LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH SCOPE 0.635mm This specification covers the 0.635mm PITCH BOARD TO BOARD CONNECTOR series. PRODUCT NAME AND PART NUMBER Product Name Receptacle Assembly Material Number Without Cover With Cover Without Cover With Cover Without Cover With Cover Stacking Height H=5-10mm Stacking Height H=11-16mm Stacking Height H=6,12mm Plug Assembly LEAD FREE LEAD FREE LEAD FREE LEAD FREE LEAD FREE LEAD FREE REV. A B C D E F G H J K SHEET 1-11 1-11 1-11 1-11 1-11 1-14 1-14 1-13 1-13 1-13 REVISE ON PC ONLY 2015/01/20 Y.SATO06 REV. DESCRIPTION STATUS DESIGN CONTROL J DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE REVISED J2015-0948 K THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: N.AIDA CHECKED BY: K.TOJO APPROVED BY: M.SASAO DATE: YR/MO/DAY 2004/03/01 FILE NAME SHEET 1 OF 13 EN-037(2013-04 rev.1) PS-52760-015.docx LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH Product Name Without Cover Without Cover With Cover Without Cover With Cover LEAD FREE LEAD FREE LEAD FREE LEAD FREE LEAD FREE Stacking Height H=9,15mm With Cover LEAD FREE Stacking Height H=10,16mm Without Cover With Cover LEAD FREE LEAD FREE Stacking Height H=7,13mm Plug Assembly Material Number Stacking Height H=8,14mm * : Refer to the drawing EMBOSSED PACKAGING OF PRODUCT WITHOUT COVER EMBOSSED PACKAGING OF PRODUCT WITH COVER STICK PACKAGING OF PRODUCT WITH COVER TRAY PACKAGING OF PRODUCT WITHOUT COVER EMBOSSED PACKAGING OF PRODUCT WITHOUT COVER STICK PACKAGING OF PRODUCT WITHOUT COVER EMBOSSED PACKAGING OF PRODUCT WITH COVER REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 2 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH RATINGS Item Standard Rated Voltage (MAXIMUM) 100 V [AC( rms)/DC] Rated Current (MAXIMUM) Ambient Temperature Range (Operating and Non-operating) 1 Including terminal temperature rise 0.5 A -55 +105 *1 PERFORMANCE Electrical Performance Item 4-1-1 4-1-2 Test Condition Contact Resistance Insulation Resistance 20mV 10mA (JIS C5402 5.4) Mate applicable connectors, measure by dry circuit, 20mV MAXIMUM, 10mA MAXIMUM. (JIS C5402 5.4) DC 250V (JIS C5402 5.2/MIL-STD-202 302) REV. Requirement H= 4 - 7mm 40 milliohm MAXIMUM H= 8 -10mm 50 milliohm MAXIMUM H= 11 -13mm 60 milliohm MAXIMUM H= 14 -16mm 70 milliohm MAXIMUM 1000 Megohm MINIMUM Mate applicable connectors together and apply 250V DC between adjacent terminal and ground. (JIS C5402 5.2/MIL-STD-202 Method 302) REVISE ON PC ONLY K Stacking Height SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 3 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition Dielectric Strength 4-1-3 AC 250V 1 (JIS C5402 5.1/MIL-STD-202 301) JAPANESE ENGLISH Stacking Height Requirement No Breakdown Mate applicable connectors, apply 250V AC for 1 minute between adjacent terminal or ground. (JIS C5402 5.1/MIL-STD-202 Method 301) . Mechanical Performance Item Insertion Force/ Withdrawal Force 4-2-1 Test Condition Requirement 253 mm Insertion Force Insert and withdraw connectors, Withdrawal at a rate of 253mm/minute. Force 0.690N {70gf} / CIRCUIT MAXIMUM 253mm 4-2-2 Terminal Pull-out Apply axial pull out force on the terminal Force assembled in the housing at a rate of 253mm/ minute. REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 0.118N {12gf} / CIRCUIT MINIMUM 52760-**70 52885-**72 52837-**70 52901-**72 55091-**71 55091-**72 53481-**67 53481-**77 53625-**72 53551-**77 53647-***9 53649-**72 53553-**77 53627-**72 1.96 N { 0.2kgf } MINIMUM TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 4 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Environmental Performance and Others Item 4-3-2 Test Condition Repeated Mate / Un-mate 4-3-1 Temperature Rise 1 10 50 When mate / un-mated up to 50 cycles repeatedly at a rate of 10 cycles / minute. (UL 498) Mate applicable connectors and measure the temperature rise of contact when the maximum AC rated current is passed. (UL 498) DC 1mA 3 105510Hz/ 1.5mm 2 (MIL-STD-202 201) 4-3-3 Vibration Mate connectors and subject to the following vibration conditions, for a period