1. Product profile
1.1 General description
Two planar Schottky barrier double diodes with common cathodes and an integrated
guard ring for stress protection encapsulated in a SOT666 ultra small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
Low forward voltage
Low capacitance
AEC-Q101 qualified
Ultra small and flat lead SMD plastic package
Excellent coplanarity and improved thermal behavior
1.3 Applications
Ultra high-speed switching
Voltage clamping
Line termination
Reverse polarity protection
1.4 Quick reference data
[1] Pulse test: tp300 μs; δ≤0.02.
BAT54CV
Two Schottky barrier double diodes
Rev. 3 — 15 November 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current - - 200 mA
VRreverse voltage - - 30 V
VFforward voltage [1]
IF=0.1mA - - 240 mV
IF=1mA - - 320 mV
IF=10mA - - 400 mV
IF=30mA - - 500 mV
IF= 100 mA - - 800 mV
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 2 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 anode (diode 1)
2 anode (diode 2)
3 common cathode (diode 3, 4)
4 anode (diode 3)
5 anode (diode 4)
6 common cathode (diode 1, 2) 123
456
1
56
23
4
sym05
7
Table 3. Ordering i nformation
Type number Package
Name Description Version
BAT54CV - plastic surface-mounted package; 6 leads SOT666
Table 4. Marking codes
Type number Marking code
BAT54CV C5
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 30 V
IFforward current - 200 mA
IFRM repetitive peak
forward current tp10 ms; δ≤0.5 - 0.85 A
IFSM non-repetitive peak
forward current square wave;
tp=8.3ms [1] -2A
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 3 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
[1] Tj=25°C prior to surge.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[5] Soldering point of cathode tab.
Per device, one diode loaded
Ptot total power dissipation Tamb 25 °C[2]
[3] -350mW
[4] -420mW
Tjjunction temperature - 125 °C
Tamb ambient temperature 65 +125 °C
Tstg storage temperature 65 +150 °C
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device, one diode loaded
Rth(j-a) thermal resistance from
junction to ambient in free air [1][2]
[3] --360K/W
[4] --300K/W
Rth(j-sp) thermal resistance from
junction to solder point [5] --175K/W
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 4 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 7. Characteristics
Tamb =25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage [1]
IF=0.1mA - - 240 mV
IF=1mA - - 320 mV
IF=10mA - - 400 mV
IF=30mA - - 500 mV
IF= 100 mA - - 800 mV
IRreverse current VR=25V - - 2 μA
Cddiode capacitance VR=1V; f=1MHz - - 10 pF
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
103
102
101
IF
(mA)
VF (V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
VR (V)
103
102
101
IR
(μA)
10
1
(1)
(2)
(3)
msa893
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 5 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in auto motive applications.
9. Package outline
Tamb =25°C; f = 1 MHz
Fig 3. Diod e capacitance as a function of reverse voltage; typical values
0102030
0
5
10
15
V
R
(V)
C
d
(pF)
msa891
Fig 4. Package outline BAT54CV (SOT666)
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 6 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
4000
BAT54CV SOT666 4 mm pitch, 8 mm tape and reel -115
Reflow soldering is the only recommended soldering method.
Fig 5. Reflow soldering footprint BAT54CV (SOT666)
solder lands
placement area
occupied area
solder paste
sot666_
fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.075
0.538
Dimensions in mm
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 7 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAT54CV v.3 20101115 Product data sheet - BAT54CV_2
Modifications: Section 1.2 “Features and benefits: amended.
Table 1 “Quick reference data: updated.
Table 5 “Limiting values: Ptot amended.
Table 6 “Thermal characteristics: Rth(j-a) amended, Rth(j-sp) added.
Figure 4: superseded by minimized outline drawin g.
Section 8 “Test inform at io n: added.
Section 11 “Soldering: added.
Section 13 “Legal information: updated.
BAT54CV_2 20100115 Objective data sheet - BAT54CV_1
BAT54CV_1 20040922 Objective data sheet - -
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 8 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificat io nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyon d those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
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contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
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customer for the products described herein shall be limited in accordance
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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authorized or warranted to be suit able for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo m er(s). Customer is responsible for doing all necessary
testing for the customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet D evelopment This document contain s data from the objective specification for product development .
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BAT54CV All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 15 November 2010 9 of 10
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
Quick reference data The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BAT54CV
Two Schottky barrier double diodes
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 November 2010
Document identifier: BAT54CV
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Packing information . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10