INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1006N-R03 1
CPC1006N
Single-Pole, Normally Open
4-Pin SOP OptoMOS® Relay
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Pb
Part # Description
CPC1006N 4-Pin SOP (100/tube)
CPC1006NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 75 mArms / mADC
On-Resistance (max) 10
LED Current to operate 0.5 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Designed for EN50130-4 Compliant
Security Systems
• 1500Vrms Input/Output Isolation
• Only 0.5mA of LED Current Required to Operate
• Small 4-Pin SOP Package
• TTL/CMOS Compatible Input
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• SMD Pick & Place, Wave Solderable
• Tape & Reel Version Available
The CPC1006N is a miniature single-pole, normally
open (1-Form-A) solid state relay in a 4-pin SOP
package that employs optically coupled MOSFET
technology to provide 1500Vrms of input to output
isolation.
The relay outputs are constructed with efficient
MOSFET switches and photovoltaic die that
use IXYS Integrated Circuits Division's patented
OptoMOS architecture while the input, a highly
efficient GaAlAs infrared LED, provides the optically
coupled control.
Using IXYS Integrated Circuits Division’s state of the
art double-molded vertical construction packaging
to produce one of the world’s smallest relays, the
CPC1006N offers board space savings of at least
20% over the competitor’s larger 4-pin SOP relay.
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
1
23
4
+ Control
– Control
Load
Load
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R03
CPC1006N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 70 mW
Total Power Dissipation 1400 mW
Isolation Voltage Input to Output 1500 Vrms
ESD Rating, Human Body Model 4 kV
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous IF=0.5mA IL- - 75 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 1IF=0.5mA, IL=75mA RON -710
Off-State Leakage Current IF=0mA, VL=60VPILEAK --1A
Switching Speeds
Turn-On IF=2mA, VL=10V ton - - 10 ms
Turn-Off toff - - 10 ms
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -5 - pF
Input Characteristics
Input Control Current to Activate 2IL=75mA IF- 0.1 0.5 mA
Input Control Current to Deactivate - IF0.05 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Capacitance Input to Output - CI/O -1 - pF
1 Measurement taken within 1 second of on-time.
2 For applications requiring high temperature operation (greater than 60ºC) a LED drive current of 2mA is recommended.
Electrical Characteristics @ 25ºC
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CPC1006N
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R03
PERFORMANCE DATA*
*The Performance Data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Turn-On Time (ms)
0.099 0.108 0.117 0.126 0.135 0.144 0.153
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=2mA, IL=75mA, TA=25ºC)
Turn-Off Time (ms)
0.400 0.415 0.430 0.445 0.460 0.475 0.490
Device Count (N)
0
5
10
15
20
25
Typical Turn-Off Time
(N=50, IF=2mA, IL=75mA, TA=25ºC)
On-Resistance (:)
6.7 6.8 6.9 7.0 7.1 7.2 7.3
Device Count (N)
0
5
10
15
20
25
Typical On-Resistance Distribution
(N=50, IF=0.5mA, IL=75mA, TA=25ºC)
LED Forward Current (mA)
0.07 0.08 0.09 0.10 0.11 0.12
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=75mA, TA=25ºC)
Blocking Voltage (VP)
83 84 85 86 87 88 89 90 91
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(N=50, IF=0mA, TA=25ºC)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
LED Forward Voltage (V)
1.235 1.240 1.245 1.250 1.255 1.260 1.265
Device Count (N)
0
5
10
15
20
25
30
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=2mA
IF=1mA
IF=50mA
IF=20mA
IF=10mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (Ps)
0
50
100
150
200
250
300
Typical Turn-On Time
vs. LED Forward Current
(IL=50mA, TA=25ºC)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
443
444
445
446
447
448
449
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF (mA)
0.06
0.08
0.10
0.12
0.14
0.16
0.18
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
0
100
200
300
400
500
600
Typical Turn-On Time
vs. Temperature
(IL=50mA)
IF=1mA
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
300
400
500
600
700
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
IF=5mA
IF=2mA
IF=1mA
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R03
CPC1006N
PERFORMANCE DATA*
*The Performance Data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
5
6
7
8
9
10
11
12
Typical On-Resistance
vs. Temperature
(IF=1mA, IL=50mA)
Load Voltage (V)
-0.6 -0.4 -0.2 0.0 0.2 0.4 0.6
Load Current (mA)
-100
-50
0
50
100
Typical Load Current
vs. Load Voltage
(IF=0.5mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
45
50
55
60
65
70
75
80
Maximum Load Current
vs. Temperature
(IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
84
86
88
90
92
94
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
2
4
6
8
10
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=60V)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
4
6
8
10
12
14
Output Capacitance vs. Load Voltage
(IF=0mA)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (mA)
0
100
200
300
400
500
600
700
800
Energy Rating Curve
(IF=0.5mA)
INTEGRATED CIRCUITS DIVISION
CPC1006N
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R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1006N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1006N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1006N-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/13/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1006N
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1006N
CPC1006NTR Tape & Reel