of 2 hours in each of 3 mutually perpendicular axes, passing DC 1mA during the test. Amplitude : 1.5mm P-P Frequency : 10-55-10Hz (MIL-STD-202, Method 201) REVISE ON PC ONLY K REV. JAPANESE ENGLISH SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 Requirement Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Temperature Rise 30 MAXIMUM Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Discontinuity 0.1 microsecond MAXIMUM TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 5 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition DC 1mA 6 11ms 2 490m/s {50G} 3 (JIS C60068-2-27/MIL-STD-202 213) Shock 4-3-4 4-3-6 Heat Resistance Cold Resistance REV. Appearance No Damage : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM 0.1 microsecond MAXIMUM Appearance No Damage Mate applicable connectors and expose to 1052 for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. (JIS C60068-2-2/MIL-STD-202 Method 108) Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM 553 96 12 ( JIS C60068-2-1 ) Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Mate applicable connectors and expose to - 553 for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. ( JIS C60068-2-1 ) REVISE ON PC ONLY K Requirement Mate applicable connectors and subject to the following shock conditions. 3 times of shocks Contact shall be applied for each 6 directions along 3 Resistance mutually perpendicular axes, passing DC 1mA current during the test. (Total of 18 shocks) Test pulse : Half Sine 2 Peak value : 490m/s {50G} Duration : 11ms Discontinuity (JIS C60068-2-27/MIL-STD-202 Method 213) 1052 96 12 (JIS C60068-2-2/MIL-STD-202 108 ) 4-3-5 JAPANESE ENGLISH SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 6 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition 602 9095% 96 12 (JIS C60068-2-3/MIL-STD-202 103) 4-3-7 Humidity Mate applicable connectors and expose to 602, relative humidity 90 to 95% for 96 hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. (JIS C60068-2-3/MIL-STD-202 Method 103) -553 30+852 30 1 5 3 12 (JISC0025) 4-3-8 Temperature Cycling Mate applicable connectors and subject to the following conditions for 5 cycles. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. 1 cycle a) -553 30 minutes b) +852 30 minutes (Transit time shall be within 3 minutes) (JISC0025) REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 JAPANESE ENGLISH Requirement Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Dielectric Strength 4-1-3 Must meet 4-1-3 Insulation Resistance 100 Megohm MINIMUM Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 7 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Test Condition 352 51% 484 (JIS C60068-2-11/MIL-STD-202 101) 4-3-9 4-3-10 4-3-11 Salt Spray SO2 Gas Solder-ability Mate applicable connectors and expose to the following salt mist conditions. Upon completion of the exposure period, salt deposits shall be removed by a gentle wash or dip in running water, after which the specified measurements shall be performed. NaCl solution Concentration: 51 % Spray time: 484 hours Ambient temperature:352 (JIS C60068-2-11/MIL-STD-202 Method 101) 402 505ppm 24 Mate applicable connectors and expose to 505ppm SO2 gas, ambient temperature 402 for 24 hours. 0.5mm 2453 30.5 Dip soldertails into the molten solder {held at 2453} up to 0.5mm from the bottom of the housing for 30.5 seconds. REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 JAPANESE ENGLISH Requirement Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Appearance No Damage Contact Resistance : 20 milliohm Change from initial requirement : 20 milliohm MAXIMUM Solder Wetting 95% 95% of immersed area must show no voids, pin holes TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 8 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION Item JAPANESE ENGLISH Test Condition Requirement () 62 (When reflowing) Repeat paragraph 6, two times. 