25 nF
Reverse Transfer Capacitance Cres – – 4.7 nF
Inductive Turn-on Delay Time td(on) V
CC = 1000V, – – 600 ns
Load Rise Time tr I
C = 1000A, IE = 1000A, – – 150 ns
Switch Turn-off Delay Time td(off) V
GE1 = VGE2 = 15V, – – 900 ns
Times Fall Time tf R
G = 0.47Ω, – – 200 ns
Diode Reverse Recovery Time*** trr Inductive Load – – 450 ns
Diode Reverse Recovery Charge*** Qrr Switching Operation – 90 – µC
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.
** TC' measurement points is just under the chips. If this value is used, Rth(f-a) should be measured just under the chips.
***Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
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