Surface Mount Information
Pick and Place
The 9-36V ProLynxTM modules use an open frame construction
and are designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a large
surface area for pick and place operations. The label meets all
the requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow temperatures
of up to 300oC. The label also carries product information such
as product code, serial number and the location of
manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered
to optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process.
Lead Free Soldering
The 9-36V ProLynxTM modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering process.
Failure to observe the instructions below may result in the
failure of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder profiles
and MSL classification procedures. This standard provides a
recommended forced-air-convection reflow profile based on
the volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Fig. 41. Soldering outside of the recommended profile
requires testing to verify results and performance.
For questions regarding Land grid array(LGA) soldering, solder
volume; please contact GE for special manufacturing process
instructions.
MSL Rating
The 9-36V ProLynxTM modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required
for MSL ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf
life for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the
following conditions: < 40° C, < 90% relative humidity.
Figure 41. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).