4-3-12 Resistance to Soldering Heat () 0.5mm 0.5mm 370400 5 Appearance No Damage (Soldering iron method) 0.5mm from terminal tip and fitting nail tip. Soldering time : 5 seconds MAX. Solder temperature : 370400 ( { ) } Reference Standard Reference Unit PRODUCT SHAPE, DIMENSIONS AND MATERIALS Refer to the drawing. REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 9 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH INFRARED REFLOW CONDITION +5 250 -0 () +5 250 -0 (PEAK TEMP.) 230 230 MIN. 2040 2040 sec. 90120 90120 sec. (150200) (Pre-heat150200) () TEMPERATURE CONDITION GRAPH (TEMPERATURE ON THE SURFACE OF P.C.BOARD PATTERN) NOTE ; Please check the reflow soldering condition by your own devices beforehand. Because the condition changes by the soldering devices, P.C.Boards, and so on. REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 10 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH INSTRUCTION UPON USAGE 1. Max0.02mm The mounting specification for coplanarity does not include the influence of warpage of the printed circuit board. The warpage of the printed circuit board should be a maximum of 0.02mm if measuring from one connector edge to the other. 2. The product performance was tested using rigid printed circuit board. In case the product needs to be reflowed onto flexible circuit board, please conduct a reflow test on the flexible circuit board in advance. 3. Please add a stiffener on the flexible printed circuit (FPC) when you mount the connector onto FPC in order to prevent deformation of the FPC. 4. Depending on the reflow conditions, there may be the possibility of a color change in the housing. However, this color change does not have any effect on the product's performance. 5. If you leave any soldering area on this product open, there may be the possibility of a missing terminal short circuiting between pins, terminal buckling or the potential for the connector to come off of the printed circuit board. Therefore, please solder all of the terminals and fitting nails on the printed circuit board. 6. Please do not conduct any "washing process" on the connector because it may damage the product's function. 7. When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in the product specification. If the conditions in the product spec are not followed, it may cause the terminals to fall off, a change in the contact gap, a deformation of the housing, melting of the housing, and damage the connector. REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 11 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 8. When conducting manual repairs using a soldering iron, please do not use more solder and flux than needed. This may cause solder wicking and flux wicking issues, and it will eventually cause a contact defect and functional issues. 9. embossed package, paper reel product exists. Please be very careful upon usage. 10. 12 3 Please mate the connector horizontally along the mating direction shown below. (See figure 1) Please align the connector by lightly shaking it from side to side. (See figure 2) Please be very careful when extracting the connector at an angle. This may cause damage to the connector. Plug <Span -direction> <Pitch -direction> 1 Receptacle Fig.1 Parallel manner Mating/un-mating 2 Fig.2 Extraction 3 Fig.3 Excess twist extraction REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 12 OF 13 EN-037(2013-04 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH REV. REV. RECORD DATE ECN NO. WRITTEN BY : CHECKED BY : A RELEASED `04/03/01 J2004-2758 N.AIDA K.TOJO B REVISED `04/04/23 J2004-3983 E.SUZUKI K.TOJO C REVISED `05/01/19 J2005-2076 N.AIDA K.TOJO D REVISED `05/02/24 J2005-2773 N.AIDA K.TOJO E REVISED `07/10/16 J2008-1357 R.TSURUOKA T.HARUYAMA F REVISED `11/10/27 J2012-0609 T.KAIHO T.ASAKAWA G REVISED `13/09/20 J2014-0524 Y.SATO06 T.ASAKAWA H REVISED `14/08/04 J2015-0176 N.NAITO T.ASAKAWA J REVISED `14/08/14 J2015-0230 N.NAITO T.ASAKAWA K REVISED 2015/01/20 J2015-0948 Y.SATO06 T.ASAKAWA REVISE ON PC ONLY K REV. SEE SHEET 1 OF 13 DESCRIPTION DOCUMENT NUMBER PS-52760-015 TITLE: 0.635 mm PITCH B TO B CONN. HOUSING ASSEMBLY -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52760-015.docx 13 OF 13 EN-037(2013-04 rev.1)